JPH0457900A - Detergent for rosin solder flux and method for washing rosin solder flux using said detergent - Google Patents
Detergent for rosin solder flux and method for washing rosin solder flux using said detergentInfo
- Publication number
- JPH0457900A JPH0457900A JP17065890A JP17065890A JPH0457900A JP H0457900 A JPH0457900 A JP H0457900A JP 17065890 A JP17065890 A JP 17065890A JP 17065890 A JP17065890 A JP 17065890A JP H0457900 A JPH0457900 A JP H0457900A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning agent
- acid
- solder flux
- rosin
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims abstract description 47
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 title claims abstract description 29
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 title claims abstract description 29
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 29
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims description 7
- 239000003599 detergent Substances 0.000 title abstract 6
- 238000005406 washing Methods 0.000 title description 3
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 19
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 11
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000004480 active ingredient Substances 0.000 claims abstract description 8
- 150000003839 salts Chemical class 0.000 claims abstract description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 6
- 239000011574 phosphorus Substances 0.000 claims abstract description 6
- 229920000137 polyphosphoric acid Polymers 0.000 claims abstract description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000012459 cleaning agent Substances 0.000 claims description 56
- -1 glycol ether compound Chemical class 0.000 claims description 29
- 238000004140 cleaning Methods 0.000 claims description 22
- 239000002253 acid Substances 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 229910052783 alkali metal Inorganic materials 0.000 claims description 4
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical class [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- GIXFALHDORQSOQ-UHFFFAOYSA-N 2,4,6,8-tetrahydroxy-1,3,5,7,2$l^{5},4$l^{5},6$l^{5},8$l^{5}-tetraoxatetraphosphocane 2,4,6,8-tetraoxide Chemical compound OP1(=O)OP(O)(=O)OP(O)(=O)OP(O)(=O)O1 GIXFALHDORQSOQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004254 Ammonium phosphate Substances 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-L Phosphate ion(2-) Chemical compound OP([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-L 0.000 claims description 3
- 235000019289 ammonium phosphates Nutrition 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229920000388 Polyphosphate Polymers 0.000 claims description 2
- AZSFNUJOCKMOGB-UHFFFAOYSA-N cyclotriphosphoric acid Chemical compound OP1(=O)OP(O)(=O)OP(O)(=O)O1 AZSFNUJOCKMOGB-UHFFFAOYSA-N 0.000 claims description 2
- 239000001205 polyphosphate Substances 0.000 claims description 2
- 235000011176 polyphosphates Nutrition 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 claims description 2
- 229940048102 triphosphoric acid Drugs 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- 229910000318 alkali metal phosphate Inorganic materials 0.000 claims 1
- 150000001340 alkali metals Chemical class 0.000 claims 1
- ZRIUUUJAJJNDSS-UHFFFAOYSA-N ammonium phosphates Chemical class [NH4+].[NH4+].[NH4+].[O-]P([O-])([O-])=O ZRIUUUJAJJNDSS-UHFFFAOYSA-N 0.000 claims 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 claims 1
- 229920001276 ammonium polyphosphate Polymers 0.000 claims 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- 235000021317 phosphate Nutrition 0.000 claims 1
- 229940005657 pyrophosphoric acid Drugs 0.000 claims 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052736 halogen Inorganic materials 0.000 abstract description 5
- 150000002367 halogens Chemical class 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 229920001223 polyethylene glycol Polymers 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000002202 Polyethylene glycol Substances 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 150000008282 halocarbons Chemical class 0.000 description 3
- 239000000271 synthetic detergent Substances 0.000 description 3
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000007127 saponification reaction Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004065 wastewater treatment Methods 0.000 description 2
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 description 1
- QCNZRFLQCBZYMO-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]pentane Chemical compound CCCCCOCCOCCOCCCC QCNZRFLQCBZYMO-UHFFFAOYSA-N 0.000 description 1
- VXVGKMGIPAWMJC-UHFFFAOYSA-N 1-[2-(2-ethoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCC VXVGKMGIPAWMJC-UHFFFAOYSA-N 0.000 description 1
- GNVFCWJZMJINCS-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCC GNVFCWJZMJINCS-UHFFFAOYSA-N 0.000 description 1
- CWXNQBGBKAMLPP-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]pentane Chemical compound CCCCCOCCOCCOCCC CWXNQBGBKAMLPP-UHFFFAOYSA-N 0.000 description 1
- BOGFHOWTVGAYFK-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCCC BOGFHOWTVGAYFK-UHFFFAOYSA-N 0.000 description 1
