JPH04324686A - Optical semiconductor device - Google Patents
Optical semiconductor deviceInfo
- Publication number
- JPH04324686A JPH04324686A JP3093894A JP9389491A JPH04324686A JP H04324686 A JPH04324686 A JP H04324686A JP 3093894 A JP3093894 A JP 3093894A JP 9389491 A JP9389491 A JP 9389491A JP H04324686 A JPH04324686 A JP H04324686A
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving element
- light receiving
- shield
- molded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 26
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000003825 pressing Methods 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 230000000694 effects Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000013459 approach Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Light Receiving Elements (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、各種電子機器に用いら
れる光半導体装置に関し、特に高感度および耐外乱特性
が要求される受光装置として用いられるリモートコント
ロール用光半導体装置に係る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device used in various electronic devices, and more particularly to an optical semiconductor device for remote control used as a light receiving device that requires high sensitivity and disturbance resistance.
【０００２】0002
【従来の技術】従来の光半導体装置は、各種電子機器の
リモートコントロール用のＯＰＩＣ受光デバイスであり
、受光素子（フオトダイオード）と、フオトダイオード
からの信号に基づき駆動する駆動素子（ＩＣ回路）とが
一体となつた受光チツプを透光性樹脂でモールドし、フ
オトダイオードに光を集光するために、上部にレンズを
設けた構造になつていた。[Prior Art] A conventional optical semiconductor device is an OPIC light-receiving device for remote control of various electronic devices, and includes a light-receiving element (photodiode) and a driving element (IC circuit) that is driven based on a signal from the photodiode. The light-receiving chip was molded with transparent resin, and a lens was installed on top to focus the light onto the photodiode.
【０００３】0003
【発明が解決しようとする課題】最近、光を利用したリ
モートコントロール装置が各種電子機器に用いられるよ
うになつたが、用途が雑多であり、例えば、ビデオテー
プレコーダ（ＶＴＲ）、テレビジヨン受像機（ＴＶ）、
コンパクトデイスク（ＣＤ）、コンポネントシステムや
ラジオカセツトレコーダー、エアコンデイシヨナー等が
あり、使用される環境がさまざまである。[Problems to be Solved by the Invention] Recently, remote control devices using light have come to be used in various electronic devices, but their uses are miscellaneous, such as video tape recorders (VTRs), television receivers, etc. (TV),
There are compact discs (CDs), component systems, radio cassette recorders, air conditioners, etc., and they are used in a variety of environments.
【０００４】リモートコントロールを取りまく環境とし
て、５０／６０Ｈｚ蛍光灯、インバータ蛍光灯、白熱灯
、太陽光等の外乱光と、ＴＶのブラウン管の同期信号か
ら出るノイズのような各種電子機器が発生する電磁ノイ
ズとに大別され、このようなノイズの中で、信号光を増
幅、識別し誤動作する事なく、受信する必要がある。[0004] The environment surrounding the remote control includes disturbance light such as 50/60Hz fluorescent lamps, inverter fluorescent lamps, incandescent lamps, and sunlight, and electromagnetic interference generated by various electronic devices such as noise from the synchronization signal of a TV's cathode ray tube. It is necessary to amplify and identify the signal light and receive it without malfunctioning in such noise.
【０００５】従来のリモートコントロール用ＯＰＩＣ受
光デバイスは、外乱光に対し、フオトダイオード部には
当然ノイズとして入つてくるが、ＩＣ回路部に外乱光が
あたるため、ＩＣ回路部の上面には、メタル層をベタ状
に形成して遮光している。しかし、蛍光灯、白熱灯、太
陽光などの外乱光が存在する環境下で使用される場合、
どうしても、レンズ部分のみならずあらゆる方向から外
乱光が内部に入りノイズとして影響していた。In the conventional OPIC light-receiving device for remote control, ambient light naturally enters the photodiode section as noise, but since the ambient light hits the IC circuit section, the top surface of the IC circuit section is covered with metal. The layer is formed in a solid shape to block light. However, when used in an environment with ambient light such as fluorescent lights, incandescent lights, and sunlight,
Unavoidably, ambient light entered the camera from all directions, not just the lens, and affected it as noise.
【０００６】とりわけ、屋外で使用される場合、太陽光
の影響が大きく、晴天下で１０万Ｌｘ、日陰で１万Ｌｘ
あり、直接太陽光が当たつた場合など、チツプエツジか
ら、光が入ると、ＩＣ回路の各種半導体部品のＰＮジヤ
ンクシヨン部に疑似的に光電流が生じ、等価的に寄生の
フオトダイオードとして働き、回路の誤動作の原因にな
ることがあつた。[0006] Particularly when used outdoors, the influence of sunlight is large, with 100,000 Lx under clear skies and 10,000 Lx in the shade.
