JPH0544085B2 - - Google Patents
Info
- Publication number
- JPH0544085B2 JPH0544085B2 JP56211211A JP21121181A JPH0544085B2 JP H0544085 B2 JPH0544085 B2 JP H0544085B2 JP 56211211 A JP56211211 A JP 56211211A JP 21121181 A JP21121181 A JP 21121181A JP H0544085 B2 JPH0544085 B2 JP H0544085B2
- Authority
- JP
- Japan
- Prior art keywords
- block
- thin film
- film magnetic
- forming surface
- magnetic transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 238000005498 polishing Methods 0.000 description 9
- 238000001514 detection method Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
- G11B5/3166—Testing or indicating in relation thereto, e.g. before the fabrication is completed
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】
(1) 発明の技術分野
本発明は複数の薄膜磁気ヘツドを設けたブロツ
ク被研磨物のギヤツプの部分の研磨を中断するこ
となく施工しうる薄膜磁気ヘツドのラツプ仕上げ
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention provides a lap finishing method for a thin film magnetic head that can be applied without interrupting the polishing of the gap portion of a block to be polished provided with a plurality of thin film magnetic heads. Regarding.
(2) 発明の背景
従来、複数の薄膜磁気ヘツドを設けたブロツク
の研削仕上げ面に対しラツピングを施す仕方は、
ラツピングの途中でその作業の中断を要するため
ラツピングに手間がかかるばかりでなく、その測
定手段の性質上精度が悪くならざるを得ないとい
う不具合を有し、その改善が要望されていた。(2) Background of the Invention Conventionally, wrapping is applied to the ground surface of a block provided with a plurality of thin film magnetic heads.
Wrapping is not only time-consuming because the wrapping operation must be interrupted in the middle of the wrapping process, but also has the disadvantage that accuracy inevitably deteriorates due to the nature of the measuring means, and an improvement has been desired.
(3) 従来技術と問題点
即ち、従来技術では、研削仕上げ面のラツピン
グに際して、そのラツプ仕上げの進行状況を調べ
るのに、その都度ラツピング作業を中断して顕微
鏡等で被ラツプ仕上げ物の所望仕上げ面に対する
偏差を測定し、その偏差が所定値内に入つていな
いとその中断していたラツピングを再開する如き
方法を採つていた。従つて、この方法ではラツピ
ングに要する時間が長くならざるを得なかつた。
又、上記測定手段の性質上、その測定を施行し難
い被ラツプ仕上げ物にあつてはその測定に誤差が
入り易く、測定を精度よく施行し得ないという欠
点があつた。(3) Prior art and problems In other words, in the conventional technology, when lapping a ground surface, in order to check the progress of the lapping, the lapping operation is interrupted each time and the desired finish of the object to be lapped is examined using a microscope or the like. A method has been adopted in which the deviation with respect to the surface is measured, and if the deviation is not within a predetermined value, the interrupted wrapping is restarted. Therefore, this method inevitably requires a long time for wrapping.
Furthermore, due to the nature of the above-mentioned measuring means, it is difficult to measure the finished product to be lapped, so there is a drawback that errors tend to occur in the measurement, making it impossible to measure accurately.
(4) 発明の目的
本発明は上述の如き従来技術の有する欠点に鑑
みて創案されたもので、その目的は、複数の薄膜
磁気ヘツドを設けたブロツクの研磨を中断するこ
となく所要研磨量まで続行出来ると共に、ブロツ
クの構造によつてギヤツプ長の研磨精度の左右さ
れない薄膜磁気ヘツドのラツプ仕上げ方法を提供
することにある。(4) Purpose of the Invention The present invention was devised in view of the drawbacks of the prior art as described above, and its purpose is to polish a block provided with a plurality of thin film magnetic heads up to a required polishing amount without interrupting the polishing process. It is an object of the present invention to provide a lap finishing method for a thin film magnetic head that can be continued and the polishing accuracy of the gap length is not affected by the structure of the block.
