CN113141686A - Device for manufacturing large-area high-heat-flux-density equivalent heat source by using heating rod - Google Patents
Device for manufacturing large-area high-heat-flux-density equivalent heat source by using heating rod Download PDFInfo
- Publication number
- CN113141686A CN113141686A CN202110348669.XA CN202110348669A CN113141686A CN 113141686 A CN113141686 A CN 113141686A CN 202110348669 A CN202110348669 A CN 202110348669A CN 113141686 A CN113141686 A CN 113141686A
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- China
- Prior art keywords
- heat
- cover plate
- base body
- heating rod
- heating
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
Abstract
A device for manufacturing a large-area equivalent heat source with high heat flow density by using a heating rod is designed to realize the aggregation of heat of a high-power heating device and the accumulation of the heat to a fixed hot surface through a plurality of metal components with good heat conduction performance, thereby achieving the purpose of providing the large-area equivalent heat source with high heat flow density. The invention comprises a structure of an equivalent heat source base body and a cover plate for clamping a heating material, and comprises mechanical and heat transfer design, thereby effectively ensuring that the heat of the traditional heat source is transferred to the bottom surface of the base body, and well ensuring the heat flow density and uniformity transmitted by the bottom surface in experimental application.
Description
Technical Field
The invention relates to the field of heat transfer, and particularly provides a device for manufacturing a large-area high-heat-flow-density equivalent heat source by using a heating rod.
Background
The heat dissipation design for the emerging high-power electronic device is one of the important issues in the development of electronic equipment in recent years, and because the high-power heating device, such as a high-power transistor, an ultra-high speed computer chip, and the like, is experimented in heat dissipation design, the raw material is expensive and is difficult to purchase from the market through a conventional way, and meanwhile, a heat source device with a large area and high heat flux density is not uncommon in the market. Therefore, how to simulate the experimental conditions of large area and high heat flow density becomes one of the problems for developing the design.
At present, the existing high-power heating device in the market is usually a heating rod or a heating patch for heating, and is limited by safety conditions, the power density of the heating rod is often limited, the maximum power of the conventional heating rod in the market is generally not more than 300W, and due to relevant industrial conditions, the shape of the heat source is limited (rod-shaped or sheet-shaped), and the heat source cannot well meet the requirements of thermal design experiments.
Disclosure of Invention
In order to solve the problems, the invention provides a device for manufacturing a large-area equivalent heat source with high heat flow density by using a heating rod.
In order to ensure the heat transmission efficiency, the invention adopts metal materials with higher heat conductivity, such as iron, aluminum, copper and the like, ensures the heat transmission rate, ensures the stable integral structure, is not easy to overheat and damage, and can ensure that the heat flux density of the heat concentration surface is relatively uniform. The cover plate is made of a material with a low heat conductivity coefficient.
The design method adopted by the invention is as follows: according to the heat transfer principle, the heating rod is coated by the metal blind holes on the base body, and the heat source is fixed by the cover plate. The invention comprises a cover plate (402) and a base body (403).
The base body (403) is made of a metal material having good thermal conductivity. The structure of the substrate (403) is shown in FIG. 1. The metal blind holes (101) are used for inserting purchased heating rods (404) and are arranged in the base body (403) in an array mode. The depth of the blind hole is designed according to the heating rod (404) and is slightly longer than that of the heating rod (404); the distance between the bottom surface of the blind hole and the hot surface (105) is moderate; the cover plate fixing threaded hole (102) is used for fixing the cover plate (402); the substrate fixing hole (103) is a reserved hole position for fixedly connecting the substrate with other experimental equipment (not attached in the drawing); the step body (104) is a reserved surface for placing the substrate fixing hole (103) and other sensors used in experiments, and the hot surface (105) is a large-area high-heat-flow-density heat release surface and is also a heat source providing surface for heat dissipation design. According to kirchhoff's law, after the matrix structure is processed, the outer surfaces of the matrix structure except the hot surface (105) are all subjected to rough treatment to reduce the blackness epsilon of the matrix structure. In some cases, the temperature of the substrate (403) may be too high, and it is considered to wrap or adhere a heat insulating material, such as a heat insulating tape, around the substrate (403), or to apply a heat insulating adhesive, spray a heat insulating paint, or the like. The substrate (403) should be treated for rust prevention.
The cover plate (402) should be made of wood or rubber with poor thermal conductivity, and the temperature of the base body may be too high in some cases, so that a metal material with good strength can be used, but in this case, the cover plate (402) and the base body (403) should be fixed by heat protection, such as adding a rubber gasket for heat insulation. The structure of the cover plate (402) is shown in fig. 2, wherein the diameter of the through hole (201) is slightly smaller than that of the blind metal hole (101) of the base body (403), which is used for fixing the heating rod (404) in the blind metal hole (101) of the base body (403) and ensuring that the heating rod does not have large displacement during heating operation. The cover plate fixing through hole (202) is a through hole for fixing the cover plate (402) and the base body (403), and the cover plate fixing through hole and the base body are connected and fixed through a fixing screw (401). According to kirchhoff's law, the outer surface of the cover plate (402) is roughened to reduce the blackness epsilon.
Drawings
FIG. 1 is a schematic view of the structure of the substrate of the present invention.
Fig. 2 is a schematic view of the cover plate structure of the present invention.
FIG. 3 is a structural view of a heating rod used in the present invention.
Fig. 4 is a schematic view of the overall assembly of the present invention.
FIG. 5 is a cloud of the results of numerical simulation experiments of the present invention.
FIG. 6 is a data diagram of the results of numerical simulation experiments in accordance with the present invention.