When light enters the chip edge, such as when exposed to direct sunlight, a pseudo photocurrent is generated in the PN junction of various semiconductor components in an IC circuit, which equivalently acts as a parasitic photodiode, causing damage to the circuit. This could cause malfunction.
【０００７】また、リモートコントロール用ＯＰＩＣ受
光デバイスは、近距離から遠距離までのリモコン信号を
受信する必要があり、高ゲインのアンプを有しているこ
とから、各種電子機器の発生する電磁ノイズに対して、
誤動作することがあつた。[0007] In addition, the OPIC light receiving device for remote control needs to receive remote control signals from short distances to long distances, and because it has a high gain amplifier, it is susceptible to electromagnetic noise generated by various electronic devices. for,
There were some malfunctions.
【０００８】なお、各ユーザーにて、金属板等を受光デ
バイスの後方にとりつける例があつたが、全体、特に、
受光デバイスの前面をカバーしにくいために、十分なシ
ールド効果が得られなかつた。また、金属板等の取付ス
ペースを必要とするため、形状が大きくなる等の問題が
あつた。[0008] Although there were cases in which each user attached a metal plate or the like to the rear of the light receiving device, overall, in particular,
Because it was difficult to cover the front surface of the light-receiving device, a sufficient shielding effect could not be obtained. Further, since a space for installing a metal plate or the like is required, there are problems such as an increase in size.
【０００９】本発明は、上記課題に鑑み、外乱光による
影響を低減し、かつ耐電磁ノイズ特性の向上を図り得る
リモートコントロール用光半導体装置の提供を目的とす
る。SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to provide an optical semiconductor device for remote control, which can reduce the influence of disturbance light and improve electromagnetic noise resistance.
【００１０】0010
【課題を解決するための手段】本発明請求項１による課
題解決手段は、図１〜５の如く、受光素子３と、該受光
素子３に隣接して配置され受光素子３からの信号に基づ
き駆動する駆動素子４と、該駆動素子４および受光素子
３が搭載されるリードフレーム１と、これらをモールド
樹脂にて被覆して成るモールド体５と、該モールド体５
の前面で信号光を受光素子３に集光させる集光レンズＲ
を有する外装ケースＧと、前記モールド体５と集光レン
ズＲとの間に配置され受光素子３および駆動素子４を外
乱光および電磁ノイズから遮断するための導電性の遮蔽
体６とを備え、前記モールド体５の前面は、遮蔽体６を
受光素子３に可及的に接近させるよう薄く形成され、前
記該遮蔽体６は、その一部が引き出されて接地可能とさ
れ、かつ外部からの信号光を受光素子３のみに採光する
ための採光窓７が形成され、前記外装ケースＧは、モー
ルド体５を集光レンズＲ側に押圧して遮蔽体６を挟持さ
せると共に遮蔽体６をモールド体５の前面に密着させる
ための押圧手段Ｑが設けられたものである。Means for Solving the Problems The means for solving the problems according to claim 1 of the present invention, as shown in FIGS. A driving element 4 to be driven, a lead frame 1 on which the driving element 4 and the light receiving element 3 are mounted, a molded body 5 formed by covering these with molded resin, and the molded body 5
A condensing lens R that condenses the signal light onto the light receiving element 3 in front of the
an exterior case G having a The front surface of the molded body 5 is formed to be thin so that the shielding body 6 is brought as close as possible to the light receiving element 3, and a part of the shielding body 6 is pulled out so that it can be grounded and is protected against external interference. A lighting window 7 is formed to allow the signal light to enter only the light receiving element 3, and the exterior case G presses the molded body 5 toward the condensing lens R to sandwich the shielding body 6, and also molds the shielding body 6. A pressing means Q is provided for bringing the body 5 into close contact with the front surface thereof.
【００１１】本発明請求項２による課題解決手段は、図
６の如く、受光素子３と、該受光素子３に隣接して配置
され受光素子からの信号に基づき駆動する駆動素子４と
、該駆動素子４および受光素子３が搭載されるリードフ
レーム１と、前記受光素子３および駆動素子４を外乱光
および電磁ノイズから遮断するための導電性の遮蔽体６
とを備え、該遮蔽体６は、その一部が接地可能とされ、
かつ外部からの信号光を受光素子３のみに採光するため
の採光窓７が形成され、該採光窓７が受光素子３に可及
的に接近するよう、金型内でリードフレーム１と遮蔽体
６とを対向してセツトし、モールド樹脂にて被覆して信
号光を受光素子３に集光させる集光レンズＲを有するモ
ールド体５が形成されたものである。The means for solving the problem according to claim 2 of the present invention, as shown in FIG. A lead frame 1 on which an element 4 and a light-receiving element 3 are mounted, and a conductive shield 6 for shielding the light-receiving element 3 and drive element 4 from disturbance light and electromagnetic noise.