(5) 発明の構成
そして、この目的は、薄膜磁気ヘツド平板ブロ
ツクの肉厚方向であつて、且つ１側の広面積のブ
ロツク面（以下、磁気変換ギヤツプ形成面と言
う。）側に形成された複数の薄膜磁気ヘツドの磁
気変換ギヤツプを形成し、前記磁気変換ギヤツプ
形成面側に、少なくとも前記薄膜磁気ヘツド平板
ブロツクの両端を含む予め決められた複数の位置
毎に距離測定用電気的素子を設け、該各距離測定
用電気素子の呈する電気的特性量から定盤を用い
てラツプ仕上げされつつある前記磁気変換ギヤツ
プ形成面の所望仕上げ磁気変換ギヤツプ面に対す
る距離を連続的に測定し、その測定値に応じて加
重量を当該測定値対応の位置毎に薄膜磁気ヘツド
平板ブロツクの前記磁気変換ギヤツプ形成面とは
反対側の広面積のブロツク面から前記磁気変換ギ
ヤツプ形成面側へ垂直に向けて印加することによ
つて、達成される。(5) Structure of the Invention The object is to form a thin-film magnetic head flat plate block in the thickness direction and on one side of the wide-area block surface (hereinafter referred to as the magnetic transducer gap forming surface). a plurality of magnetic transducer gaps of a plurality of thin film magnetic heads are formed, and distance measuring electric elements are provided on the side where the magnetic transducer gaps are formed at a plurality of predetermined positions including at least both ends of the flat block of the thin film magnetic head. and continuously measuring the distance of the magnetic transducer gap forming surface that is being lap finished to the desired finished magnetic transducer gap surface using a surface plate from the electrical characteristic amount exhibited by each of the distance measuring electric elements. A weight is applied in accordance with the measured value from a wide area block surface on the opposite side of the magnetic transducer gap forming surface of the thin film magnetic head flat plate block perpendicularly to the magnetic transducer gap forming surface. This is achieved by applying
(6) 発明の実施例
以下、添付図面を参照しながら、本発明の実施
例を説明する。(6) Embodiments of the invention Hereinafter, embodiments of the invention will be described with reference to the accompanying drawings.
第１図は本発明を実施する研磨装置、例えばラ
ツプ仕上げ装置を示す。１は定盤で、これは被研
磨物（被ラツプ仕上げ物）２と相対的に移動し、
これら両者の対向面間に給与されるラツプ剤３に
よつて被ラツプ仕上げ物２の被ラツプ仕上げ面が
ラツプ仕上げされるものである。その被ラツプ仕
上げ物２は、例えばガラス、サフアイヤ等の基板
に複数の薄膜磁気ヘツドを列状に形成したブロツ
クである。その１つ１つの変換ギヤツプを含む縦
断面を示すのが第２図である（以下、これについ
て説明する）。この図において、４，５は磁性層、
６はコイル、７は絶縁物、Ｇはギヤツプである。 FIG. 1 shows a polishing apparatus, such as a lapping apparatus, in which the present invention is practiced. 1 is a surface plate that moves relative to the object to be polished (work to be lapped) 2;
The surface to be lapped of the object to be lapped 2 is lapped by the lapping agent 3 applied between these opposing surfaces. The object to be lapped 2 is a block in which a plurality of thin film magnetic heads are formed in a row on a substrate such as glass or sapphire. FIG. 2 shows a longitudinal section including each of the conversion gaps (this will be explained below). In this figure, 4 and 5 are magnetic layers;
6 is a coil, 7 is an insulator, and G is a gap.
このブロツク２は支持機構８によつて、第１図
上下方向に摺動自在に支えられている。 This block 2 is supported by a support mechanism 8 so as to be freely slidable in the vertical direction in FIG.
