JPH04504003A - モノリシック加速度計 - Google Patents
モノリシック加速度計Info
- Publication number
- JPH04504003A JPH04504003A JP3514538A JP51453891A JPH04504003A JP H04504003 A JPH04504003 A JP H04504003A JP 3514538 A JP3514538 A JP 3514538A JP 51453891 A JP51453891 A JP 51453891A JP H04504003 A JPH04504003 A JP H04504003A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- capacitor
- acceleration
- detector
- capacitors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0035—Testing
- B81C99/004—Testing during manufacturing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/13—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by measuring the force required to restore a proofmass subjected to inertial forces to a null position
- G01P15/131—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by measuring the force required to restore a proofmass subjected to inertial forces to a null position with electrostatic counterbalancing means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Sensors (AREA)
Abstract
Description
Claims (6)
- 1.第1及び第2コンデンサであり、各々が1対の電極を有し、各々のコンデン サの電極の一方が他方のコンデンサの電極の一方に電気的に接続されており、こ れにより差動コンデンサ構成を形成している第1及び第2コンデンサを含むキャ パシタンス型加速度検知器であって、上記コンデンサの各々において、上記電極 の一方が静止的であり、上記電極の他方が適用された加速度に応答して移動可能 であり、これらの電極は全てシリコン基板上に懸下されたポリシリコン部材から 形成されていることを特徴とするキャパシタンス型加速度検知器。
- 2.上記コンデンサ電極の全てが物理的に並列に配向されており、上記可動電極 が上記可動電極と上記基板の間に上記電極によって画成された軸に対して垂直な 軸に沿って適用された力に応答して可動であることを特徴とする請求項1の加速 度検知器。
- 3.上記コンデンサ電極の各々が多数のセクションから形成されていることを特 徴とする請求項1又は2の加速度検知器。
- 4.上記電極セクションが並列に配向されていることを特徴とする請求項3の加 速度検知器。
- 5.加速度計において、 a.第1及び第2コンデンサであり、該コンデンサの各々が1対の電極を有し、 各々のコンデンサの電極の一方が他方のコンデンサの電極の一方に電気的に接続 されておりしこれにより差動コンデンサ構成を形成している第1及び第2コンデ ンサを有するキャパシタンス型加速度検知器であって、上記コンデンサの各々に おいて、上記電極の一方が静止的であり、上記電極の他方が適用された加速度に 応答して移動可能であり、これらの電極は全てシリコン基板上に懸下されたポリ シリコン部材から形成されていることと、b.上記検知器のコンデンサに互いに 位相が180度ずれている第1及び第2搬送波信号を適用するための手段と、及 びc.上記検知器の出力信号を分解するための手段と、を含むことを特徴とする 加速度計。
- 6.上記検知器からの出力信号を分解するための手段が上記検知器を力平衡モー ドで作動せしめるための手段を含むことを特徴とする請求項5の加速度計。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56908090A | 1990-08-17 | 1990-08-17 | |
US569,080 | 1990-08-17 | ||
PCT/US1991/005851 WO1992003740A1 (en) | 1990-08-17 | 1991-08-16 | Monolithic accelerometer |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26320995A Division JP3294482B2 (ja) | 1990-08-17 | 1995-10-11 | モノリシック加速度計 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04504003A true JPH04504003A (ja) | 1992-07-16 |
JPH0644008B2 JPH0644008B2 (ja) | 1994-06-08 |
Family
ID=24274026
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3514538A Expired - Lifetime JPH0644008B2 (ja) | 1990-08-17 | 1991-08-16 | モノリシック加速度計 |
JP26320995A Expired - Lifetime JP3294482B2 (ja) | 1990-08-17 | 1995-10-11 | モノリシック加速度計 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26320995A Expired - Lifetime JP3294482B2 (ja) | 1990-08-17 | 1995-10-11 | モノリシック加速度計 |
Country Status (5)
Country | Link |
---|---|
US (3) | US5345824A (ja) |
EP (1) | EP0543901B1 (ja) |
JP (2) | JPH0644008B2 (ja) |
DE (1) | DE69113632T2 (ja) |
WO (1) | WO1992003740A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5622633A (en) * | 1994-08-18 | 1997-04-22 | Nippondenso Co., Ltd. | Semiconductor sensor with suspended microstructure and method for fabricating same |
US5824608A (en) * | 1995-06-27 | 1998-10-20 | Nippondenso Co., Ltd. | Semiconductor physical-quantity sensor and method for manufacturing same |
JPH11261079A (ja) * | 1997-12-23 | 1999-09-24 | Motorola Inc | 半導体素子およびその製造方法 |
JP2003530562A (ja) * | 2000-04-12 | 2003-10-14 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | センサ非依存性の振動振幅制御部 |
DE19509338C2 (de) * | 1994-03-15 | 2003-10-16 | Denso Corp | Beschleunigungssensor |
JP2010232431A (ja) * | 2009-03-27 | 2010-10-14 | Denso Corp | 容量式物理量検出装置 |
JP2012522986A (ja) * | 2009-04-03 | 2012-09-27 | アナログ デバイシス, インコーポレイテッド | シングルポートメモリを伴うデジタル出力センサfifoバッファ |
Families Citing this family (233)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5620931A (en) * | 1990-08-17 | 1997-04-15 | Analog Devices, Inc. | Methods for fabricating monolithic device containing circuitry and suspended microstructure |
US5417111A (en) * | 1990-08-17 | 1995-05-23 | Analog Devices, Inc. | Monolithic chip containing integrated circuitry and suspended microstructure |
US5326726A (en) * | 1990-08-17 | 1994-07-05 | Analog Devices, Inc. | Method for fabricating monolithic chip containing integrated circuitry and suspended microstructure |
US5314572A (en) * | 1990-08-17 | 1994-05-24 | Analog Devices, Inc. | Method for fabricating microstructures |
US6903084B2 (en) | 1991-08-29 | 2005-06-07 | Sterix Limited | Steroid sulphatase inhibitors |
GB9205711D0 (en) * | 1992-03-16 | 1992-04-29 | Lynxvale Ltd | Micromechanical sensor |
US5763782A (en) * | 1992-03-16 | 1998-06-09 | British Technology Group Limited | Micromechanical sensor |
EP0568494A1 (de) * | 1992-04-27 | 1993-11-03 | K.K. Holding Ag | Kapazitives Beschleunigungs-Messsystems |
JP3367113B2 (ja) | 1992-04-27 | 2003-01-14 | 株式会社デンソー | 加速度センサ |
DE69309274T2 (de) * | 1992-06-17 | 1997-10-30 | Analog Devices Inc | Verfahren zur herstellung eines eine integrierte halbleiterschaltung und eine selbsttragende mikrostruktur enthaltenden monolithischen chip |
US5337606A (en) * | 1992-08-10 | 1994-08-16 | Motorola, Inc. | Laterally sensitive accelerometer and method for making |
US5461916A (en) | 1992-08-21 | 1995-10-31 | Nippondenso Co., Ltd. | Mechanical force sensing semiconductor device |
DE4228795C2 (de) * | 1992-08-29 | 2003-07-31 | Bosch Gmbh Robert | Drehratensensor und Verfahren zur Herstellung |
JP3151956B2 (ja) * | 1992-09-04 | 2001-04-03 | 株式会社村田製作所 | 加速度センサ |
EP0590658A1 (fr) * | 1992-10-02 | 1994-04-06 | CSEM, Centre Suisse d'Electronique et de Microtechnique S.A. | Dispositif de mesure d'une force |