A part of the shielding body 6 can be grounded,
In addition, a lighting window 7 is formed to allow signal light from the outside to enter only the light receiving element 3, and the lead frame 1 and the shielding body are formed in the mold so that the lighting window 7 approaches the light receiving element 3 as much as possible. 6 are set facing each other and covered with mold resin to form a molded body 5 having a condensing lens R for condensing signal light onto the light receiving element 3.
【００１２】0012
【作用】上記請求項１，２による課題解決手段において
、使用時に外部の発光素子にて光信号を送信すると、送
信された光は、遮蔽体６の採光窓７を通過して受光素子
３にて受光され、電気的信号に変換される。そして、受
光素子３からの信号に基づき、駆動素子４が駆動する。[Operation] In the problem solving means according to claims 1 and 2, when an optical signal is transmitted by an external light emitting element during use, the transmitted light passes through the light receiving window 7 of the shielding body 6 and reaches the light receiving element 3. The light is received and converted into an electrical signal. Then, based on the signal from the light receiving element 3, the driving element 4 is driven.
【００１３】このとき、受光素子３および駆動素子４の
前方に、採光窓７を有する遮蔽体６を設け、かつ、遮蔽
体６の採光窓７を受光素子３に可及的に接近させている
ので、外乱光の駆動素子４への影響を低減する。また、
遮蔽体６の一部が引き出されて接地可能とされているこ
とから、各種電子機器からの電磁ノイズに対する耐量を
向上させる。At this time, a shielding body 6 having a lighting window 7 is provided in front of the light receiving element 3 and the driving element 4, and the lighting window 7 of the shielding body 6 is brought as close to the light receiving element 3 as possible. Therefore, the influence of disturbance light on the drive element 4 is reduced. Also,
Since a part of the shielding body 6 is pulled out and can be grounded, the resistance to electromagnetic noise from various electronic devices is improved.
【００１４】[0014]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。Embodiments Hereinafter, embodiments of the present invention will be explained based on the drawings.
【００１５】（第一実施例）図１は本発明の第一実施例
を示す光半導体装置の側面視断面図、図２は同じくその
正面視断面図、図３はその背面図、図４は同じく遮蔽体
を背後から見た斜視図、図５は多連フレーム方式の光半
導体装置を示す背面図である。(First Embodiment) FIG. 1 is a side sectional view of an optical semiconductor device showing a first embodiment of the present invention, FIG. 2 is a front sectional view thereof, FIG. 3 is a rear view thereof, and FIG. Similarly, FIG. 5 is a perspective view of the shield seen from behind, and FIG. 5 is a rear view showing a multi-frame type optical semiconductor device.
【００１６】図示の如く、本実施例の光半導体装置は、
ビデオテープレコーダ（ＶＴＲ）やエアコンデイシヨナ
ー等に用いられるリモートコントロール用のＯＰＩＣ受
光デバイスであり、受光素子３と、該受光素子３に隣接
して配置され受光素子３からの信号に基づき駆動する駆
動素子４と、該駆動素子４および受光素子３が搭載され
るリードフレーム１と、これらをモールド樹脂にて被覆
して成るモールド体５と、該モールド体５の前面で信号
光を受光素子３に集光させる集光レンズＲを有する外装
ケースＧと、前記モールド体５と集光レンズＲとの間に
配置され受光素子３および駆動素子４を外乱光および電
磁ノイズから遮断するための導電性の遮蔽体６とを備え
、前記モールド体５の前面は、遮蔽体６を受光素子３に
可及的に接近させるよう薄く形成され、前記該遮蔽体６
は、その一部が引き出されて接地可能とされ、かつ外部
からの信号光を受光素子３のみに採光するための採光窓
７が形成され、前記外装ケースＧは、モールド体５を集
光レンズＲ側に押圧して遮蔽体６を挟持させると共に遮
蔽体６をモールド体５の前面に密着させるための押圧手
段Ｑが設けられたものである。As shown in the figure, the optical semiconductor device of this embodiment has the following features:
This is an OPIC light-receiving device for remote control used in video tape recorders (VTRs), air conditioners, etc., and is arranged adjacent to the light-receiving element 3 and is driven based on the signal from the light-receiving element 3. A driving element 4, a lead frame 1 on which the driving element 4 and the light receiving element 3 are mounted, a molded body 5 made by covering these with mold resin, and a signal light is transmitted to the light receiving element 3 on the front surface of the molded body 5. an exterior case G having a condensing lens R that condenses light; and a conductive case disposed between the molded body 5 and the condensing lens R to shield the light receiving element 3 and the driving element 4 from disturbance light and electromagnetic noise. The front surface of the molded body 5 is formed thin so as to bring the shield 6 as close as possible to the light-receiving element 3, and
A part thereof is pulled out and can be grounded, and a lighting window 7 is formed to allow signal light from the outside to enter only the light receiving element 3, and the exterior case G connects the molded body 5 to a condensing lens. A pressing means Q is provided for pressing toward the R side to sandwich the shielding body 6 and bringing the shielding body 6 into close contact with the front surface of the mold body 5.
