JPH0491199A - Cleanser for rosin solder flux and method for cleansing rosin solder flux with the cleanser - Google Patents
Cleanser for rosin solder flux and method for cleansing rosin solder flux with the cleanserInfo
- Publication number
- JPH0491199A JPH0491199A JP20720190A JP20720190A JPH0491199A JP H0491199 A JPH0491199 A JP H0491199A JP 20720190 A JP20720190 A JP 20720190A JP 20720190 A JP20720190 A JP 20720190A JP H0491199 A JPH0491199 A JP H0491199A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning agent
- rosin
- solder flux
- cleaning
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims description 44
- 229910000679 solder Inorganic materials 0.000 title claims description 28
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 title claims description 25
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 title claims description 25
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 title claims description 25
- 238000000034 method Methods 0.000 title claims description 9
- -1 glycol ether compound Chemical class 0.000 claims abstract description 25
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 20
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 12
- 150000001413 amino acids Chemical class 0.000 claims abstract description 10
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000004480 active ingredient Substances 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 239000004094 surface-active agent Substances 0.000 claims abstract description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 3
- 239000012459 cleaning agent Substances 0.000 claims description 49
- 238000004140 cleaning Methods 0.000 claims description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 239000004475 Arginine Substances 0.000 claims description 4
- ODKSFYDXXFIFQN-UHFFFAOYSA-N arginine Natural products OC(=O)C(N)CCCNC(N)=N ODKSFYDXXFIFQN-UHFFFAOYSA-N 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 2
- 108010039491 Ricin Proteins 0.000 claims 2
- 229920001223 polyethylene glycol Polymers 0.000 abstract description 9
- 239000002202 Polyethylene glycol Substances 0.000 abstract description 8
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 abstract description 3
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 abstract 1
- 108010062796 arginyllysine Proteins 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 238000000354 decomposition reaction Methods 0.000 abstract 1
- 235000019645 odor Nutrition 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000000758 substrate Substances 0.000 description 8
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000008282 halocarbons Chemical class 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 2
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 2
- 239000004472 Lysine Substances 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007127 saponification reaction Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 description 1
- QCNZRFLQCBZYMO-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]pentane Chemical compound CCCCCOCCOCCOCCCC QCNZRFLQCBZYMO-UHFFFAOYSA-N 0.000 description 1
- VXVGKMGIPAWMJC-UHFFFAOYSA-N 1-[2-(2-ethoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCC VXVGKMGIPAWMJC-UHFFFAOYSA-N 0.000 description 1
- HQDGQKLBDFTNEM-UHFFFAOYSA-N 1-[2-(2-ethoxyethoxy)ethoxy]pentane Chemical compound CCCCCOCCOCCOCC HQDGQKLBDFTNEM-UHFFFAOYSA-N 0.000 description 1
- PXQCQQARRAYIFS-UHFFFAOYSA-N 1-[2-(2-ethoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCC PXQCQQARRAYIFS-UHFFFAOYSA-N 0.000 description 1
- HYLLZXPMJRMUHH-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOC HYLLZXPMJRMUHH-UHFFFAOYSA-N 0.000 description 1
- MBRRDORCFVPYMA-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOC MBRRDORCFVPYMA-UHFFFAOYSA-N 0.000 description 1
- GNVFCWJZMJINCS-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCC GNVFCWJZMJINCS-UHFFFAOYSA-N 0.000 description 1
- BOGFHOWTVGAYFK-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCCC BOGFHOWTVGAYFK-UHFFFAOYSA-N 0.000 description 1
- POEDHWVTLBLWDA-UHFFFAOYSA-N 1-butylindole-2,3-dione Chemical compound C1=CC=C2N(CCCC)C(=O)C(=O)C2=C1 POEDHWVTLBLWDA-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- PWTNRNHDJZLBCD-UHFFFAOYSA-N 2-(2-pentoxyethoxy)ethanol Chemical compound CCCCCOCCOCCO PWTNRNHDJZLBCD-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- LSCNICLUNGUIRB-SNVBAGLBSA-N 2-[2-[(2R)-2-methylpentoxy]ethoxy]ethanol Chemical compound CCC[C@@H](C)COCCOCCO LSCNICLUNGUIRB-SNVBAGLBSA-N 0.000 description 1
