JPH0447889B2 - - Google Patents
Info
- Publication number
- JPH0447889B2 JPH0447889B2 JP18248185A JP18248185A JPH0447889B2 JP H0447889 B2 JPH0447889 B2 JP H0447889B2 JP 18248185 A JP18248185 A JP 18248185A JP 18248185 A JP18248185 A JP 18248185A JP H0447889 B2 JPH0447889 B2 JP H0447889B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- block
- film magnetic
- thin film
- magnetic head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005498 polishing Methods 0.000 claims description 91
- 239000010409 thin film Substances 0.000 claims description 34
- 230000007246 mechanism Effects 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 238000007517 polishing process Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 238000012937 correction Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
- G11B5/3166—Testing or indicating in relation thereto, e.g. before the fabrication is completed
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
薄膜磁気ヘツドの研磨方法に関し、特に複数の
薄膜磁気ヘツドを搭載したスライダーブロツクの
ギヤツプ深さ寸法を高精度に加工することができ
る薄膜磁気ヘツドの研磨方法に関する。[Detailed Description of the Invention] [Field of Application of the Invention] This invention relates to a method of polishing a thin-film magnetic head, and particularly to a method for polishing a thin-film magnetic head that can process the gap depth dimension of a slider block equipped with a plurality of thin-film magnetic heads with high accuracy. Regarding polishing method.
薄膜磁気ヘツドにおいては、ギヤツプ深さ寸法
が電気特性に大きく影響し、非常に高精度な寸法
であることが要求される。このギヤツプ深さは、
最終的に研磨加工により仕上げられる。薄膜ヘツ
ドの生産能率を高めるため、この研磨加工は、例
えば５〜１０スライダーの薄膜ヘツドが搭載され
たブロツク単位で行つているが、１ブロツク内の
ギヤツプ深さを全て上記寸法精度に均一加工する
ことは極めて難かしく、薄膜ヘツド加工上の重要
な問題となつている。
In a thin film magnetic head, the gap depth has a large effect on the electrical characteristics and is required to have extremely high precision. This gap depth is
Finally, it is finished by polishing. In order to increase the production efficiency of thin film heads, this polishing process is performed in units of blocks each containing, for example, 5 to 10 sliders of thin film heads, and all gap depths within one block must be uniformly processed to the above-mentioned dimensional accuracy. This is extremely difficult and has become an important problem in thin film head processing.
従来、複数の薄膜磁気ヘツドを搭載したスライ
ダーブロツク（以下単に、ブロツクと略す）のギ
ヤツプ深さを精度よく均一に加工するためには、
仕上げ研磨工程以前に、研削等によりブロツク内
のギヤツプ深さを精度よく均一に揃えておく必要
がある。また、研磨加工を複数のブロツク同時に
行うためには、前工程で更に各ブロツクの研磨代
を高精度に揃えておく必要があり、その場合、前
加工を１ブロツク単位で行わなければならず、生
産能率の低下が問題となつていた。 Conventionally, in order to accurately and uniformly machine the gap depth of a slider block (hereinafter simply referred to as block) equipped with multiple thin-film magnetic heads, it was necessary to
Before the final polishing step, it is necessary to uniformly align the gap depth within the block by grinding or the like. In addition, in order to perform polishing on multiple blocks at the same time, it is necessary to align the polishing allowances of each block with high precision in the pre-process, and in that case, the pre-process must be performed on a block-by-block basis. Declining production efficiency was a problem.
これを改善するため、例えば、特開昭58−
115618号公報に記載された方法によれば、ブロツ
クの複数の位置に荷重を作用させ、ブロツクの仕
上げの途中の面に対する距離を連続的に測定し、
この測定値に応答したブロツクへの加重量を位置
ごとに制御することにより、ブロツクに均一な研
磨を与えている。これにより、進行状況を調べる
度ごとに、ラツピングを中断して仕上げ面に対す
る偏差を測定しなくてもよくなつた。しかし、こ
の方法では、研磨加工を１ブロツク単位でしか行
えないため、やはり生産能率が低い。 In order to improve this, for example,
According to the method described in Publication No. 115618, a load is applied to a plurality of positions on a block, and the distance to the surface of the block in the middle of finishing is continuously measured.
