JPH0233453U - - Google Patents
Info
- Publication number
- JPH0233453U JPH0233453U JP11135188U JP11135188U JPH0233453U JP H0233453 U JPH0233453 U JP H0233453U JP 11135188 U JP11135188 U JP 11135188U JP 11135188 U JP11135188 U JP 11135188U JP H0233453 U JPH0233453 U JP H0233453U
- Authority
- JP
- Japan
- Prior art keywords
- portions
- terminals
- integrated
- external connection
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の側面図、第２図は
本考案の他の実施例の側面図である。
１０１，２０１……封止樹脂、１０２，２０２
……通常の端子、１０３，２０３……引出部が一
体化された端子、１０４，２０４……一体化され
た端子の外部接続部、１０５，２０５……樹脂表
面部の部分的に一体化されてない端子。
FIG. 1 is a side view of one embodiment of the present invention, and FIG. 2 is a side view of another embodiment of the present invention. 101,201...Sealing resin, 102,202
...Ordinary terminal, 103,203...Terminal with integrated pull-out part, 104,204...External connection part of integrated terminal, 105,205...Partially integrated with resin surface part No terminal.
Claims (1)
一体化し端子の外部接続部を一体化された端子の
中間部に有することを特徴とする半導体装置。 A semiconductor device characterized in that the lead-out portions of adjacent terminals are integrated except for the surface portions of the sealing resin, and the external connection portions of the terminals are provided in the intermediate portions of the integrated terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11135188U JPH0233453U (en) | 1988-08-24 | 1988-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11135188U JPH0233453U (en) | 1988-08-24 | 1988-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233453U true JPH0233453U (en) | 1990-03-02 |
Family
ID=31349317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11135188U Pending JPH0233453U (en) | 1988-08-24 | 1988-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233453U (en) |
-
1988
- 1988-08-24 JP JP11135188U patent/JPH0233453U/ja active Pending