- GJMPSRSMBJLKKB-UHFFFAOYSA-N 3-methylphenylacetic acid Chemical compound CC1=CC=CC(CC(O)=O)=C1 GJMPSRSMBJLKKB-UHFFFAOYSA-N 0.000 description 1
- HAAZMOAXEMIBAJ-UHFFFAOYSA-N 4-chloro-2-methylquinazoline Chemical compound C1=CC=CC2=NC(C)=NC(Cl)=C21 HAAZMOAXEMIBAJ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ONIBWKKTOPOVIA-BYPYZUCNSA-N L-Proline Chemical compound OC(=O)[C@@H]1CCCN1 ONIBWKKTOPOVIA-BYPYZUCNSA-N 0.000 description 1
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 description 1
- QIVBCDIJIAJPQS-VIFPVBQESA-N L-tryptophane Chemical compound C1=CC=C2C(C[C@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-VIFPVBQESA-N 0.000 description 1
- 229920001213 Polysorbate 20 Polymers 0.000 description 1
- ONIBWKKTOPOVIA-UHFFFAOYSA-N Proline Natural products OC(=O)C1CCCN1 ONIBWKKTOPOVIA-UHFFFAOYSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- QIVBCDIJIAJPQS-UHFFFAOYSA-N Tryptophan Natural products C1=CC=C2C(CC(N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- MMCPOSDMTGQNKG-UHFFFAOYSA-N anilinium chloride Chemical compound Cl.NC1=CC=CC=C1 MMCPOSDMTGQNKG-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000002529 flux (metallurgy) Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- XPVOJYDIBHYVFL-UHFFFAOYSA-N n'-[2-(2-aminoethylamino)ethyl]ethane-1,2-diamine;hydrochloride Chemical compound Cl.NCCNCCNCCN XPVOJYDIBHYVFL-UHFFFAOYSA-N 0.000 description 1
- GSGDTSDELPUTKU-UHFFFAOYSA-N nonoxybenzene Chemical compound CCCCCCCCCOC1=CC=CC=C1 GSGDTSDELPUTKU-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 1
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 229940117957 triethanolamine hydrochloride Drugs 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
Landscapes
- Detergent Compositions (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ロジン系ハンダフラックスの洗浄剤、特にア
ッセンブリー用ロジン系ハンダフラックスの洗浄剤なら
びに該洗浄剤を用いでなるロジン系ハンダフラックスの
洗浄方法に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a cleaning agent for rosin-based solder flux, particularly a cleaning agent for rosin-based solder flux for assembly, and a cleaning agent for rosin-based solder flux using the cleaning agent. Regarding the method.
（従来の技術）
ロジン系ハンダフラックスはプリント回路板やプリント
配線基板などのモジュールの製作にあたって使用される
。ハンダ処理の目的は、一般には基板と入出力ピンとの
接着強度を高めたり、接点の酸化を防止して導電性を維
持するためであり、かかるハンダ処理の実効を図らんと
してハンダ付けに際してロジン系ハンダフラックスが使
用される。ハンダ付は終了後は、基板面からフラックス
のみを選択的にしかも完全に除去すべく洗浄剤が使用さ
れる。すなわち、フラックスの洗浄が不充分である場合
には、残留フラックスによる悪影響として、回路腐食が
起こったり、あるいは基板表面の電気絶縁性が低下し、
最終的には回路破損につながるという不利がある。その
ため、洗浄剤を使用して、残留フラックス、特にそれに
含有されている活性剤成分を除去することにより、１１
ｊ記不利を解消している。(Prior Art) Rosin-based solder flux is used in the production of modules such as printed circuit boards and printed wiring boards. The purpose of soldering is generally to increase the adhesive strength between the board and the input/output pins, and to prevent oxidation of the contacts and maintain conductivity. Solder flux is used. After soldering is completed, a cleaning agent is used to selectively and completely remove only the flux from the board surface. In other words, if the flux is not sufficiently cleaned, the residual flux may cause circuit corrosion, or the electrical insulation of the board surface may deteriorate.
This has the disadvantage of ultimately leading to circuit damage. Therefore, by using a cleaning agent to remove the residual flux, especially the activator component contained in it, 11
The disadvantages listed in j have been resolved.
従来、ロジン系ハンダフラックスの洗浄剤としてはトリ
クロロエチレン、トリクロロトリフルオロエタン等のい
わゆるフロン等のハロゲン化炭化水素製剤ｊが使用され
でいる。ところが、オゾン層破壊などの環境汚染の問題
から、かかるハロゲン化炭化水素溶剤の使用規制が本格
化されつつあり、電機業界においてもいわゆるフロン代
替のハンダフラックスの洗浄剤の開発が急務となってき
た。Conventionally, halogenated hydrocarbon preparations such as so-called chlorofluorocarbons such as trichlorethylene and trichlorotrifluoroethane have been used as cleaning agents for rosin-based solder flux. However, due to environmental pollution problems such as ozone layer depletion, restrictions on the use of such halogenated hydrocarbon solvents are becoming more serious, and the development of so-called fluorocarbon substitute solder flux cleaning agents has become an urgent need in the electronics industry. .
近時、非ハロゲン系のハンダフラックス洗浄剤が種々開
発されでいる。例えば、アルカ’ノケン化型の場合には
、水忍液タイプであるため引火性の問題はないが、洗浄
に際し加熱下に長時間の液接触せしめることが必要とな
り洗浄効率が低いこと、更には基板の金属部の腐食が懸
念されるなどの不利がある。Recently, various non-halogen solder flux cleaning agents have been developed. For example, in the case of the alkaline saponification type, there is no flammability problem because it is a water-based liquid type, but cleaning efficiency is low because it requires long-term contact with the liquid under heating. There are disadvantages such as concerns about corrosion of the metal parts of the board.