By controlling the amount of weight applied to the block in response to this measured value for each position, uniform polishing is achieved on the block. This eliminates the need to interrupt wrapping and measure deviations from the finished surface every time the progress is checked. However, in this method, the polishing process can only be performed in units of one block, so the production efficiency is still low.
また、従来の方法には、第４図に示すように、
ブロツクの前加工面を基準として研磨加工を行う
方法がある。すなわち、ある基準平面３にブロツ
ク１の加工面を接触させて、研磨加工面にブロツ
ク加工面を模倣して研磨用治具（被研磨物を挟持
する形式のＡタイプ）２に取り付ける方法がある
が、この場合には、ブロツク１と基準平面３とが
直接接触しているため、ブロツク１にチツピング
等の損傷を与え易いという問題点、およびブロツ
ク１が取付けられた研磨用治具を研磨定盤に設置
する際にも、同じようにブロツク１と研磨定盤が
直接接触してチツピング等の損傷を生じ易いとい
う問題点がある。 In addition, the conventional method includes, as shown in Figure 4,
There is a method of polishing based on the previously processed surface of the block. That is, there is a method in which the machined surface of the block 1 is brought into contact with a certain reference plane 3, the polished surface imitates the block machined surface, and the block 1 is attached to the polishing jig (Type A, which holds the object to be polished) 2. However, in this case, since the block 1 and the reference plane 3 are in direct contact, there is a problem that the block 1 is easily damaged such as chipping, and the polishing jig to which the block 1 is attached cannot be used for polishing. When installing it on a board, there is a similar problem in that the block 1 and the polishing surface plate come into direct contact with each other, which tends to cause damage such as chipping.
本発明の目的は、これらの従来の問題を解決
し、ブロツク内のギヤツプ深さ寸法を、前工程の
加工精度に左右されず、精度よく、かつ均一に、
しかもチツピング等の損傷を生じることなく、複
数のブロツクを同時に加工することができる薄膜
磁気ヘツドの研磨方法を提供することにある。
The purpose of the present invention is to solve these conventional problems and to accurately and uniformly measure the gap depth within a block without being affected by the machining accuracy of the previous process.
Moreover, it is an object of the present invention to provide a method for polishing a thin film magnetic head that can simultaneously process a plurality of blocks without causing damage such as chipping.
上記目的を達成するため、本発明による薄膜磁
気ヘツドの研磨方法は、薄膜磁気ヘツドが複数個
搭載されたブロツクをＺ方向の位置調節機構を介
して固定し、位置調節機構によりブロツクのＸ軸
に対する傾きを調節する第１のステツプと、次に
ブロツク上の複数の点において薄膜磁気ヘツドの
ギヤツプ深さ寸法を測定する第２のステツプと、
測定点で該ブロツクの加工面と予め研磨定盤の平
面が転写されてある研磨用ダミーの研磨面との相
対距離を測定する第３のステツプと、第２および
第３のステツプで測定した値が和が一定になるよ
うに位置調節機構で調節する第４のステツプと、
研磨用治具と研磨定盤を回転ないし直線的に相対
運動させて、薄膜磁気ヘツドのギヤツプ深さ寸法
を均一に研磨して仕上げる第５のステツプとを有
することに特徴がある。
In order to achieve the above object, the method of polishing a thin film magnetic head according to the present invention fixes a block on which a plurality of thin film magnetic heads are mounted via a position adjustment mechanism in the Z direction, and adjusts the position of the block with respect to the X axis by the position adjustment mechanism. a first step of adjusting the tilt, and then a second step of measuring the gap depth dimension of the thin film magnetic head at a plurality of points on the block;
A third step of measuring the relative distance between the machined surface of the block and the polishing surface of the polishing dummy onto which the plane of the polishing surface plate has been transferred in advance at the measurement point, and the values measured in the second and third steps. a fourth step of adjusting the sum using a position adjustment mechanism so that the sum becomes constant;
The present invention is characterized in that it includes a fifth step in which the polishing jig and the polishing surface plate are rotated or linearly moved relative to each other to uniformly polish and finish the gap depth of the thin film magnetic head.