- KKQVUWHSUOGDEI-UHFFFAOYSA-N 2-(2-butan-2-yloxyethoxy)ethanol Chemical compound CCC(C)OCCOCCO KKQVUWHSUOGDEI-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- FIIFPAUBZGVKCI-UHFFFAOYSA-N 2-(2-pentan-2-yloxyethoxy)ethanol Chemical compound CCCC(C)OCCOCCO FIIFPAUBZGVKCI-UHFFFAOYSA-N 0.000 description 1
- RTKWMMLLJKMZQU-UHFFFAOYSA-N 2-(2-pentan-3-yloxyethoxy)ethanol Chemical compound CCC(CC)OCCOCCO RTKWMMLLJKMZQU-UHFFFAOYSA-N 0.000 description 1
- PWTNRNHDJZLBCD-UHFFFAOYSA-N 2-(2-pentoxyethoxy)ethanol Chemical compound CCCCCOCCOCCO PWTNRNHDJZLBCD-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- LSCNICLUNGUIRB-SNVBAGLBSA-N 2-[2-[(2R)-2-methylpentoxy]ethoxy]ethanol Chemical compound CCC[C@@H](C)COCCOCCO LSCNICLUNGUIRB-SNVBAGLBSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- GJMPSRSMBJLKKB-UHFFFAOYSA-N 3-methylphenylacetic acid Chemical compound CC1=CC=CC(CC(O)=O)=C1 GJMPSRSMBJLKKB-UHFFFAOYSA-N 0.000 description 1
- HAAZMOAXEMIBAJ-UHFFFAOYSA-N 4-chloro-2-methylquinazoline Chemical compound C1=CC=CC2=NC(C)=NC(Cl)=C21 HAAZMOAXEMIBAJ-UHFFFAOYSA-N 0.000 description 1
- 229920001213 Polysorbate 20 Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 description 1
- 229910000387 ammonium dihydrogen phosphate Inorganic materials 0.000 description 1
- MMCPOSDMTGQNKG-UJZMCJRSSA-N aniline;hydrochloride Chemical compound Cl.N[14C]1=[14CH][14CH]=[14CH][14CH]=[14CH]1 MMCPOSDMTGQNKG-UJZMCJRSSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 229940090012 bentyl Drugs 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910000388 diammonium phosphate Inorganic materials 0.000 description 1
- 235000019838 diammonium phosphate Nutrition 0.000 description 1
- GUBNMFJOJGDCEL-UHFFFAOYSA-N dicyclomine hydrochloride Chemical group [Cl-].C1CCCCC1C1(C(=O)OCC[NH+](CC)CC)CCCCC1 GUBNMFJOJGDCEL-UHFFFAOYSA-N 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000002529 flux (metallurgy) Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 235000019837 monoammonium phosphate Nutrition 0.000 description 1
- XPVOJYDIBHYVFL-UHFFFAOYSA-N n'-[2-(2-aminoethylamino)ethyl]ethane-1,2-diamine;hydrochloride Chemical compound Cl.NCCNCCNCCN XPVOJYDIBHYVFL-UHFFFAOYSA-N 0.000 description 1
- GSGDTSDELPUTKU-UHFFFAOYSA-N nonoxybenzene Chemical compound CCCCCCCCCOC1=CC=CC=C1 GSGDTSDELPUTKU-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 1
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 235000015424 sodium Nutrition 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 229940117957 triethanolamine hydrochloride Drugs 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ロジン系ハンダフラックスの洗浄剤、特にア
ッセンブリー用ロジン系ハンダフラックスの洗浄剤なら
びに該洗浄剤を用いてなるロジン系ハンダフラックスの
洗浄方法に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a cleaning agent for rosin-based solder flux, particularly a cleaning agent for rosin-based solder flux for assembly, and a cleaning agent for rosin-based solder flux using the cleaning agent. Regarding the method.
（従来の技術）
ロジン系ハンダフラックスはプリント回路板やプリント
配線基板などのモジュールの製作にあたって使用される
。ハンダ処理の目的は、一般には基板と入出力ビンとの
接着強度を高めたり、接点の酸化を防止して導電性を維
持するためであり、かかるハンダ処理の実効を図らんと
してハンダ付けに際してロジン系ハンダフラックスが使
用される。ハンダ付は終了後は、基板面からフラックス
のみを選択的にしかも完全に除去すべく洗浄剤が使用さ
れる。すなわち、フラックスの洗浄が不充分である場合
には、残留フラックスによる悪影響として、回路腐食が
起こったり、あるいは基板表面の電気絶縁性が低下し、
最終的には回路破損につながるという不利がある。その
ため、洗浄剤を使用して、残留フラックス、特にそれに
含有されている活性剤成分を除去することにより、前記
不利を解消している。(Prior Art) Rosin-based solder flux is used in the production of modules such as printed circuit boards and printed wiring boards. The purpose of soldering is generally to increase the adhesive strength between the board and the input/output bottle, and to prevent oxidation of the contacts and maintain conductivity. type solder flux is used. After soldering is completed, a cleaning agent is used to selectively and completely remove only the flux from the board surface. In other words, if the flux is not sufficiently cleaned, the residual flux may cause circuit corrosion, or the electrical insulation of the board surface may deteriorate.
This has the disadvantage of ultimately leading to circuit damage. Therefore, the disadvantages mentioned above are overcome by using cleaning agents to remove the residual flux, especially the activator components contained therein.
従来、ロジン系ハンダフラックスの洗浄剤としてはトリ
クロロエチレン、トリクロロトリフルオロエタン等のい
わゆるフロン等のハロゲン化炭化水素溶剤が使用されて
いる。ところが、オゾン層破壊などの環境汚染の問題か
ら、かかるハロゲン化炭化水素溶剤の使用規制が本格化
されつつあり、電機業界においてもいわゆるフロン代替
のハンダフランクスの洗浄剤の開発が急務となってきた
。Conventionally, halogenated hydrocarbon solvents such as so-called chlorofluorocarbons such as trichlorethylene and trichlorotrifluoroethane have been used as cleaning agents for rosin-based solder flux. However, due to environmental pollution problems such as ozone layer depletion, restrictions on the use of such halogenated hydrocarbon solvents are becoming more serious, and the development of so-called fluorocarbon substitute cleaning agents for solder franking has become an urgent need in the electronics industry. .
近時、非ハロゲン系のハンダフラックス洗浄剤が種々開
発されている。例えば、アルカリケン化型の場合には、
水溶液タイプであるため引火性の問題はないが、洗浄に
際し加熱下に長時間の液接触せしめることが必要となり
洗浄効率が低いこと、更には基板の金属部の腐食が懸念
されるなどの不利がある。Recently, various non-halogen solder flux cleaning agents have been developed. For example, in the case of alkali saponification type,
Since it is an aqueous solution type, there is no problem with flammability, but there are disadvantages such as low cleaning efficiency as it requires contact with the liquid for a long time under heating, and furthermore, there is a concern that the metal parts of the board may corrode. be.
