JPH04169080A - Hot setting type anisotropic conductive connection member - Google Patents
Hot setting type anisotropic conductive connection memberInfo
- Publication number
- JPH04169080A JPH04169080A JP29506090A JP29506090A JPH04169080A JP H04169080 A JPH04169080 A JP H04169080A JP 29506090 A JP29506090 A JP 29506090A JP 29506090 A JP29506090 A JP 29506090A JP H04169080 A JPH04169080 A JP H04169080A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- anisotropic conductive
- conductive adhesive
- separator
- connecting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001070 adhesive effect Effects 0.000 claims abstract description 30
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 239000012790 adhesive layer Substances 0.000 claims abstract description 24
- 239000002245 particle Substances 0.000 claims abstract description 23
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 14
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000009998 heat setting Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 8
- 238000002788 crimping Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000011295 pitch Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004447 silicone coating Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野コ
本発明は電気回路基板(以下基板という)間の接続に用
いられる加熱硬化型異方導電接続部材(以下接続部材と
いう)に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heat-curable anisotropically conductive connecting member (hereinafter referred to as a connecting member) used for connection between electric circuit boards (hereinafter referred to as a board).
[従来の技術]
異方導電接着剤はLCDとFPC,PCBとFPC等の
接続に用いられるが、近年接続部の多ピン化、小ピツチ
化が進み、また耐熱性等の信頼度の向上を求められる結
果、熱硬化型接着剤が使用されるようになった。[Prior art] Anisotropic conductive adhesives are used to connect LCDs and FPCs, PCBs and FPCs, etc., but in recent years, the number of pins and pitches of connections has increased, and improvements in reliability such as heat resistance have been made. As a result of this need, thermosetting adhesives have come into use.
[発明が解決しようとするIII(]
しかし熱硬化型異方導電接着剤により基板間を接続する
には、接続部にあらかじめ異方導電接着剤を仮圧着する
ため加熱するので、仮圧着後のポットライフが短くなる
という問題があった。[Three to be solved by the invention (]) However, in order to connect substrates using a thermosetting anisotropic conductive adhesive, heating is required in advance to temporarily press the anisotropic conductive adhesive onto the connection part, so There was a problem that the pot life was shortened.
[課題を解決するための手段]
゛本発明は上記の問題を解決し、仮圧着後のボッ1 ト
ライフの長い接続部材を提供するもので、これは、加熱
硬化成分を含む絶縁性接着剤中に導電性粒子を分散した
異方導電接着剤層とこれに密着させたセパレータからな
り、該異方導電接着剤層とセパレータとの密着強度FS
と、該異方導電接着剤層を電気回路基板の接続部に温度
10〜50’C。[Means for Solving the Problems] ゛The present invention solves the above problems and provides a connecting member with a long bot life after temporary pressure bonding, which is made by using an insulating adhesive containing a heat curing component. It consists of an anisotropic conductive adhesive layer in which conductive particles are dispersed and a separator that is in close contact with this, and the adhesion strength FS between the anisotropic conductive adhesive layer and the separator is
Then, apply the anisotropic conductive adhesive layer to the connecting portion of the electric circuit board at a temperature of 10 to 50'C.
圧力3 kg/cd以上で押し付けた際の異方導電接着
剤層に対する接続部の密着強度FCどの関係が、FS<
FCであることを特徴とする加熱硬化型異方導電接続部
材である。The adhesion strength FC of the connection part to the anisotropic conductive adhesive layer when pressed at a pressure of 3 kg/cd or more is FS<
This is a heat-curable anisotropically conductive connecting member characterized by being FC.