以下、本発明の実施例を、図面により詳細に説
明する。第５図は、薄膜磁気ヘツド素子の断面図
である。薄膜磁気ヘツドは、第５図に示すよう
に、セラミツク等の基板４上に、下他膜５、下部
磁性膜６、ギヤツプ材７、導体コイル８、絶縁層
９、上部磁性膜１０、保護膜１１より形成され、
浮上面１３に対し研削、研磨等を施こすことによ
り所定のギヤツプ深さ寸法Ｇに高精度に加工し
て、製造される。なお、１２はギヤツプ深さの０
点、つまり研磨される最終点である。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 5 is a cross-sectional view of the thin film magnetic head element. As shown in FIG. 5, the thin film magnetic head includes a lower layer 5, a lower magnetic layer 6, a gap material 7, a conductive coil 8, an insulating layer 9, an upper magnetic layer 10, and a protective layer on a substrate 4 made of ceramic or the like. formed from 11,
The air bearing surface 13 is processed to a predetermined gap depth G with high precision by grinding, polishing, or the like. Note that 12 is the gap depth of 0.
point, the final point to be polished.
第１図は、本発明の一実施例を示す薄膜磁気ヘ
ツドの研磨方法の説明図である。 FIG. 1 is an explanatory diagram of a method of polishing a thin film magnetic head showing an embodiment of the present invention.
１は被加工物であるブロツク、１４は被加工物
を保持して研磨する研磨用治具（被研磨物を調節
機構で固定する形式のＢタイプ）、１５は研磨用
ダミー、１６は研磨定盤、１７，１７′はスライ
ダーブロツク平行調節機構、１８はギヤツプ深さ
０の点を結んだラインである。 1 is a block which is a workpiece, 14 is a polishing jig for holding and polishing a workpiece (B type in which the workpiece is fixed with an adjustment mechanism), 15 is a polishing dummy, and 16 is a polishing fixture. 17 and 17' are slider block parallel adjustment mechanisms, and 18 is a line connecting the gap depth points of 0.
研磨用治具１４に固定された研磨用ダミー１５
の研磨面１５′は、研磨定盤１６の平面が転写さ
れており、この研磨用治具１４に、第５図に示し
た薄膜磁気ヘツドが複数個搭載されたブロツク１
を、Ｚ軸方向の位置調節機構１７，１７′を介し
て固定している。この調節機構１７，１７′によ
り、ブロツク１のＸ軸に対する傾きθを調節する
ことができる。 Polishing dummy 15 fixed to polishing jig 14
The polishing surface 15' has the flat surface of the polishing surface plate 16 transferred thereto, and the polishing jig 14 has a block 1 mounted with a plurality of thin film magnetic heads shown in FIG.
are fixed via Z-axis position adjustment mechanisms 17, 17'. The adjustment mechanisms 17, 17' allow adjustment of the inclination θ of the block 1 with respect to the X axis.