一方、アルカリケン化型でない洗浄剤も開発されてはい
るものの、洗浄力、毒性、臭気、引火性などのすべての
要求性能を完全に満足しつるものはいまだ見い出されて
いないのが現状である。On the other hand, although non-alkaline saponification type cleaning agents have been developed, the current situation is that no one has yet been found that completely satisfies all required performance such as cleaning power, toxicity, odor, and flammability. .
そのため１本発明者らは前記諸問題を解決すべく鋭！検
討を重ねた結果として、特定のグリコルエーテル系化合
物とノニオン性界面活性剤とを必須成分として使用した
場合には、前記課題を解決しうることを見出し、特願平
１−２９１９０５号に記載の発明を完成し、すでに特許
出願を行った。Therefore, the inventors of the present invention are working hard to solve the above-mentioned problems. As a result of repeated studies, it was discovered that the above-mentioned problems could be solved when a specific glycol ether compound and a nonionic surfactant were used as essential components, and the authors disclosed in Japanese Patent Application No. 1-291905. The invention has been completed and a patent application has already been filed.
ハンダフラックス洗浄剤が水希釈時にも充分な洗浄力を
保持することができる場合には、洗浄剤の引火危険性の
低減、洗浄剤の低廉化、排水処理負荷の大幅低減などを
達成できるというメリットがあり、前記特許出願明細書
中においても該洗浄剤の使用態様として水希釈して使用
しつる旨記載されている。しかしながら、該発明によっ
ても水希釈して使用した場合には、その洗浄力の低下傾
向が認められる。If the solder flux cleaning agent can maintain sufficient cleaning power even when diluted with water, the benefits include reducing the risk of ignition of the cleaning agent, reducing the cost of the cleaning agent, and significantly reducing the burden of wastewater treatment. The above-mentioned patent application specification also describes that the cleaning agent is used after being diluted with water. However, even according to the invention, when used diluted with water, there is a tendency for the detergency to decrease.
（発明が解決しようとする課題）
本発明は、洗浄力、特に水希釈時の洗浄力に優れ、しか
も環境特性、臭気、引火性などの点でも実質上満足しつ
る非ハロゲン系のハンダフラックス洗浄剤、ならびに該
洗浄剤を用いる洗浄方法を提供することを目的とする。(Problems to be Solved by the Invention) The present invention provides a non-halogen solder flux cleaning product that has excellent cleaning power, especially when diluted with water, and is substantially satisfactory in terms of environmental characteristics, odor, and flammability. An object of the present invention is to provide a cleaning agent and a cleaning method using the cleaning agent.
（課題を解決するための手段）
本発明者らは前記目的を達成すべく鋭、徴検討を重ねた
結果、特定のグリコールエーテル系化合物とノニオン性
界面活性剤と特定のアミノ酸を必須成分としてなる混合
物を使用した場合には、１ｉｉｉ記課題を解決しうるこ
とを見出し本発明を完成するに至った。(Means for Solving the Problems) In order to achieve the above-mentioned object, the present inventors have made intensive studies and found that a specific glycol ether compound, a nonionic surfactant, and a specific amino acid are essential components. The present inventors have found that problem 1iii can be solved when a mixture is used, and have completed the present invention.
すなわち本発明は。That is, the present invention.
■一般式（１）：
％式％
（式中、Ｒ１は水素原子または炭素数 １〜５のアルキ
ル基を、Ｒ２は炭素数１〜５のアルキル基、Ｒ３は水素
原子またはメチル基を、ｍは２〜４の整数を示す）で表
されるグリコールエーテル系化合物のうちの少なくとも
一種、ノニオン性界面活性剤、および塩基性アミノ酸か
らなる混合物を有効成分として含有す−ることを特徴と
するロジン系ハンダフラックスの洗浄剤、ならびに
該洗浄剤をロジン系ハンダフラックスと接触させること
を特徴とするロジン系ハンダフラックスの洗浄方法に係
る。■General formula (1): % formula % (In the formula, R1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R2 is an alkyl group having 1 to 5 carbon atoms, R3 is a hydrogen atom or a methyl group, m represents an integer of 2 to 4), a nonionic surfactant, and a mixture of basic amino acids as an active ingredient. The present invention relates to a cleaning agent for rosin-based solder flux, and a method for cleaning rosin-based solder flux, which is characterized by bringing the cleaning agent into contact with rosin-based solder flux.