本発明を図面によっそ説明すると、第1図において、本
発明の接続部材上では、セパレータ2上に加熱硬化型接
着剤層3が密着されているが、この中には導電性粒子4
が分散され異方導電性を付与される。第2図は接続部材
上をリール状に巻いたもので、5はコアである。第3図
は、本発明の接続部材上による基板接続の一例で、基板
6と7のそれぞれの接続部8,9が接続部材上によって
接続されている。To explain the present invention with reference to the drawings, in FIG. 1, on the connecting member of the present invention, a heat-curable adhesive layer 3 is closely adhered to a separator 2, and conductive particles 4 are included in this layer 3.
are dispersed and given anisotropic conductivity. FIG. 2 shows a connection member wound into a reel, and 5 is a core. FIG. 3 shows an example of substrate connection on the connecting member of the present invention, in which the connecting portions 8 and 9 of the substrates 6 and 7 are connected on the connecting member.
基板間の接続部材は基板の種類によって異なるが、接続
部材と少なくとも一方の基板の接続部との密着強度がセ
パレータとの密着強度を上まわっておればよい。The connection member between the substrates varies depending on the type of substrate, but it is sufficient that the adhesion strength between the connection member and the connection portion of at least one of the substrates exceeds the adhesion strength between the connection member and the separator.
基板の接続部表面にはつぎの構成が例示される。The following configuration is exemplified on the surface of the connection portion of the board.
すなわち、LCDの場合にはIT○とガラス、PCBの
場合には、ガラスエポキシあるいはガラスエポえ、羨。In other words, in the case of LCD, it is IT○ and glass, and in the case of PCB, it is glass epoxy or glass epoxy.
。箔、、)接着剤、、Au)ツキ層、8nメツキ層ある
いはハンダメツキ層、FPCの場合には、ポリイミドあ
るいはポリイミドとCu箔との接着剤あるいはポリエス
テルあるいはBTレジンと、Auメツキ層+ Snメツ
キ層、ハンダメツキ層あるいはAgペースト、カーボン
ペースト等である。. foil, ) adhesive, , Au) plating layer, 8n plating layer or solder plating layer, in the case of FPC, polyimide or adhesive of polyimide and Cu foil, polyester or BT resin, Au plating layer + Sn plating layer , solder plating layer, Ag paste, carbon paste, etc.
絶縁性接着剤に混入される加熱硬化成分としては、エポ
キシ樹脂系、アクリル系、ウレタン系。Heat curing components mixed into insulating adhesives include epoxy resin, acrylic, and urethane.
シリコーン系、クロロプレン系、ニトリル系などが例示
されるが、これらは導通の信頼性を向上させるため剥離
強度、耐熱性、可撓性を改善するよう熱可塑性樹脂とブ
レンドすることが効果的であり、例としてポリアミド系
、ポリエステル系、アイオノマー系、EVA、EAA、
EMA、EEAなどのポリオレフィン系、NBR,S、
BR等の各種合成ゴム系のもの、さらにはこれらの変性
物、複合物があげられる。いずれの場合も、硬化剤。Examples include silicone-based, chloroprene-based, and nitrile-based, but it is effective to blend these with thermoplastic resins to improve peel strength, heat resistance, and flexibility in order to improve continuity reliability. , Examples include polyamide-based, polyester-based, ionomer-based, EVA, EAA,
Polyolefins such as EMA and EEA, NBR, S,
Examples include various synthetic rubbers such as BR, as well as modified products and composites thereof. In both cases, hardener.
加硫剤、制御剤、劣化防止剤、耐熱添加剤、熱伝導向上
剤、粘着付与剤、軟化剤、着色剤、各種カップリング剤
、金属不活性剤等が適宜−添加されることが望ましい。It is desirable that vulcanizing agents, control agents, deterioration inhibitors, heat-resistant additives, thermal conductivity improvers, tackifiers, softeners, coloring agents, various coupling agents, metal deactivators, and the like be added as appropriate.
さらに、前記基板の接続部に対し、10〜50℃の温度
範囲において良好な密着性と、本接着時に十分な反応速
度、剥離強度を得るために、この絶縁性接着剤は、10
〜50℃における粘度が1000ボイズ以下である液状
エポキシ樹脂100重量部、加熱硬化型潜在性硬化剤な
らびに溶融温度が80℃以上の熱可塑性樹脂20〜10
00重量部および粘着付与剤5〜500重量部とを含ん
だものとすることが最も有効である。これは微視的に1
0〜50℃において固体状態にある熱可塑性樹脂マトリ
クス中に液状のエポキシ樹脂が分散した構造をとってお
り、これによって10〜50℃という低温においても基
板との密着性が良好になるとともに、接続部材としてフ
ィルム状の形を保持し、良好な作業性を得ることができ
る。Furthermore, in order to obtain good adhesion to the connection part of the substrate in the temperature range of 10 to 50°C, and sufficient reaction speed and peel strength during main bonding, this insulating adhesive is
100 parts by weight of a liquid epoxy resin with a viscosity of 1000 voids or less at ~50°C, a heat-curable latent curing agent, and 20 to 10 parts of a thermoplastic resin with a melting temperature of 80°C or higher.
It is most effective to contain 0.00 parts by weight and 5 to 500 parts by weight of a tackifier. This is microscopically 1
It has a structure in which liquid epoxy resin is dispersed in a thermoplastic resin matrix that is in a solid state at 0 to 50 degrees Celsius, and this allows for good adhesion to the substrate even at low temperatures of 10 to 50 degrees Celsius, as well as excellent connection. It is possible to maintain a film-like shape as a member and obtain good workability.
導電性粒子としては、ニッケル、ハンダ、金、銀、パラ
ジウムなどの金属粒子、タングステンカーバイドなどの
セラミック粒子、カーボン粒子、表面をメツキ等の方法
で金属被覆したプラスチック粒子等が例示される。導通
の信頼性を得るために、粒径はできるだけ均一にするこ
とがよく、低ピンチレヘル例えば0.1a++やQ、2
m+ピッチの接続部におけるリークを防ぐという観点か
ら、粒子径は平均25.以下であることが望ましいが、
粒子が小さすぎると接着剤が薄く強度が弱くなるため、
平均5p以上であることが好ましい、また粒子には粘着
性がないため、接続まえの状態で異方導電接着剤層表面
に粒子が露出しないことが好ましく、このため異方導電
接着剤層の厚さは導電性粒子の平均粒子径の1.2倍以
上にすることがよい。しかじ厚すぎると、ヒートシール
時に接着剤がフローしきれずに導通不良を生じ、さらに
オーバーフローにより接着剤が流れ出して周囲に悪影響
を与える危険性があるため、100μs以下とすること
がよい。Examples of the conductive particles include metal particles such as nickel, solder, gold, silver, and palladium, ceramic particles such as tungsten carbide, carbon particles, and plastic particles whose surfaces are coated with metal by a method such as plating. In order to obtain reliable conduction, the particle size should be as uniform as possible, with a low pinch level such as 0.1a++, Q, 2
From the viewpoint of preventing leakage at the m+pitch connection, the average particle size is 25. It is desirable that the following is true, but
If the particles are too small, the adhesive will be thin and weak, so
It is preferable that the average particle size is 5p or more, and since the particles do not have adhesive properties, it is preferable that the particles are not exposed on the surface of the anisotropically conductive adhesive layer before connection. Therefore, the thickness of the anisotropically conductive adhesive layer The diameter is preferably 1.2 times or more the average particle diameter of the conductive particles. However, if it is too thick, the adhesive will not flow completely during heat sealing, resulting in poor conductivity, and there is also a risk that the adhesive will flow out due to overflow and have an adverse effect on the surroundings, so it is preferable to make it 100 μs or less.
セパレータは、異方導電接着剤をフィルム状に保持する
とともに、仮圧着時に異方導電接着剤層を基板側へ転写
した後剥がされるため、易剥離性をもつことが必要で、
例えば合成紙、ポリプロピレンフィルム、シリコーンに
より離脱処理した紙やポリエステルフィルム、ふっ素樹
脂フィルム等が例示される。The separator holds the anisotropically conductive adhesive in the form of a film and is peeled off after the anisotropically conductive adhesive layer is transferred to the substrate during temporary pressure bonding, so it must be easily removable.
