JPH04306297A - Rosinic solder flux cleanser and method for cleansing with the cleanser - Google Patents
Rosinic solder flux cleanser and method for cleansing with the cleanserInfo
- Publication number
- JPH04306297A JPH04306297A JP9827091A JP9827091A JPH04306297A JP H04306297 A JPH04306297 A JP H04306297A JP 9827091 A JP9827091 A JP 9827091A JP 9827091 A JP9827091 A JP 9827091A JP H04306297 A JPH04306297 A JP H04306297A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning agent
- cleaning
- solder flux
- cleanser
- rosin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims description 28
- -1 glycol ether compound Chemical class 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 16
- 150000008282 halocarbons Chemical class 0.000 claims abstract description 10
- 239000004094 surface-active agent Substances 0.000 claims abstract description 9
- 238000011282 treatment Methods 0.000 claims abstract description 8
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 7
- 239000010452 phosphate Substances 0.000 claims abstract description 7
- 239000004480 active ingredient Substances 0.000 claims abstract description 6
- 239000012459 cleaning agent Substances 0.000 claims description 64
- 238000004140 cleaning Methods 0.000 claims description 33
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 17
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 17
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 16
- 229910052736 halogen Inorganic materials 0.000 claims description 7
- 150000002367 halogens Chemical class 0.000 claims description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000001035 drying Methods 0.000 abstract description 7
- 238000004065 wastewater treatment Methods 0.000 abstract description 5
- 125000000217 alkyl group Chemical group 0.000 abstract description 4
- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 230000008569 process Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- 239000002202 Polyethylene glycol Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- 239000003945 anionic surfactant Substances 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000010835 comparative analysis Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical class CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000007127 saponification reaction Methods 0.000 description 2
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- UJIGKESMIPTWJH-UHFFFAOYSA-N 1,3-dichloro-1,1,2,2,3-pentafluoropropane Chemical compound FC(Cl)C(F)(F)C(F)(F)Cl UJIGKESMIPTWJH-UHFFFAOYSA-N 0.000 description 1
- VXVGKMGIPAWMJC-UHFFFAOYSA-N 1-[2-(2-ethoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCC VXVGKMGIPAWMJC-UHFFFAOYSA-N 0.000 description 1
- HQDGQKLBDFTNEM-UHFFFAOYSA-N 1-[2-(2-ethoxyethoxy)ethoxy]pentane Chemical compound CCCCCOCCOCCOCC HQDGQKLBDFTNEM-UHFFFAOYSA-N 0.000 description 1
- PXQCQQARRAYIFS-UHFFFAOYSA-N 1-[2-(2-ethoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCC PXQCQQARRAYIFS-UHFFFAOYSA-N 0.000 description 1
- HYLLZXPMJRMUHH-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOC HYLLZXPMJRMUHH-UHFFFAOYSA-N 0.000 description 1
- YXOUPUFJBBFWNL-UHFFFAOYSA-N 1-[2-(2-pentoxyethoxy)ethoxy]pentane Chemical compound CCCCCOCCOCCOCCCCC YXOUPUFJBBFWNL-UHFFFAOYSA-N 0.000 description 1
- GNVFCWJZMJINCS-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCC GNVFCWJZMJINCS-UHFFFAOYSA-N 0.000 description 1
- CWXNQBGBKAMLPP-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]pentane Chemical compound CCCCCOCCOCCOCCC CWXNQBGBKAMLPP-UHFFFAOYSA-N 0.000 description 1
- BOGFHOWTVGAYFK-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCCC BOGFHOWTVGAYFK-UHFFFAOYSA-N 0.000 description 1
- NRAYRSGXIOSRHV-UHFFFAOYSA-N 1-chloro-1,2,2,3-tetrafluoropropane Chemical compound FCC(F)(F)C(F)Cl NRAYRSGXIOSRHV-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- MSWVMWGCNZQPIA-UHFFFAOYSA-N 1-fluoropropan-2-one Chemical compound CC(=O)CF MSWVMWGCNZQPIA-UHFFFAOYSA-N 0.000 description 1
- PSQZJKGXDGNDFP-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropan-1-ol Chemical compound OCC(F)(F)C(F)(F)F PSQZJKGXDGNDFP-UHFFFAOYSA-N 0.000 description 1
- FCEUVAQYYKMPRC-UHFFFAOYSA-N 2,2,3,3,4,4-hexafluorobutan-1-ol Chemical compound OCC(F)(F)C(F)(F)C(F)F FCEUVAQYYKMPRC-UHFFFAOYSA-N 0.000 description 1
- KKQVUWHSUOGDEI-UHFFFAOYSA-N 2-(2-butan-2-yloxyethoxy)ethanol Chemical compound CCC(C)OCCOCCO KKQVUWHSUOGDEI-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- PWTNRNHDJZLBCD-UHFFFAOYSA-N 2-(2-pentoxyethoxy)ethanol Chemical compound CCCCCOCCOCCO PWTNRNHDJZLBCD-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- LSCNICLUNGUIRB-SNVBAGLBSA-N 2-[2-[(2R)-2-methylpentoxy]ethoxy]ethanol Chemical compound CCC[C@@H](C)COCCOCCO LSCNICLUNGUIRB-SNVBAGLBSA-N 0.000 description 1
- COAUHYBSXMIJDK-UHFFFAOYSA-N 3,3-dichloro-1,1,1,2,2-pentafluoropropane Chemical compound FC(F)(F)C(F)(F)C(Cl)Cl COAUHYBSXMIJDK-UHFFFAOYSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Landscapes
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、ロジン系ハンダフラッ
クス洗浄剤および該洗浄剤を用いた該フラックスの洗浄
処理方法に関する。更に詳しくは、特定の組成物である
洗浄剤を同一洗浄槽内において洗浄およびすすぎ処理を
順次に行うことを特徴とする洗浄性に優れしかも加熱乾
燥工程や排水処理工程を省略しうるロジン系ハンダフラ
ックスの洗浄処理方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rosin-based solder flux cleaning agent and a method for cleaning the flux using the cleaning agent. More specifically, it is a rosin-based solder that has excellent cleaning properties and is characterized by sequentially performing cleaning and rinsing processes using a cleaning agent having a specific composition in the same cleaning tank, and which can omit the heating drying process and wastewater treatment process. This invention relates to a flux cleaning method.