研磨方法としては、先ず、ブロツク１に搭載さ
れている被加工物、つまり第５図に示す薄膜磁気
ヘツドのギヤツプ深さ寸法Ｇを、ブロツク上の複
数の点、例えば、第１図では、ブロツク１の両端
の薄膜磁気ヘツド素子のＧ１，Ｇ２の２箇所にお
いて測定する。次に、ブロツク１上で、ギヤツプ
深さ寸法Ｇを測定した各点において、ブロツク１
の加工面１′とあらかじめ研磨定盤１６の平面を
転写してある研磨用ダミー１５の研磨面１５′と
の相対距離L1，L2を測定する。ここで、ブロツ
ク１上のライン１８は、ブロツク１上に搭載され
た複数の薄膜磁気ヘツドのギヤツプ０点を結んだ
ラインであつて、第５図のライン１２でギヤツプ
０点が示されている。いま、第１図のライン１８
と研磨定盤１６の平面が平行となるためには、次
式の成立することが必要である。 As for the polishing method, first, the gap depth dimension G of the workpiece mounted on block 1, that is, the thin film magnetic head shown in FIG. Measurements are taken at two locations, G1 and G2, of the thin film magnetic head element at both ends of 1. Next, at each point on block 1 where the gap depth dimension G was measured,
The relative distances L 1 and L 2 between the processed surface 1' and the polished surface 15' of the polishing dummy 15 onto which the flat surface of the polishing surface plate 16 has been transferred in advance are measured. Here, line 18 on block 1 is a line connecting the gap 0 points of the plurality of thin film magnetic heads mounted on block 1, and line 12 in FIG. 5 indicates the gap 0 point. . Now, line 18 in Figure 1
In order for the planes of the polishing surface plate 16 to be parallel to
Ｇ１＋Ｌ１＝Ｇ２＋Ｌ２＝Ｃ（Ｃは定数）……
(1)
上式(1)を満足させるように、相対距離Ｌ１，Ｌ
２を調節機構１７，１７′により調節し、研磨定
盤１６とブロツク１上のギヤツプ深さ０点を結ん
だライン１８を平行な状態にして、研磨用治具１
４と研磨定盤１６を回転あるいは直線的に相対運
動させることにより、ブロツク１内の各薄膜磁気
ヘツドのギヤツプ深さ寸法Ｇを均一に仕上げるこ
とができる。また、研磨終了後は、ブロツク１の
みを研磨用治具１４より取り外し、研磨用ダミー
１５を治具１４に取り付けたまま繰り返し使用す
ることができる。なお、上式(1)を満足させるよう
に、相対距離Ｌ１，Ｌ２を調節機構１７，１７′
により調節する具体的方法としては、例えば、研
磨定盤１６上に研磨用治具１４を設定する前に、
研磨用ダミー１５を取り付けたまま、ダミー１５
側を上に逆向きに置いて、ダミー１５の研磨面１
５′の高さからブロツク１の両端のワーク面（加
工される面）までの距離を厚み計等で測定し（こ
のときの距離がｌ１，ｌ２とする）、次にブロツ
ク１の両端の薄膜磁気ヘツド素子のＧ１，Ｇ２の
寸法を測定する。上式(1)より、Ｇ１−Ｇ２＝Ｌ２
−Ｌ１であるから、ｌ１の距離をｌ１＝Ｌ１とし
て固定すれば、反対側の距離Ｌ２は、Ｌ２＝ｌ１
＋（Ｇ１−Ｇ２）が成立するように調節機構１７
により調節すればよい。このようにして、上式(1)
を満足させた後、第１図に示すように、研磨定盤
１６上にブロツク１を取り付けた研磨用治具１４
を設置し、研磨定盤１６と回転あるいは直線的に
相対運動させることにより、まず研磨用ダミー１
５が初期の研磨面１５′に基づいて、これに平行
に研磨される。その後、ダミーの加工量がＬ１
（この場合、Ｌ１＜Ｌ２とする）に達すると、だ
ミーと共にワークも研磨され、最終的にワーク加
工面１′をライン１８と平行に研磨することがで
きる。勿論、上式(1)で、Ｇ１＝Ｇ２，Ｌ１＝Ｌ２
＝Ｃでも差し支えない。 G1+L1=G2+L2=C (C is a constant)...
(1) The relative distances L1 and L are set so that the above formula (1) is satisfied.
2 with the adjustment mechanisms 17 and 17', and the line 18 connecting the gap depth 0 point on the polishing surface plate 16 and the block 1 is made parallel, and the polishing jig 1 is adjusted.
By rotating or linearly moving the polishing surface plate 16 relative to the polishing surface plate 16, the gap depth G of each thin film magnetic head in the block 1 can be made uniform. Further, after polishing is completed, only the block 1 can be removed from the polishing jig 14, and the polishing dummy 15 can be used repeatedly while attached to the jig 14. Note that the relative distances L1 and L2 are adjusted by adjusting mechanisms 17 and 17' so as to satisfy the above formula (1).