一方、アルカリケン化型でない洗浄剤も開発されてはい
るものの、洗浄力、毒性、臭気、引火性などのすべての
要求性能を完全に満足しうるものはいまだ見い出されて
いないのが現状である。On the other hand, although non-alkali saponification type cleaning agents have been developed, the current situation is that no one has yet been found that completely satisfies all required performance such as cleaning power, toxicity, odor, and flammability. .
そのため、本発明者らは前記諸問題を解決すべく鋭意検
討を重ねた結果として、特定のグリコールエーテル系化
合物とノニオン性界面活性剤とを必須成分として使用し
た場合には、前記課題を解決しうることを見出し、特願
平１−２９１９０５号に記載の発明を完成し、すでに特
許出願を行った。Therefore, as a result of intensive studies to solve the above problems, the present inventors have found that the above problems can be solved when a specific glycol ether compound and a nonionic surfactant are used as essential components. He completed the invention described in Japanese Patent Application No. 1-291905 and has already filed a patent application.
ハンダフラックス洗浄剤が水希釈時にも充分な洗浄力を
保持することができる場合には、洗浄剤の引火危険性の
低減、洗浄剤の低廉化、排水処理負荷の大幅低減などを
達成できるというメリット・があり、前記特許出願明細
書中においても該洗浄剤の使用態様として水希釈して使
用しつる旨記載されている。しかしながら、該発明によ
っても水希釈して使用した場合には、その洗浄力の低下
傾向が認められる。If the solder flux cleaning agent can maintain sufficient cleaning power even when diluted with water, the benefits include reducing the risk of ignition of the cleaning agent, reducing the cost of the cleaning agent, and significantly reducing the burden of wastewater treatment.・The above-mentioned patent application specification also states that the cleaning agent is used after being diluted with water. However, even according to the invention, when used diluted with water, there is a tendency for the detergency to decrease.
（発明が解決しようとする課題）
本発明は、洗浄力、特に水希釈時の洗浄力に優れ、しか
も環境特性、臭気、引火性などの点でも実質上満足しつ
る非ハロゲン系のハンダフラックス洗浄剤、ならびに該
洗浄剤を用いる洗浄方法を提供することを目的とする。(Problems to be Solved by the Invention) The present invention provides a non-halogen solder flux cleaning product that has excellent cleaning power, especially when diluted with water, and is substantially satisfactory in terms of environmental characteristics, odor, and flammability. An object of the present invention is to provide a cleaning agent and a cleaning method using the cleaning agent.
（課題を解決するための手段）
本発明者らは前記目的を達成すべく鋭意検討を重ねた結
果、特定のグリコールエーテル系化合物とノニオン性界
面活性剤と無機リン系化合物を必須成分としてなる混合
物を使用した場合には、前記課題を解決しうることを見
出し本発明を完成するに至った。(Means for Solving the Problem) As a result of intensive studies to achieve the above object, the present inventors have developed a mixture comprising a specific glycol ether compound, a nonionic surfactant, and an inorganic phosphorus compound as essential components. The present inventors have found that the above-mentioned problems can be solved by using the above method, and have completed the present invention.
すなわち本発明は、
■一般式（１）：
％式％）
（式中、Ｒ１は水素原子または炭素数１〜５のアルキル
基を、Ｒ２は炭素数１〜５のアルキル基、Ｒ３は水素原
子またはメチル基を、ｍは２〜４の整数を示す）で表さ
れるグリコールエーテル系化合物のうちの少なくとも一
種（Ａ）、ノニオン性界面活性剤（Ｂ）、ならびにリン
酸、リン酸水素、ポリリン酸およびこれらの塩からなる
群から選ばれる少なくとも一種の無機リン系化合物（Ｃ
）からなる混合物を有効成分として含有することを特徴
とするロジン系ハンダフラックスの洗浄剤、ならびに
該洗浄剤をロジン系ハンダフラックスと接触させること
を特徴とするロジン系ハンダフラックスの洗浄方法に係
る。That is, the present invention has the following characteristics: (1) General formula (1): % formula %) (In the formula, R1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R2 is an alkyl group having 1 to 5 carbon atoms, and R3 is a hydrogen atom. or a methyl group, m is an integer of 2 to 4) (A), a nonionic surfactant (B), and phosphoric acid, hydrogen phosphate, polyphosphorus. At least one inorganic phosphorus compound selected from the group consisting of acids and salts thereof (C
) A cleaning agent for rosin-based solder flux characterized by containing a mixture consisting of the following as an active ingredient, and a method for cleaning rosin-based solder flux characterized by bringing the cleaning agent into contact with rosin-based solder flux.