【００１７】前記受光素子３（フオトダイオード等）お
よび駆動素子４（ＩＣ回路）は、図１，２の如く、上下
方向に１チツプ化して受光チツプ１１とされている。The light receiving element 3 (photodiode, etc.) and the driving element 4 (IC circuit) are integrated into one chip in the vertical direction to form a light receiving chip 11, as shown in FIGS.
【００１８】前記リードフレーム１は、図２の如く、前
記受光チツプ１１が搭載される搭載片２を有する搭載用
リード端子１２と、受光チツプ１１の駆動素子４にボン
デイングワイヤ１３を介して電気的に接続される接続片
１７，１８を有する接続用リード端子１４，１５とを備
え、該リード端子１２，１４，１５は、図５の如く、フ
レーム１９に多連式に片持ち支持されている。As shown in FIG. 2, the lead frame 1 includes a mounting lead terminal 12 having a mounting piece 2 on which the light receiving chip 11 is mounted, and an electrical connection to the driving element 4 of the light receiving chip 11 via a bonding wire 13. 5, the lead terminals 12, 14, 15 are supported by a frame 19 in multiple cantilevers as shown in FIG. .
【００１９】前記モールド体５は、エポキシ樹脂等の透
明樹脂または可視光カツト樹脂が使用して、例えばトラ
ンスフアーモールド方式により射出成形されている。そ
して、該モールド体５の前面部の厚みは、図１の如く、
前記遮蔽体６を受光素子３に可及的に接近して配するよ
う、できるだけ薄く設定されている。The molded body 5 is injection molded using a transparent resin such as an epoxy resin or a visible light cut resin, for example, by a transfer molding method. The thickness of the front part of the molded body 5 is as shown in FIG.
The shielding body 6 is set to be as thin as possible so as to be disposed as close to the light receiving element 3 as possible.
【００２０】前記外装ケースＧは、図１〜３の如く、例
えば弾性変形可能なエポキシ樹脂等に顔料が混入された
可視光カツト樹脂を用いて背面および下面開放の箱形に
形成されている。該外装ケースＧの集光レンズＲは、図
１の如く、半球状とされており、前記採光窓７に対応す
る位置に配されている。そして、集光レンズＲの曲率は
、入射光を採光窓７に集光してデバイスの光学的特性を
向上させるよう設定されている。As shown in FIGS. 1 to 3, the exterior case G is formed into a box shape with an open back and bottom surface using a visible light cut resin in which a pigment is mixed into an elastically deformable epoxy resin, for example. The condensing lens R of the exterior case G has a hemispherical shape as shown in FIG. 1, and is arranged at a position corresponding to the lighting window 7. The curvature of the condensing lens R is set so as to condense the incident light onto the lighting window 7 to improve the optical characteristics of the device.
【００２１】なお図１〜３中、２０ａはモールド体５等
の左右方向の位置ずれを防止する位置決め用凸部、２０
Ｃは同じく前方向の位置ずれを防止する位置決め用凸部
、２０ｂはリードフレーム１の引き出し用開口である。In FIGS. 1 to 3, reference numeral 20a denotes a positioning convex portion 20 for preventing displacement of the molded body 5, etc. in the left-right direction.
C is a positioning convex portion that similarly prevents displacement in the front direction, and 20b is an opening for drawing out the lead frame 1.
【００２２】前記遮蔽体６は、図４の如く、一枚の金属
板を折曲形成して成り、前記モールド体５の前面を覆い
前記採光窓７が設けられた前壁２１と、モールド体５の
側面を覆う側壁２２と、モールド体５の上面を覆う上壁
２３と、該上壁２３から引き出されてこれらを接地可能
とするための接地リード２４とから構成されている。な
お、遮蔽体６は、図５の如く、前記リードフレーム１の
リード端子と同様に、接地リード２４がクレドール２５
にて支持されることにより多連式とされている。また、
採光窓７は、受光素子３とほぼ同じ大きさに形成されて
いる。なお、該採光窓７の大きさは受光素子３より小さ
ければ、光の絞り込みをより良好にできる。As shown in FIG. 4, the shielding body 6 is formed by bending a single metal plate, and covers the front surface of the molded body 5, and the front wall 21 in which the lighting window 7 is provided, and the molded body 5, an upper wall 23 that covers the upper surface of the molded body 5, and a ground lead 24 that is drawn out from the upper wall 23 and allows these to be grounded. Note that, as shown in FIG.
It is a multi-connection type by being supported by. Also,
The lighting window 7 is formed to have approximately the same size as the light receiving element 3. Incidentally, if the size of the lighting window 7 is smaller than the light receiving element 3, the light can be narrowed down better.