本発明のロジン系ハンダフラックスの洗浄剤の成分のう
ち、前Ｍ巳一般式（１）で表されるグリコールエーテル
系化合物としては、ジエチレングリコール七ツメチルエ
ーテル、ジエチレングリコールジメチルエーテル、ジエ
チレングリコールモノエチルエーテル、ジエチレングリ
コールジエチルニーデル、ジエチレングリコールメチル
エチルエーテル、ジエチレングリコールモノプロビルエ
ーテル、ジエチレングリコールジプロピルエーテル、ジ
エチレングリコールメチルプロピルエーテル、ジエチレ
ングリコールエチルプロビルエーテル、ジエチレングリ
コールモノブチルエーテル、ジエチレングリコールジブ
チルエーテル、ジエチレングリコールメチルブチルエー
テル、ジエチレングリコールエチルブチルエーテル、ジ
エチレングリコールプロピルブチルエーテル、ジエチレ
ングリコールモノペンチルエーテル、ジエチレングリコ
ールジブチルエーテル、ジエチレングリコールメチルペ
ンチルエーテル、ジエチレングリコールエチルペンチル
エーテル、ジエチレングリコールプロビルペンチルエー
テル、ジエチレングリコールブチルペンチルエーテル：
これらに対応するトリーもしくはテトラエチレングリコ
ールエーテル類；これらに対応するジー、トリーもしく
はテトラプロピレングリコールエーテル類を例示できる
。これら化合物は単独でまたは２種以上を適宜組み合せ
て使用できる。Among the components of the cleaning agent for the rosin-based solder flux of the present invention, the glycol ether compounds represented by the general formula (1) include diethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether, and diethylene glycol diethyl ether. Dell, diethylene glycol methyl ethyl ether, diethylene glycol monopropyl ether, diethylene glycol dipropyl ether, diethylene glycol methyl propyl ether, diethylene glycol ethyl propyl ether, diethylene glycol monobutyl ether, diethylene glycol dibutyl ether, diethylene glycol methyl butyl ether, diethylene glycol ethyl butyl ether, diethylene glycol propyl butyl ether, diethylene glycol Monopentyl ether, diethylene glycol dibutyl ether, diethylene glycol methyl pentyl ether, diethylene glycol ethyl pentyl ether, diethylene glycol probyl pentyl ether, diethylene glycol butyl pentyl ether:
Examples include tri- or tetraethylene glycol ethers corresponding to these; and di-, tri- or tetrapropylene glycol ethers corresponding to these. These compounds can be used alone or in an appropriate combination of two or more.
本発明のロジン系ハンダフラックスの洗浄剤の成分のう
ち、ノニオン性界面活性剤としては、そのイオン性がノ
ニオン性である限り特に制限はなく、各種公知のものを
採用しつる。その具体例としては、ポリオキシエチレン
アルキル（ｃｉ＜）エーテル、ポリオキシエチレンフェ
ノールエーテル、ポリオキシエチレンアルキルフェノー
ルエーテルなどのポリエチレングリコールエーテル型ノ
ニオン性界面活性剤；ポリエチレングリコールモノエス
テル、ポリエチレングリコールジエステルなどのポリエ
チレングリコールエステル型ノニオン性界面活性剤；高
級脂肪族アミンのエチレンオキサイド付加物；脂肪酸ア
ミドのエチレンオキサイド付加物；ソルビタン脂肪酸エ
ステル、ショ糖脂肪酸エステルなどの多価アルコール型
ノニオン性界面活性剤；脂肪酸アルカノールアミドなど
。Among the components of the rosin-based solder flux cleaning agent of the present invention, the nonionic surfactant is not particularly limited as long as its ionicity is nonionic, and various known surfactants may be used. Specific examples include polyethylene glycol ether type nonionic surfactants such as polyoxyethylene alkyl (ci<) ether, polyoxyethylene phenol ether, polyoxyethylene alkyl phenol ether; polyethylene glycol monoester, polyethylene glycol diester, etc. Glycol ester type nonionic surfactants; ethylene oxide adducts of higher aliphatic amines; ethylene oxide adducts of fatty acid amides; polyhydric alcohol type nonionic surfactants such as sorbitan fatty acid esters and sucrose fatty acid esters; fatty acid alkanolamides Such.
更にはこれらに対応するポリオキシプロピレン系ノニオ
ン性界面活性剤およびポリオキシエチレンポリオキシブ
ロビレン共重合型ノニオン性界面活性剤をあげることが
できる。これらノニオン性界面活性剤は１種単独でまた
は２種以上組合せて使用できる。Furthermore, corresponding polyoxypropylene type nonionic surfactants and polyoxyethylene polyoxybrobylene copolymer type nonionic surfactants can be mentioned. These nonionic surfactants can be used alone or in combination of two or more.
これらのうち、洗浄力の点から好ましいものとしては、
ポリエチレングリコールエーテル型ノニオン性界面活性
剤であり、更に好ましいものとしては下記一般式（２）
で表されるものが該当する。Among these, the preferred ones in terms of cleaning power are:
A polyethylene glycol ether type nonionic surfactant, more preferably one represented by the following general formula (2)
The following are applicable.