【０００２】0002
【従来の技術】ロジン系ハンダフラックスはプリント回
路板やプリント配線基板などのモジュールの製作にあた
って使用される。ハンダ処理の目的は、一般は基板と入
出力ピンとの接着強度を高めたり、接点の酸化を防止し
て導電性を維持するためであり、かかるハンダ処理の実
効を図らんとしてハンダ付けに際してロジン系ハンダフ
ラックスが使用される。ハンダ付け終了後は、基板面か
らフラックスのみを選択的にしかも完全に除去すべく洗
浄剤が使用される。すなわち、フラックスの洗浄が不充
分である場合には、残留フラックスによる悪影響として
、回路腐食が起こったり、あるいは基板表面の電気絶縁
性が低下し、最終的には回路破損につながるという不利
がある。そのため、洗浄剤を使用して、残留フラックス
、特にそれに含有されている活性剤成分を除去すること
により、前記不利を解消している。2. Description of the Related Art Rosin-based solder flux is used in the production of modules such as printed circuit boards and printed wiring boards. The purpose of soldering is generally to increase the adhesive strength between the board and the input/output pins, and to prevent oxidation of the contacts and maintain conductivity.In order to make the soldering process more effective, rosin-based Solder flux is used. After soldering is completed, a cleaning agent is used to selectively and completely remove only the flux from the board surface. That is, if the cleaning of the flux is insufficient, there is a disadvantage that the residual flux causes circuit corrosion or decreases the electrical insulation of the substrate surface, which ultimately leads to circuit damage. Therefore, the disadvantages mentioned above are overcome by using cleaning agents to remove the residual flux, especially the activator components contained therein.
【０００３】従来、ロジン系ハンダフラックスの洗浄剤
としてはトリクロロエチレン、トリクロロトリフルオロ
エタン等のいわゆるフロン等のハロゲン化炭化水素溶剤
が使用されている。該ハロゲン系の洗浄剤については、
それ自体不燃性でありかつ乾燥性に優れるという利点を
有するものの、オゾン層破壊などの環境汚染の問題から
、それらの使用規制が本格化されつつあり、電機業界に
おいてもいわゆるフロン代替のハンダフラックスの洗浄
剤の開発が急務となってきた。Conventionally, halogenated hydrocarbon solvents such as so-called chlorofluorocarbons such as trichlorethylene and trichlorotrifluoroethane have been used as cleaning agents for rosin-based solder flux. Regarding the halogen-based cleaning agent,
Although they themselves have the advantage of being nonflammable and having excellent drying properties, due to environmental pollution problems such as ozone layer depletion, their use is being strictly regulated. The development of cleaning agents has become an urgent need.
【０００４】かかる状況を受けて近時、非ハロゲン系の
ハンダフラックス洗浄剤、例えばケン化型、炭化水素溶
剤型、高級アルコール型など種々のものが開発され上市
されつつあるが、従来のフロンなどに比べて一長一短が
ある。例えば、アルカリケン化型の場合には、水溶液タ
イプであるため引火性の問題はないが、洗浄に際し加熱
下に長時間の液接触せしめることが必要となり洗浄効率
が低いこと、更には基板の金属部の腐食が懸念されるな
どの不利がある。一方、炭化水素溶剤型、高級アルコー
ル型などの洗浄剤の場合には、洗浄力、毒性、臭気、引
火性などのすべての要求性能を完全に満足しうるものは
いまだ見出されていないのが現状である。In response to this situation, various non-halogen solder flux cleaning agents, such as saponification type, hydrocarbon solvent type, and higher alcohol type, have recently been developed and are being put on the market. There are advantages and disadvantages compared to . For example, in the case of alkaline saponification type, there is no problem of flammability because it is an aqueous solution type, but when cleaning, it is necessary to contact the liquid for a long time under heating, resulting in low cleaning efficiency. There are disadvantages such as concerns about corrosion of the parts. On the other hand, in the case of cleaning agents such as hydrocarbon solvent type and higher alcohol type, no one has yet been found that completely satisfies all required performance such as cleaning power, toxicity, odor, and flammability. This is the current situation.