Examples include synthetic paper, polypropylene film, silicone-treated paper, polyester film, and fluororesin film.
本発明の接続部材は作業性の面からリール状にすること
がよく、このためセパレータは製造時に接着剤を塗布す
る面が1反対側の面より密着性のよいことが望まれ、こ
の点で最も良好なものは、ふっ素樹脂フィルムあるいは
面画にそれぞれの面の剥離し易さの度合いを変えてシリ
コーン離型処理を施したポリエステルフィルムである。The connecting member of the present invention is preferably formed into a reel from the viewpoint of workability. Therefore, it is desirable that the surface of the separator to which adhesive is applied during manufacture has better adhesion than the opposite surface. The most favorable is a fluororesin film or a polyester film in which the surface pattern is subjected to silicone release treatment to vary the degree of ease of peeling on each surface.
ふっ素樹脂フィルムとしてはPTFE、FEP、ETF
E、’PFA、PCT、FE、PVDF等が例示され、
これらは表面に微小な凹凸を有しているため、溶液状態
の接着剤を塗布した面には表面の凹凸に対するアンカー
効果によって良好な密着性が得られ、接着剤が乾燥した
後では、塗布面はどアンカー効果が得られないため、リ
ール状としたときに逆側に接着剤が取られることがない
。またシリコーン処理したポリエステルフィルムは、剥
離し難い方の面に接着剤を設けることによって逆側へ取
られることを防ぐことができる。剥離性の度合いは、シ
リコーンの処理量によって調節できるが、処理量が少な
いとシリコーン被膜に微小な欠陥を生じ、この欠陥の量
によって剥離性が変わるものど考えられる。Fluororesin films include PTFE, FEP, and ETF.
E, 'PFA, PCT, FE, PVDF, etc. are exemplified,
Since these have minute irregularities on the surface, good adhesion is achieved on the surface coated with solution adhesive due to the anchoring effect of the surface irregularities, and after the adhesive dries, the coated surface Since no side anchor effect is obtained, the adhesive will not be removed from the opposite side when it is made into a reel. Furthermore, by providing an adhesive on the side that is difficult to peel off, the silicone-treated polyester film can be prevented from being removed to the opposite side. The degree of releasability can be adjusted by the amount of silicone treated, but if the amount of treatment is small, minute defects will occur in the silicone coating, and it is thought that the releasability will change depending on the amount of these defects.
上記した接続部材を用いて基板間を接続するには、まず
この接続部材を基板のどちらか一方の接続部上に載置し
、10〜50℃の温度で3kg/cm2以上の圧力を加
えて仮圧着し、ついでセパレータを剥がした後、約15
0℃以上、10〜50kg/d、20〜60秒の条件で
本接続を達成する。仮圧着の際接着剤の表面の基板への
密着性をよくするために、圧着子として厚さ0.05+
m以上、硬度20〜80度の弾性体を用いると微妙な凹
凸に対する追従性がよく、エアーを巻き込み難く効果的
である。To connect between boards using the above-mentioned connecting member, first place this connecting member on the connecting part of one of the boards, and apply a pressure of 3 kg/cm2 or more at a temperature of 10 to 50°C. After temporary pressure bonding and then peeling off the separator, about 15
The main connection is achieved under the conditions of 0° C. or higher, 10 to 50 kg/d, and 20 to 60 seconds. In order to improve the adhesion of the adhesive surface to the substrate during temporary crimping, use a crimping element with a thickness of 0.05+.
Using an elastic body with a hardness of 20 to 80 degrees and a hardness of 20 to 80 degrees is effective because it has good ability to follow subtle irregularities and is difficult to entrain air.