Ｒ’ Ｏ−（ＣＨ，ＣＨ，Ｏ）、−Ｈ（式中、Ｒ４は
炭素数６〜２０、好ましくはｌＯ〜１４の直鎖もしくは
分岐鎖アルキル基、フェニル基。R' O-(CH, CH, O), -H (wherein R4 is a straight or branched alkyl group having 6 to 20 carbon atoms, preferably 10 to 14 carbon atoms, or a phenyl group.
または炭素数７〜１２の直鎖もしくは分岐鎖アルキル基
で置換されたフェニル基を、ｎは２〜２０の整数、好ま
しくは３〜１６の整数を示す。）本発明のロジン系ハン
ダフラックスの洗浄剤は前記グリコールエーテル（Ａ）
、前記ノニオン界面活性剤ＩＢ）のほかに第三成分とし
ては塩基性アミノ酸を含有することが必須とされる。該
塩基性アミノ酸としては、アルギニン、リシンのごとき
複素環を有しないもの、更にはヒスチジン、トリプトフ
ァン、プロリン、オキシプロリンのごとき複素環を有す
るものが該当し、これらは単独でまたは組み合わせて使
用することができる。好ましくは、アルギニン、リシン
が該当する。なお、アミノ酸としては前記のほかに多種
のものがあるが、いずれも本発明目的を達成しつる第三
成分とはなりえない。or a phenyl group substituted with a linear or branched alkyl group having 7 to 12 carbon atoms, where n is an integer of 2 to 20, preferably an integer of 3 to 16. ) The cleaning agent for the rosin-based solder flux of the present invention is the glycol ether (A).
In addition to the nonionic surfactant IB), it is essential to contain a basic amino acid as a third component. The basic amino acids include those without a heterocycle such as arginine and lysine, and those with a heterocycle such as histidine, tryptophan, proline, and oxyproline, and these may be used alone or in combination. I can do it. Preferably, arginine and lysine are applicable. Although there are many types of amino acids in addition to those mentioned above, none of them can serve as the third component that achieves the purpose of the present invention.
前記ｆＡ）成分と＋Ｂ）成分と［Ｃ）成分との使用割合
は、特に制限はされないが１通常−は順にｌＯ〜９５重
量ｉ程度 ５〜９０１１程度：０．１〜２０重Ｎ％程度
であり、好ましくは順に７０〜９０重量％程度＝５〜３
０１１程度二０．５〜１０重量Ｘ程度である。The proportions of the above fA) component, +B) component, and [C) component are not particularly limited, but 1 usually - is about 10 to 95 weight i in order, 5 to 9011 grade: about 0.1 to 20 weight N%. Yes, preferably about 70 to 90% by weight = 5 to 3
The weight is about 0.011 and about 0.5 to 10 weight.
前記ｆＡｌ成分、ｆＢｌ成分およびｆｃ）成分とから構
成される本発明の洗浄剤は、ロジン系ハンダフラックス
、特にアッセンブリー用ロジン系ハンダフラックスの洗
浄に適用される。該フラックスとしては、ロジン、変性
ロジンなどのロジン類を主成分とする非活性ロジンフラ
ックス、該ロジン類と活性化剤（例えば、トリエタノー
ルアミン塩酸塩、トリエチレンテトラミン塩酸塩、シク
ロヘキシルアミン塩酸塩、塩酸アニリンなどのアミン化
合物の有機酸または無機酸の塩など）とを主成分とする
活性ロジンフラックスが一般的である。必要により消泡
剤、酸化防止剤などの添加剤を配合することができ、該
添加剤の使用量は洗浄剤に対して０．１ｚ程度以下とさ
れる。本発明の洗浄剤は、アッセンブリー用の活性ロジ
ンフラックスに通用した場合その使用意義が大きい。The cleaning agent of the present invention comprising the fAl component, fBl component and fc) component is applied to cleaning rosin-based solder flux, particularly rosin-based solder flux for assembly. The flux includes an inactive rosin flux mainly composed of rosins such as rosin and modified rosin, and rosins and activators (for example, triethanolamine hydrochloride, triethylenetetramine hydrochloride, cyclohexylamine hydrochloride, etc.). Activated rosin fluxes whose main components are organic or inorganic acid salts of amine compounds such as aniline hydrochloride are common. If necessary, additives such as antifoaming agents and antioxidants can be added, and the amount of these additives used is about 0.1z or less relative to the cleaning agent. The cleaning agent of the present invention has great significance when used as an active rosin flux for assembly.