【０００５】ところで、本発明者らは前記問題を解決す
べく鋭意検討を重ねた結果、特定のグリコールエーテル
系化合物とノニオン性界面活性剤および水を必須成分と
してなる混合物、更にはこれら成分に加えてポリオキシ
アルキレンリン酸エステル系界面活性剤を必須成分とし
てなる混合物を使用した場合には、前記課題を解決しう
ることを見出した。すなわち、洗浄力に優れ、しかも環
境特性、臭気、引火性などの点でも実質上満足しうる非
ハロゲン系のハンダフラックス洗浄剤、ならびに該洗浄
剤を用いる洗浄方法に係る発明を完成し、すでに特許出
願を行った。By the way, the inventors of the present invention have made extensive studies to solve the above problem, and have found that a mixture containing a specific glycol ether compound, a nonionic surfactant, and water as essential components, and a mixture containing a specific glycol ether compound, a nonionic surfactant, and water as essential components, It has been found that the above problems can be solved when a mixture containing a polyoxyalkylene phosphate surfactant as an essential component is used. That is, we have completed an invention related to a non-halogen solder flux cleaning agent that has excellent cleaning power and is substantially satisfactory in terms of environmental characteristics, odor, flammability, etc., as well as a cleaning method using the cleaning agent, and have already obtained a patent. I filed an application.
【０００６】しかし、これら各種のフロン代替洗浄剤は
、いずれも水すすぎの工程が必須となる。水すすぎ処理
により優れた清浄度の被洗浄物が収得されるものの、反
面では既存の洗浄装置をそのままでは採用し難いという
課題がある。すなわち、水すすぎ工程に付随して、引き
続き加熱乾燥工程や排水処理工程が必要となるため洗浄
装置の仕様変更を伴う。[0006] However, all of these various fluorocarbon alternative cleaning agents require a water rinsing step. Although the water rinsing process yields objects to be cleaned with excellent cleanliness, there is a problem in that it is difficult to use existing cleaning equipment as is. That is, in addition to the water rinsing process, a heating drying process and a waste water treatment process are required, which necessitates a change in the specifications of the cleaning device.
【０００７】[0007]
【発明が解決しようとする課題】本発明は、洗浄力に優
れ、しかも環境特性、臭気、非引火性などの点でも実質
上満足しうるフロン代替の新規洗浄剤を提供すること、
さらには該洗浄剤を使用して該フラックスの洗浄を行う
に当たり、水すすぎ工程が不要であり、しかも従来の洗
浄装置をそのまま使用しうる洗浄処理方法を提供するこ
とにある。すなわち、従来のフロン代替の新規洗浄剤に
よる洗浄処理に際して必須であった、水すすぎ操作なら
びにこれに由来する付着水除去のための加熱乾燥工程や
排水処理工程のいずれの工程をも省略することのできる
新規な洗浄処理方法を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a new cleaning agent as an alternative to fluorocarbons, which has excellent cleaning power and is substantially satisfactory in terms of environmental characteristics, odor, and non-flammability.
Another object of the present invention is to provide a cleaning method that does not require a water rinsing step when cleaning the flux using the cleaning agent and can use conventional cleaning equipment as is. In other words, it is possible to omit the water rinsing operation, as well as the heating drying process and wastewater treatment process to remove the attached water derived from the water rinsing operation, which were essential when cleaning with a new cleaning agent that replaces conventional fluorocarbons. The purpose is to provide a new cleaning treatment method that can be used.
【０００８】[0008]
【課題を解決するための手段】本発明者らは前記目的を
達成すべく鋭意検討を重ねた結果、フロン代替の新規洗
浄剤である非ハロゲン系のロジン系ハンダフラックス洗
浄剤にハロゲン化炭化水素を併用することにより、同一
洗浄槽において洗浄およびすすぎ処理方法を順次に適用
することにより、前記課題をことごとく解決しうること
を見出し、本発明を完成するに至った。[Means for Solving the Problems] As a result of extensive studies to achieve the above object, the present inventors have developed a new cleaning agent that uses halogenated hydrocarbons in a non-halogen-based rosin-based solder flux cleaning agent that replaces fluorocarbons. The inventors have discovered that all of the above-mentioned problems can be solved by sequentially applying the cleaning and rinsing treatment methods in the same cleaning tank, and have completed the present invention.
【０００９】すなわち本発明は、非ハロゲン系のロジン
系ハンダフラックス洗浄剤（Ａ）と、ハロゲン化炭化水
素（Ｂ）とを有効成分として含有するロジン系ハンダフ
ラックス洗浄剤、ならびにThat is, the present invention provides a rosin-based solder flux cleaning agent containing a non-halogenated rosin-based solder flux cleaning agent (A) and a halogenated hydrocarbon (B) as active ingredients;
【００１０】ロジン系ハンダフラックスが付着した被処
理物に前記洗浄剤を洗浄槽内で接触せしめ、次いで同一
槽内で該洗浄剤中のハロゲン化炭化水素（Ｂ）の蒸気雰
囲気下で被処理物に接触せしめることを特徴とするロジ
ン系ハンダフラックス洗浄剤を用いてなる洗浄処理方法
に係る。[0010] The cleaning agent is brought into contact with the workpiece to which the rosin-based solder flux has adhered in a cleaning tank, and then the workpiece is cleaned in the same tank under a vapor atmosphere of the halogenated hydrocarbon (B) in the cleaning agent. The present invention relates to a cleaning treatment method using a rosin-based solder flux cleaning agent, which is characterized in that the cleaning agent is brought into contact with a rosin-based solder flux cleaning agent.
