JPH0476220B2 - - Google Patents
Info
- Publication number
- JPH0476220B2 JPH0476220B2 JP3940784A JP3940784A JPH0476220B2 JP H0476220 B2 JPH0476220 B2 JP H0476220B2 JP 3940784 A JP3940784 A JP 3940784A JP 3940784 A JP3940784 A JP 3940784A JP H0476220 B2 JPH0476220 B2 JP H0476220B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- optical component
- printed board
- photo
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 109
- 238000000034 method Methods 0.000 abstract description 7
- 239000002131 composite material Substances 0.000 abstract description 6
- 238000003780 insertion Methods 0.000 abstract description 4
- 230000037431 insertion Effects 0.000 abstract description 4
- 239000013307 optical fiber Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000003864 performance function Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
(a) 発明の技術分野
本発明は、発光素子及び受光素子を備えた光部
品の構造に係り、特に光部品のパツケージに取り
つけられた光素子の送受光窓と導電性電極の取り
つけ構造に関する。Detailed Description of the Invention (a) Technical Field of the Invention The present invention relates to the structure of an optical component equipped with a light emitting element and a light receiving element, and particularly relates to a light transmission/reception window of an optical element attached to a package of the optical component and a conductive This invention relates to a structure for attaching sex electrodes.
(b) 技術の背景
近年、発光素子及び受光素子を備えた光部品が
広範囲に普及して、光部品と接続される光回路及
び電気回路との効率的な結合が極めて重要な課題
となつている。(b) Background of the technology In recent years, optical components equipped with light-emitting elements and light-receiving elements have become widespread, and efficient coupling between optical components and optical circuits and electric circuits to which they are connected has become an extremely important issue. There is.
特に、光部品を搭載する光プリント板は電気部
品を搭載する、従来の電気部品を搭載するプリン
ト板に相当するもので、既に実用の段階になつて
いる。 In particular, optical printed boards on which optical components are mounted are equivalent to conventional printed boards on which electrical components are mounted, and have already reached the stage of practical use.
光プリント板に実装される対象部品としては、
光半導体装置、光半導体と回路が一体になつた光
装置、光増幅器、光減衰器、光スイツチ等光回路
に使用される部品全般に亙る。 これらの光部品
は、適当な樹脂等でパツケージにされていて、こ
のような光部品を、光プリント板に搭載するだけ
で、既に光プリント板に配設されている光回路、
例えば光フアイバーなどで光路が形成されている
光回路と直ちに接続されるものである。 The target parts to be mounted on the optical printed board are:
This covers all parts used in optical circuits, such as optical semiconductor devices, optical devices in which optical semiconductors and circuits are integrated, optical amplifiers, optical attenuators, and optical switches. These optical components are packaged with a suitable resin, etc., and by simply mounting such optical components on an optical printed board, the optical circuits already arranged on the optical printed board can be integrated.
For example, it is immediately connected to an optical circuit in which an optical path is formed using an optical fiber or the like.
従つて、パツケージ化された光部品は、簡易に
光プリント板に挿入され、然も光エネルギーの授
受を行う窓と導電電極が、光プリント板の上に何
等の支障無く実装されることが必要である。 Therefore, packaged optical components must be easily inserted into optical printed circuit boards, and windows and conductive electrodes that transmit and receive optical energy must be mounted on the optical printed circuit boards without any problems. It is.
従来の上記の光部品は、光のエネルギーを授受
する部分である窓の部分と、その部分からの信号
を伝達する導電電極がパツケージの同一方向に配
列されていることはなく、反対側又は側面から取
り出されているのが一般の構造である。 In the conventional optical components mentioned above, the window part, which is the part that transmits and receives light energy, and the conductive electrode, which transmits the signal from that part, are not arranged in the same direction of the package, but on the opposite side or side. The general structure is taken from.
このことは、光プリント板に光部品を実装し
て、光回路と電気回路等と接続する場合に、配線
が非常に複雑になるため、これの改善が要望され
ている。 This makes wiring very complicated when optical components are mounted on an optical printed board and connected to an optical circuit and an electric circuit, so there is a demand for improvement.