以上によって加熱硬化型異方導電接着剤層を仮圧着した
後でも、硬化の反応性を低下させることなく、ポットラ
イフが長い接続部材を得ることができる。As described above, even after temporarily press-bonding the heat-curable anisotropically conductive adhesive layer, a connecting member with a long pot life can be obtained without reducing the reactivity of curing.
[実施例]
カルボキシル基含有の熱可塑性SBR(スチレン−ブタ
ジェンラバー)100重量部とテルペンフェノール系粘
着付与剤50重量部を、トルエン=MEK=8 : 2
の混合溶剤に25重量%となるように溶解し、これに液
状エポキシ樹脂(AER331L:旭化成)50重量部
、マイクロカプセル型エポキシ硬化剤(ツバキュアHX
−374J:旭化成)50重量部、粒径約10μの球形
フェノール樹脂にAg、Auの2層メツキを施した比重
的1.2の導電性粒子20重量部を混合して異方導電性
接着剤をつくった。これをナイフコーターで、セパレー
タとなる厚さ75ρのPTFEフィルムにヒフロンテー
プNo。900:日東電工)にコーティングし、送風乾
燥させて、総厚さloo庫(接着剤層の厚さ25庫)と
し、これを3I幅にスリットして巻取り接着部材を得た
。[Example] 100 parts by weight of carboxyl group-containing thermoplastic SBR (styrene-butadiene rubber) and 50 parts by weight of a terpene phenol tackifier were mixed into toluene=MEK=8:2
To this, 50 parts by weight of liquid epoxy resin (AER331L: Asahi Kasei) and microcapsule type epoxy curing agent (Tsubacure HX) were dissolved in a mixed solvent of
-374J: Asahi Kasei) 50 parts by weight of a spherical phenolic resin with a particle size of approximately 10μ mixed with 20 parts by weight of conductive particles with a specific gravity of 1.2 plated with two layers of Ag and Au to create an anisotropic conductive adhesive. I made it. Using a knife coater, apply No. HYFLON tape to a 75ρ thick PTFE film that will serve as a separator. 900 (Nitto Denko) and dried with air to obtain a total thickness of LOOO (adhesive layer thickness: 25 mm), which was slit into a 3I width to obtain a wound adhesive member.
これを、ガラス上にITO膜により0.2ピツチのパタ
ーンが形成されたLCDの接続部に載置し、室温27℃
において加熱することなく、圧着子トシて厚さlna、
ゴム硬度70度のシリコーンゴムを取付けた治具で10
kg/cdの圧力で1秒間押し付は仮圧着したが、セパ
レータであるPTFEフィルムを容易に剥がし取ること
ができた。仮圧着直後および仮圧着より2週間25℃、
50%RHの室内に放置した後、0.2m+ピッチのF
PCを170℃20kg/at、30秒にて本接着し、
抵抗値、剥離強度を測定した結果を表1に示す。This was placed on the connection part of an LCD with a 0.2 pitch pattern formed on glass using an ITO film at a room temperature of 27°C.
The thickness of the crimper is lna, without heating.
10 with a jig fitted with silicone rubber with a rubber hardness of 70 degrees.
Temporary pressure bonding was achieved by pressing at a pressure of kg/cd for 1 second, but the PTFE film serving as a separator could be easily peeled off. 25℃ immediately after temporary crimping and for 2 weeks after temporary crimping,
After leaving it in a room with 50% RH, F of 0.2m+pitch
Adhere the PC at 170℃, 20kg/at, 30 seconds,
Table 1 shows the results of measuring the resistance value and peel strength.
