JPH0397939U - - Google Patents

Info

Publication number
JPH0397939U
JPH0397939U JP505090U JP505090U JPH0397939U JP H0397939 U JPH0397939 U JP H0397939U JP 505090 U JP505090 U JP 505090U JP 505090 U JP505090 U JP 505090U JP H0397939 U JPH0397939 U JP H0397939U
Authority
JP
Japan
Prior art keywords
substrate
leads
package body
periphery
foot pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP505090U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP505090U priority Critical patent/JPH0397939U/ja
Publication of JPH0397939U publication Critical patent/JPH0397939U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例を示す図、第2図は本
考案の実施例の側面図、第3図はフツトパターン
の配置を示す図、第4図はリードの接合状態を示
す図、第5図は基板を示す平面図、第6図は本考
案の変形例を示す図、第7図は従来例を示す図、
第8図は従来の基板を示す図である。 図において、1は基板、2はフツトパターン、
3は接合部、4はパツケージ本体、5はリードで
ある。
FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a side view of the embodiment of the present invention, FIG. 3 is a diagram showing the arrangement of the foot pattern, and FIG. 4 is a diagram showing the bonding state of the leads. 5 is a plan view showing the board, FIG. 6 is a view showing a modification of the present invention, FIG. 7 is a view showing a conventional example,
FIG. 8 is a diagram showing a conventional substrate. In the figure, 1 is a substrate, 2 is a foot pattern,
3 is a joint, 4 is a package body, and 5 is a lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板1のフツトパターン2への接合部3がパツ
ケージ本体4の周縁に沿つて多段に配置されたリ
ード5を有する表面実装素子。
A surface mount device in which a bonding portion 3 to a foot pattern 2 of a substrate 1 has leads 5 arranged in multiple stages along the periphery of a package body 4.
JP505090U 1990-01-25 1990-01-25 Pending JPH0397939U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP505090U JPH0397939U (en) 1990-01-25 1990-01-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP505090U JPH0397939U (en) 1990-01-25 1990-01-25

Publications (1)

Publication Number Publication Date
JPH0397939U true JPH0397939U (en) 1991-10-09

Family

ID=31508772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP505090U Pending JPH0397939U (en) 1990-01-25 1990-01-25

Country Status (1)

Country Link
JP (1) JPH0397939U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006037529A (en) * 2004-07-28 2006-02-09 Kvk Corp Fixing structure of slide bar
JP2007229433A (en) * 2006-02-06 2007-09-13 Takara Standard Co Ltd Mist sauna apparatus and bathroom including the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006037529A (en) * 2004-07-28 2006-02-09 Kvk Corp Fixing structure of slide bar
JP2007229433A (en) * 2006-02-06 2007-09-13 Takara Standard Co Ltd Mist sauna apparatus and bathroom including the same

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