For example, before setting the polishing jig 14 on the polishing surface plate 16,
With the polishing dummy 15 attached, remove the dummy 15.
Place the polished side 1 of the dummy 15 upside down.
Measure the distance from the height of 5' to the work surfaces (surfaces to be processed) at both ends of block 1 using a thickness gauge, etc. (the distances at this time are 11 and 12), and then Measure the dimensions of G1 and G2 of the magnetic head element. From the above formula (1), G1-G2=L2
-L1, so if the distance l1 is fixed as l1=L1, the distance L2 on the opposite side is L2=l1
Adjustment mechanism 17 so that +(G1-G2) is established.
You can adjust it accordingly. In this way, the above formula (1)
After satisfying the above requirements, as shown in FIG.
First, the polishing dummy 1 is installed and rotated or linearly moved relative to the polishing surface plate 16.
5 is polished based on and parallel to the initial polishing surface 15'. After that, the dummy processing amount is L1
(In this case, L1<L2), the workpiece is polished together with the dummy, and finally the workpiece processing surface 1' can be polished parallel to the line 18. Of course, in the above formula (1), G1=G2, L1=L2
=C is also acceptable.
また、被加工物であるブロツク１は、第１図に
示すように、研磨用ダミー１５の研磨面１５′よ
り任意の距離Ｌ１，Ｌ２だけ研磨定盤１６に対し
て、研磨用治具１４の側にずらして取り付けられ
ているため、ブロツク１を搭載した研磨用治具１
４を研磨定盤１６に設置する際に、被加工物であ
るブロツク１が研磨定盤１６に接触しない。従つ
て、被加工物であるブロツク１にチツピング等の
損傷が生じることがない。 Further, as shown in FIG. 1, the block 1, which is the workpiece, is placed on the polishing jig 14 by an arbitrary distance L1, L2 from the polishing surface 15' of the polishing dummy 15 with respect to the polishing surface plate 16. Polishing jig 1 equipped with block 1 because it is installed offset to the side.
4 on the polishing surface plate 16, the block 1, which is the workpiece, does not come into contact with the polishing surface plate 16. Therefore, damage such as chipping does not occur to the block 1, which is the workpiece.
第２図は、本発明の他の実施例を示す薄膜磁気
ヘツドの研磨方法の図である。第２図において、
２１は制御回路、２２，２２′は調節機構１７，
１７′に取り付けられた駆動部、１９，１９′はギ
ヤツプ深さ検出部、２０，２３はそれぞれ導線で
あり、他の記号は第１図のものと同じものを表わ
している。第１図の実施例では、被加工物のブロ
ツク１を研磨用治具１４に取り付ける際に、平行
補正を行うのみであつたが、第２図の実施例で
は、ギヤツプ深さを測定しながら全自動平行補正
を行う。すなわち、第２図では、従来知られてい
る方法、例えば、電気抵抗、静電容量等により研
磨加工中のギヤツプ深さ寸法Ｇを、ブロツク１上
の複数の点より検出するようにしている。ギヤツ
プ深さ寸法検出部１９，１９′から通常検出され
る信号は導線２０を通して制御回路２１に伝送さ
れる。制御回路２１は、この信号により、研磨加
工中にブロツク１のギヤツプ深さ０点を結んだラ
イン１８の平行を検出し、もし狂いがある場合に
は、その量に応じた補正量を演算し、補正指令を
調節機構１７，１７′に取り付けられた駆動部２
２，２２′に導線２３を通して伝達する。例えば、
駆動部２２，２２′を圧電素子とすると、制御回
路２１はこれに導線２３を介して補正量に応じた
信号を伝えて、調節機構１７，１７′を駆動し、
被加工物ブロツク１のギヤツプ深さ０点を結んだ
ライン１８と、研磨定盤１６との平行を保つよう
に補正しながら研磨し、ギヤツプ深さ寸法Ｇが所
定の寸法になつた時点を、検出部１９，１９′に
より検出することにより、研磨を停止する。この
ようにして、全自動平行補正研磨が可能となる。 FIG. 2 is a diagram of a method of polishing a thin film magnetic head showing another embodiment of the present invention. In Figure 2,
21 is a control circuit, 22, 22' is an adjustment mechanism 17,