【００２３】前記押圧手段Ｑは、図１，２の如く、外装
ケースＧの背面の左右両側に前側、すなわち集光レンズ
Ｒ側に付勢力を有するよう内方向に突出して設けられた
押圧片から構成されており、該押圧片の先端には、モー
ルド体５の装着時にモールド体５の両端部に当接して外
装ケースＧの内部に案内する傾斜面Ｔが形成されている
。As shown in FIGS. 1 and 2, the pressing means Q includes pressing pieces provided on both left and right sides of the back surface of the exterior case G so as to project inward so as to have a biasing force toward the front, that is, toward the condenser lens R. The tip of the pressing piece is formed with an inclined surface T that comes into contact with both ends of the molded body 5 and guides it into the exterior case G when the molded body 5 is mounted.
【００２４】上記構造の光半導体装置は、次のように製
造される。The optical semiconductor device having the above structure is manufactured as follows.
【００２５】まず、受光素子３および駆動素子４からな
る受光チツプ１１をリードフレーム１にダイレクトボン
ドおよびワイヤボンデイングする。First, the light receiving chip 11 consisting of the light receiving element 3 and the driving element 4 is directly bonded and wire bonded to the lead frame 1.
【００２６】そして、受光チツプ１１を透光性のモール
ド樹脂にて被覆してモールド体５を形成する。この際、
モールド体５の前面部をできるだけ薄くモールドしてお
く。Then, the light-receiving chip 11 is covered with a light-transmitting molding resin to form a molded body 5. On this occasion,
The front part of the molded body 5 is molded as thinly as possible.
【００２７】次に、受光素子３に対応する位置に遮蔽体
６の採光窓７を合わせて配し、かつ駆動素子４を全面カ
バーするよう遮蔽体６をモールド体５にかぶせる。Next, the light receiving window 7 of the shield 6 is placed at a position corresponding to the light receiving element 3, and the shield 6 is placed over the molded body 5 so as to cover the entire drive element 4.
【００２８】しかる後、モールド体５および遮蔽体６を
合わせて全体をカバーするよう、前方から集光レンズＲ
を有する外装ケースＧを装着する。After that, the condenser lens R is inserted from the front so that the molded body 5 and the shielding body 6 are combined to cover the entire body.
Attach the outer case G that has the following.
【００２９】そうすると、外装ケースＧの押圧片Ｑは、
モールド体１５の両側壁に当接して内側に弾性変形し、
これと同時に、外装ケースＧの両側壁は左右両側に広げ
られ、モールド体１５は、押圧片Ｇの傾斜面Ｔに沿つて
外装ケースＧの内部に案内される。そして、モールド体
５が押圧片Ｑの先端を越えると、押圧片Ｑに対する負荷
が解除され、押圧片Ｑは弾性復元する。Then, the pressing piece Q of the outer case G is
It comes into contact with both side walls of the mold body 15 and is elastically deformed inward,
At the same time, both side walls of the exterior case G are expanded to the left and right sides, and the molded body 15 is guided into the interior of the exterior case G along the inclined surface T of the pressing piece G. When the molded body 5 passes over the tip of the pressing piece Q, the load on the pressing piece Q is released and the pressing piece Q is elastically restored.
【００３０】この結果、遮蔽体６は、外装ケースＧとモ
ールド体５との間で挟持されると共に、押圧片Ｑの押圧
力により、遮蔽体６の採光窓７をモールド体５の前面に
密着させることができる。したがつて、遮蔽体６の固定
は、外装ケースＧの装着時に同時に行うことができ、し
かも集光レンズＲ、遮蔽体６の採光窓７および受光素子
７の光学系の位置関係もずれにくく、位置合わせも容易
となる。As a result, the shielding body 6 is held between the outer case G and the molded body 5, and the lighting window 7 of the shielding body 6 is brought into close contact with the front surface of the molded body 5 by the pressing force of the pressing piece Q. can be done. Therefore, the shielding body 6 can be fixed at the same time as the outer case G is attached, and the positional relationship of the condenser lens R, the light receiving window 7 of the shielding body 6, and the optical system of the light receiving element 7 is difficult to shift. Positioning is also facilitated.
【００３１】また、リモートコントロールの送信器（図
示せず）内の発光素子から光信号が送信されると、この
信号光は集光レンズＲにて集光され、遮蔽体６の採光窓
７を通過してモールド体５に進入し、受光素子３にて受
光され、電気信号に変換され、この電気信号に基づき駆
動素子４が駆動する。Furthermore, when an optical signal is transmitted from a light emitting element in a transmitter (not shown) of the remote control, this signal light is condensed by a condensing lens R, and passes through a lighting window 7 of a shielding body 6. The light passes through the mold body 5, is received by the light receiving element 3, and is converted into an electric signal, and the drive element 4 is driven based on this electric signal.