９は加重機構で、その本体は支持機構８にて支
えられると共にそのピストンロツド１０（第３図
参照）は支持機構８によつて第１図上下方向に摺
動自在に支えられている。この加重機構９のロツ
ド駆動部１１は、例えばボイスコイルで構成され
ている。 Reference numeral 9 denotes a weighting mechanism whose main body is supported by a support mechanism 8, and whose piston rod 10 (see FIG. 3) is supported by the support mechanism 8 so as to be slidable in the vertical direction in FIG. The rod driving section 11 of this weighting mechanism 9 is composed of, for example, a voice coil.
ボイスコイル１１の各々はその各別の制御線１
２を経て制御回路１３へ接続されている。該制御
回路１３への入力は各別の線１４を経て、ブロツ
ク２の仕上げられつつある面の仕上げ面への距離
を表わす信号を送出する各別の測定手段１５へ接
続されている。 Each of the voice coils 11 has its own separate control line 1
2 to the control circuit 13. The inputs to the control circuit 13 are connected via separate lines 14 to separate measuring means 15 which emit a signal representative of the distance of the surface of the block 2 being finished to the finished surface.
測定手段１５は例えば、第４図及び第５図に示
されるように、ブロツク２の仕上げられつつある
面の仕上げ面への距離を電気的に測定するもので
ある。その電気的特性量は第４図では静電容量
で、第５図では電気抵抗値である。第４図では、
測定手段１５はブロツク２の仕上げ面より予め決
められた距離だけ内側に入つた位置に予め決めら
れた面積の電極１６が上述したロツド１０の当接
する位置下方にロツド毎に設けられ、この電極か
ら各別に引出線１７を引出すと共に上述各電極に
対抗する電極として作用定盤１から一本の導線１
８を引出して引出線１７と導線１８との間に現わ
れる静電容量を制御回路１３へ供給するようにし
て構成されている。 The measuring means 15 is, for example, as shown in FIGS. 4 and 5, for electrically measuring the distance of the surface of the block 2 that is being finished to the finished surface. The electrical characteristic quantity is the capacitance in FIG. 4, and the electrical resistance value in FIG. In Figure 4,
The measuring means 15 includes an electrode 16 of a predetermined area located at a position a predetermined distance inward from the finished surface of the block 2, and is provided for each rod below the position where the above-mentioned rod 10 contacts. Leading wires 17 are drawn out separately from each other, and one conductive wire 1 is provided from the surface plate 1, which acts as an electrode opposing each of the above-mentioned electrodes.
8 is drawn out and the capacitance appearing between the lead wire 17 and the conducting wire 18 is supplied to the control circuit 13.
また、第５図では、ブロツク２の仕上げ開始面
から仕上げ面より予め決められた距離だけ内側に
入つた位置までであつて、且つ上述ロツド１０の
当接面下方に抵抗性領域１９を形成し、その各抵
抗性領域１９の共通端から引出線２０を引出すと
共に該共通端とは反対側の抵抗性領域端から各別
に引出線２１を引出して引出線２０と引出線２０
と引出線２１との間に現われる電気抵抗値を制御
回路１３へ供給するようにして、測定手段１５は
構成されている。 In addition, in FIG. 5, a resistive region 19 is formed from the finishing start surface of the block 2 to a position that is a predetermined distance inward from the finished surface and below the abutting surface of the rod 10. , a leader line 20 is drawn out from the common end of each resistive region 19, and a leader line 21 is drawn out individually from the end of the resistive region opposite to the common end.
The measuring means 15 is configured to supply the electrical resistance value appearing between the lead wire 21 and the lead wire 21 to the control circuit 13.
制御回路１３は、例えば、電気的特性量が静電
容量である場合であつて、その静電容量がブロツ
ク２の左右２個所で測定する場合には、第６図の
如くなる。この図において、２２，２３は増幅器
で、その入力に接続されるC1，C2は第７図に示
されるようにブロツク２の左右２箇所から得られ
る静電容量である。そして、２４はそ入力が増幅
器２２，２３の出力に接続される差動増幅器で、
その出力にはブロツク２の傾きに比例する信号S1
が発生する。この出力は差動増幅器２５，２６の
一方の入力へ接続され、差動増幅器２５，２６の
他方の入力は基準信号発生回路２７，２８へ接続
されている。差動増幅器２５，２６の出力は第８
図のボイスコイル２９，３０へ接続されている。
第８図における他の参照番号は第１図と同じ構成
要素を示している。 For example, when the electrical characteristic quantity is capacitance and the capacitance is measured at two positions on the left and right sides of block 2, the control circuit 13 becomes as shown in FIG. In this figure, 22 and 23 are amplifiers, and C 1 and C 2 connected to their inputs are capacitances obtained from the left and right sides of the block 2, as shown in FIG. 24 is a differential amplifier whose input is connected to the outputs of amplifiers 22 and 23;
Its output is a signal S 1 proportional to the slope of block 2.
occurs. This output is connected to one input of differential amplifiers 25 and 26, and the other input of differential amplifiers 25 and 26 is connected to reference signal generation circuits 27 and 28. The outputs of the differential amplifiers 25 and 26 are the eighth
It is connected to the voice coils 29 and 30 shown in the figure.
Other reference numbers in FIG. 8 indicate the same components as in FIG.
次に、上述構成の研磨装置の動作を説明する。 Next, the operation of the polishing apparatus configured as described above will be explained.
被研磨物、例えば第２図に示すような薄膜磁気
ヘツドを複数形成されたブロツク２の研磨、例え
ばラツピング（以下、これについて説明する。）
に際にして、ブロツク２が装置のホルダ、即ち支
持機構８に装着される。 Polishing of an object to be polished, for example, a block 2 formed with a plurality of thin film magnetic heads as shown in FIG. 2, for example, lapping (this will be explained below).
At this time, the block 2 is mounted in a holder or support mechanism 8 of the device.
然る後に、ブロツク２と定盤１とに相対的な移
動を生ぜしめつつこれらの間にラツプ剤３が給与
されてブロツク２のラツプ仕上げ面にラツピング
を生じさせていく。その際、加重機構９のロツド
１０からブロツク２の背面へ荷重が加えられてい
る。 Thereafter, the lapping agent 3 is applied between the block 2 and the surface plate 1 while causing relative movement therebetween, thereby causing lapping on the lapped surface of the block 2. At this time, a load is applied from the rod 10 of the weighting mechanism 9 to the back surface of the block 2.
そのラツピングが進行していくにつれて、ラツ
ピングされつつある面の、所望の仕上げ面までの
距離が測定手段１５によつて測定される。 As the wrapping progresses, the measuring means 15 measures the distance of the surface being wrapped to the desired finished surface.
測定手段が第４図に示される如く上記距離が静
電容量で表わされて来る手段であるにしろ、又第
５図に示される如く上記距離が電気抵抗値で表わ
されて来る手段であるにしろ、手段１５からの信
号値が制御回路１３へ供給されてそこからロツド
駆動部１１の各々へ、均一なラツピングを生じさ
せる制御信号が供給される。 Whether the measuring means is a means in which the distance is expressed in terms of capacitance as shown in FIG. 4, or a means in which the distance is expressed in terms of electrical resistance as shown in FIG. In any case, the signal values from the means 15 are fed to a control circuit 13 from which a control signal is fed to each of the rod drives 11 to produce a uniform wrapping.
この制御信号の発生形式の一例を第４図、第７
図、第８図を用いて説明すると、第７図に示す静
電容量C1が静電容量C2より大きくなるならば、
ブロツク２の静電容量C2がある側の方がそのラ
ツピング量が少ないこととなり、その傾きを表わ
す信号S1が差動増幅器２４から発生し、この信号
S1を受ける差動増幅器２５からは第８図のボイス
コイル２９へ供給されていた信号を弱めた信号
W1が発生されてボイスコイル２９によるロツド
１０への荷重を弱める一方、信号S1を受ける差動
増幅器２６からは第８図のボイスコイル３０へ供
給されていた信号を強めた信号W2が発生されて
ボイスコイル３０によるロツド１０への荷重を強
める。このようにして、制御回路１３へ与えられ
る静電容量は、常に同一値に保たれながらラツピ
ングは従来のようなラツピングの中断なしに続行
されるから、手間がかからず短時間のうち、所望
の仕上げ面までラツピングをなしうる。 An example of the generation format of this control signal is shown in Figures 4 and 7.