本発明のロジン系ハンダフラックスの洗浄剤の成分のう
ち、前記−船底（１）で表されるグリコルエーテル系化
合物としては、ジエチレングリコールモノメチルエーテ
ル、ジエチレングリコールジメチルエーテル、ジエチレ
ングリコールモノエチルエーテル、ジエチレングリコー
ルジエチルエーテル、ジエチレングリコールメチルエチ
ルエテル、ジエチレングリコールモノプロピルエーテル
、ジエチレングリコールジプロピルエーテル、ジエチレ
ングリコールメチルプロビルエーテル、ジエチレングリ
コールエチルプロピルエーテル、ジエチレングリコール
モノブチルエーテル、ジエチレングリコールジブチルエ
ーテル、ジエチレングリコールメチルブチルエーテル、
ジエチレングリコールエチルブチルエーテル、ジエチレ
ングリコールプロピルブチルエーテル、ジエチレングリ
コールモノペンチルエーテル、ジエチレングリコールジ
エチルエーテル、ジエチレングリコールメチルペンチル
エーテル、ジエチレングリコールエチルベンチルエーテ
ル、ジエチレングリコールプロビルペンチルエーテル、
ジエチレングリコールブチルペンチルエーテル；これら
に対応するトリーもしくはテトラエチレングリコールエ
ーテル類：これらに対応するジー、トリーもしくはテト
ラプロピレングリコールエーテル類を例示できる。これ
ら化合物は単独でまたは２種以上を適宜組み合せて使用
できる。Among the components of the rosin-based solder flux cleaning agent of the present invention, the glycol ether compounds represented by -bottom (1) include diethylene glycol monomethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, and diethylene glycol methyl. Ethyl ether, diethylene glycol monopropyl ether, diethylene glycol dipropyl ether, diethylene glycol methylpropyl ether, diethylene glycol ethylpropyl ether, diethylene glycol monobutyl ether, diethylene glycol dibutyl ether, diethylene glycol methylbutyl ether,
Diethylene glycol ethyl butyl ether, diethylene glycol propyl butyl ether, diethylene glycol monopentyl ether, diethylene glycol diethyl ether, diethylene glycol methyl pentyl ether, diethylene glycol ethyl bentyl ether, diethylene glycol propyl pentyl ether,
Examples include diethylene glycol butyl pentyl ether; tri- or tetraethylene glycol ethers corresponding to these; and di-, tri- or tetrapropylene glycol ethers corresponding to these. These compounds can be used alone or in an appropriate combination of two or more.
本発明のロジン系ハンダフラックスの洗浄剤の成分のう
ち、ノニオン性界面活性剤としては、そのイオン性がノ
ニオン性である限り特に制限はなく、各種公知のものを
採用しつる。その具体例としては、ポリオキシエチレン
アルキル（Ｃ，＜）エーテル、ポリオキシエチレンフェ
ノールエーテル、ポリオキシエチレンアルキルフェノー
ルエーテルなどのポリエチレングリコールエーテル型ノ
ニオン性界面活性剤；ポリエチレングリコールモノエス
テル、ポリエチレングリコールジエステルなどのポリエ
チレングリコールエステル型ノニオン性界面活性剤：高
級脂肪族アミンのエチレンオキサイド付加物；脂肪酸ア
ミドのエチレンオキサイド付加物；ソルビタン脂肪酸エ
ステル、ショ糖脂肪酸エステルなどの多価アルコール型
ノニオン性界面活性剤；脂肪酸アルカノールアミドなど
、更にはこれらに対応するポリオキシプロピレン系ノニ
オン性界面活性剤およびポリオキシエチレンポリオキシ
ブロビレン共重合型ノニオン性界面活性剤をあげること
ができる。これらノニオン性界面活性剤は１種単独でま
たは２種以上組合せて使用できる。Among the components of the rosin-based solder flux cleaning agent of the present invention, the nonionic surfactant is not particularly limited as long as its ionicity is nonionic, and various known surfactants may be used. Specific examples include polyethylene glycol ether type nonionic surfactants such as polyoxyethylene alkyl (C, <) ether, polyoxyethylene phenol ether, and polyoxyethylene alkyl phenol ether; polyethylene glycol monoester, polyethylene glycol diester, etc. Polyethylene glycol ester type nonionic surfactants: ethylene oxide adducts of higher aliphatic amines; ethylene oxide adducts of fatty acid amides; polyhydric alcohol type nonionic surfactants such as sorbitan fatty acid esters and sucrose fatty acid esters; fatty acid alkanols Examples include amides, and corresponding polyoxypropylene nonionic surfactants and polyoxyethylene polyoxybrobylene copolymer nonionic surfactants. These nonionic surfactants can be used alone or in combination of two or more.
これらのうち、洗浄力の点から好ましいものとしては、
ポリエチレングリコールエーテル型ノニオン性界面活性
剤であり、更に好ましいものとしては下記−船底（２）
で表されるものが該当する。Among these, the preferred ones in terms of cleaning power are:
A polyethylene glycol ether type nonionic surfactant, more preferably the following - bottom (2)
The following are applicable.
Ｒ’ Ｏ−（ＣＨ，ＣＨ，Ｏ） ａ −Ｈ（式中、
Ｒ４は炭素数６〜２ｏ、好ましくは１０−１４の直鎖も
しくは分岐鎖アルキル基、フェニル基、または炭素数７
〜１２の直鎖もしくは分岐鎖アルキル基で置換されたフ
ェニル基を、ｎは２〜２０の整数、好ましくは３〜１６
の整数を示す、）本発明のロジン系ハンダフラックスの
洗浄剤の（Ｃ１成分としては、前記のようにリン酸、リ
ン酸水素、ポリリン酸およびこれらの塩が該当する。R' O-(CH,CH,O) a-H (in the formula,
R4 is a linear or branched alkyl group having 6 to 2 carbon atoms, preferably 10-14 carbon atoms, a phenyl group, or a carbon number 7
- phenyl group substituted with 12 linear or branched alkyl groups, n is an integer of 2 to 20, preferably 3 to 16
As described above, phosphoric acid, hydrogen phosphate, polyphosphoric acid, and salts thereof are applicable as the (C1 component) of the rosin-based solder flux cleaning agent of the present invention.
これらｆｃ）成分はいずれも、一般合成洗剤において、
合成洗剤の洗浄作用、可溶化力を向上させたり、不溶性
成分の再沈着防止などの目的で使用され、いわゆるビル
ダーと称される無機リン系化合物である。All of these fc) components are used in general synthetic detergents.
It is an inorganic phosphorus compound called a builder, which is used for the purpose of improving the cleaning action and solubilizing power of synthetic detergents, and preventing redeposition of insoluble components.