【００３２】このとき、上述のように、モールド体５の
前面を薄く形成し、かつ遮蔽体６の採光窓７をモールド
体５の前面に密着させて、駆動素子４を遮蔽体６にてカ
バーしているので、遮蔽体６の採光窓７を受光素子３に
可及的に接近させることができ、外乱光の駆動素子４へ
の影響を大幅に低減できる。At this time, as described above, the front surface of the molded body 5 is made thin, and the lighting window 7 of the shielding body 6 is brought into close contact with the front surface of the molded body 5, so that the drive element 4 is covered with the shielding body 6. Therefore, the lighting window 7 of the shielding body 6 can be brought as close as possible to the light receiving element 3, and the influence of ambient light on the driving element 4 can be significantly reduced.
【００３３】また、遮蔽体６の接地リード２４を外へ出
し、グランド接続可能としていることにより、各種電子
機器から発生する電磁ノイズを遮断する事が可能になる
。したがつて、光半導体装置を、ノイズの多い製品へ用
途拡大することが可能となる。Furthermore, by extending the ground lead 24 of the shield 6 to the outside so that it can be connected to the ground, it is possible to block electromagnetic noise generated from various electronic devices. Therefore, it becomes possible to expand the use of the optical semiconductor device to products with a lot of noise.
【００３４】（第二実施例）図６は本発明の第二実施例
を示す光半導体装置の側面視断面図である。(Second Embodiment) FIG. 6 is a side sectional view of an optical semiconductor device showing a second embodiment of the present invention.
【００３５】図示の如く、本実施例の光半導体装置は、
受光素子３と、該受光素子３に隣接して配置され受光素
子からの信号に基づき駆動する駆動素子４と、該駆動素
子４および受光素子３が搭載されるリードフレーム１と
、前記受光素子３および駆動素子４を外乱光および電磁
ノイズから遮断するための導電性の遮蔽体６とを備え、
該遮蔽体６は、その一部が接地可能とされ、かつ外部か
らの信号光を受光素子３のみに採光するための採光窓７
が形成され、該採光窓７が受光素子３に可及的に接近す
るよう、金型内でリードフレーム１と遮蔽体６とを対向
してセツトし、モールド樹脂にて被覆して信号光を受光
素子３に集光させる集光レンズＲを有するモールド体５
が形成されたものである。As shown in the figure, the optical semiconductor device of this example is as follows:
A light receiving element 3, a driving element 4 arranged adjacent to the light receiving element 3 and driven based on a signal from the light receiving element, a lead frame 1 on which the driving element 4 and the light receiving element 3 are mounted, and the light receiving element 3. and a conductive shield 6 for shielding the drive element 4 from disturbance light and electromagnetic noise,
A portion of the shielding body 6 can be grounded, and has a lighting window 7 for allowing signal light from the outside to enter only the light receiving element 3.
is formed, and the lead frame 1 and the shielding body 6 are set facing each other in a mold so that the lighting window 7 is as close to the light receiving element 3 as possible, and the lead frame 1 and the shielding body 6 are coated with mold resin to emit the signal light. A molded body 5 having a condensing lens R that condenses light onto the light receiving element 3
was formed.
【００３６】上記構成の光半導体装置の製造時には、受
光チツプ１１をリードフレーム１にダイレクトボンドし
、遮蔽体６を受光チツプ１１に対向させて、その採光窓
７を受光チツプ１１に可及的に接近させるようリードフ
レーム１を金型にて位置決めする。そうすると、従来の
ように、各ユーザーにて金属板等を受光デバイスの周囲
に取付けるのに比べ、遮蔽体６の採光窓７を受光チツプ
１１に可及的に接近させながら、確実に遮蔽体６を位置
決めできる。When manufacturing the optical semiconductor device having the above configuration, the light receiving chip 11 is directly bonded to the lead frame 1, the shielding body 6 is placed opposite to the light receiving chip 11, and the light receiving window 7 is placed as close to the light receiving chip 11 as possible. The lead frame 1 is positioned using a mold so that they approach each other. In this way, compared to the conventional method in which each user attaches a metal plate or the like around the light-receiving device, the light receiving window 7 of the shield 6 can be brought as close as possible to the light-receiving chip 11 while the shield can be positioned.
【００３７】その後、これらをモールド樹脂にて一体的
にトランスフアモールドし、集光レンズＲを有するモー
ルド体５を形成する。Thereafter, these are integrally transfer-molded using a molding resin to form a molded body 5 having a condensing lens R.
【００３８】本実施例についての作用、効果は第一実施
例と同様である。The functions and effects of this embodiment are the same as those of the first embodiment.
【００３９】なお、本発明は、上記実施例に限定される
ものではなく、本発明の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。It should be noted that the present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.