FR2700012B1 (fr) * | 1992-12-28 | 1995-03-03 | Commissariat Energie Atomique | Accéléromètre intégré à axe sensible parallèle au substrat. |
US6199874B1 (en) | 1993-05-26 | 2001-03-13 | Cornell Research Foundation Inc. | Microelectromechanical accelerometer for automotive applications |
US6149190A (en) * | 1993-05-26 | 2000-11-21 | Kionix, Inc. | Micromechanical accelerometer for automotive applications |
US5563343A (en) * | 1993-05-26 | 1996-10-08 | Cornell Research Foundation, Inc. | Microelectromechanical lateral accelerometer |
US5610335A (en) * | 1993-05-26 | 1997-03-11 | Cornell Research Foundation | Microelectromechanical lateral accelerometer |
US5616514A (en) * | 1993-06-03 | 1997-04-01 | Robert Bosch Gmbh | Method of fabricating a micromechanical sensor |
DE4318466B4 (de) * | 1993-06-03 | 2004-12-09 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikromechanischen Sensors |
DE4332057A1 (de) * | 1993-09-21 | 1995-03-30 | Siemens Ag | Integrierte mikromechanische Sensorvorrichtung und Verfahren zu deren Herstellung |
US5576483A (en) * | 1993-10-01 | 1996-11-19 | Hysitron Incorporated | Capacitive transducer with electrostatic actuation |
DE4341271B4 (de) * | 1993-12-03 | 2005-11-03 | Robert Bosch Gmbh | Beschleunigungssensor aus kristallinem Material und Verfahren zur Herstellung dieses Beschleunigungssensors |
DE4400127C2 (de) * | 1994-01-05 | 2003-08-14 | Bosch Gmbh Robert | Kapazitiver Beschleunigungssensor und Verfahren zu seiner Herstellung |
WO1995019571A1 (de) * | 1994-01-18 | 1995-07-20 | Siemens Aktiengesellschaft | Tunneleffekt-sensor |
JP3435844B2 (ja) * | 1994-03-07 | 2003-08-11 | 株式会社デンソー | 半導体加速度センサ及びその製造方法 |
US5851851A (en) * | 1994-03-07 | 1998-12-22 | Nippondenso Co., Ltd. | Method for fabricating a semiconductor acceleration sensor |
JP3627761B2 (ja) * | 1994-03-09 | 2005-03-09 | 株式会社デンソー | 半導体力学量センサの製造方法 |
DE19508485B4 (de) * | 1994-03-09 | 2005-12-22 | Denso Corp., Kariya | Verfahren zum Herstellen eines Halbleitersensors |
US5936159A (en) * | 1994-03-09 | 1999-08-10 | Nippondenso Co., Ltd. | Semiconductor sensor having multi-layer movable beam structure film |
JP3555214B2 (ja) * | 1994-03-15 | 2004-08-18 | 株式会社デンソー | 半導体加速度センサ |
DE4419844B4 (de) * | 1994-06-07 | 2009-11-19 | Robert Bosch Gmbh | Beschleunigungssensor |
US5510156A (en) * | 1994-08-23 | 1996-04-23 | Analog Devices, Inc. | Micromechanical structure with textured surface and method for making same |
JP3139305B2 (ja) * | 1994-08-24 | 2001-02-26 | 株式会社村田製作所 | 容量型加速度センサ |
US5517123A (en) * | 1994-08-26 | 1996-05-14 | Analog Devices, Inc. | High sensitivity integrated micromechanical electrostatic potential sensor |
DE4431338C2 (de) * | 1994-09-02 | 2003-07-31 | Bosch Gmbh Robert | Beschleunigungssensor |
DE4431478B4 (de) * | 1994-09-03 | 2006-04-13 | Robert Bosch Gmbh | Aufhängung für mikromechanische Struktur und mikromechanischer Beschleunigungssensor |
DE4432837B4 (de) * | 1994-09-15 | 2004-05-13 | Robert Bosch Gmbh | Beschleunigungssensor und Meßverfahren |
JP3435850B2 (ja) * | 1994-10-28 | 2003-08-11 | 株式会社デンソー | 半導体力学量センサ及びその製造方法 |
DE4439203C2 (de) * | 1994-11-03 | 2001-06-28 | Bosch Gmbh Robert | Schaltungsanordnung zur Auswertung eines Beschleunigungssensorsignals |
US5565625A (en) * | 1994-12-01 | 1996-10-15 | Analog Devices, Inc. | Sensor with separate actuator and sense fingers |
US5511420A (en) * | 1994-12-01 | 1996-04-30 | Analog Devices, Inc. | Electric field attraction minimization circuit |
US5542295A (en) * | 1994-12-01 | 1996-08-06 | Analog Devices, Inc. | Apparatus to minimize stiction in micromachined structures |
US5640039A (en) * | 1994-12-01 | 1997-06-17 | Analog Devices, Inc. | Conductive plane beneath suspended microstructure |
US5528520A (en) * | 1994-12-08 | 1996-06-18 | Ford Motor Company | Calibration circuit for capacitive sensors |
US5583290A (en) * | 1994-12-20 | 1996-12-10 | Analog Devices, Inc. | Micromechanical apparatus with limited actuation bandwidth |
JP3216455B2 (ja) * | 1994-12-22 | 2001-10-09 | 株式会社村田製作所 | 容量型静電サーボ加速度センサ |
US5587518A (en) * | 1994-12-23 | 1996-12-24 | Ford Motor Company | Accelerometer with a combined self-test and ground electrode |
US5901031A (en) * | 1995-02-01 | 1999-05-04 | Murata Manufacturing Co., Ltd. | Variable capacitor |
DE19503236B4 (de) * | 1995-02-02 | 2006-05-24 | Robert Bosch Gmbh | Sensor aus einem mehrschichtigen Substrat |
FI100918B (fi) * | 1995-02-17 | 1998-03-13 | Vaisala Oy | Pintamikromekaaninen, symmetrinen paine-eroanturi |
DE19506401A1 (de) * | 1995-02-23 | 1996-08-29 | Siemens Ag | Beschleunigungssensor |
JP3322067B2 (ja) * | 1995-04-24 | 2002-09-09 | 株式会社デンソー | 物理量検出装置 |
US5639542A (en) * | 1995-06-07 | 1997-06-17 | Analog Devices, Inc. | Sub-ground plane for micromachined device |
US5621157A (en) * | 1995-06-07 | 1997-04-15 | Analog Devices, Inc. | Method and circuitry for calibrating a micromachined sensor |
US5659195A (en) * | 1995-06-08 | 1997-08-19 | The Regents Of The University Of California | CMOS integrated microsensor with a precision measurement circuit |
US5922212A (en) * | 1995-06-08 | 1999-07-13 | Nippondenso Co., Ltd | Semiconductor sensor having suspended thin-film structure and method for fabricating thin-film structure body |
US5640133A (en) * | 1995-06-23 | 1997-06-17 | Cornell Research Foundation, Inc. | Capacitance based tunable micromechanical resonators |
DE19524604A1 (de) * | 1995-07-06 | 1997-01-09 | Bosch Gmbh Robert | Schaltungsanordnung, insbesondere für einen kapazitiven Beschleunigungssensor |
JPH11515092A (ja) * | 1995-07-20 | 1999-12-21 | コーネル・リサーチ・ファンデーション・インコーポレイテッド | 高感度力検出のための超小型化ねじれキャンティレバー |
US6000280A (en) * | 1995-07-20 | 1999-12-14 | Cornell Research Foundation, Inc. | Drive electrodes for microfabricated torsional cantilevers |
US6012336A (en) * | 1995-09-06 | 2000-01-11 | Sandia Corporation | Capacitance pressure sensor |
US5963788A (en) * | 1995-09-06 | 1999-10-05 | Sandia Corporation | Method for integrating microelectromechanical devices with electronic circuitry |
US5798283A (en) * | 1995-09-06 | 1998-08-25 | Sandia Corporation | Method for integrating microelectromechanical devices with electronic circuitry |
US5661240A (en) * | 1995-09-25 | 1997-08-26 | Ford Motor Company | Sampled-data interface circuit for capacitive sensors |
DE19537814B4 (de) * | 1995-10-11 | 2009-11-19 | Robert Bosch Gmbh | Sensor und Verfahren zur Herstellung eines Sensors |
DE19758847B4 (de) * | 1996-02-05 | 2007-10-31 | Denso Corp., Kariya | Halbleitersensor für eine physikalische Grösse |
JP3430771B2 (ja) * | 1996-02-05 | 2003-07-28 | 株式会社デンソー | 半導体力学量センサの製造方法 |
DE19704359B4 (de) * | 1996-02-05 | 2006-03-30 | Denso Corp., Kariya | Halbleitersensor für eine physikalische Größe und Verfahren zu seinem Betrieb |
US5818227A (en) * | 1996-02-22 | 1998-10-06 | Analog Devices, Inc. | Rotatable micromachined device for sensing magnetic fields |
US5659262A (en) * | 1996-03-15 | 1997-08-19 | Analog Devices, Inc. | Offset trimming for a micromachined sensing device |
US5880369A (en) * | 1996-03-15 | 1999-03-09 | Analog Devices, Inc. | Micromachined device with enhanced dimensional control |
US5748004A (en) * | 1996-03-15 | 1998-05-05 | Analog Devices, Inc. | Reset switch for a micromachined device |
US5694740A (en) * | 1996-03-15 | 1997-12-09 | Analog Devices, Inc. | Micromachined device packaged to reduce stiction |
US5747353A (en) * | 1996-04-16 | 1998-05-05 | National Semiconductor Corporation | Method of making surface micro-machined accelerometer using silicon-on-insulator technology |
JP3435979B2 (ja) * | 1996-04-26 | 2003-08-11 | 株式会社デンソー | 物理量検出装置 |
US5744968A (en) * | 1996-04-30 | 1998-04-28 | Motorola Inc. | Ratiometric circuit |
US5992233A (en) | 1996-05-31 | 1999-11-30 | The Regents Of The University Of California | Micromachined Z-axis vibratory rate gyroscope |
US6250156B1 (en) | 1996-05-31 | 2001-06-26 | The Regents Of The University Of California | Dual-mass micromachined vibratory rate gyroscope |
DE19625666C1 (de) * | 1996-06-26 | 1998-01-15 | Siemens Ag | Ausleseschaftung und kapazitiv messender Senser |
DE69626972T2 (de) * | 1996-07-31 | 2004-01-08 | Stmicroelectronics S.R.L., Agrate Brianza | Integrierter kapazitiver Halbleiter-Beschleunigungsmessaufnehmer sowie Verfahren zu seiner Herstellung |
US5878283A (en) * | 1996-09-05 | 1999-03-02 | Eastman Kodak Company | Single-use camera with motion sensor |
DE19639946B4 (de) * | 1996-09-27 | 2006-09-21 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
DE19650681C2 (de) * | 1996-12-06 | 2001-08-16 | Zentr Mikroelekt Dresden Gmbh | Kapazitive Sensoranordnung |
DE19704454C2 (de) * | 1997-02-06 | 2000-03-02 | Bosch Gmbh Robert | Verfahren zur Herstellung oberflächenmikromechanischer Strukturen mittels Ätzung in der Dampfphase |
US6220096B1 (en) | 1997-03-20 | 2001-04-24 | Interscience, Inc. | Differential wideband vibration |
US5874675A (en) * | 1997-03-20 | 1999-02-23 | Interscience, Inc. | Wideband vibration sensor |
DE19719779A1 (de) * | 1997-05-10 | 1998-11-12 | Bosch Gmbh Robert | Beschleunigungssensor |
US5808198A (en) * | 1997-05-19 | 1998-09-15 | The Charles Stark Draper Laboratory, Inc. | RF balanced capacitive vibration sensor system |
US5914553A (en) * | 1997-06-16 | 1999-06-22 | Cornell Research Foundation, Inc. | Multistable tunable micromechanical resonators |
US5939633A (en) * | 1997-06-18 | 1999-08-17 | Analog Devices, Inc. | Apparatus and method for multi-axis capacitive sensing |
US6223598B1 (en) | 1997-06-18 | 2001-05-01 | Analog Devices, Inc. | Suspension arrangement for semiconductor accelerometer |
US6048774A (en) * | 1997-06-26 | 2000-04-11 | Denso Corporation | Method of manufacturing dynamic amount semiconductor sensor |
US6167757B1 (en) | 1997-09-08 | 2001-01-02 | The Regents Of The University Of Michigan | Single-side microelectromechanical capacitive accelerometer and method of making same |
US6718605B2 (en) | 1997-09-08 | 2004-04-13 | The Regents Of The University Of Michigan | Single-side microelectromechanical capacitive accelerometer and method of making same |
US6035714A (en) | 1997-09-08 | 2000-03-14 | The Regents Of The University Of Michigan | Microelectromechanical capacitive accelerometer and method of making same |
FR2769369B1 (fr) | 1997-10-08 | 1999-12-24 | Sercel Rech Const Elect | Accelerometre a plaque mobile, avec moteur electrostatique de contre-reaction |
GB9722766D0 (en) | 1997-10-28 | 1997-12-24 | British Telecomm | Portable computers |
DE19750134C1 (de) * | 1997-11-13 | 1999-03-18 | Univ Dresden Tech | Kapazitiver Beschleunigungssensor und Verfahren zu dessen Herstellung |
DE19750350C1 (de) * | 1997-11-13 | 1999-08-05 | Univ Dresden Tech | Dreidimensionaler Chip-Beschleunigungssensor und Verfahren zu seiner Herstellung mittels UV-unterstützter Mikrogalvanik |
DE69729457T2 (de) * | 1997-12-17 | 2005-06-30 | Em Microelectronic-Marin S.A., Marin | Verfahren zur Einstellung einer eine kapazitive Grösse in eine korrespondierende Spannung umsetzende Signalverarbeitungsschaltung |
CH691990A5 (fr) * | 1997-12-17 | 2001-12-14 | Em Microelectronic Marin Sa | Procédure de caractérisation d'un convertisseur en tension ou en courant connecté à un montage capacitif |
DE19800745A1 (de) | 1998-01-12 | 1999-07-15 | Bosch Gmbh Robert | Design- und Herstellungsverfahren für eine mikromechanische Vorrichtung |
JP3660119B2 (ja) * | 1998-02-18 | 2005-06-15 | 株式会社デンソー | 半導体力学量センサ |
US6275034B1 (en) | 1998-03-11 | 2001-08-14 | Analog Devices Inc. | Micromachined semiconductor magnetic sensor |
JP3424550B2 (ja) * | 1998-04-13 | 2003-07-07 | 株式会社デンソー | 半導体力学量センサの製造方法 |
US6069516A (en) * | 1998-04-28 | 2000-05-30 | Maxim Integrated Products, Inc. | Compact voltage biasing circuitry for enhancement of power MOSFET |
JP3264884B2 (ja) | 1998-05-11 | 2002-03-11 | 三菱電機株式会社 | 容量検出回路 |
JP4178658B2 (ja) | 1998-06-30 | 2008-11-12 | 株式会社デンソー | 容量式物理量検出装置 |
GB9819817D0 (en) * | 1998-09-12 | 1998-11-04 | Secr Defence | Improvements relating to micro-machining |
US6044297A (en) | 1998-09-25 | 2000-03-28 | Medtronic, Inc. | Posture and device orientation and calibration for implantable medical devices |
KR100464309B1 (ko) * | 1998-12-31 | 2005-02-28 | 삼성전자주식회사 | 면적변화정전용량형마이크로가속도계및그제조방법 |
JP4238437B2 (ja) | 1999-01-25 | 2009-03-18 | 株式会社デンソー | 半導体力学量センサとその製造方法 |
US6266588B1 (en) | 1999-03-01 | 2001-07-24 | Mcclellan Scott B. | Vehicle motion detection and recording method and apparatus |
US6970095B1 (en) | 1999-05-17 | 2005-11-29 | Caveo Technology, Llc | Theft detection system and method |
US6497141B1 (en) | 1999-06-07 | 2002-12-24 | Cornell Research Foundation Inc. | Parametric resonance in microelectromechanical structures |
US6545661B1 (en) * | 1999-06-21 | 2003-04-08 | Midway Amusement Games, Llc | Video game system having a control unit with an accelerometer for controlling a video game |
US6549792B1 (en) * | 1999-06-25 | 2003-04-15 | Agere Systems Inc. | Accelerometer influenced communication device |
US6386032B1 (en) | 1999-08-26 | 2002-05-14 | Analog Devices Imi, Inc. | Micro-machined accelerometer with improved transfer characteristics |
JP4327395B2 (ja) | 1999-08-31 | 2009-09-09 | アナログ デバイセス インコーポレーテッド | センサおよび微細加工された装置 |
DE10046958B4 (de) | 1999-09-27 | 2009-01-02 | Denso Corp., Kariya-shi | Kapazitive Vorrichtung zum Erfassen einer physikalischen Grösse |
US6257062B1 (en) | 1999-10-01 | 2001-07-10 | Delphi Technologies, Inc. | Angular Accelerometer |
US7335650B2 (en) | 2000-01-14 | 2008-02-26 | Sterix Limited | Composition |
US6868726B2 (en) * | 2000-01-20 | 2005-03-22 | Analog Devices Imi, Inc. | Position sensing with improved linearity |
US6753638B2 (en) | 2000-02-03 | 2004-06-22 | Calient Networks, Inc. | Electrostatic actuator for micromechanical systems |
JP4352562B2 (ja) | 2000-03-02 | 2009-10-28 | 株式会社デンソー | 信号処理装置 |
JP2002040047A (ja) * | 2000-07-25 | 2002-02-06 | Denso Corp | 容量型物理量検出センサ |
US6484567B1 (en) * | 2000-08-03 | 2002-11-26 | Symyx Technologies, Inc. | Rheometer for rapidly measuring small quantity samples |
JP2002082127A (ja) | 2000-09-07 | 2002-03-22 | Mitsubishi Electric Corp | 静電容量型加速度センサ、静電容量型角加速度センサおよび静電アクチュエータ |
US6825967B1 (en) | 2000-09-29 | 2004-11-30 | Calient Networks, Inc. | Shaped electrodes for micro-electro-mechanical-system (MEMS) devices to improve actuator performance and methods for fabricating the same |
US6393914B1 (en) | 2001-02-13 | 2002-05-28 | Delphi Technologies, Inc. | Angular accelerometer |
US6433524B1 (en) | 2001-03-15 | 2002-08-13 | Rosemount Aerospace Inc. | Resistive bridge interface circuit |
US6701788B2 (en) | 2001-07-31 | 2004-03-09 | Kelsey-Hayes Company | Multiple output inertial sensing device |
DE10148858A1 (de) * | 2001-10-04 | 2003-04-10 | Bosch Gmbh Robert | Mikromechanischer Sensor mit Selbsttestfunktion und Optimierungsverfahren |
US6761070B2 (en) | 2002-01-31 | 2004-07-13 | Delphi Technologies, Inc. | Microfabricated linear accelerometer |
US20030161949A1 (en) * | 2002-02-28 | 2003-08-28 | The Regents Of The University Of California | Vapor deposition of dihalodialklysilanes |
US6718826B2 (en) | 2002-02-28 | 2004-04-13 | Delphi Technologies, Inc. | Balanced angular accelerometer |
US6666092B2 (en) | 2002-02-28 | 2003-12-23 | Delphi Technologies, Inc. | Angular accelerometer having balanced inertia mass |
US6744264B2 (en) | 2002-04-25 | 2004-06-01 | Motorola, Inc. | Testing circuit and method for MEMS sensor packaged with an integrated circuit |
US7776027B2 (en) * | 2002-07-11 | 2010-08-17 | Misonix, Incorporated | Medical handpiece with automatic power switching means |
US6727749B1 (en) * | 2002-08-29 | 2004-04-27 | Xilinx, Inc. | Switched capacitor summing system and method |
US9107615B2 (en) | 2002-12-18 | 2015-08-18 | Active Protective Technologies, Inc. | Method and apparatus for body impact protection |
KR20050107470A (ko) | 2003-02-28 | 2005-11-11 | 배 시스템즈 피엘시 | 가속도계 |
US7514283B2 (en) * | 2003-03-20 | 2009-04-07 | Robert Bosch Gmbh | Method of fabricating electromechanical device having a controlled atmosphere |
JP2004361388A (ja) * | 2003-05-15 | 2004-12-24 | Mitsubishi Electric Corp | 容量型慣性力検出装置 |
US7075160B2 (en) * | 2003-06-04 | 2006-07-11 | Robert Bosch Gmbh | Microelectromechanical systems and devices having thin film encapsulated mechanical structures |
US6936491B2 (en) | 2003-06-04 | 2005-08-30 | Robert Bosch Gmbh | Method of fabricating microelectromechanical systems and devices having trench isolated contacts |
US6952041B2 (en) | 2003-07-25 | 2005-10-04 | Robert Bosch Gmbh | Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same |
US20050054133A1 (en) * | 2003-09-08 | 2005-03-10 | Felton Lawrence E. | Wafer level capped sensor |
US7275424B2 (en) * | 2003-09-08 | 2007-10-02 | Analog Devices, Inc. | Wafer level capped sensor |
JP4645013B2 (ja) * | 2003-10-03 | 2011-03-09 | パナソニック株式会社 | 加速度センサ及びそれを用いた複合センサ |
US7397097B2 (en) * | 2003-11-25 | 2008-07-08 | Stmicroelectronics, Inc. | Integrated released beam layer structure fabricated in trenches and manufacturing method thereof |
US20050170609A1 (en) * | 2003-12-15 | 2005-08-04 | Alie Susan A. | Conductive bond for through-wafer interconnect |
US6936918B2 (en) * | 2003-12-15 | 2005-08-30 | Analog Devices, Inc. | MEMS device with conductive path through substrate |
DE102004003181B3 (de) * | 2004-01-22 | 2005-08-11 | Robert Bosch Gmbh | Mikromechanischer Sensor mit einer Auswerteschaltung |
JP4367165B2 (ja) * | 2004-02-13 | 2009-11-18 | 株式会社デンソー | 半導体力学量センサの検査方法 |
US7068125B2 (en) | 2004-03-04 | 2006-06-27 | Robert Bosch Gmbh | Temperature controlled MEMS resonator and method for controlling resonator frequency |
US20050235751A1 (en) * | 2004-04-27 | 2005-10-27 | Zarabadi Seyed R | Dual-axis accelerometer |
US7194376B2 (en) * | 2004-04-27 | 2007-03-20 | Delphi Technologies, Inc. | Circuit and method of processing multiple-axis sensor output signals |
US7102467B2 (en) | 2004-04-28 | 2006-09-05 | Robert Bosch Gmbh | Method for adjusting the frequency of a MEMS resonator |
DE102004021693B4 (de) * | 2004-04-30 | 2008-11-06 | Austriamicrosystems Ag | Mikromechanischer Sensor |
US7608534B2 (en) * | 2004-06-02 | 2009-10-27 | Analog Devices, Inc. | Interconnection of through-wafer vias using bridge structures |
US7038150B1 (en) | 2004-07-06 | 2006-05-02 | Sandia Corporation | Micro environmental sensing device |
US7093478B2 (en) * | 2004-07-08 | 2006-08-22 | Analog Devices, Inc. | Method for calibrating accelerometer sensitivity |
US20060021444A1 (en) * | 2004-07-28 | 2006-02-02 | Helix Technology Corporation | Method of operating a resistive heat-loss pressure sensor |
US7249516B2 (en) * | 2004-07-28 | 2007-07-31 | Brooks Automation, Inc. | Method of operating a resistive heat-loss pressure sensor |
EP1779121A1 (en) * | 2004-08-17 | 2007-05-02 | Analog Devices, Inc. | Multiple axis acceleration sensor |
FI20041344A (fi) * | 2004-10-15 | 2006-04-16 | Valtion Teknillinen | Anturi ja menetelmä komponenttiin kohdistuvan suureen mittaamiseksi |
US7179674B2 (en) * | 2004-12-28 | 2007-02-20 | Stmicroelectronics, Inc. | Bi-directional released-beam sensor |
US7353706B2 (en) | 2004-12-28 | 2008-04-08 | Stmicroelectronics, Inc. | Weighted released-beam sensor |
US7795695B2 (en) | 2005-01-27 | 2010-09-14 | Analog Devices, Inc. | Integrated microphone |
US7250322B2 (en) * | 2005-03-16 | 2007-07-31 | Delphi Technologies, Inc. | Method of making microsensor |
US20060207327A1 (en) * | 2005-03-16 | 2006-09-21 | Zarabadi Seyed R | Linear accelerometer |
WO2006105314A1 (en) * | 2005-03-29 | 2006-10-05 | Analog Devices, Inc. | Capacitive sensor with damping |
ES2245614B1 (es) * | 2005-05-25 | 2006-12-16 | Universitat Autonoma De Barcelona | Sistema de lectura para un elemento transductor mecanico. |
US7562573B2 (en) * | 2005-07-21 | 2009-07-21 | Evigia Systems, Inc. | Integrated sensor and circuitry and process therefor |
US7455106B2 (en) * | 2005-09-07 | 2008-11-25 | Schlumberger Technology Corporation | Polymer protective coated polymeric components for oilfield applications |
JP2007178420A (ja) * | 2005-11-30 | 2007-07-12 | Denso Corp | 容量式物理量センサおよびその診断方法 |
US7444883B2 (en) * | 2005-12-22 | 2008-11-04 | Honeywell International Inc. | Vibrating beam force transducer |
US20070170528A1 (en) | 2006-01-20 | 2007-07-26 | Aaron Partridge | Wafer encapsulated microelectromechanical structure and method of manufacturing same |
US7543473B2 (en) * | 2006-08-01 | 2009-06-09 | Analog Devices, Inc. | Sensor self-test transfer standard |
US7757555B2 (en) * | 2006-08-30 | 2010-07-20 | Robert Bosch Gmbh | Tri-axis accelerometer having a single proof mass and fully differential output signals |
US20080087979A1 (en) * | 2006-10-13 | 2008-04-17 | Analog Devices, Inc. | Integrated Circuit with Back Side Conductive Paths |
JP2008145269A (ja) * | 2006-12-11 | 2008-06-26 | Denso Corp | センサ装置 |
DE102007017209B4 (de) * | 2007-04-05 | 2014-02-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mikromechanischer Inertialsensor zur Messung von Drehraten |
EP1988366A1 (en) * | 2007-04-30 | 2008-11-05 | STMicroelectronics S.r.l. | Readout-interface circuit for a capacitive microelectromechanical sensor, and corresponding sensor |
US9047850B1 (en) | 2007-10-17 | 2015-06-02 | David Wiley Beaty | Electric instrument music control device with magnetic displacement sensors |
US7923623B1 (en) | 2007-10-17 | 2011-04-12 | David Beaty | Electric instrument music control device with multi-axis position sensors |
JP4645656B2 (ja) * | 2008-02-07 | 2011-03-09 | 株式会社デンソー | 半導体力学量センサ |
DE102008010717A1 (de) * | 2008-02-22 | 2009-08-27 | Siemens Aktiengesellschaft | Vorrichtung und Verfahren zur Anzeige einer medizinischen Bildinformation sowie bildgebendes System mit einer derartigen Vorrichtung |
WO2009138498A1 (de) * | 2008-05-15 | 2009-11-19 | Continental Teves Ag & Co. Ohg | Mikromechanischer beschleunigungssensor |
US7956621B2 (en) * | 2008-06-11 | 2011-06-07 | Analog Devices, Inc. | Anti-capture method and apparatus for micromachined devices |
US8076893B2 (en) * | 2008-09-04 | 2011-12-13 | The Board Of Trustees Of The University Of Illinois | Displacement actuation and sensing for an electrostatic drive |
EP2329280B1 (en) * | 2008-09-15 | 2012-07-04 | Nxp B.V. | A capacitive sensor device and a method of sensing accelerations |
JP4894840B2 (ja) * | 2008-10-08 | 2012-03-14 | 株式会社デンソー | 物理量検出装置 |
US8338689B1 (en) | 2008-10-17 | 2012-12-25 | Telonics Pro Audio LLC | Electric instrument music control device with multi-axis position sensors |
US8322216B2 (en) * | 2009-09-22 | 2012-12-04 | Duli Yu | Micromachined accelerometer with monolithic electrodes and method of making the same |
US8688393B2 (en) * | 2010-07-29 | 2014-04-01 | Medtronic, Inc. | Techniques for approximating a difference between two capacitances |
JP5750867B2 (ja) * | 2010-11-04 | 2015-07-22 | セイコーエプソン株式会社 | 機能素子、機能素子の製造方法、物理量センサーおよび電子機器 |
US20130018216A1 (en) | 2011-07-13 | 2013-01-17 | Beckerle Travis M | Fully-implantable microphoneless cochlear implant |
CN102323448B (zh) * | 2011-09-01 | 2013-04-10 | 中国航空工业第六一八研究所 | 一种零位自补偿的线性加速度计 |
US8816703B2 (en) * | 2011-09-01 | 2014-08-26 | Robert Bosch Gmbh | Linear capacitance-to-voltage converter using a single amplifier for accelerometer front ends with cancellation of spurious forces contributed by sensor circuitry |
JP6140919B2 (ja) * | 2011-09-30 | 2017-06-07 | 曙ブレーキ工業株式会社 | 加速度センサ回路 |
US8933712B2 (en) | 2012-01-31 | 2015-01-13 | Medtronic, Inc. | Servo techniques for approximation of differential capacitance of a sensor |
US9027403B2 (en) | 2012-04-04 | 2015-05-12 | Analog Devices, Inc. | Wide G range accelerometer |
DE102015111425B4 (de) * | 2014-07-18 | 2016-06-30 | Klaus Kürschner | Verfahren und Einrichtung zur elektrischen Kraftmessung mittels Isolationsdünnschicht |
US10196883B2 (en) | 2015-01-09 | 2019-02-05 | Weatherford Technology Holdings, Llc | Long-stroke pumping unit |
DE102015001128B4 (de) * | 2015-01-29 | 2021-09-30 | Northrop Grumman Litef Gmbh | Beschleunigungssensor mit Federkraftkompensation |
CA3154199C (en) | 2015-01-29 | 2024-01-16 | Weatherford Technology Holdings, Llc | Long stroke pumping unit |
CA3187473A1 (en) | 2015-02-23 | 2016-09-01 | Weatherford Technology Holdings, Llc | Long-stroke pumping unit |
US10465457B2 (en) | 2015-08-11 | 2019-11-05 | Weatherford Technology Holdings, Llc | Tool detection and alignment for tool installation |
US10626683B2 (en) | 2015-08-11 | 2020-04-21 | Weatherford Technology Holdings, Llc | Tool identification |
US10197050B2 (en) | 2016-01-14 | 2019-02-05 | Weatherford Technology Holdings, Llc | Reciprocating rod pumping unit |
US10549090B2 (en) | 2016-08-17 | 2020-02-04 | Envoy Medical Corporation | Communication system and methods for fully implantable modular cochlear implant system |
US10466130B2 (en) * | 2017-02-27 | 2019-11-05 | Multitest Elektronische Systeme Gmbh | Test device, a test system and a method for testing a mechanical pressure sensor |
US10544631B2 (en) | 2017-06-19 | 2020-01-28 | Weatherford Technology Holdings, Llc | Combined multi-coupler for top drive |
DE102017211080B3 (de) | 2017-06-29 | 2018-11-08 | Infineon Technologies Dresden GmbH & Co. KG | Mikromechanischer Sensor und Verfahren zum Herstellen eines mikromechanischen Sensors und eines mikromechanischen Sensorelements |
US10527104B2 (en) | 2017-07-21 | 2020-01-07 | Weatherford Technology Holdings, Llc | Combined multi-coupler for top drive |
US10712360B2 (en) | 2017-09-27 | 2020-07-14 | Azoteq (Pty) Ltd | Differential charge transfer based accelerometer |
US11287442B2 (en) * | 2018-03-06 | 2022-03-29 | Apple Inc. | Continuous calibration of accelerometer sensitivity by proof-mass dithering |
JP6931637B2 (ja) * | 2018-08-21 | 2021-09-08 | 株式会社富士セラミックス | 圧電型加速度センサ |
TWI681192B (zh) * | 2018-12-12 | 2020-01-01 | 蘇州明皜傳感科技有限公司 | 三軸加速度計 |
MX2021009963A (es) | 2019-02-21 | 2022-01-06 | Envoy Medical Corp | Sistema coclear implantable con componentes integrados y caracterizacion del cable. |
US11564046B2 (en) | 2020-08-28 | 2023-01-24 | Envoy Medical Corporation | Programming of cochlear implant accessories |
US11697019B2 (en) | 2020-12-02 | 2023-07-11 | Envoy Medical Corporation | Combination hearing aid and cochlear implant system |
US11471689B2 (en) | 2020-12-02 | 2022-10-18 | Envoy Medical Corporation | Cochlear implant stimulation calibration |
US11806531B2 (en) | 2020-12-02 | 2023-11-07 | Envoy Medical Corporation | Implantable cochlear system with inner ear sensor |
US11839765B2 (en) | 2021-02-23 | 2023-12-12 | Envoy Medical Corporation | Cochlear implant system with integrated signal analysis functionality |
US11633591B2 (en) | 2021-02-23 | 2023-04-25 | Envoy Medical Corporation | Combination implant system with removable earplug sensor and implanted battery |
US11865339B2 (en) | 2021-04-05 | 2024-01-09 | Envoy Medical Corporation | Cochlear implant system with electrode impedance diagnostics |
US20230123673A1 (en) * | 2021-10-19 | 2023-04-20 | Verb Surgical Inc. | Integrated sensors for surgical staplers |
Family Cites Families (92)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4029346A (en) * | 1975-10-14 | 1977-06-14 | Browning Charles W | Line threader device |
US4071838A (en) * | 1976-02-09 | 1978-01-31 | Diax Corporation | Solid state force transducer and method of making same |
US4050049A (en) * | 1976-02-09 | 1977-09-20 | Signetics Corporation | Solid state force transducer, support and method of making same |
US4244225A (en) * | 1979-06-08 | 1981-01-13 | Itt Industries, Inc. | Mechanical resonator arrangements |
US4378510A (en) * | 1980-07-17 | 1983-03-29 | Motorola Inc. | Miniaturized accelerometer with piezoelectric FET |
US4342227A (en) * | 1980-12-24 | 1982-08-03 | International Business Machines Corporation | Planar semiconductor three direction acceleration detecting device and method of fabrication |
US4356730A (en) * | 1981-01-08 | 1982-11-02 | International Business Machines Corporation | Electrostatically deformographic switches |
US4457179A (en) * | 1981-03-16 | 1984-07-03 | The Bendix Corporation | Differential pressure measuring system |
CH642461A5 (fr) * | 1981-07-02 | 1984-04-13 | Centre Electron Horloger | Accelerometre. |
US4532809A (en) * | 1981-10-05 | 1985-08-06 | Allied Corporation | Pressure measuring systems with increased accuracy for a constant resolution |
US4435737A (en) * | 1981-12-16 | 1984-03-06 | Rockwell International Corporation | Low cost capacitive accelerometer |
US4430895A (en) * | 1982-02-02 | 1984-02-14 | Rockwell International Corporation | Piezoresistive accelerometer |
US4804875A (en) * | 1982-09-16 | 1989-02-14 | The Singer Company | Monolythic resonator vibrating beam accelerometer |
US4553436A (en) * | 1982-11-09 | 1985-11-19 | Texas Instruments Incorporated | Silicon accelerometer |
US4522072A (en) * | 1983-04-22 | 1985-06-11 | Insouth Microsystems, Inc. | Electromechanical transducer strain sensor arrangement and construction |
GB2146697B (en) * | 1983-09-17 | 1986-11-05 | Stc Plc | Flexible hinge device |
US4473768A (en) * | 1983-09-30 | 1984-09-25 | Teledyne Industries, Inc. | Piezoelectric force-balance accelerometer system |
US4488445A (en) * | 1983-10-28 | 1984-12-18 | Honeywell Inc. | Integrated silicon accelerometer with cross-axis compensation |
US4600934A (en) * | 1984-01-06 | 1986-07-15 | Harry E. Aine | Method of undercut anisotropic etching of semiconductor material |
FR2558263B1 (fr) * | 1984-01-12 | 1986-04-25 | Commissariat Energie Atomique | Accelerometre directif et son procede de fabrication par microlithographie |
FR2560997B1 (fr) * | 1984-03-06 | 1987-06-05 | Sfena | Capteur accelerometrique a structure pendulaire plane |
GB2159278B (en) * | 1984-05-23 | 1988-04-13 | Stc Plc | Heading sensor |
DE3429250C1 (de) * | 1984-08-08 | 1986-03-27 | Texas Instruments Deutschland Gmbh, 8050 Freising | Auf die Einwirkung einer Kraft ansprechender Sensor |
US5000817A (en) * | 1984-10-24 | 1991-03-19 | Aine Harry E | Batch method of making miniature structures assembled in wafer form |
US4674319A (en) * | 1985-03-20 | 1987-06-23 | The Regents Of The University Of California | Integrated circuit sensor |
US4705659A (en) * | 1985-04-01 | 1987-11-10 | Motorola, Inc. | Carbon film oxidation for free-standing film formation |
FR2580389B2 (fr) * | 1985-04-16 | 1989-03-03 | Sfena | Accelerometre micro-usine a rappel electrostatique |
DE3515349A1 (de) * | 1985-04-27 | 1986-10-30 | Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn | Elektrischer geber zur messung mechanischer groessen |
US4891985A (en) * | 1985-07-22 | 1990-01-09 | Honeywell Inc. | Force sensor with attached mass |
US4679434A (en) * | 1985-07-25 | 1987-07-14 | Litton Systems, Inc. | Integrated force balanced accelerometer |
JPH0821722B2 (ja) * | 1985-10-08 | 1996-03-04 | 日本電装株式会社 | 半導体振動・加速度検出装置 |
JPS6293668A (ja) * | 1985-10-21 | 1987-04-30 | Hitachi Ltd | 角速度・加速度検出器 |
US4691568A (en) * | 1985-12-09 | 1987-09-08 | Motorola, Inc. | Semi-conductor accelerometer |
US4736629A (en) * | 1985-12-20 | 1988-04-12 | Silicon Designs, Inc. | Micro-miniature accelerometer |
JPS62213280A (ja) * | 1986-03-14 | 1987-09-19 | Nissan Motor Co Ltd | 半導体加速度センサ |
US4670092A (en) * | 1986-04-18 | 1987-06-02 | Rockwell International Corporation | Method of fabricating a cantilever beam for a monolithic accelerometer |
FR2599833B1 (fr) * | 1986-06-10 | 1992-02-14 | Metravib Sa | Capteur de grandeurs mecaniques integre sur silicium et procede de fabrication |
US4922756A (en) * | 1988-06-20 | 1990-05-08 | Triton Technologies, Inc. | Micro-machined accelerometer |
JPS6341080A (ja) * | 1986-08-06 | 1988-02-22 | Nissan Motor Co Ltd | 半導体加速度センサ |
EP0268351B1 (en) * | 1986-08-25 | 1991-10-23 | Richard A. Hanson | Proof mass suspension assembly for an accelerometer |
EP0456285A3 (en) * | 1986-09-22 | 1992-01-02 | Nippondenso Co., Ltd. | Semiconductor accelerometer |
FR2604791B1 (fr) * | 1986-10-02 | 1988-11-25 | Commissariat Energie Atomique | Procedes de fabrication d'une jauge piezoresistive et d'un accelerometre comportant une telle jauge |
US4926696A (en) * | 1986-11-19 | 1990-05-22 | Massachusetts Institute Of Technology | Optical micropressure transducer |
US4942767A (en) * | 1986-11-19 | 1990-07-24 | Massachusetts Institute Of Technology | Pressure transducer apparatus |
JPS63252257A (ja) * | 1986-11-20 | 1988-10-19 | Aisin Seiki Co Ltd | 加速度検出装置 |
US4896098A (en) * | 1987-01-08 | 1990-01-23 | Massachusetts Institute Of Technology | Turbulent shear force microsensor |
US4779463A (en) * | 1987-01-13 | 1988-10-25 | Systron Donner Corporation | Servo accelerometer |
US4884446A (en) * | 1987-03-12 | 1989-12-05 | Ljung Per B | Solid state vibrating gyro |
US4967605A (en) * | 1987-04-24 | 1990-11-06 | Wacoh Corporation | Detector for force and acceleration using resistance element |
US4943750A (en) * | 1987-05-20 | 1990-07-24 | Massachusetts Institute Of Technology | Electrostatic micromotor |
US4997521A (en) * | 1987-05-20 | 1991-03-05 | Massachusetts Institute Of Technology | Electrostatic micromotor |
US4851080A (en) * | 1987-06-29 | 1989-07-25 | Massachusetts Institute Of Technology | Resonant accelerometer |
FR2617607B1 (fr) * | 1987-06-30 | 1989-12-01 | Applic Gles Electrici Meca | Accelerometre pendulaire a reequilibrage et procede de fabrication d'un tel accelerometre |
GB8718004D0 (en) * | 1987-07-29 | 1987-12-16 | Marconi Co Ltd | Accelerometer |
JPH077012B2 (ja) * | 1987-08-18 | 1995-01-30 | 富士通株式会社 | 加速度センサ |
DE3885568T2 (de) * | 1987-10-02 | 1994-03-17 | Sextant Avionique | Flacher Pendelbeschleunigungsaufnehmer. |
US4766768A (en) * | 1987-10-22 | 1988-08-30 | Sundstrand Data Control, Inc. | Accelerometer with isolator for common mode inputs |
US5211051A (en) * | 1987-11-09 | 1993-05-18 | California Institute Of Technology | Methods and apparatus for improving sensor performance |
US4809552A (en) * | 1987-11-23 | 1989-03-07 | Allied-Signal, Inc. | Multidirectional force-sensing transducer |
GB8728442D0 (en) * | 1987-12-04 | 1988-01-13 | Russell M K | Triaxial accelerometers |
US5016072A (en) * | 1988-01-13 | 1991-05-14 | The Charles Stark Draper Laboratory, Inc. | Semiconductor chip gyroscopic transducer |
US5060039A (en) * | 1988-01-13 | 1991-10-22 | The Charles Stark Draper Laboratory, Inc. | Permanent magnet force rebalance micro accelerometer |
FR2627592B1 (fr) * | 1988-02-22 | 1990-07-27 | Sagem | Accelerometre pendulaire non asservi a poutre resonante |
US4930351A (en) * | 1988-03-24 | 1990-06-05 | Wjm Corporation | Vibratory linear acceleration and angular rate sensing system |