17' is a drive unit, 19 and 19' are gap depth detection units, 20 and 23 are conductive wires, and other symbols are the same as those in FIG. In the embodiment shown in Fig. 1, only parallel correction was performed when attaching the block 1 of the workpiece to the polishing jig 14, but in the embodiment shown in Fig. 2, while measuring the gap depth, Performs fully automatic parallel correction. That is, in FIG. 2, the gap depth G during polishing is detected from a plurality of points on the block 1 using conventionally known methods such as electrical resistance and capacitance. Signals normally detected from the gap depth dimension detectors 19, 19' are transmitted to a control circuit 21 through a conductor 20. Based on this signal, the control circuit 21 detects the parallelism of the line 18 connecting the gap depth 0 point of the block 1 during the polishing process, and if there is any deviation, calculates a correction amount according to the amount. , a correction command is sent to the drive section 2 attached to the adjustment mechanism 17, 17'.
2 and 22' through a conductor 23. for example,
If the driving parts 22, 22' are piezoelectric elements, the control circuit 21 transmits a signal corresponding to the correction amount to this via the conductor 23 to drive the adjustment mechanisms 17, 17'.
Polishing is performed while correcting the line 18 connecting the gap depth 0 point of the workpiece block 1 and the polishing surface plate 16 to maintain parallelism, and the time when the gap depth dimension G reaches a predetermined dimension is Polishing is stopped by detection by the detection units 19, 19'. In this way, fully automatic parallel correction polishing becomes possible.
第３図は、第２図の制御系を研磨加工機に実装
した例を示す図である。第３図において、２４は
研磨治具ガイドローラー、２５はガイドローラー
支持部、２６はスリツプリングであり、その他の
記号は第１図、第２図と同じものを表わしてい
る。ブロツク１からのギヤツプ深さ寸法Ｇの検出
信号、および調節機構駆動部２２，２２′への制
御信号は、この場合には、研磨用治具１４上に取
付けられたスリツプリング２６により制御回路
（第３図では図示省略）に接続されている。ここ
では、回転する研磨定盤１６上で、ガイド支持部
２５により支持された研磨治具ガイドローラ２４
を介して自点運動を行わせ、研磨用治具１４から
の信号の取り出しを可能にしている。なお、第３
図では、研磨定盤１６上に２個の研磨用治具１４
が載置されているが、さらに隙間なく載置するこ
とができる。その場合、研磨定盤１６が回転し、
かつ研磨治具ガイドローラ２４により研磨治具１
４も自転しているため、ギヤツプ検出部１９，１
９′からの信号取り出し線２０と制御回路から駆
動部２２，２２′への制御線２３は、ねじれたり、
からんだりするが、第３図では、スリツプリング
２６により、回転状態の駆動部２２，２２′およ
び研磨用治具１４との結合を円滑に行つている。
つまり、外部からの導線端子をスリツプリング２
６の固定部側に接続し、回転している研磨用治具
１４の導線端子をスリツプリング２６の回転部側
に接続する。スリツプリング２６は、これらの固
定端子と回転端子と連続的に接続状態に保ち、円
滑に制御信号の伝達とギヤツプ検出信号の伝達と
を実行している。 FIG. 3 is a diagram showing an example in which the control system shown in FIG. 2 is implemented in a polishing machine. In FIG. 3, 24 is a polishing jig guide roller, 25 is a guide roller support part, 26 is a slip ring, and other symbols are the same as in FIGS. 1 and 2. In this case, the detection signal of the gap depth dimension G from the block 1 and the control signal to the adjustment mechanism drive parts 22, 22' are sent to the control circuit ( (not shown in FIG. 3). Here, a polishing jig guide roller 24 supported by a guide supporter 25 on a rotating polishing surface plate 16 is shown.