【００４０】例えば、上記実施例は、受光素子３と駆動
素子４とが受光チツプ１１として一体とされたリモコン
用ＯＰＩＣ受光デバイスを例に挙げて説明したが、駆動
素子４と受光素子３との二チツプを一パツケージに入れ
たデバイスであれば、上記構造にすることにより同様な
効果が得られることはいうまでもない。For example, in the above embodiment, an OPIC light-receiving device for a remote control in which a light-receiving element 3 and a driving element 4 are integrated as a light-receiving chip 11 was explained as an example. It goes without saying that if the device has two chips in one package, the same effect can be obtained by using the above structure.
【００４１】また、上記実施例では、外装ケースＧやモ
ールド体５に可視光カツト樹脂を用いているため、光半
導体装置の下方および背後等からの光についてはさ程考
慮する必要がなく、故に遮蔽体６についてはこの部分を
省略した構造とされていたが、遮蔽体６を、採光窓７を
除いて受光素子３および駆動素子４の全周囲を遮光する
よう構成してもよい。この場合、遮蔽体６とリードフレ
ーム１とは非接触状態を保つよう構成する必要がある。Furthermore, in the above embodiment, since visible light cutting resin is used for the exterior case G and the mold body 5, there is no need to take much consideration to light coming from below and behind the optical semiconductor device. Although the shielding body 6 has a structure in which this part is omitted, the shielding body 6 may be configured to shield the entire periphery of the light receiving element 3 and the driving element 4 except for the daylight window 7. In this case, it is necessary to configure the shield 6 and the lead frame 1 to maintain a non-contact state.
【００４２】[0042]
【発明の効果】以上の説明から明らかな通り、本発明請
求項１，２によると、受光素子および駆動素子の前方に
採光窓を有する遮蔽体を設け、遮蔽体の一部を引き出し
て接地可能とし、しかも、遮蔽体の採光窓を受光素子に
可及的に接近させているので、外乱光および電磁ノイズ
の駆動素子への影響を大幅に低減することができる。Effects of the Invention As is clear from the above description, according to claims 1 and 2 of the present invention, a shielding body having a lighting window is provided in front of the light receiving element and the driving element, and a part of the shielding body can be pulled out and grounded. Moreover, since the light receiving window of the shielding body is placed as close as possible to the light receiving element, the influence of ambient light and electromagnetic noise on the drive element can be significantly reduced.
【００４３】また、遮蔽体を受光素子等に接近するにあ
たり、遮蔽体の位置決めを確実に行い得るので、その光
学的信頼性を確実に保つことができ、安定性に優れた光
半導体装置を提供できるといつた優れた効果がある。[0043] Furthermore, since the positioning of the shielding body can be reliably performed when approaching the light-receiving element etc., its optical reliability can be reliably maintained, thereby providing an optical semiconductor device with excellent stability. It has excellent effects.
【図１】図１は本発明の第一実施例を示す光半導体装置
の側面視断面図である。FIG. 1 is a side sectional view of an optical semiconductor device showing a first embodiment of the present invention.
【図２】図２は同じくその正面視断面図である。FIG. 2 is also a front sectional view thereof.
【図３】図３はその背面図である。FIG. 3 is a rear view thereof.
【図４】図４は同じく遮蔽体を背後から見た斜視図であ
る。FIG. 4 is a perspective view of the shield seen from behind.
【図５】図５は多連フレーム方式の光半導体装置を示す
背面図である。FIG. 5 is a rear view showing a multiple frame type optical semiconductor device.
【図６】図６は本発明の第二実施例を示す光半導体装置
の側面視断面図である。FIG. 6 is a side sectional view of an optical semiconductor device showing a second embodiment of the present invention.
１ リードフレーム ３ 受光素子 ４ 駆動素子 ５ モールド体 ６ 遮蔽体 ７ 採光窓 Ｇ 外装ケース Ｑ 押圧手段 Ｒ 集光レンズ 1 Lead frame 3 Photo receiving element 4 Drive element 5 Mold body 6. Shielding body 7. Lighting window G Exterior case Q Pressing means R Condensing lens
Claims (2)
置され受光素子からの信号に基づき駆動する駆動素子と
、該駆動素子および受光素子が搭載されるリードフレー
ムと、これらをモールド樹脂にて被覆して成るモールド
体と、該モールド体の前面で信号光を受光素子に集光さ
せる集光レンズを有する外装ケースと、前記モールド体
と集光レンズとの間に配置され受光素子および駆動素子
を外乱光および電磁ノイズから遮断するための導電性の
遮蔽体とを備え、前記モールド体の前面は、遮蔽体を受
光素子に可及的に接近させるよう薄く形成され、前記該
遮蔽体は、その一部が引き出されて接地可能とされ、か
つ外部からの信号光を受光素子のみに採光するための採
光窓が形成され、前記外装ケースは、モールド体を集光
レンズ側に押圧して遮蔽体を挟持させると共に遮蔽体を
モールド体の前面に密着させるための押圧手段が設けら
れたことを特徴とする光半導体装置。1. A light receiving element, a driving element arranged adjacent to the light receiving element and driven based on a signal from the light receiving element, a lead frame on which the driving element and the light receiving element are mounted, and a molded resin. an exterior case having a condensing lens that focuses signal light onto a light receiving element on the front surface of the molded body; a light receiving element and a drive disposed between the molded body and the condensing lens; a conductive shield for shielding the device from disturbance light and electromagnetic noise, the front surface of the molded body is formed thin so as to bring the shield as close as possible to the light receiving element, and the shield is , a part of which can be pulled out and grounded, and a lighting window is formed to allow signal light from the outside to enter only the light receiving element, and the exterior case is formed by pressing the molded body toward the condensing lens. An optical semiconductor device characterized in that a pressing means is provided for sandwiching a shield and bringing the shield into close contact with the front surface of a molded body.