【００１１】本発明において、前記洗浄剤（Ａ）として
は、特に制限されず従来公知の非ハロゲン系洗浄剤を使
用できる。例えばグリコールエーテル系化合物と炭化水
素系溶剤と各種界面活性剤との混合物、グリコールエー
テル系化合物と界面活性剤との混合物、これら混合物と
水との混合物などを種々例示できる。好ましい組成とし
ては、例えばグリコールエーテル系化合物、ノニオン性
界面活性剤および水からなる混合物、あるいはグリコー
ルエーテル系化合物、ノニオン性界面活性剤、ポリオキ
シアルキレンリン酸エステル系界面活性剤および水から
なる非引火性かつ非ハロゲン系洗浄剤が該当する。In the present invention, the cleaning agent (A) is not particularly limited, and conventionally known non-halogen cleaning agents can be used. For example, various examples include mixtures of glycol ether compounds, hydrocarbon solvents, and various surfactants, mixtures of glycol ether compounds and surfactants, and mixtures of these mixtures and water. Preferred compositions include, for example, a mixture of a glycol ether compound, a nonionic surfactant, and water, or a non-flammable mixture of a glycol ether compound, a nonionic surfactant, a polyoxyalkylene phosphate surfactant, and water. This applies to sterile and non-halogen cleaning agents.
【００１２】以下、前記の好適洗浄剤（Ａ）を代表させ
て該洗浄剤の成分につき以下詳述する。前記一般式（１
）で表されるグリコールエーテル系化合物としては、ジ
エチレングリコールモノメチルエーテル、ジエチレング
リコールジメチルエーテル、ジエチレングリコールモノ
エチルエーテル、ジエチレングリコールジエチルエーテ
ル、ジエチレングリコールメチルエチルエーテル、ジエ
チレングリコールモノプロピルエーテル、ジエチレング
リコールジプロピルエーテル、ジエチレングリコールメ
チルプロピルエーテル、ジエチレングリコールエチルプ
ロピルエーテル、ジエチレングリコールモノブチルエー
テル、ジエチレングリコールジブチルエーテル、ジエチ
レングリコールメチルブチルエーテル、ジエチレングリ
コールエチルブチルエーテル、ジエチレングリコールプ
ロピルブチルエーテル、ジエチレングリコールモノペン
チルエーテル、ジエチレングリコールジペンチルエーテ
ル、ジエチレングリコールメチルペンチルエーテル、ジ
エチレングリコールエチルペンチルエーテル、ジエチレ
ングリコールプロピルペンチルエーテル、ジエチレング
リコールブチルペンチルエーテル；これらに対応するト
リ−もしくはテトラエチレングリコールエーテル類；こ
れらに対応するジ−、トリ−もしくはテトラプロピレン
グリコールエーテル類を例示できる。これら化合物は単
独でまたは２種以上を適宜組み合せて使用できる。[0012] Hereinafter, the components of the above-mentioned preferred detergent (A) will be described in detail as a representative example. The general formula (1
) are diethylene glycol monomethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol monopropyl ether, diethylene glycol dipropyl ether, diethylene glycol methylpropyl ether, diethylene glycol ethyl Propyl ether, diethylene glycol monobutyl ether, diethylene glycol dibutyl ether, diethylene glycol methyl butyl ether, diethylene glycol ethyl butyl ether, diethylene glycol propyl butyl ether, diethylene glycol monopentyl ether, diethylene glycol dipentyl ether, diethylene glycol methyl pentyl ether, diethylene glycol ethyl pentyl ether, diethylene glycol propyl pentyl ether, diethylene glycol butyl pentyl Examples include ether; tri- or tetraethylene glycol ethers corresponding to these; and di-, tri- or tetrapropylene glycol ethers corresponding to these. These compounds can be used alone or in an appropriate combination of two or more.