To explain using Fig. 8, if the capacitance C 1 shown in Fig. 7 becomes larger than the capacitance C 2 , then
The amount of wrapping is smaller on the side where the capacitance C2 of block 2 is present, and a signal S1 representing the slope is generated from the differential amplifier 24, and this signal
From the differential amplifier 25 that receives S 1 , a signal that is a weakened version of the signal that was being supplied to the voice coil 29 in FIG.
W 1 is generated to weaken the load on the rod 10 by the voice coil 29, while the differential amplifier 26 receiving the signal S 1 generates a signal W 2 which is an enhanced version of the signal supplied to the voice coil 30 in FIG. This increases the load on the rod 10 by the voice coil 30. In this way, the capacitance applied to the control circuit 13 is always kept at the same value, and wrapping is continued without interrupting wrapping as in the conventional method. Wrapping can be done up to the finished surface.
この仕上げ面への到達は上記静電容量が予め設
定されている値になつたことで知らされる。これ
をヘツドブロツク２について云えば、ギヤツプＧ
が所望のギヤツプ長に仕上げられたことに相当す
る。 Reaching this finished surface is notified when the capacitance reaches a preset value. Regarding headblock 2, gap G
This corresponds to finishing the gap length to the desired gap length.
このような関係は静電容量検出箇所数が増えて
も、同様である。 Such a relationship remains the same even if the number of capacitance detection points increases.
また、電気的特性量が電気抵抗値においても、
静電容量と同じ技法でラツピング制御をなしう
る。 Also, even if the electrical characteristic quantity is the electrical resistance value,
Wrapping control can be achieved using the same technique as capacitance.
そして、これらの電気的特性量の抽出はブロツ
クの幾何学的型態に煩わされことなく、所望の検
出箇所に設けることが出来、ブロツクの幾何学的
型態により検出精度が左右されることはない。 Furthermore, the extraction of these electrical characteristic quantities can be provided at the desired detection location without worrying about the geometrical form of the block, and the detection accuracy is not affected by the geometrical form of the block. do not have.
(7) 発明の効果
以上の説明から明らかなように、本発明によれ
ば、次の効果が得られる。(7) Effects of the invention As is clear from the above explanation, according to the present invention, the following effects can be obtained.
研磨を中断することはないから、短時間のう
ちに所望の研磨をなしうる。 Since polishing is not interrupted, desired polishing can be accomplished in a short time.
比較的に広い面に対して均一な研磨を施工し
うる。 Uniform polishing can be performed on a relatively wide surface.
被研磨物の幾何学的型態による精度への影響
を除去しうる。 The influence of the geometric shape of the object to be polished on precision can be eliminated.
ブロツクに設けた複数の薄膜磁気ヘツドのギ
ヤツプ長を均一にすることができるので、特性
のそろつたヘツドを製造することができる等で
ある。 Since the gap lengths of the plurality of thin film magnetic heads provided in the block can be made uniform, heads with uniform characteristics can be manufactured.
第１図は本発明の実施例を示す図、第２図は研
磨される薄膜磁気ヘツドの断面図、第３図はヘツ
ドブロツクへの加圧状況を示すためのブロツク平
面図、第４図及び第５図は夫々、別異の測定手段
を示す図、第６図は制御回路例を示す図、第７図
及び第８図は２個所で静電容量を測定し、その値
に基いて２箇所で加重する例を示すための図であ
る。
図中、１は定盤、２は被研磨物（ブロツク）、
８は支持機構、９は加重機構、１３は制御回路、
１５は測定手段である。
FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a sectional view of a thin film magnetic head to be polished, FIG. 3 is a block plan view showing the state of pressure applied to the head block, and FIGS. Figure 5 shows different measurement means, Figure 6 shows an example of a control circuit, Figures 7 and 8 measure capacitance at two locations, and based on the measured values, two locations are determined. FIG. In the figure, 1 is the surface plate, 2 is the object to be polished (block),
8 is a support mechanism, 9 is a weighting mechanism, 13 is a control circuit,
15 is a measuring means.