Shown in the figure: 101-metal blind holes; 102-cover plate fixing threaded holes; 103-base fixing hole; 104-a step body; 105-hot side; 201-a through hole; 202-cover plate fixing through holes; 301-a heat-generating rod body; 302-heating rod insulator; 303-heating rod electrode; 401-set screws; 402-a cover plate; 403-matrix.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and examples, but the scope of the present invention is not limited to the examples described below.
The distance between the bottom surface of the blind hole (101) of the base body (403) and the hot surface (105) is moderate; in this example, the distance is taken to be 3mm in order to ensure the overall structural rigidity and the uniformity of the floor heat flux density.
The assembly of the base (403) and cover (402) is shown in figure 4. Firstly, heat-conducting media such as heat-conducting silicone grease and the like for eliminating gaps and increasing heat transfer efficiency are coated on a heating rod (404); then, inserting the heating rod (404) into the metal blind hole (101) of the base body (403), forcibly inserting the heating rod into the bottom, and repeatedly rotating and pulling out the heating rod to ensure that no gap exists between the bottom surface of the heating rod (404) and the bottom surface of the metal blind hole (101); subsequently, the cover plate (402) is placed and fastened and fixed using the fixing screw (401).
According to an ideal experimental environment, considering the ideal liquid cooling heat dissipation condition of the bottom surface contacting with the ideal liquid in the standing air, the power of a heating rod adopted in the experiment is 300W, a simulation test is carried out according to the design, the heat flow density distribution cloud chart of the hot surface is shown in figure 5, the numerical result of the heat flow density of the hot surface is shown in figure 6, and the average heat flow density of the hot surface (105) exceeds 100W/cm2And the heat flux density on the surface is relatively uniform (the heat flux density range is less than 10 percent), thereby achieving the ideal use effect.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (3)
1. A device for manufacturing a large-area equivalent heat source with high heat flow density by using a heating rod is characterized in that: the metal cavity and the heat-conducting base body for storing the common high-power heating materials in the market are manufactured by using the metal material with good heat conduction. The cover plate is used for fixing, and the heat flow density of the working surface is higher than 100w/cm through heat conduction control of the non-working surface2The heat flow range on the surface is less than 10%, and the area of the working hot surface is more than 15mm multiplied by 15 mm.
2. A base structure for equipping a heat-generating material and conducting heat according to claim 1, characterized in that: the base body is provided with blind holes for being equipped with heating materials, the blind holes can enable the heating materials to be arranged in the base body in an array mode, and the shape of the blind holes is designed according to the heating materials and is slightly larger than the heating materials; the distance between the bottom surface of the blind hole and the hot surface is moderate. According to kirchhoff's law, after the matrix structure is processed, the outer surfaces of the matrix structure except the working surface are all subjected to rough treatment so as to reduce the blackness epsilon of the matrix structure. In some cases, the temperature of the substrate may be too high, and it is considered to wrap or adhere a heat insulating material, such as a heat insulating tape, around the substrate, or to apply a heat insulating paste, spray a heat insulating paint, or the like. The substrate should be treated for rust prevention.
3. A cover plate for use with a base structure according to claim 1 and claim 2, wherein: the cover plate should be made of wood or rubber with poor heat conductivity, and the collective temperature may be too high in some cases, so that a metal material with better strength can be used, but in this case, the cover plate should be fixed with the base body and should be thermally protected, for example, a rubber gasket is added for thermal insulation. The cover plate is provided with a hole for fixing the heating element and a hole for mounting and combining with the substrate. According to kirchhoff's law, the outer surface of the cover plate is subjected to rough treatment so as to reduce the blackness epsilon of the cover plate.
Priority Applications (1)
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CN202110348669.XA CN113141686A (en) | 2021-03-31 | 2021-03-31 | Device for manufacturing large-area high-heat-flux-density equivalent heat source by using heating rod |
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CN202110348669.XA CN113141686A (en) | 2021-03-31 | 2021-03-31 | Device for manufacturing large-area high-heat-flux-density equivalent heat source by using heating rod |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103354672A (en) * | 2013-07-02 | 2013-10-16 | 中国核动力研究设计院 | Heating device simulating multiple kinds of heat flux density distribution patterns |
CN109060872A (en) * | 2018-07-19 | 2018-12-21 | 哈尔滨工业大学(深圳) | A kind of device for simulating heat source for misting cooling experimental system measuring and calculating heat flow density |
CN109060865A (en) * | 2018-07-26 | 2018-12-21 | 桂林电子科技大学 | A kind of experimental provision of equivalent heat source |
CN211936271U (en) * | 2019-12-03 | 2020-11-17 | 河南省日立信股份有限公司 | Molecular sieve device for removing water vapor in sulfur hexafluoride gas |
CN112067655A (en) * | 2020-09-16 | 2020-12-11 | 橘子洲(北京)技术发展有限公司 | Processing method of simulated heat source and simulated heat source |
-
2021
- 2021-03-31 CN CN202110348669.XA patent/CN113141686A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103354672A (en) * | 2013-07-02 | 2013-10-16 | 中国核动力研究设计院 | Heating device simulating multiple kinds of heat flux density distribution patterns |
CN109060872A (en) * | 2018-07-19 | 2018-12-21 | 哈尔滨工业大学(深圳) | A kind of device for simulating heat source for misting cooling experimental system measuring and calculating heat flow density |
CN109060865A (en) * | 2018-07-26 | 2018-12-21 | 桂林电子科技大学 | A kind of experimental provision of equivalent heat source |
CN211936271U (en) * | 2019-12-03 | 2020-11-17 | 河南省日立信股份有限公司 | Molecular sieve device for removing water vapor in sulfur hexafluoride gas |
CN112067655A (en) * | 2020-09-16 | 2020-12-11 | 橘子洲(北京)技术发展有限公司 | Processing method of simulated heat source and simulated heat source |
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Application publication date: 20210720 |