JPH0334243U - - Google Patents
Info
- Publication number
- JPH0334243U JPH0334243U JP9542289U JP9542289U JPH0334243U JP H0334243 U JPH0334243 U JP H0334243U JP 9542289 U JP9542289 U JP 9542289U JP 9542289 U JP9542289 U JP 9542289U JP H0334243 U JPH0334243 U JP H0334243U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- view
- groove
- isogonal
- plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 4
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ないし第３図は本考案の一実施例に係り
、第１図は半導体パツケージの外観形状を示す斜
視図、第２図はその基板を裏面側から見た状態を
示す斜視図であり、第３図は半導体パツケージの
基板をパーツフイーダに収納した状態を示す正面
図である。また、第４図は本考案の別実施例に係
り、半導体パツケージの基板を裏面側から見た状
態を示す斜視図である。
図における符号Ａ……半導体パツケージ、１…
…基板、６……通し溝である。
1 to 3 relate to an embodiment of the present invention, in which FIG. 1 is a perspective view showing the external shape of a semiconductor package, and FIG. 2 is a perspective view showing the substrate as viewed from the back side. , FIG. 3 is a front view showing the state in which the substrate of the semiconductor package is housed in the parts feeder. Further, FIG. 4 is a perspective view showing a substrate of a semiconductor package viewed from the back side according to another embodiment of the present invention. Reference numeral A in the figure...semiconductor package, 1...
...Substrate, 6...Through groove.
Claims (1)
の裏面における中心線よりも一辺側に偏つた位置
に、この一辺と平行状に凹設された通し溝を形成
したことを特徴とする半導体パツケージ。 A semiconductor package characterized in that a through groove is formed parallel to one side of the back surface of the semiconductor package, which has an isogonal shape in plan view, at a position offset to one side from a center line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9542289U JPH0334243U (en) | 1989-08-14 | 1989-08-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9542289U JPH0334243U (en) | 1989-08-14 | 1989-08-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0334243U true JPH0334243U (en) | 1991-04-04 |
Family
ID=31644683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9542289U Pending JPH0334243U (en) | 1989-08-14 | 1989-08-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334243U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008253181A (en) * | 2007-04-04 | 2008-10-23 | Kyowa Kk | Greening device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333637B2 (en) * | 1980-03-28 | 1988-07-06 | Enaajii Dainamitsukusu Inc | |
| JPS63300544A (en) * | 1987-05-29 | 1988-12-07 | Nec Corp | Resin seal package of semiconductor integrated circuit |
-
1989
- 1989-08-14 JP JP9542289U patent/JPH0334243U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333637B2 (en) * | 1980-03-28 | 1988-07-06 | Enaajii Dainamitsukusu Inc | |
| JPS63300544A (en) * | 1987-05-29 | 1988-12-07 | Nec Corp | Resin seal package of semiconductor integrated circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008253181A (en) * | 2007-04-04 | 2008-10-23 | Kyowa Kk | Greening device |