Claims (1)
つて、且つ１側の広面積のブロツク面（以下、磁
気変換ギヤツプ形成面と言う。）側に形成された
複数の薄膜磁気ヘツドの磁気変換ギヤツプを形成
し、前記磁気変換ギヤツプ形成面側に、少なくと
も前記薄膜磁気ヘツド平板ブロツクの両端を含む
予め決められた複数の位置毎に距離測定用電気的
素子を設け、 該各距離測定用電気的素子の呈する電気的特性
量から定盤を用いてラツプ仕上げされつつある前
記磁気変換ギヤツプ形成面の所望仕上げ磁気変換
ギヤツプ面に対する距離を連続的に測定し、 その測定値に応じて加重量を当該測定値対応の
位置毎に薄膜磁気ヘツド平板ブロツクの前記磁気
変換ギヤツプ形成面とは反対側の広面積のブロツ
ク面から前記磁気変換ギヤツプ形成面側へ垂直に
向けて印加することを特徴とする薄膜磁気ヘツド
のラツプ仕上げ方法。[Scope of Claims] 1. A plurality of thin film magnetic heads formed in the thickness direction of the flat plate block of the thin film magnetic head and on one wide area block surface (hereinafter referred to as the magnetic conversion gap forming surface) side. forming a magnetic transducer gap of the head, and providing distance measuring electric elements on the side of the magnetic transducer gap forming surface at each of a plurality of predetermined positions including at least both ends of the thin film magnetic head flat block; Continuously measure the distance of the magnetic transducer gap forming surface that is being lap-finished from the electrical characteristic quantity exhibited by the electrical element for measurement to the desired finished magnetic transducer gap surface, and according to the measured value. A weight is applied perpendicularly to the magnetic transducer gap forming surface from a wide area block surface opposite to the magnetic transducer gap forming surface of the thin film magnetic head flat plate block at each position corresponding to the measured value. Features a lap finishing method for thin film magnetic heads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56211211A JPS58115618A (en) | 1981-12-28 | 1981-12-28 | Polishing method of thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56211211A JPS58115618A (en) | 1981-12-28 | 1981-12-28 | Polishing method of thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58115618A JPS58115618A (en) | 1983-07-09 |
| JPH0544085B2 true JPH0544085B2 (en) | 1993-07-05 |
Family
ID=16602156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56211211A Granted JPS58115618A (en) | 1981-12-28 | 1981-12-28 | Polishing method of thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58115618A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2861291B2 (en) * | 1990-06-19 | 1999-02-24 | ソニー株式会社 | Method for manufacturing thin-film magnetic head and apparatus for manufacturing thin-film magnetic head |
| US6217425B1 (en) | 1998-06-12 | 2001-04-17 | Tdk Corporation | Apparatus and method for lapping magnetic heads |
| US6322422B1 (en) | 1999-01-19 | 2001-11-27 | Nec Corporation | Apparatus for accurately measuring local thickness of insulating layer on semiconductor wafer during polishing and polishing system using the same |
| JP2001121394A (en) | 1999-10-25 | 2001-05-08 | Tdk Corp | Magnetic head polishing device and method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5317404A (en) * | 1976-08-02 | 1978-02-17 | Dainippon Printing Co Ltd | Method of making printing form for inverted halfftone gravure plate making |
-
1981
- 1981-12-28 JP JP56211211A patent/JPS58115618A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5317404A (en) * | 1976-08-02 | 1978-02-17 | Dainippon Printing Co Ltd | Method of making printing form for inverted halfftone gravure plate making |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58115618A (en) | 1983-07-09 |
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