【００１３】前記好適洗浄剤（Ａ）の成分のうち、ノニ
オン性界面活性剤としては、そのイオン性がノニオン性
である限り特に制限はなく、各種公知のものを採用しう
る。その具体例としては、ポリオキシエチレンアルキル
（Ｃ６＜）エーテル、ポリオキシエチレンフェノールエ
ーテル、ポリオキシエチレンアルキルフェノールエーテ
ルなどのポリエチレングリコールエーテル型ノニオン性
界面活性剤；ポリエチレングリコールモノエステル、ポ
リエチレングリコールジエステルなどのポリエチレング
リコールエステル型ノニオン性界面活性剤；高級脂肪族
アミンのエチレンオキサイド付加物；脂肪酸アミドのエ
チレンオキサイド付加物；ソルビタン脂肪酸エステル、
ショ糖脂肪酸エステルなどの多価アルコール型ノニオン
性界面活性剤；脂肪酸アルカノールアミドなど、更には
これらに対応するポリオキシプロピレン系ノニオン性界
面活性剤およびポリオキシエチレンポリオキシプロピレ
ン共重合型ノニオン性界面活性剤をあげることができる
。
これらノニオン性界面活性剤は１種単独でまたは２種以
上組合せて使用できる。これらのうち、洗浄力の点から
好ましいものとしては、ポリエチレングリコールエーテ
ル型ノニオン性界面活性剤であり、更に好ましいものと
しては下記一般式（２）で表されるものが該当する。Among the components of the preferred detergent (A), the nonionic surfactant is not particularly limited as long as its ionicity is nonionic, and various known surfactants may be used. Specific examples include polyethylene glycol ether type nonionic surfactants such as polyoxyethylene alkyl (C6<) ether, polyoxyethylene phenol ether, and polyoxyethylene alkyl phenol ether; polyethylene glycol monoester, polyethylene glycol diester, etc. Glycol ester type nonionic surfactant; ethylene oxide adduct of higher aliphatic amine; ethylene oxide adduct of fatty acid amide; sorbitan fatty acid ester,
Polyhydric alcohol type nonionic surfactants such as sucrose fatty acid esters; fatty acid alkanolamides, etc., as well as corresponding polyoxypropylene type nonionic surfactants and polyoxyethylene polyoxypropylene copolymer type nonionic surfactants. I can give you some medicine. These nonionic surfactants can be used alone or in combination of two or more. Among these, polyethylene glycol ether type nonionic surfactants are preferred from the viewpoint of detergency, and those represented by the following general formula (2) are more preferred.
【００１４】[0014]
【化２】[Case 2]
【００１５】前記リン酸エステル系アニオン性界面活性
剤としては各種公知のリン酸エステル系アニオン性界面
活性剤を制限なく使用しうるが、好ましくは下記一般式
（３）で表されるものが該当する。As the phosphate ester anionic surfactant, various known phosphate ester anionic surfactants can be used without limitation, but those represented by the following general formula (3) are preferable. do.
【００１６】[0016]
【化３】[Chemical formula 3]
【００１７】で表される界面活性剤またはその塩である
。かかる塩としてはナトリウム塩、カリウム塩などの金
属塩、アンモニウム塩、アルカノールアミン塩などを例
示できる。なお、前記一般式（３）で表されるリン酸エ
ステル系アニオン性界面活性剤またはその塩としては、
各種市販品があり、例えば第一工業製薬株式会社製の「
プライサーフ」シリーズ、日本乳化剤株式会社製の「Ｎ
−１０００ＦＣＰ」、「ＲＡ−５７４」、「ＲＡ−５７
９」などが例示できる。A surfactant represented by the following formula or a salt thereof. Examples of such salts include metal salts such as sodium salts and potassium salts, ammonium salts, and alkanolamine salts. In addition, as the phosphate ester-based anionic surfactant or its salt represented by the general formula (3),
There are various commercially available products, such as Daiichi Kogyo Seiyaku Co., Ltd.'s "
Pricesurf” series, Nippon Nyukazai Co., Ltd.’s “N”
-1000FCP”, “RA-574”, “RA-57
An example is "9".
【００１８】前記グリコールエーテル系化合物とノニオ
ン性界面活性剤とポリオキシリン酸エステル系界面活性
剤との使用割合は、特に制限はされないが、通常は順に
１０〜９５重量％ 程度： ５〜９０重量％ 程度：
０．１〜９０重量％ 程度であり、好ましくは順に５０
〜９０重量％ 程度：１０〜６０重量％ 程度：０．５
〜６０重量％程度である。The proportions of the glycol ether compound, nonionic surfactant, and polyoxyphosphate ester surfactant used are not particularly limited, but are usually about 10 to 95% by weight: about 5 to 90% by weight. :
About 0.1 to 90% by weight, preferably 50% by weight
~90% by weight: 10-60% by weight: 0.5
It is about 60% by weight.
【００１９】本発明のロジン系ハンダフラックス洗浄剤
成分のうち、前記成分（Ｂ）としては、前記洗浄剤（Ａ
）と完全に相溶するものであれば特に制限なく使用でき
る。例えば、１，１，１，３，３，３−ヘキサフルオロ
−２−プロパノール、２，２，３，３，４，４−ヘキサ
フルオロブタノール、５−フッ化プロパノール（ペンタ
フルオロプロピルアルコール）、ヘキサフルオロアセト
ン・水和物、３，３−ジクロロ−１，１，１，２，２−
ペンタフルオロプロパン、１，３−ジクロロ−１，１，
２，２，３−ペンタフルオロプロパン、１−クロロ−１
，２，２，３−テトラフルオロプロパン、１，１，１−
トリクロロエタン、１，１，２−トリクロロトリフルオ
ロエタン、１，１，２−トリクロロ−１，２，２−トリ
フルオロエタン、トリクロロエチレンなどを例示できる
。なお、これらの市販品としてはダイキン工業株式会社
製の「ペフォールＴＭ５Ｐ」、旭硝子株式会社製の「Ａ
Ｋ２２５」などを例示できる。Among the rosin-based solder flux cleaning agent components of the present invention, the component (B) is the cleaning agent (A).
) can be used without particular restrictions as long as it is completely compatible with the above. For example, 1,1,1,3,3,3-hexafluoro-2-propanol, 2,2,3,3,4,4-hexafluorobutanol, 5-fluorinated propanol (pentafluoropropyl alcohol), hexafluoro-2-propanol, Fluoroacetone hydrate, 3,3-dichloro-1,1,1,2,2-
Pentafluoropropane, 1,3-dichloro-1,1,
2,2,3-pentafluoropropane, 1-chloro-1
, 2,2,3-tetrafluoropropane, 1,1,1-
Examples include trichloroethane, 1,1,2-trichlorotrifluoroethane, 1,1,2-trichloro-1,2,2-trifluoroethane, and trichloroethylene. These commercially available products include "Pefol TM5P" manufactured by Daikin Industries, Ltd. and "A" manufactured by Asahi Glass Co., Ltd.
K225'' can be exemplified.
【００２０】なお、本発明において洗浄剤（Ａ）中の水
の含有量は、得られる洗浄剤が非引火性を示すにたる量
であればよく、通常は３０重量％未満程度であり、洗浄
力をより考慮すれば１０〜５重量％が好適である。[0020] In the present invention, the content of water in the cleaning agent (A) is sufficient as long as the resulting cleaning agent exhibits non-flammability, and is usually less than 30% by weight. If strength is taken into consideration, 10 to 5% by weight is suitable.
【００２１】本発明の洗浄剤を基板上のロジンフラック
スに接触させるには以下の手段を採用しうる。すなわち
、洗浄剤（Ａ）とハロゲン化炭化水素（Ｂ）を通常、２
０〜８０重量％：８０〜２０重量％程度、好ましくは４
０〜６０重量％：６０〜４０重量％となるよう調整する
。かくして得られた洗浄剤に被処理剤である例えば基板
を直接浸漬して洗浄する方法、該洗浄剤をスプレー装置
を使用してフラッシュする方法、機械的手段によりブラ
ッシングする方法、超音波洗浄方法などの各種方法から
適宜に選択して採用することができる。The following means can be employed to bring the cleaning agent of the present invention into contact with the rosin flux on the substrate. That is, the cleaning agent (A) and the halogenated hydrocarbon (B) are usually
0-80% by weight: about 80-20% by weight, preferably 4
0 to 60% by weight: Adjust to 60 to 40% by weight. A method of directly immersing the substrate to be treated in the thus obtained cleaning agent, a method of flushing the cleaning agent using a spray device, a method of brushing by mechanical means, an ultrasonic cleaning method, etc. The method can be appropriately selected and adopted from various methods.
【００２２】本発明において洗浄剤を適用する際の条件
としては、洗浄剤中の有効成分の濃度、該成分の使用比
率、除去すべきフラックスの種類等により適宜選択すれ
ば良く、一般に除去すべきフラックスを洗浄除去するの
に有効な温度と時間で洗浄剤をフラックスに接触させる
。洗浄剤組成物中の成分（Ｂ）の沸点以上の温度で使用
する。例えば、沸点が５０℃程度の成分（Ｂ）を有効成
分に持つ洗浄剤を用いて、基板上のハンダフラックスを
除去する場合、例えば６０℃程度に加温された洗浄剤に
ハンダフラックスを有する基板を約１〜５分程度浸漬す
れば、良好に除去することができる。Conditions for applying the cleaning agent in the present invention may be appropriately selected depending on the concentration of the active ingredient in the cleaning agent, the usage ratio of the ingredient, the type of flux to be removed, etc. The cleaning agent is contacted with the flux at a temperature and time effective to wash away the flux. It is used at a temperature equal to or higher than the boiling point of component (B) in the cleaning composition. For example, when removing solder flux on a board using a cleaning agent that has component (B) as an active ingredient with a boiling point of about 50°C, for example, if the cleaning agent is heated to about 60°C, the board with solder flux is removed. It can be removed well by soaking it for about 1 to 5 minutes.
【００２３】こうしてフラックスを除去された基板は、
次いで洗浄剤液層より引き上げられ、ついで洗浄槽の上
部に生じた成分（Ｂ）の蒸気と接触させることにより、
残留している洗浄剤を完全除去する。該蒸気によるすす
ぎ時間は一般には３０秒〜３分程度で充分である。なお
、成分（Ｂ）の蒸気の揮散を防ぎ、洗浄剤の組成を一定
に保つには、例えば洗浄槽を密閉型とし、その上部にコ
ンデンサーなどを設置するなどの常套手段を講じること
により容易に解決できる。The substrate from which the flux has been removed in this way is
Then, by bringing it into contact with the vapor of component (B) that is pulled up from the cleaning agent liquid layer and then generated at the top of the cleaning tank,
Completely remove any remaining cleaning agent. Generally, the rinsing time with the steam is about 30 seconds to 3 minutes. In addition, in order to prevent the volatilization of component (B) vapor and to keep the composition of the cleaning agent constant, it is easy to do so by taking conventional measures, such as making the cleaning tank a closed type and installing a condenser above it. Solvable.
【００２４】[0024]
【発明の効果】本発明の洗浄剤を使用し洗浄およびすす
ぎ処理することにより、清浄度が非常に高い基板を収得
できる。また洗浄装置の仕様により、成分（Ｂ）に起因
するオゾン層破壊の問題も実質的に解消される。加えて
、成分（Ｂ）を利用することより、水すすぎ工程が不要
となり、そのため従来のような水すすぎ工程に由来する
加熱乾燥工程が不必要となり、排水処理についても省略
または大幅な負担軽減が可能となるなど種々の効果が奏
せられる。[Effects of the Invention] By performing cleaning and rinsing treatments using the cleaning agent of the present invention, a substrate with extremely high cleanliness can be obtained. Further, depending on the specifications of the cleaning device, the problem of ozone layer depletion caused by component (B) is also substantially eliminated. In addition, the use of component (B) eliminates the need for a water rinsing process, which eliminates the need for the conventional heating and drying process associated with the water rinsing process, and eliminates or significantly reduces the burden of wastewater treatment. Various effects can be achieved, such as making it possible.
【００２５】[0025]
【実施例】以下、実施例を挙げ、本発明を更に詳しく説
明するが、本発明はこれらの実施例のみに限定されるも
のではない。[Examples] The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited to these Examples.
【００２６】参考例１（洗浄剤（Ａ）の調製）ジエチレ
ングリコールジブチルエーテル６５重量部とポリエチレ
ングリコールアルキルエーテル型ノニオン性界面活性剤
（第一工業製薬株式会社製、商品名「ノイゲンＥＴ−１
３５」、一般式（２）においてＲ４ は炭素数１２〜１
４の分岐鎖アルキル基、ｍが９のものである）２０重量
部、ポリオキシエチレンアルキルエーテルのリン酸モノ
エステル（一般式（３）においてＲ５ は炭素数１２の
直鎖アルキル基、ｎが１６、Ｘは水酸基である）３重量
部および純水１２重量部を混合して洗浄剤（Ａ）−１を
調製した。Reference Example 1 (Preparation of Cleaning Agent (A)) 65 parts by weight of diethylene glycol dibutyl ether and a polyethylene glycol alkyl ether type nonionic surfactant (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd., trade name "Noogen ET-1")
35'', in general formula (2), R4 has 12 to 1 carbon atoms
20 parts by weight of polyoxyethylene alkyl ether phosphoric acid monoester (in general formula (3), R5 is a straight-chain alkyl group having 12 carbon atoms, and n is 16) , X is a hydroxyl group) and 12 parts by weight of pure water were mixed to prepare a cleaning agent (A)-1.
【００２７】参考例２〜５
参考例１において、洗浄剤（Ａ−１）の組成を表１に示
すように変化させた他は同様にして洗浄剤（Ａ−２）〜
（Ａ−５）を調製した。Reference Examples 2 to 5 Cleaning agents (A-2) to 5 were prepared in the same manner as in Reference Example 1, except that the composition of the cleaning agent (A-1) was changed as shown in Table 1.
(A-5) was prepared.
【００２８】実施例１（本発明洗浄剤の調製およびその
性能評価方法）
洗浄剤（Ａ−１）６０重量部と５−フッ化プロパノール
（以下５ＦＰと略す；ダイキン工業（株）製、商品名「
ペフォールＴＭ５Ｐ」）４０重量部とを混合して本発明
の洗浄剤を調製した。Example 1 (Preparation of the cleaning agent of the present invention and method for evaluating its performance) 60 parts by weight of the cleaning agent (A-1) and 5-fluorinated propanol (hereinafter abbreviated as 5FP; manufactured by Daikin Industries, Ltd., trade name) "
A cleaning agent of the present invention was prepared by mixing 40 parts by weight of "Pefol TM5P").
【００２９】一方、プリント配線基板（銅張積層板）の
全面に、ロジン系フラックス（ＬＯＮＣＯ社製、商品名
「Ｒｅｓｉｎ Ｆｌｕｘ ＃７７−２５ 」）を塗布し
、１３０℃で２分間乾燥した後、２６０℃で５秒間、ハ
ンダフローを行い供試基板を調整した。この基板を８５
℃の密封容器中で上記洗浄剤に浸漬し、次いで洗浄剤よ
り基板を引き上げ５ＦＰの蒸気で１分間すすぎ処理を行
った。更にこの基板を室温で放置乾燥後、フラックスの
除去の度合を以下の判定基準に基づき目視判定した。結
果は表３に示す。On the other hand, rosin-based flux (manufactured by LONCO, trade name: "Resin Flux #77-25") was applied to the entire surface of the printed wiring board (copper-clad laminate), and after drying at 130° C. for 2 minutes, The test board was prepared by performing solder flow at 260° C. for 5 seconds. This board is 85
The substrate was immersed in the above cleaning agent in a sealed container at .degree. C., and then the substrate was lifted from the cleaning agent and rinsed with 5FP steam for 1 minute. Furthermore, after this substrate was left to dry at room temperature, the degree of flux removal was visually judged based on the following criteria. The results are shown in Table 3.
【００３０】◎ 良好に除去できる ○ ほぼ良好に除去できる △ 若干残存する × かなり残存する◎ Can be removed well ○ Can be removed almost successfully △ Some remains × Quite a lot remains
【００３１】次いで、上記基板をオメガメーター６００
ＳＥ（ＫＥＮＫＯ社製、商品名）を用いて、基板の清浄
度・すすぎ度（残留イオン濃度）を測定した。結果は表
３に示す。[0031] Next, the above board was tested using an Omegameter 600.
The cleanliness and rinsing level (residual ion concentration) of the substrate was measured using SE (manufactured by KENKO, trade name). The results are shown in Table 3.
【００３２】実施例２〜１８
実施例１において、洗浄剤の組成、洗浄処理条件を表２
に示すものに変化させた他は同様にして行い、フラック
スの除去の度合を評価した。結果は表３に示す。Examples 2 to 18 In Example 1, the composition of the cleaning agent and the cleaning treatment conditions are shown in Table 2.
The process was carried out in the same manner except that it was changed to the one shown in , and the degree of flux removal was evaluated. The results are shown in Table 3.
【００３３】比較例１
実施例１と同様の方法で、洗浄およびすすぎ処理をフロ
ン−１１３のみを用いて行ない、比較評価を行った。結
果は表３に示す。Comparative Example 1 In the same manner as in Example 1, cleaning and rinsing treatments were carried out using only Freon-113, and a comparative evaluation was conducted. The results are shown in Table 3.
【００３４】比較例２
実施例１のすすぎ処理工程において５ＦＰに代えて水を
使用した他は同様にして比較評価を行った。結果は表３
に示す。Comparative Example 2 Comparative evaluation was carried out in the same manner as in Example 1 except that water was used instead of 5FP in the rinsing process. The results are in Table 3
Shown below.
【００３５】[0035]
【表１】[Table 1]
【００３６】[0036]
【表２】[Table 2]
【００３７】[0037]
【表３】[Table 3]
Claims (5)
クス洗浄剤（Ａ）と、ハロゲン化炭化水素（Ｂ）とを有
効成分として含有するロジン系ハンダフラックス洗浄剤
。1. A rosin-based solder flux cleaning agent containing a non-halogen rosin-based solder flux cleaning agent (A) and a halogenated hydrocarbon (B) as active ingredients.
化１】 で表されるグリコールエーテル系化合物のうちの少なく
とも一種、ノニオン性界面活性剤ならびに必要により水
および／またはポリオキシアルキレンリン酸エステル系
界面活性剤からなる混合物である請求項１記載の洗浄剤
。[Claim 2] The cleaning agent (A) has the general formula (1):
The cleaning method according to claim 1, which is a mixture consisting of at least one glycol ether compound represented by formula 1, a nonionic surfactant, and optionally water and/or a polyoxyalkylene phosphate surfactant. agent.
Ｂ）の使用比率が順に２０〜８０重量％：８０〜２０重
量％である請求項１記載の洗浄剤。[Claim 3] A cleaning agent (A) and a halogenated hydrocarbon (
The cleaning agent according to claim 1, wherein the ratio of B) used is 20 to 80% by weight: 80 to 20% by weight, in this order.
Ａ）と完全相溶するものである請求項１記載の洗浄剤。Claim 4: The halogenated hydrocarbon (B) is a cleaning agent (
The cleaning agent according to claim 1, which is completely compatible with A).
被処理物に請求項１の洗浄剤を洗浄槽内で接触せしめ、
次いで同一槽内で該洗浄剤中のハロゲン化炭化水素（Ｂ
）の蒸気雰囲気下で被処理物に接触せしめることを特徴
とするロジン系ハンダフラックス洗浄剤を用いてなる洗
浄処理方法。5. Bringing the cleaning agent of claim 1 into contact with the workpiece to which rosin-based solder flux has adhered in a cleaning tank,
Next, in the same tank, the halogenated hydrocarbon (B
) A cleaning treatment method using a rosin-based solder flux cleaning agent, which is characterized in that it is brought into contact with an object to be treated in a steam atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9827091A JPH04306297A (en) | 1991-04-02 | 1991-04-02 | Rosinic solder flux cleanser and method for cleansing with the cleanser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9827091A JPH04306297A (en) | 1991-04-02 | 1991-04-02 | Rosinic solder flux cleanser and method for cleansing with the cleanser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04306297A true JPH04306297A (en) | 1992-10-29 |
Family
ID=14215254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9827091A Pending JPH04306297A (en) | 1991-04-02 | 1991-04-02 | Rosinic solder flux cleanser and method for cleansing with the cleanser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04306297A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008506804A (en) * | 2004-07-15 | 2008-03-06 | アクゾ ノーベル ナムローゼ フェンノートシャップ | Phosphate alkanols, their use as hydrotropes and cleaning compositions containing said compositions |
-
1991
- 1991-04-02 JP JP9827091A patent/JPH04306297A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008506804A (en) * | 2004-07-15 | 2008-03-06 | アクゾ ノーベル ナムローゼ フェンノートシャップ | Phosphate alkanols, their use as hydrotropes and cleaning compositions containing said compositions |
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