前記（Ｃ）成分の塩としてはアンモニウム塩、アルカリ
金属塩が好ましい。記（Ｃ１成分のうちリン酸水素塩と
しては、例えば、リン酸二水素アンモニウム、リン酸水
素二アンモニウム、酸性リン酸アンモニウムナトリウム
、酸性リン酸アンモニウムカリウムなどが挙げられる。The salt of component (C) is preferably an ammonium salt or an alkali metal salt. (Among C1 components, hydrogen phosphates include, for example, ammonium dihydrogen phosphate, diammonium hydrogen phosphate, sodium acidic ammonium phosphate, potassium acidic ammonium phosphate, etc.
ポリリン酸としては、例えばビロリン酸、トリリン酸、
トリメタリン酸、テトラメタリン酸、ヘキサメタリン酸
などが挙げられ、これらの塩としてはアンモニウム塩、
ナトリウム塩およびカリウム塩が好ましい。Examples of polyphosphoric acid include birophosphoric acid, triphosphoric acid,
Examples include trimetaphosphoric acid, tetrametaphosphoric acid, hexametaphosphoric acid, etc. Salts of these include ammonium salts,
Sodium and potassium salts are preferred.
本発明のロジン系ハンダフラックスの洗浄剤と一般合成
洗剤とは、使用目的、要求性能などの点で本来相違する
ものである。しかしながら、前記ＩＡ）成分およびｆＢ
＋成分のみからなるフラックスの洗浄剤においては、相
当量の水で希釈した場合にその洗浄力の低下が認められ
るという不利があり、かかる問題を（Ｃ）成分の添加に
より容易に改良することができるという意義がある。（
Ｃ）成分の塩の種類としては、特に制限はされないが通
常はアルカリ金属塩が好ましい。洗浄力の点から見て、
（Ｃ）成分のうち好ましいものとしてはポリリン酸およ
びポリリン酸塩、特に好ましくはテトラメタリン酸、ヘ
キサメタリン酸およびこれらの塩を挙げることができる
。The rosin-based solder flux cleaning agent of the present invention and general synthetic detergents are essentially different in terms of purpose of use, required performance, etc. However, the IA) component and fB
A flux cleaning agent consisting only of component (C) has the disadvantage that its cleaning power decreases when diluted with a considerable amount of water, and this problem can be easily improved by adding component (C). It is meaningful that it can be done. (
The type of salt of component C) is not particularly limited, but alkali metal salts are usually preferred. In terms of cleaning power,
Preferred among component (C) are polyphosphoric acid and polyphosphates, particularly preferably tetrametaphosphoric acid, hexametaphosphoric acid, and salts thereof.
前記ｆＡ）成分とｆＢｌ成分とｆｃ）成分との使用割合
は、特に制限はされないが、通常は順に１０〜９５重量
％程度：５〜９０重量を程度：０．１〜２０重Ｎ％程度
であり、好ましくは順に５０〜９０重量％程度：１０〜
４０重量を程度：０．５〜５ＪＩＮ％程度である。The proportions of the fA) component, fBl component, and fc) component used are not particularly limited, but usually about 10 to 95% by weight: 5 to 90% by weight and about 0.1 to 20% by weight. Yes, preferably about 50 to 90% by weight in order: 10 to
40 weight: about 0.5 to 5 JIN%.
＃ｉ７記（Ａ）成分、ｆＢ）成分およびｆｃ）成分とか
ら構成される本発明の洗浄剤は、ロジン系ハンダフラッ
クス、特にアッセンブリー用ロジン系ハンダフラックス
の洗浄に適用される。該フラックスとしては、ロジン、
変性ロジンなどのロジン類を主成分とする非活性ロジン
フラックス、該ロジン類と活性化剤（例えば、トリエタ
ノールアミン塩酸塩、トリエチレンテトラミン塩酸塩、
シクロヘキシルアミン塩酸塩、塩酸アニリンなどのアミ
ン化合物の有機酸または無機酸の塩など）とを主成分と
する活性ロジンフラックスが一般的である。必要により
消泡剤、酸化防止剤などの添加剤を配合することができ
、該添加剤の使用量は洗浄剤に対して０，１％程度以下
とされる０本発明の洗浄剤は、アッセンブリー用の活性
ロジンフラックスに適用した場合その使用意義が大きい
。#i7 The cleaning agent of the present invention comprising component (A), component fB) and component fc) is applied to cleaning rosin-based solder flux, particularly rosin-based solder flux for assembly. The flux includes rosin,
Inactive rosin flux mainly composed of rosin such as modified rosin, rosin and activator (for example, triethanolamine hydrochloride, triethylenetetramine hydrochloride,
Cyclohexylamine hydrochloride, aniline hydrochloride, and other organic or inorganic acid salts of amine compounds) are commonly used as activated rosin fluxes. If necessary, additives such as antifoaming agents and antioxidants can be added, and the amount of these additives used is about 0.1% or less of the cleaning agent.The cleaning agent of the present invention is suitable for assembly. It has great significance when applied to active rosin flux for commercial use.
本発明の洗浄剤を基板上のロジンフラックスに接触させ
るには以下の手段を採用しつる。すなわち、本発明の有
効成分たる前記（Ａｌ成分、ＦＢ＋成分および（Ｃ１成
分からなる洗浄剤を、そのままでまたは水で溶解して、
有効成分の濃度が通常１００未満〜ｌＯ重量ｉ程度とな
るよう調整する。か（して得られた水溶液または有効成
分そのものに基板を直接浸漬して洗浄する方法、該水溶
液をスプレー装置を使用してフラッシュする方法、ある
いは機械的手段によりブラッシングしながらする方法な
どを適宜選択して採用することができる。本発明の洗浄
剤を適用する際の条件としては、洗浄剤中の有効成分の
濃度、該成分の使用比率、除去すべきフラックスの種類
等により適宜選択すれば良（、一般に除去すべきフラッ
クスを洗浄除去するのに有効な温度と時間で洗浄剤をフ
ラックスに接触させる。洗浄剤の使用時の温度は室温程
度から８０℃程度であり、通常、５０〜７０℃程度とす
るのが好ましい。基板上のハンダフラックスを、例えば
５０〜７０℃程度の温度において浸漬法により除去する
場合、一般には本発明の洗浄剤にハンダフラックスを有
する基板を約１〜５分程度浸漬すれば、良好に除去する
ことができる。The following means are employed to bring the cleaning agent of the present invention into contact with the rosin flux on the substrate. That is, the cleaning agent consisting of the above-mentioned (Al component, FB + component and (C1 component), which is the active ingredient of the present invention, as it is or dissolved in water,
The concentration of the active ingredient is usually adjusted to be less than 100 to about 10 wt. (Cleaning by directly immersing the substrate in the aqueous solution or the active ingredient itself, flushing the aqueous solution using a spray device, or cleaning while brushing by mechanical means) as appropriate. The conditions for applying the cleaning agent of the present invention may be selected as appropriate depending on the concentration of the active ingredient in the cleaning agent, the usage ratio of the ingredient, the type of flux to be removed, etc. (In general, the cleaning agent is brought into contact with the flux at a temperature and time effective to wash and remove the flux to be removed. The temperature when using the cleaning agent is about room temperature to about 80°C, and usually 50 to 70°C. When removing solder flux on a substrate by a dipping method at a temperature of, for example, 50 to 70°C, generally the substrate having solder flux is soaked in the cleaning agent of the present invention for about 1 to 5 minutes. It can be removed well by immersion.
こうしてフラックスを除去された基板は仕上げ処理とし
て水洗を行い残留している可能性のある洗浄剤を完全に
除去するのが好ましい。このような水洗処理により、基
板の清浄度は、非常に高いものとなる。本発明の洗浄剤
は、従来のハロゲン化炭化水素系の洗浄剤を用いた場合
と同様またはそれ以上のフラックス洗浄効果を発揮し、
高レベルの基板洗浄度を達成する。The substrate from which the flux has been removed is preferably washed with water as a finishing treatment to completely remove any cleaning agent that may remain. By such water washing treatment, the cleanliness of the substrate becomes extremely high. The cleaning agent of the present invention exhibits flux cleaning effects similar to or better than those using conventional halogenated hydrocarbon cleaning agents,
Achieve a high level of substrate cleanliness.
（実施例）
以下、実施例を挙げ、本発明を更に詳しく説明するが、
本発明はこれら実施例のみに限定されるものではない。(Example) Hereinafter, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited only to these examples.
実施例１
ジエチレングリコールジメチルエーテル５９．５重量部
とポリエチレングリコールアルキルエーテル型ノニオン
性界面活性剤（第一工業製薬■製、商品名［ノイゲンＥ
Ｔ−１３５Ｊ 、一般式（２）においてＲ４は炭素数１
２〜１４の分岐鎖アルキル基、ｎは９である） ９．４
５重量部およびヘキサメタリン酸１．０５重量部および
純水３０重量部を混合して本発明の洗浄剤を調製した。Example 1 59.5 parts by weight of diethylene glycol dimethyl ether and a polyethylene glycol alkyl ether type nonionic surfactant (manufactured by Daiichi Kogyo Seiyaku ■, trade name [Neugen E])
T-135J, in general formula (2), R4 has 1 carbon number
2 to 14 branched alkyl groups, n is 9) 9.4
A cleaning agent of the present invention was prepared by mixing 5 parts by weight, 1.05 parts by weight of hexametaphosphoric acid, and 30 parts by weight of pure water.
一方、プリント配線基板（銅張積層板）の全面に、ロジ
ン系フラックス（ＬＯＮＣＯ社製、商品名ｒ Ｒｅ５ｉ
ｎ Ｆｌｕｘ ＃７７−２５ Ｊ ）を塗布し、１３０
℃で２分間乾燥した後、２６０℃で５秒間、ハンダフロ
を行ない供試基板を調製した。On the other hand, rosin-based flux (manufactured by LONCO, trade name: Re5i) was applied to the entire surface of the printed wiring board (copper-clad laminate).
n Flux #77-25 J) and apply 130
After drying at 260° C. for 2 minutes, solder flow was performed at 260° C. for 5 seconds to prepare a test board.
この基板を室温下に、上記の洗浄剤に浸漬し、フラック
スの除去の度合いを以下の判定基準に基づき目視判定し
た。結果は第１表に示す。This substrate was immersed in the above cleaning agent at room temperature, and the degree of flux removal was visually evaluated based on the following criteria. The results are shown in Table 1.
○ 良好に除去できる
△ 若干残存する
× かなり残存する
次いで、上記基板を水洗および乾燥した後、オメガメー
ター６００ＳＥ（ＫＥＮＫＯ社製、商品名）を用いて、
基板の清浄度（残留イオン濃度）を測定した。結果は第
１表に示す。○ Can be removed well △ Slightly remaining × Significantly remaining Next, after washing and drying the above board, using Omegameter 600SE (manufactured by KENKO, trade name),
The cleanliness (residual ion concentration) of the substrate was measured. The results are shown in Table 1.
実施例２〜７および比較例１
実施例１において、洗浄剤組成比または洗浄時の浸漬温
度をそれぞれ第１表に示すように変化させた他は同様に
して評価を行った。結果は第１表に示す。Examples 2 to 7 and Comparative Example 1 Evaluations were conducted in the same manner as in Example 1, except that the composition ratio of the cleaning agent or the immersion temperature during cleaning were changed as shown in Table 1. The results are shown in Table 1.
実施例８〜１８および比較例２
実施例１において５（Ａ）成分、ｆＢｌ成分およびｆｃ
ｌ成分のうちのいずれか少な（とも一種を第１表に示す
ように変化させた他は同様にして評価を行った。結果は
第１表に示す。Examples 8 to 18 and Comparative Example 2 In Example 1, the 5(A) component, fBl component, and fc
Evaluations were carried out in the same manner except that one of the components was changed as shown in Table 1. The results are shown in Table 1.