置され受光素子からの信号に基づき駆動する駆動素子と
、該駆動素子および受光素子が搭載されるリードフレー
ムと、前記受光素子および駆動素子を外乱光および電磁
ノイズから遮断するための導電性の遮蔽体とを備え、該
遮蔽体は、その一部が接地可能とされ、かつ外部からの
信号光を受光素子のみに採光するための採光窓が形成さ
れ、該採光窓が受光素子に可及的に接近するよう、金型
内でリードフレームと遮蔽体とを対向してセツトし、モ
ールド樹脂にて被覆して信号光を受光素子に集光させる
集光レンズを有するモールド体が形成されたことを特徴
とする光半導体装置。2. A light-receiving element, a drive element arranged adjacent to the light-receiving element and driven based on a signal from the light-receiving element, a lead frame on which the drive element and the light-receiving element are mounted, and the light-receiving element and the drive element. A conductive shield for shielding the element from disturbance light and electromagnetic noise, a part of which can be grounded, and a conductive shield for directing signal light from the outside only to the light receiving element. A lighting window is formed, and a lead frame and a shield are set facing each other in the mold so that the lighting window is as close as possible to the light receiving element, and the lead frame and the shield are covered with mold resin to transmit the signal light to the light receiving element. 1. An optical semiconductor device comprising a molded body having a condensing lens that condenses light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9389491A JP2651756B2 (en) | 1991-04-24 | 1991-04-24 | Optical semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9389491A JP2651756B2 (en) | 1991-04-24 | 1991-04-24 | Optical semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04324686A true JPH04324686A (en) | 1992-11-13 |
| JP2651756B2 JP2651756B2 (en) | 1997-09-10 |
Family
ID=14095191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9389491A Expired - Fee Related JP2651756B2 (en) | 1991-04-24 | 1991-04-24 | Optical semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2651756B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000012892A (en) * | 1998-06-17 | 2000-01-14 | Shichizun Denshi:Kk | Photointerrupter |
| JP2002057366A (en) * | 2000-08-08 | 2002-02-22 | Nippon Aleph Corp | Photointerrupter |
| JP2006237890A (en) * | 2005-02-23 | 2006-09-07 | Oki Electric Ind Co Ltd | Remote control photodetector module |
| WO2008083524A1 (en) * | 2007-01-12 | 2008-07-17 | Xiamen Hualian Electronics Co., Ltd. | Method for manufactureing infrared remote-control receiving-amplifier |
| US9379272B2 (en) | 2013-09-13 | 2016-06-28 | Kabushiki Kaisha Toshiba | Light receiving element and optically coupled insulating device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000082829A (en) | 1998-09-04 | 2000-03-21 | Dowa Mining Co Ltd | Method and device for receiving light and device for receiving and radiating light |
-
1991
- 1991-04-24 JP JP9389491A patent/JP2651756B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000012892A (en) * | 1998-06-17 | 2000-01-14 | Shichizun Denshi:Kk | Photointerrupter |
| JP2002057366A (en) * | 2000-08-08 | 2002-02-22 | Nippon Aleph Corp | Photointerrupter |
| JP4626038B2 (en) * | 2000-08-08 | 2011-02-02 | 株式会社日本アレフ | Photo-interrupter |
| JP2006237890A (en) * | 2005-02-23 | 2006-09-07 | Oki Electric Ind Co Ltd | Remote control photodetector module |
| WO2008083524A1 (en) * | 2007-01-12 | 2008-07-17 | Xiamen Hualian Electronics Co., Ltd. | Method for manufactureing infrared remote-control receiving-amplifier |
| US9379272B2 (en) | 2013-09-13 | 2016-06-28 | Kabushiki Kaisha Toshiba | Light receiving element and optically coupled insulating device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2651756B2 (en) | 1997-09-10 |
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| LAPS | Cancellation because of no payment of annual fees |