(c) 従来技術と問題点
従来の技術は、大別して二種類あつて、第１は
光部品と、電気回路との接続を行う場合に光フア
イバーとコネクター等のその周辺部品により、両
者を接続する場合と、第２は平面基板内で、光導
入部の光屈折率を、適宜変化させることによつ
て、光部品からの光路を規定方向に伝導する方法
である。(c) Conventional technology and problems Conventional technology can be roughly divided into two types: the first is to connect optical components and electrical circuits using optical fibers and peripheral components such as connectors; The second method is to propagate the optical path from the optical component in a prescribed direction by appropriately changing the optical refractive index of the light introduction part within the planar substrate.
第１の方法による光フアイバーとコネクター等
のその周辺部品によつて接続する場合は、当然な
がら接続が立体的になり、且つ複雑な接続個所が
増加して、装置が大型化すると共に接続方式が高
度の技術を要することになる。 If the first method is used to connect optical fibers and peripheral parts such as connectors, the connection will naturally become three-dimensional, and the number of complicated connection points will increase, making the device larger and requiring different connection methods. This requires advanced technology.
第２の方法では、光部品単体のパツケージとし
てはかなりの機能を有し、単機能に限らず、光
ICのごとく複合機能を持たせることもできるが、
方式が複雑になつて、このような光部品を更に増
加して多種多様な組合せを行つて高性能の機能を
持つ光回路を製作する場合には、それらの光部品
間を光フアイバーで結合せざるを得ない欠点があ
る。 In the second method, the package has a considerable function as a single optical component, and is not limited to a single function.
Although it can have multiple functions like an IC,
As the method becomes more complex, and when optical circuits with high performance functions are manufactured by increasing the number of such optical components and combining them in a wide variety of ways, it is necessary to connect these optical components with optical fibers. There are unavoidable drawbacks.
以下図面によつて概要を説明する。 The outline will be explained below with reference to the drawings.
第１図は、従来の光部品の一例として受光検知
器の例について説明する。 FIG. 1 describes an example of a light receiving detector as an example of a conventional optical component.
１は光部品のパツケージであり、この導出入窓
で受光された光信号はパツケージ内で光エネルギ
ーが電気エネルギーに変換されて、その変換され
た電気信号は導電電極３によつて外部に取り出さ
れて、外部回路に接続されるが、直接光を授受す
る場合の結合には光接続部品として光フアイバー
その他が必要になる。 Reference numeral 1 denotes a package of optical components, and the optical signal received by this lead-in/out window is converted into electrical energy within the package, and the converted electrical signal is taken out to the outside by a conductive electrode 3. However, when directly transmitting and receiving light, an optical fiber or the like is required as an optical connection component.
(d) 発明の目的
本発明は上記従来の欠点に鑑み、光部品を光回
路プリント板に実装する場合に簡易且つ小型にで
きる光部品のパツケージの方法を提供することを
目的とする。(d) Object of the Invention In view of the above-mentioned conventional drawbacks, an object of the present invention is to provide a method for packaging optical components that can be simplified and made smaller when mounting optical components on an optical circuit printed board.
(e) 発明の構成
この目的は、本発明によれば、光部品のパツケ
ージに設ける発光又は受光を行う光導出入窓の方
向と該光部品の導電性電極の方向を同一方向とし
たことを特徴とする光部品の構造を提供すること
によつて達成できる。(e) Structure of the Invention This object is characterized in that, according to the present invention, the direction of the light introduction/exit window for emitting or receiving light provided in the package of the optical component and the direction of the conductive electrode of the optical component are made to be the same direction. This can be achieved by providing an optical component structure that achieves this.
(f) 発明の実施例
以下本発明の実施例を図面によつて詳述する。
光部品には、前記のように多種類の部品があるの
で、本実施例では、光を授受する素子を内臓する
光部品について説明する。(f) Examples of the invention Examples of the invention will be described in detail below with reference to the drawings.
Since there are many types of optical components as described above, in this embodiment, an optical component incorporating an element that transmits and receives light will be described.
第２図は本発明の代表的な光部品の模式図であ
る。 FIG. 2 is a schematic diagram of a typical optical component of the present invention.
図において、１０は光エネルギーの授受を行う
光部品のパツケージである。 In the figure, 10 is a package of optical components that transmits and receives optical energy.