The self-point movement is performed through the polishing jig 14, thereby making it possible to extract signals from the polishing jig 14. In addition, the third
In the figure, two polishing jigs 14 are placed on a polishing surface plate 16.
is placed, but it can be placed even further without any gaps. In that case, the polishing surface plate 16 rotates,
And the polishing jig 1 is moved by the polishing jig guide roller 24.
Since 4 is also rotating, gap detection parts 19 and 1
The signal take-out line 20 from 9' and the control line 23 from the control circuit to the drive parts 22, 22' are twisted,
However, in FIG. 3, the slip ring 26 smoothly connects the rotating driving parts 22, 22' and the polishing jig 14.
In other words, the conductor terminal from the outside is connected to the slip ring 2.
6 to the fixed part side of the slip ring 26, and the conducting wire terminal of the rotating polishing jig 14 to the rotating part side of the slip ring 26. The slip ring 26 maintains a continuous connection with these fixed terminals and rotating terminals, and smoothly transmits control signals and gap detection signals.
このように、本実施例においては、薄膜磁気ヘ
ツドの研磨加工の際に、研磨用治具１４に研磨定
盤１６の平面を転写した基準面を設けておき、こ
れに複数の薄膜磁気ヘツドが搭載されたブロツク
１におけるギヤツプ深さ０点を結んだラインを、
一定距離だけずらして平行に調節し、このブロツ
クを研磨用治具１４に取り付けて研磨するので、
研磨の前工程で、ブロツク１内の各薄膜磁気ヘツ
ドのギヤツプ深さ寸法を、高精度に均一にしてお
かなくても、複数のブロツク１を同時に、しかも
各薄膜磁気ヘツドのギヤツプ深さを精度よく均一
に研磨することができる。この結果、前工程での
手間を、大幅に省略することができ、生産能率を
向上することが可能である、また、研磨加工にお
いて、被加工物であるブロツク１を搭載した研磨
用治具１４を、研磨定盤１６に設置する際に、ブ
ロツク１に対してチツピング等の損傷を与えずに
済み、薄膜磁気ヘツドの製造における歩留り向上
を可能にする。 As described above, in this embodiment, when polishing a thin film magnetic head, a reference surface is provided on the polishing jig 14 on which the flat surface of the polishing surface plate 16 is transferred, and a plurality of thin film magnetic heads are placed on this reference surface. The line connecting the gap depth 0 point of the installed block 1 is
The block is adjusted to be parallel by shifting it by a certain distance, and then this block is attached to the polishing jig 14 and polished.
In the pre-polishing process, it is not necessary to make the gap depth of each thin-film magnetic head in block 1 uniform with high precision. Can be polished evenly. As a result, the labor in the pre-process can be significantly omitted and production efficiency can be improved.In addition, in the polishing process, the polishing jig 14 on which the block 1, which is the workpiece, is mounted When the block 1 is placed on the polishing surface plate 16, damage such as chipping is not caused to the block 1, thereby making it possible to improve the yield in manufacturing thin film magnetic heads.
以上説明したように、本発明によれば、ブロツ
クに搭載された薄膜磁気ヘツドのギヤツプ深さ寸
法を、前工程の加工精度に係わりなく、精度よ
く、かつ均一に、しかもチツピング等の損傷を与
えずに、複数のブロツクを同時に加工することが
できるので、前工程の手間を大幅に省略できると
ともに、生産能率の向上と歩留りの向上を計るこ
とができる。
As explained above, according to the present invention, the gap depth dimension of the thin film magnetic head mounted on the block can be adjusted accurately and uniformly, regardless of the machining accuracy of the previous process, while preventing damage such as chipping. Since a plurality of blocks can be processed at the same time without any problems, it is possible to significantly reduce the labor involved in pre-processing and improve production efficiency and yield.