US4874499A (en) * | 1988-05-23 | 1989-10-17 | Massachusetts Institute Of Technology | Electrochemical microsensors and method of making such sensors |
US4951510A (en) * | 1988-07-14 | 1990-08-28 | University Of Hawaii | Multidimensional force sensor |
US4882993A (en) * | 1988-08-05 | 1989-11-28 | The United States Of America As Represented By The Secretary Of The Army | Electronic back-up safety mechanism for hand-emplaced land mines |
US4896100A (en) * | 1988-08-30 | 1990-01-23 | Hitec Products, Inc. | Signal conditioner for capacitive transducer |
US4945765A (en) * | 1988-08-31 | 1990-08-07 | Kearfott Guidance & Navigation Corp. | Silicon micromachined accelerometer |
US4891255A (en) * | 1988-09-29 | 1990-01-02 | The United States Of America As Represented By The United States Department Of Energy | (110) Oriented silicon wafer latch accelerometer and process for forming the same |
US4908509A (en) * | 1988-10-27 | 1990-03-13 | Massachusetts Institute Of Technology | Traction and reaction force microsensor |
JPH0623782B2 (ja) * | 1988-11-15 | 1994-03-30 | 株式会社日立製作所 | 静電容量式加速度センサ及び半導体圧力センサ |
US4901570A (en) * | 1988-11-21 | 1990-02-20 | General Motors Corporation | Resonant-bridge two axis microaccelerometer |
US4893509A (en) * | 1988-12-27 | 1990-01-16 | General Motors Corporation | Method and product for fabricating a resonant-bridge microaccelerometer |
US5025346A (en) * | 1989-02-17 | 1991-06-18 | Regents Of The University Of California | Laterally driven resonant microstructures |
US4879914A (en) * | 1989-02-27 | 1989-11-14 | Sundstrand Data Control, Inc. | Unitary push-pull force transducer |
US5005413A (en) * | 1989-02-27 | 1991-04-09 | Sundstrand Data Control, Inc. | Accelerometer with coplanar push-pull force transducers |
US4901586A (en) * | 1989-02-27 | 1990-02-20 | Sundstrand Data Control, Inc. | Electrostatically driven dual vibrating beam force transducer |
US4912990A (en) * | 1989-02-27 | 1990-04-03 | Sundstrand Data Control, Inc. | Magnetically driven vibrating beam force transducer |
US5008774A (en) * | 1989-02-28 | 1991-04-16 | United Technologies Corporation | Capacitive accelerometer with mid-plane proof mass |
US4928203A (en) * | 1989-02-28 | 1990-05-22 | United Technologies | Capacitive accelerometer with hinges on top and bottom surface |
US4930042A (en) * | 1989-02-28 | 1990-05-29 | United Technologies | Capacitive accelerometer with separable damping and sensitivity |
US4930043A (en) * | 1989-02-28 | 1990-05-29 | United Technologies | Closed-loop capacitive accelerometer with spring constraint |
US4969359A (en) * | 1989-04-06 | 1990-11-13 | Ford Motor Company | Silicon accelerometer responsive to three orthogonal force components and method for fabricating |
US4987781A (en) * | 1989-05-03 | 1991-01-29 | Sensym, Incorporated | Accelerometer chip |
US5060526A (en) * | 1989-05-30 | 1991-10-29 | Schlumberger Industries, Inc. | Laminated semiconductor sensor with vibrating element |
US5103667A (en) * | 1989-06-22 | 1992-04-14 | Ic Sensors, Inc. | Self-testable micro-accelerometer and method |
US5006487A (en) * | 1989-07-27 | 1991-04-09 | Honeywell Inc. | Method of making an electrostatic silicon accelerometer |
US4945733A (en) * | 1989-11-22 | 1990-08-07 | Labrecque James C | Refrigeration |
US4980598A (en) * | 1989-12-21 | 1990-12-25 | Lucas Schaevitz Inc. | Monolithic resonator for a vibrating beam accelerometer |
US4995233A (en) * | 1990-02-07 | 1991-02-26 | Brunswick Corporation | Automatically controlled exhaust assembly for marine stern drive |
US5251484A (en) * | 1992-04-03 | 1993-10-12 | Hewlett-Packard Company | Rotational accelerometer |
-
1991
- 1991-08-16 DE DE69113632T patent/DE69113632T2/de not_active Expired - Lifetime
- 1991-08-16 JP JP3514538A patent/JPH0644008B2/ja not_active Expired - Lifetime
- 1991-08-16 EP EP91915044A patent/EP0543901B1/en not_active Expired - Lifetime
- 1991-08-16 WO PCT/US1991/005851 patent/WO1992003740A1/en active IP Right Grant
-
1993
- 1993-03-04 US US08/028,922 patent/US5345824A/en not_active Expired - Lifetime
-
1994
- 1994-04-12 US US08/226,771 patent/US5465604A/en not_active Expired - Lifetime
-
1995
- 1995-04-14 US US08/422,634 patent/US5540095A/en not_active Expired - Lifetime
- 1995-10-11 JP JP26320995A patent/JP3294482B2/ja not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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DE19509338C2 (de) * | 1994-03-15 | 2003-10-16 | Denso Corp | Beschleunigungssensor |
US5622633A (en) * | 1994-08-18 | 1997-04-22 | Nippondenso Co., Ltd. | Semiconductor sensor with suspended microstructure and method for fabricating same |
US5824608A (en) * | 1995-06-27 | 1998-10-20 | Nippondenso Co., Ltd. | Semiconductor physical-quantity sensor and method for manufacturing same |
JPH11261079A (ja) * | 1997-12-23 | 1999-09-24 | Motorola Inc | 半導体素子およびその製造方法 |
JP2003530562A (ja) * | 2000-04-12 | 2003-10-14 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | センサ非依存性の振動振幅制御部 |
JP4650990B2 (ja) * | 2000-04-12 | 2011-03-16 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | センサ非依存性の振動振幅制御部 |
JP2010232431A (ja) * | 2009-03-27 | 2010-10-14 | Denso Corp | 容量式物理量検出装置 |
JP2012522986A (ja) * | 2009-04-03 | 2012-09-27 | アナログ デバイシス, インコーポレイテッド | シングルポートメモリを伴うデジタル出力センサfifoバッファ |
Also Published As
Publication number | Publication date |
---|---|
US5540095A (en) | 1996-07-30 |
EP0543901B1 (en) | 1995-10-04 |
JP3294482B2 (ja) | 2002-06-24 |
DE69113632D1 (de) | 1995-11-09 |
WO1992003740A1 (en) | 1992-03-05 |
EP0543901A1 (en) | 1993-06-02 |
JPH08178954A (ja) | 1996-07-12 |
US5345824A (en) | 1994-09-13 |
US5465604A (en) | 1995-11-14 |
JPH0644008B2 (ja) | 1994-06-08 |
DE69113632T2 (de) | 1996-03-21 |
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