本発明の洗浄剤を基板上のロジンフラックスに接触させ
るには以下の手段を採用しつる。すなわち、本発明の有
効成分たる前記（Ａｌ成分、ｆｉｌ成分およびｔｃｒ
成分からなる洗浄剤を、そのままでまたは水で溶解して
、有効成分の濃度が通常１００未満〜ＩＯ重量％程度と
なるよう調整する。かくして得られた水溶液または有効
成分そのものに基板を直接浸漬して洗浄する方法、該水
ｉ＝をスプレー装置を使用してフラッシュする方法、あ
るいは機械約手９によりブラッシングしながらする方法
などを適宜選択して採用することができる。本発明の洗
浄剤を適用する際の条件としては、洗浄剤中の有効成分
の濃度、該成分の使用比率、除去すべきフラックスの種
類等により適宜選択すれば良く、一般に除去すべきフラ
ックスを洗浄除去するのに有効な温度と時間で洗浄剤を
フラックスに接触させる。洗浄剤の使用時の温度は室温
程度から８０℃程度であり、通常、５０〜７０℃程度と
するのが好ましい。基板上のハンダフラックスを、例え
ば５０〜７０℃程度の温度において浸漬法により除去す
る場合、−Ｍには本発明の洗浄剤にハンダフラックスを
有する基板を約 １〜５分程度浸漬すれば、良好に除去
することができる。The following means are employed to bring the cleaning agent of the present invention into contact with the rosin flux on the substrate. That is, the active ingredients of the present invention (Al component, fil component, and tcr
The cleaning agent consisting of the ingredients is adjusted as it is or dissolved in water so that the concentration of the active ingredient is usually less than 100% to about 10% by weight. A method of directly immersing the substrate in the thus obtained aqueous solution or the active ingredient itself for cleaning, a method of flushing out the water using a spray device, a method of cleaning while brushing with a mechanical hand 9, etc. are selected as appropriate. and can be adopted. Conditions for applying the cleaning agent of the present invention may be appropriately selected depending on the concentration of the active ingredient in the cleaning agent, the usage ratio of the ingredient, the type of flux to be removed, etc. Generally, the flux to be removed is cleaned. Contact the cleaning agent with the flux at a temperature and time effective to remove it. The temperature during use of the cleaning agent is from about room temperature to about 80°C, and is usually preferably about 50 to 70°C. When removing solder flux on a board by dipping at a temperature of, for example, 50 to 70°C, -M can be effectively removed by immersing the board with solder flux in the cleaning agent of the present invention for about 1 to 5 minutes. can be removed.
こうしてフラックスを除去された基板は仕上げ処理とし
て水洗を行い残留している可能性のある洗浄剤を完全に
除去するのが好ましい。このような水洗処理により、基
板の清浄度は、非常に高いものとなる。本発明の洗浄剤
は、従来のハロゲン化炭化水素系の洗浄剤を用いた場合
と同様またはそれ以上のフラックス洗浄効果を発揮し、
高レベルの基板洗浄度を達成する。The substrate from which the flux has been removed is preferably washed with water as a finishing treatment to completely remove any cleaning agent that may remain. By such water washing treatment, the cleanliness of the substrate becomes extremely high. The cleaning agent of the present invention exhibits flux cleaning effects similar to or better than those using conventional halogenated hydrocarbon cleaning agents,
Achieve a high level of substrate cleanliness.
（実施例）
以下、実施例を挙げ１本発明を更に詳しく説明するが、
本発明はこれら実施例のみに限定されるものではない。(Example) Hereinafter, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited only to these examples.
実施例１
ジエチレングリコールジメチルエーテル５９．５重量部
とポリエチレングリコールアルキルエーテル型ノニオン
性界面活性剤（第一工業製薬■製、商品名［ノイゲンＥ
Ｔ−１３５Ｊ 、一般式（２）においてＲ４は炭素数１
２〜１４の分岐鎖アルキル基、ｎは９である） ９．４
５重量部およびアルギニン１．０５重量部および純水３
０重量部を混合して本発明の洗浄剤を調製した。Example 1 59.5 parts by weight of diethylene glycol dimethyl ether and a polyethylene glycol alkyl ether type nonionic surfactant (manufactured by Daiichi Kogyo Seiyaku ■, trade name [Neugen E])
T-135J, in general formula (2), R4 has 1 carbon number
2 to 14 branched alkyl groups, n is 9) 9.4
5 parts by weight, 1.05 parts by weight of arginine, and 3 parts by weight of pure water
A cleaning agent of the present invention was prepared by mixing 0 parts by weight.
方、プリント配線基板（銅張積層板）の全面に、ロジン
系フラックス（ＬＯＮＣＯ社製、商品名ｒ Ｒｅ５ｉｎ
Ｆｌｕｘ ＃７７−２５ Ｊ ）を塗布し、１３０℃
で２分間乾燥した後、２６０℃で５秒間、ハンダフロを
行ない供試基板を調製した。On the other hand, apply rosin-based flux (manufactured by LONCO, trade name: Re5in) to the entire surface of the printed wiring board (copper-clad laminate).
Flux #77-25 J) was applied and heated to 130°C.
After drying for 2 minutes at 260° C., solder flow was performed at 260° C. for 5 seconds to prepare a test board.
この基板を室温下に、上記の洗浄剤に浸漬し、フラック
スの除去の度合いを以下の判定基準に基づき目視判定し
た。結果は第１表に示す。This substrate was immersed in the above cleaning agent at room temperature, and the degree of flux removal was visually evaluated based on the following criteria. The results are shown in Table 1.