第１図は本発明の一実施例を示す薄膜磁気ヘツ
ドの研磨方向の説明図、第２図は本発明の他の実
施例を示す薄膜磁気ヘツドの研磨方法の説明図、
第３図は第２図の制御系を研磨加工機に実装した
例を示す図、第４図は従来の研磨方法の一例を示
す図、第５図は薄膜磁気ヘツド素子の断面図であ
る。
１……スライダブロツク、１４……研磨用治
具、１５……研磨用ダミー、１５′……研磨用ダ
ミーの研磨面、１６……研磨定盤、１７，１７′
……スライダブロツクの平行調節機構、１８……
ギヤツプ深さ０点を結ぶライン、２１……制御回
路、２２，２２′……調節機構駆動部、２４……
研磨治具ガイドローラ、２５……ガイドローラ支
持部、２６……スリツプリング。
FIG. 1 is an explanatory diagram of the polishing direction of a thin film magnetic head showing one embodiment of the present invention, FIG. 2 is an explanatory diagram of a method of polishing a thin film magnetic head showing another embodiment of the present invention,
3 is a diagram showing an example in which the control system of FIG. 2 is implemented in a polishing machine, FIG. 4 is a diagram showing an example of a conventional polishing method, and FIG. 5 is a sectional view of a thin film magnetic head element. 1... Slider block, 14... Polishing jig, 15... Polishing dummy, 15'... Polishing surface of polishing dummy, 16... Polishing surface plate, 17, 17'
...Parallel adjustment mechanism of slider block, 18...
Line connecting gap depth 0 point, 21... Control circuit, 22, 22'... Adjustment mechanism drive section, 24...
Polishing jig guide roller, 25... Guide roller support part, 26... Slip ring.
Claims (1)
をＺ方向の位置調節機構を介して固定し、該位置
調節機構により上記ブロツクのＸ軸に対する傾き
を調節する第１のステツプと、次に該ブロツク上
の複数の点において薄膜磁気ヘツドのギヤツプ深
さ寸法を測定する第２のステツプと、該測定点で
該ブロツクの加工面と予め研磨定盤の平面が転写
されてある研磨用ダミーの研磨面との相対距離を
測定する第３のステツプと、上記第２および第３
のステツプで測定した値の和が一定になるように
上記位置調節機構で調節する第４ステツプと、研
磨用治具と研磨定盤を回転ないし直線的に相対運
動させて、上記薄膜磁気ヘツドのギヤツプ深さ寸
法を均一に研磨して仕上げる第５のステツプとを
有することを特徴とする薄膜磁気ヘツドの研磨方
法。1. A first step in which a block on which a plurality of thin film magnetic heads are mounted is fixed via a position adjustment mechanism in the Z direction, and the inclination of the block with respect to the X axis is adjusted by the position adjustment mechanism; a second step of measuring the gap depth dimension of the thin-film magnetic head at a plurality of points; and at the measuring points, the processed surface of the block and the polished surface of the polishing dummy on which the flat surface of the polishing surface plate has been transferred in advance. a third step of measuring the relative distance of the second and third steps;
a fourth step of adjusting the position adjustment mechanism so that the sum of the values measured in step 2 is constant; and a fourth step of adjusting the position of the thin film magnetic head by rotating or linearly moving the polishing jig and the polishing surface plate relative to each other. 1. A method for polishing a thin film magnetic head, comprising: a fifth step of polishing and finishing the gap depth uniformly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18248185A JPS6243812A (en) | 1985-08-20 | 1985-08-20 | Polishing method for thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18248185A JPS6243812A (en) | 1985-08-20 | 1985-08-20 | Polishing method for thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6243812A JPS6243812A (en) | 1987-02-25 |
| JPH0447889B2 true JPH0447889B2 (en) | 1992-08-05 |
Family
ID=16119026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18248185A Granted JPS6243812A (en) | 1985-08-20 | 1985-08-20 | Polishing method for thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6243812A (en) |
-
1985
- 1985-08-20 JP JP18248185A patent/JPS6243812A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6243812A (en) | 1987-02-25 |
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