パツケージの材料は、普通樹脂加工がなされる
か、又はキヤンタイプ、特に高信頼性の光部品の
場合にはセラミツク構造のものもある。 The material of the package is usually resin processed, or can be made of ceramic structure, especially in the case of highly reliable optical components.
パツケージの内部には、光素子が内臓されてい
るか、或いはこの光素子と関連して、一部回路も
含めて内臓されているが、この光素子には外部と
の光エネルギーの授受を行う光エネルギーの光導
出入窓１１が設けられている。 Inside the package, there is an optical element built-in, or a part of the circuit is built in relation to this optical element, but this optical element has an optical element that exchanges optical energy with the outside. An energy light introduction/exit window 11 is provided.
光部品の内部では、光エネルギーが電気信号に
変換されて、その電気信号は外部の電気回路に接
続されるための導電電極１２によつて、外部に取
り出される。 Inside the optical component, optical energy is converted into an electrical signal, and the electrical signal is extracted to the outside by a conductive electrode 12 for connection to an external electrical circuit.
このような構造の光部品では、一般に光導出入
窓と導電電極は反対方向になつていて、従来の光
部品の設計の観点でも反対方向にする構造が好都
合であるが、本発明は図のように、光導出入窓と
導電電極を同一方向にしている。 In an optical component with such a structure, the light guide/exit window and the conductive electrode are generally oriented in opposite directions, and from the design point of view of conventional optical components, it is convenient to have a structure in which they are oriented in opposite directions, but the present invention In addition, the light guide/exit window and the conductive electrode are oriented in the same direction.
第３図は、光部品のパツケージがキヤンタイプ
の場合の例であり、光部品２０の光導出入窓２１
と導電電極２２が同一方向の配置になつている。 FIG. 3 shows an example in which the package of the optical component is a can type.
and the conductive electrode 22 are arranged in the same direction.
第４図は光部品のパツケージがセラミツクタイ
プの例であつて、光部品３０の光導出入窓３１と
導電電極３２は同一方向になつている。 FIG. 4 shows an example in which the package of the optical component is a ceramic type, and the light guide/exit window 31 of the optical component 30 and the conductive electrode 32 are oriented in the same direction.
このように、同一方向に配置された光導出入窓
と導電電極を有する光部品は、例えば第５図の如
き光プリント板に使用される場合には非常に好都
合である。 In this way, an optical component having light guide/exit windows and conductive electrodes arranged in the same direction is very advantageous when used, for example, in an optical printed board as shown in FIG.
第５図の光プリント板４０は、光回路４１と電
気回路４２とが所定のパターニングで配線されて
いる光と電気の複合プリント板である。 The optical printed board 40 shown in FIG. 5 is a composite optical and electrical printed board in which an optical circuit 41 and an electric circuit 42 are wired in a predetermined pattern.
光回路の基本的な構成は、薄膜によつて形成さ
れる屈折率の異なる光伝導材料を適宜組み合わす
ことによつて、所要の光伝達のための光路を形成
することである。 The basic structure of an optical circuit is to form an optical path for desired light transmission by appropriately combining thin film photoconductive materials having different refractive indexes.
この光と電気の複合プリント板に、光部品４３
のパツケージより突出させた複数本の導電電極を
挿入して接続する挿入窓４４を穿設しておき、又
光部品の光導出入窓４５の位置に合わせて、光と
電気の複合プリント板にも光を授受するための開
口部分４６を、このプリント板に設けることによ
つて、従来の電気プリント板と同様の簡易な回路
を構成することができる。 Optical components 43 are installed on this optical and electrical composite printed board.
An insertion window 44 for inserting and connecting a plurality of conductive electrodes protruding from the package is provided, and an insertion window 44 is also provided for the optical and electrical composite printed board in accordance with the position of the light guide/exit window 45 of the optical component. By providing the printed board with an opening 46 for transmitting and receiving light, a simple circuit similar to that of a conventional electric printed board can be constructed.