尚、第１表中の使用界面活性剤（（Ｂ）成分）は次の通
りである。The surfactants (component (B)) used in Table 1 are as follows.
［ノイゲンＥＡ−１２０Ｊ （第一工業製薬■製、ポ
リエチレングリコールノニルフェニルエーテル型ノニオ
ン性界面活性剤、一般式（２）においてＲ４はノニルフ
ェニル基であり、ｎは５である）、ポリエチレングリコ
ールドデシルフェニルエーテル型ノニオン性界面活性剤
（第一工業製薬■製、商品名［ノイゲンＥＡ−１４３Ｊ
、一般式（２）においてＲ４はドデシルフェニル基で
あり、ｎはＩＯである）「ソルゲンＴｗ２０」（第一工
業製薬■製、ポリオキシエチレンソルビタンモノラウレ
ート、エチレンオキシド平均付加モル数１２）、「エバ
ン４２０」（第一工業製薬■製、ポリオキシエチレンポ
リオキシブロビレンブロックボリマー）
〔以下余白１
（本発明の効果）
本発明によれば、以下の効果が奏される（１）本発明の
洗浄剤は非ハロゲン系の洗浄剤であるため、フロン系洗
浄剤に見られるようなオゾン層破壊の問題はない。[Noigen EA-120J (manufactured by Daiichi Kogyo Seiyaku ■, polyethylene glycol nonylphenyl ether type nonionic surfactant, in general formula (2), R4 is a nonylphenyl group, and n is 5), polyethylene glycol decylphenyl Ether-type nonionic surfactant (manufactured by Daiichi Kogyo Seiyaku ■, trade name [Noogen EA-143J)
, in the general formula (2), R4 is a dodecylphenyl group, and n is IO) "Sorgen Tw20" (manufactured by Daiichi Kogyo Seiyaku ■, polyoxyethylene sorbitan monolaurate, average number of added moles of ethylene oxide 12), " Evan 420" (manufactured by Daiichi Kogyo Seiyaku ■, polyoxyethylene polyoxybrobylene block polymer) Because this cleaning agent is a non-halogen cleaning agent, it does not cause the ozone layer depletion problem that occurs with fluorocarbon cleaning agents.
（２）本発明の洗浄剤は、前記グリコールエーテル系化
合物を含有しているため水を含有しない状態では、それ
自体引火点を有するものではあるが、該化合物の引火点
が７０℃程度であり日本国消防法でいう第三石油類に属
するものであるため、その使用にあたっては特別に防爆
設計された専用の洗浄装置を使用する必要はな（、従来
のフロン洗浄に際して使用されていた各種の市販洗浄装
置をそのままで、または若干仕様変更することにより容
易に使用できる。(2) Since the cleaning agent of the present invention contains the glycol ether compound, it itself has a flash point in the absence of water, but the flash point of the compound is about 70°C. Since it belongs to the third class of petroleum as defined in the Japanese Fire Service Act, there is no need to use a special explosion-proof cleaning device when using it. Commercially available cleaning equipment can be easily used as is or by slightly modifying the specifications.
（３）本発明の洗浄剤を水希釈して使用した場合には、
洗浄剤の引火危険性の低減、洗浄剤の低廉化、排水処理
負荷の大幅低減などを達成でき、しかも充分な洗浄力を
保持することができる。(3) When the cleaning agent of the present invention is used after being diluted with water,
It is possible to reduce the risk of ignition of the cleaning agent, to lower the cost of the cleaning agent, and to significantly reduce the wastewater treatment load, while maintaining sufficient cleaning power.
（４）本発明の洗浄剤は、臭気が非常に少なく、この点
でも満足できる。(4) The cleaning agent of the present invention has very little odor and is also satisfactory in this respect.
このように、本発明によれば、洗浄六番こ優れるととも
に、環境破壊、引火性、臭気などの、屯でも十分に満足
しつる非ハロゲン系のノ＼ンダフラツクス洗浄剤および
該洗浄剤を用いるハンダフラックスを洗浄方法が提供さ
れる。As described above, according to the present invention, a non-halogen flux cleaning agent which is excellent in cleaning, and which is completely satisfactory in terms of environmental damage, flammability, odor, etc., and a solder flux cleaning agent using the cleaning agent are provided. A method of cleaning flux is provided.
荒川化学工業株式会社Arakawa Chemical Industry Co., Ltd.
Claims (1)
ル基を、Ｒ＾２は炭素数１〜５のアルキル基、Ｒ＾３は
水素原子またはメチル基を、ｍは２〜４の整数を示す）
で表されるグリコールエーテル系化合物のうちの少なく
とも一種（Ａ）、ノニオン性界面活性剤（Ｂ）、ならび
にリン酸、リン酸水素、ポリリン酸およびこれらの塩か
らなる群から選ばれる少なくとも一種の無機リン系化合
物（Ｃ） からなる混合物を有効成分として含有することを特徴と
するロジン系ハンダフラックスの洗浄剤。 ２ 前記ノニオン性界面活性剤が、 一般式（２）： Ｒ＾４Ｏ−（ＣＨ＿２ＣＨ＿２Ｏ）＿ｎ−Ｈ（式中、Ｒ
＾４は炭素数６〜２０の直鎖もしくは分岐鎖アルキル基
、フェニル基、または炭素数７〜１２の直鎖もしくは分
岐鎖アルキル基で置換されたフェニル基を、ｎは２〜２
０の整数を示す。）で表される界面活性剤である請求項
１記載の洗浄剤。 ３ 前記（Ｃ）成分がリン酸アルカリ金属塩、リン酸ア
ンモニウム塩、リン酸水素アルカリ金属塩、リン酸水素
アンモニウム塩、ポリリン酸アルカリ金属塩およびポリ
リン酸アンモニウム塩よりなる群から選ばれる少なくと
も一種である請求項１または２記載の洗浄剤。 ４ 前記ポリリン酸がピロリン酸、トリリン酸、トリメ
タリン酸、テトラメタリン酸、ヘキサメタリン酸のうち
のいずれか少なくとも一種である請求項１〜３記載の洗
浄剤。 ５ 前記グリコールエーテル系化合物とノニオン性界面
活性剤とポリオキシアルキレンリン酸エステル系界面活
性剤の使用比率が順に１０〜９５重量％：５〜９０重量
％：０．１〜２０重量％である請求項１〜４記載の洗浄
剤。 ６ 請求項１〜５のいずれかに記載の洗浄剤をロジン系
ハンダフラックスと接触させることを特徴とするロジン
系ハンダフラックスの洗浄方法。[Claims] 1 General formula (1): ▲ Numerical formulas, chemical formulas, tables, etc. (1 to 5 alkyl group, R^3 represents a hydrogen atom or methyl group, m represents an integer of 2 to 4)
At least one type of glycol ether compound represented by (A), a nonionic surfactant (B), and at least one inorganic selected from the group consisting of phosphoric acid, hydrogen phosphate, polyphosphoric acid, and salts thereof. A rosin-based solder flux cleaning agent characterized by containing a mixture of phosphorus-based compounds (C) as an active ingredient. 2 The nonionic surfactant has the general formula (2): R^4O-(CH_2CH_2O)_n-H (in the formula, R
^4 is a straight chain or branched alkyl group having 6 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a straight chain or branched alkyl group having 7 to 12 carbon atoms, and n is 2 to 2
Indicates an integer of 0. ) The cleaning agent according to claim 1, which is a surfactant represented by: 3. Component (C) is at least one selected from the group consisting of alkali metal phosphates, ammonium phosphates, alkali metal hydrogen phosphates, ammonium hydrogen phosphates, alkali metal polyphosphates, and ammonium polyphosphates. A cleaning agent according to claim 1 or 2. 4. The cleaning agent according to claim 1, wherein the polyphosphoric acid is at least one of pyrophosphoric acid, triphosphoric acid, trimetaphosphoric acid, tetrametaphosphoric acid, and hexametaphosphoric acid. 5. The use ratio of the glycol ether compound, the nonionic surfactant, and the polyoxyalkylene phosphate ester surfactant is 10 to 95% by weight: 5 to 90% by weight: 0.1 to 20% by weight, in this order. The cleaning agent according to items 1 to 4. 6. A method for cleaning rosin-based solder flux, which comprises bringing the cleaning agent according to any one of claims 1 to 5 into contact with rosin-based solder flux.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17065890A JPH0457900A (en) | 1990-06-27 | 1990-06-27 | Detergent for rosin solder flux and method for washing rosin solder flux using said detergent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17065890A JPH0457900A (en) | 1990-06-27 | 1990-06-27 | Detergent for rosin solder flux and method for washing rosin solder flux using said detergent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0457900A true JPH0457900A (en) | 1992-02-25 |
Family
ID=15908968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17065890A Pending JPH0457900A (en) | 1990-06-27 | 1990-06-27 | Detergent for rosin solder flux and method for washing rosin solder flux using said detergent |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0457900A (en) |
Cited By (4)
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|---|---|---|---|---|
| JP2006016496A (en) * | 2004-07-01 | 2006-01-19 | Arakawa Chem Ind Co Ltd | Cleaning agent for radiator mounted on reflow soldering apparatus and method for treating cleaning waste fluid |
| WO2009020199A1 (en) * | 2007-08-08 | 2009-02-12 | Arakawa Chemical Industries, Ltd. | Cleanser composition for removal of lead-free soldering flux, and method for removal of lead-free soldering flux |
| WO2011027673A1 (en) * | 2009-09-03 | 2011-03-10 | 荒川化学工業株式会社 | Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux |
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-
1990
- 1990-06-27 JP JP17065890A patent/JPH0457900A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006016496A (en) * | 2004-07-01 | 2006-01-19 | Arakawa Chem Ind Co Ltd | Cleaning agent for radiator mounted on reflow soldering apparatus and method for treating cleaning waste fluid |
| WO2009020199A1 (en) * | 2007-08-08 | 2009-02-12 | Arakawa Chemical Industries, Ltd. | Cleanser composition for removal of lead-free soldering flux, and method for removal of lead-free soldering flux |
| US8372792B2 (en) | 2007-08-08 | 2013-02-12 | Arakawa Chemical Industries, Ltd. | Cleaner composition for removing lead-free soldering flux, and method for removing lead-free soldering flux |
| JP5428859B2 (en) * | 2007-08-08 | 2014-02-26 | 荒川化学工業株式会社 | Cleaning composition for removing lead-free solder flux and method for removing lead-free solder flux |
| JP5556658B2 (en) * | 2008-08-27 | 2014-07-23 | 荒川化学工業株式会社 | Cleaning composition for lead-free solder flux removal and lead-free solder flux removal system |
| WO2011027673A1 (en) * | 2009-09-03 | 2011-03-10 | 荒川化学工業株式会社 | Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux |
| CN102482625A (en) * | 2009-09-03 | 2012-05-30 | 荒川化学工业株式会社 | Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux |
| US8877697B2 (en) | 2009-09-03 | 2014-11-04 | Arakawa Chemical Industries, Ltd. | Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux |
| JP5857740B2 (en) * | 2009-09-03 | 2016-02-10 | 荒川化学工業株式会社 | Lead-free solder water-soluble flux removing detergent, removing method and washing method |
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