○ 良好に除去できる
△ 若干残存する
× かなり残存する
次いで、上記基板を水洗および乾燥した後、オメガメー
ター６００３Ｅ （Ｋ ＥＮ Ｋ Ｏ社製、商品名）を
用いて、基板の清浄度（残留イオン濃度）を測定した。○ Can be removed well △ Slightly remaining × Significantly remaining Next, after washing and drying the above substrate, the cleanliness of the substrate (residual ion concentration ) was measured.
結果は第１表に示す。The results are shown in Table 1.
実施例２〜６Ｊ５よび比較例１
実施例１において、洗浄剤組成比または洗浄時の浸漬温
度をそれぞれ第１表に示すように変化させた他は同様に
して評価を行った。結果は第１表に示す。Examples 2 to 6J5 and Comparative Example 1 Evaluations were conducted in the same manner as in Example 1, except that the composition ratio of the cleaning agent or the immersion temperature during cleaning were changed as shown in Table 1. The results are shown in Table 1.
実施例７〜１３および比較例２〜６
実施例１において、ｆＡｌ成分、ｉＢ＋成分およびＦＣ
＋成分のうちのいずれか少なくとも一種を第１表に示す
ように変化させた他は同様にして評価を行った。結果は
第１表に示す。Examples 7 to 13 and Comparative Examples 2 to 6 In Example 1, fAl component, iB+ component, and FC
Evaluations were conducted in the same manner except that at least one of the + components was changed as shown in Table 1. The results are shown in Table 1.
面、第１表中の使用界面活性剤（（Ｂ）成分）は［ソル
ゲンＴｗ２０Ｊ （第−工業製薬■製、ポリオキシエ
チレンソルビタンモノラウレート、エチレンオキシド平
均付加モル数１２）、「エバン４２０」（第−工業製薬
味製、ポリオキシエチレンポリオキシブロビレンブロツ
クポリマー）
［以下余白］
次の通りである。The surfactants used (component (B)) in Table 1 were [Solgen Tw20J (manufactured by Dai-Kogyo Seiyaku ■, polyoxyethylene sorbitan monolaurate, average number of added moles of ethylene oxide 12), "Evan 420" ( Polyoxyethylene polyoxybrobylene block polymer (manufactured by Dai-Kogyo Yakuhin Aji Co., Ltd.) [Margins below] It is as follows.
［ノイゲンＥＡ−１２０Ｊ （第一工業製薬■製、ポ
リエチレングリコールノニルフェニルエーテル型ノニオ
ン性界面活性剤、一般式（２）においてＲ４はノニルフ
ェニル基であり、ｎは５である）、ポリエチレングリコ
ールドデシルフェニルエーテル型ノニオン性界面活性剤
（第一工業製薬■製、商品名「ノイゲンＥＡ−１４３Ｊ
、一般式（２）においてＲ４はドデシルフェニル基で
あり、ｎは１０である）（本発明の効果）
本発明によれば、以下の効果が奏される（１）本発明の
洗浄剤は非ハロゲン系の洗浄剤であるため、フロン系洗
浄剤に見られるようなオゾン層破壊の問題はない。[Noigen EA-120J (manufactured by Daiichi Kogyo Seiyaku ■, polyethylene glycol nonylphenyl ether type nonionic surfactant, in general formula (2), R4 is a nonylphenyl group, and n is 5), polyethylene glycol decylphenyl Ether-type nonionic surfactant (manufactured by Dai-ichi Kogyo Seiyaku ■, trade name: "Neugen EA-143J")
, in the general formula (2), R4 is a dodecylphenyl group, and n is 10) (Effects of the present invention) According to the present invention, the following effects are achieved (1) The cleaning agent of the present invention is a non-containing Since it is a halogen-based cleaning agent, it does not cause the problem of ozone layer depletion that occurs with fluorocarbon-based cleaning agents.
（２）本発明の洗浄剤は、１ｉｉ７記グリコ一ルエーテ
ル系化合物を含有しているため水を含有しない状態では
、それ自体引火点を有するもので：′ｉあるが、３化合
物の引火、ｔＪ５．が７０℃程度であり日本国消防法で
いう第三石油類に属するものであるため、その使用にあ
たっては特別に防爆設計された専用の洗浄装置を使用す
る必要はなく、従来のフロン洗浄に際して使用されでい
た各種の市叛洸浄装置をそのままで、または若モ仕様変
更することにより容易に使用できる。(2) Since the cleaning agent of the present invention contains the glycoyl ether compound described in 1ii7, it has a flash point itself in the absence of water. ．． Since the temperature is around 70℃ and it belongs to the Type 3 petroleum class according to the Japanese Fire Service Act, there is no need to use a special explosion-proof cleaning device when using it, and it can be used for conventional Freon cleaning. It is possible to easily use various types of city riot cleaning equipment that have been used as is or by modifying the specifications.