更に、このように同一方向の光導出入窓と導電
電極を有する光部品は、第６図に示すように、光
部品５０の光導出入窓５１と導電電極が無いパツ
ケージの面には、何等の支障を来す表面ではない
ため、例えば光部品が動作中に温度が上がり過ぎ
る場合等は、光部品５０に放熱用のフイン５３等
を取りつけることができる。 Furthermore, as shown in FIG. 6, an optical component having a light guide/exit window and a conductive electrode in the same direction does not cause any hindrance on the surface of the package where the light guide/exit window 51 of the optical component 50 and the conductive electrode are not present. Since the optical component 50 is not a surface that causes heat dissipation, for example, if the temperature of the optical component increases too much during operation, a heat dissipation fin 53 or the like can be attached to the optical component 50.
以上の説明は、光部品でも光の授受を行う素子
を内臓する光部品について述べているが、光と電
気の複合プリント板に使用される光部品であれ
ば、どのような光部品にも応用が可能であり、例
えば、光半導体、光回路、光スイツチ、光増幅
器、光減衰器、光フイルター、その他の光部品等
のいずれにも適用できる。 The above explanation is about optical components that have built-in elements that send and receive light, but it can be applied to any optical component used in optical and electrical composite printed boards. For example, it can be applied to optical semiconductors, optical circuits, optical switches, optical amplifiers, optical attenuators, optical filters, and other optical components.
(g) 発明の効果
以上、詳細に説明したように、本発明の光部品
を採用することにより、光と電気の複合プリント
板に光部品を効率良く実装に供し得るという効果
大なるものがある。(g) Effects of the Invention As explained in detail above, by employing the optical component of the present invention, there is a great effect that the optical component can be efficiently mounted on a composite optical and electrical printed board. .
第１図は、従来構造の光部品の斜視図、第２
図、第３図、第４図、第６図は本発明の光部品の
斜視図、第５図は光プリント板の斜視図である。
図において、１，１０，２０，３０，４３，５
０は光部品のパツケージ、２，１１，２１，３
１，４５，５１は光の光導出入窓、３，１２，２
２，３２，５２は導電電極、４０は光プリント
板、４１は光回路、４２は電気回路、４４は挿入
孔、４６は開孔部分、５３は放熱フインである。
Figure 1 is a perspective view of an optical component with a conventional structure;
3, 4, and 6 are perspective views of the optical component of the present invention, and FIG. 5 is a perspective view of an optical printed board. In the figure, 1, 10, 20, 30, 43, 5
0 is a package of optical components, 2, 11, 21, 3
1, 45, 51 are light guide/exit windows, 3, 12, 2
2, 32, and 52 are conductive electrodes, 40 is an optical printed board, 41 is an optical circuit, 42 is an electric circuit, 44 is an insertion hole, 46 is an opening portion, and 53 is a heat radiation fin.
Claims (1)
光用の光導出入窓と、当該光導出入窓と同一方向
面にのみ突出して設けられた導電性電極とを有す
ることを特徴とする光部品の構造。1. A structure of an optical component characterized by having a light guide window for emitting or receiving light provided in a package of the optical component, and a conductive electrode provided to protrude only in the same direction as the light guide window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59039407A JPS60182780A (en) | 1984-02-29 | 1984-02-29 | Structure of optical component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59039407A JPS60182780A (en) | 1984-02-29 | 1984-02-29 | Structure of optical component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60182780A JPS60182780A (en) | 1985-09-18 |
| JPH0476220B2 true JPH0476220B2 (en) | 1992-12-03 |
Family
ID=12552134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59039407A Granted JPS60182780A (en) | 1984-02-29 | 1984-02-29 | Structure of optical component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60182780A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60252308A (en) * | 1984-05-30 | 1985-12-13 | Hitachi Ltd | Electric and optical circuit element substrate |
| WO1988002210A1 (en) * | 1986-09-15 | 1988-03-24 | Baysage Pty. Ltd. | Electrical isolation device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5972184A (en) * | 1982-10-19 | 1984-04-24 | Nippon Denso Co Ltd | Photoelectric converter |
-
1984
- 1984-02-29 JP JP59039407A patent/JPS60182780A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5972184A (en) * | 1982-10-19 | 1984-04-24 | Nippon Denso Co Ltd | Photoelectric converter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60182780A (en) | 1985-09-18 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |