JPH0465439U - - Google Patents
Info
- Publication number
- JPH0465439U JPH0465439U JP10851590U JP10851590U JPH0465439U JP H0465439 U JPH0465439 U JP H0465439U JP 10851590 U JP10851590 U JP 10851590U JP 10851590 U JP10851590 U JP 10851590U JP H0465439 U JPH0465439 U JP H0465439U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- cavity
- internal lead
- ceramic
- corners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は従来のセラミツクパツケージの平面図である
。
１……セラミツク基板、２……キヤビテイ、３
……切欠部、４……内部リード、５……外部リー
ド、６……キヤビテイ。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a plan view of a conventional ceramic package. 1... Ceramic substrate, 2... Cavity, 3
...Notch, 4...Internal lead, 5...External lead, 6...Cavity.
Claims (1)
方形の四隅に円弧状の切欠部を有する素子搭載用
のキヤビテイと、前記キヤビテイの周囲の段部上
面に設けた内部リードと、前記内部リードと電気
的に接続して前記セラミツク基板の周縁部近傍に
設けた外部リードとを有することを特徴とするセ
ラミツクパツケージ。 A cavity for mounting an element having arc-shaped notches at the four corners of a square or rectangle provided in the center of a ceramic substrate, an internal lead provided on the upper surface of a stepped portion around the cavity, and an electrical connection with the internal lead. A ceramic package characterized in that it has an external lead connected to the ceramic substrate and provided near a peripheral edge of the ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10851590U JPH0465439U (en) | 1990-10-17 | 1990-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10851590U JPH0465439U (en) | 1990-10-17 | 1990-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465439U true JPH0465439U (en) | 1992-06-08 |
Family
ID=31855548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10851590U Pending JPH0465439U (en) | 1990-10-17 | 1990-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465439U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1050737A (en) * | 1996-08-02 | 1998-02-20 | Nec Corp | Semiconductor device and collet for mounting semiconductor element |
| JP2008192863A (en) * | 2007-02-06 | 2008-08-21 | Sumitomo Metal Electronics Devices Inc | Ceramic cover |
-
1990
- 1990-10-17 JP JP10851590U patent/JPH0465439U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1050737A (en) * | 1996-08-02 | 1998-02-20 | Nec Corp | Semiconductor device and collet for mounting semiconductor element |
| JP2008192863A (en) * | 2007-02-06 | 2008-08-21 | Sumitomo Metal Electronics Devices Inc | Ceramic cover |