（３）本発明の洗浄剤を水希釈して使用した場合には、
洗浄剤の引火危険性の低減、洗浄剤の低廉化、υ１水処
理負荷の大幅低減などを達成でき、しかも充分な洗浄力
を保持することができる。(3) When the cleaning agent of the present invention is used after being diluted with water,
It is possible to reduce the risk of ignition of the cleaning agent, to lower the cost of the cleaning agent, to significantly reduce the υ1 water treatment load, and moreover, to maintain sufficient cleaning power.
（４）本発明の？′Ｉｃ／４３剤は、臭気が非常に少な
く、この声でも満足できる。(4) What about the present invention? 'Ic/43 agent has very little odor, and even this review is satisfactory.
このように、本発明によれば、洗浄力にｉｈるとともに
、環境破壊、引火性、臭気などの沖、でも十分に満足し
つる非ハロゲン系のハンダフラックスｆｃ浄剤および該
洗浄剤を用いるハンダフランクスを洗浄方法が提供され
る。As described above, according to the present invention, a non-halogen solder flux FC detergent that has high cleaning power and is fully satisfactory despite environmental damage, flammability, odor, etc., and a solder flux using this detergent are provided. A method of cleaning franks is provided.
荒川化学工業株式会社Arakawa Chemical Industry Co., Ltd.
Claims (1)
ル基を、Ｒ＾２は炭素数１〜５のアルキル基、Ｒ＾３は
水素原子またはメチル基を、ｍは２〜４の整数を示す）
で表されるグリコールエーテル系化合物のうちの少なく
とも一種（Ａ）、ノニオン性界面活性剤（Ｂ）、および
塩基性アミノ酸（Ｃ）からなる混合物を有効成分として
含有することを特徴とするロジン系ハンダフラックスの
洗浄剤。 ［２］前記ノニオン性界面活性剤（Ｂ）が、一般式（２
）： Ｒ＾４Ｏ−（ＣＨ＿２ＣＨ＿２Ｏ）＿ｎ−Ｈ（式中、Ｒ
＾４は炭素数６〜２０の直鎖もしくは分岐鎖アルキル基
、フェニル基、または炭素数７〜１２の直鎖もしくは分
岐鎖アルキル基で置換されたフェニル基を、ｎは２〜２
０の整数を示す。）で表される界面活性剤である請求項
１記載の洗浄剤。 ［３］前記塩基性アミノ酸（Ｃ）がアルギニンおよび／
またはリシンである請求項１または２記載の洗浄剤。 ［４］前記グリコールエーテル系化合物（Ａ）とノニオ
ン性界面活性剤（Ｂ）と塩基性アミノ酸（Ｃ）の使用比
率が順に１０〜９５重量％：５〜９０重量％：０．１〜
２０重量％である請求項１〜３のいずれかに記載の洗浄
剤。 ［５］請求項１〜４のいずれかに記載の洗浄剤をロジン
系ハンダフラックスと接触させることを特徴とするロジ
ン系ハンダフラックスの洗浄方法。[Claims] [1] General formula (1): ▲There are mathematical formulas, chemical formulas, tables, etc.▼ (In the formula, R^1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and R^2 is an alkyl group having 1 to 5 carbon atoms, R^3 represents a hydrogen atom or a methyl group, and m represents an integer of 2 to 4)
A rosin-based solder containing as an active ingredient a mixture consisting of at least one of the glycol ether compounds (A), a nonionic surfactant (B), and a basic amino acid (C). Flux cleaning agent. [2] The nonionic surfactant (B) has the general formula (2
): R^4O-(CH_2CH_2O)_n-H (in the formula, R
^4 is a straight chain or branched alkyl group having 6 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a straight chain or branched alkyl group having 7 to 12 carbon atoms, and n is 2 to 2
Indicates an integer of 0. ) The cleaning agent according to claim 1, which is a surfactant represented by: [3] The basic amino acid (C) is arginine and/or
The cleaning agent according to claim 1 or 2, which is ricin or ricin. [4] The usage ratio of the glycol ether compound (A), nonionic surfactant (B), and basic amino acid (C) is 10 to 95% by weight: 5 to 90% by weight: 0.1 to
The cleaning agent according to any one of claims 1 to 3, which contains 20% by weight. [5] A method for cleaning rosin-based solder flux, which comprises bringing the cleaning agent according to any one of claims 1 to 4 into contact with rosin-based solder flux.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20720190A JPH0491199A (en) | 1990-08-03 | 1990-08-03 | Cleanser for rosin solder flux and method for cleansing rosin solder flux with the cleanser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20720190A JPH0491199A (en) | 1990-08-03 | 1990-08-03 | Cleanser for rosin solder flux and method for cleansing rosin solder flux with the cleanser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0491199A true JPH0491199A (en) | 1992-03-24 |
Family
ID=16535915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20720190A Pending JPH0491199A (en) | 1990-08-03 | 1990-08-03 | Cleanser for rosin solder flux and method for cleansing rosin solder flux with the cleanser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0491199A (en) |
-
1990
- 1990-08-03 JP JP20720190A patent/JPH0491199A/en active Pending
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