表1
[発明の効果コ
以上のように本発明により、熱硬化型樹脂の反応性の低
下を招くことなく仮圧着後のポットライフを長く維持す
ることができるため、組立工程に制約がなく、効率の良
い作業を行なうことができる。また10〜50’Cとい
う常温に近い温度範囲で仮圧着できるため、仮圧着機の
温度制御をほとんど必要とせず、圧着子の交換等のメン
テナンスも容易であり、火傷の心配もなく作業性がよく
、加熱のためのコストも低減できる。また液状エポキシ
樹脂と熱可塑性樹脂をブレンドすることによって、仮圧
着時のエツジでの接着剤の切れがよくなり、作業性が向
上する。また圧着子に厚さ0゜05m以上、硬度2o〜
80度の弾性体を用いることによって仮圧着する基板へ
の密着性が増し、エアーの巻き込みも少なくなるので歩
留りが向上する。Table 1 [Effects of the invention] As described above, according to the present invention, the pot life after temporary pressure bonding can be maintained for a long time without causing a decrease in the reactivity of the thermosetting resin, so there are no restrictions on the assembly process. Able to work efficiently. In addition, since temporary crimping can be performed at a temperature range of 10 to 50'C, which is close to room temperature, there is almost no need to control the temperature of the temporary crimping machine, and maintenance such as replacing crimpers is easy, and there is no risk of burns and work efficiency is improved. In addition, the cost for heating can also be reduced. Furthermore, by blending liquid epoxy resin and thermoplastic resin, the adhesive can be easily cut at the edges during temporary pressure bonding, improving workability. In addition, the thickness of the crimping element is 0°05m or more, and the hardness is 2o~
By using an 80 degree elastic body, the adhesion to the substrate to be temporarily bonded is increased, and air entrainment is also reduced, resulting in an improvement in yield.
第1図は本発明の接続部材の断面図、第2図は本発明の
リール状にした接続部材の斜視図、第3図は本発明の接
続部材により2枚の基板を接続したときの断面図である
。
1・・・接続部材、 2・・・セパレータ、3・・加
熱硬化型接続部材、 4・・・導電性粒子。
5・・・コア、 6.7・・・基板、 8.9・・・接
続部。Fig. 1 is a cross-sectional view of the connecting member of the present invention, Fig. 2 is a perspective view of the reel-shaped connecting member of the present invention, and Fig. 3 is a cross-sectional view of two substrates connected by the connecting member of the present invention. It is a diagram. DESCRIPTION OF SYMBOLS 1... Connection member, 2... Separator, 3... Heat-curable connection member, 4... Conductive particles. 5... Core, 6.7... Board, 8.9... Connection part.
Claims (1)
分散した異方導電接着剤層とこれに密着させたセパレー
タからなり、該異方導電接着剤層とセパレータとの密着
強度F_Sと、該異方導電接着剤層を電気回路基板の接
続部に温度10〜50℃、圧力3kg/cm^2以上で
押し付けた際の異方導電接着剤層に対する接続部の密着
強度F_Cとの関係が、F_S<F_Cであることを特
徴とする加熱硬化型異方導電接続部材。 2)上記絶縁性接着剤は、液状エポキシ樹脂100重量
部、加熱硬化型の潜在性硬化剤ならびに熱可塑性樹脂の
20〜1000重量部および粘着付与剤5〜500重量
部を含み、該液状エポキシ樹脂の10〜50℃における
粘度は1000ポイズ以下、該熱可塑性樹脂の溶融温度
は80℃以上である請求項1に記載の接続部材。 3)上記導電性粒子の平均粒子径は5〜25μmである
請求項1に記載の接続部材。 4)上記異方導電接着剤層の厚さは上記導電性粒子の平
均粒子径の1.2倍以上、100μm以下である請求項
1および3に記載の接続部材。[Claims] 1) An anisotropically conductive adhesive layer comprising conductive particles dispersed in an insulating adhesive containing a heat-curable component and a separator in close contact with the anisotropically conductive adhesive layer, the anisotropically conductive adhesive layer and the separator. adhesion strength F_S to the anisotropic conductive adhesive layer and the contact strength of the anisotropic conductive adhesive layer when pressed to the connection part of the electrical circuit board at a temperature of 10 to 50°C and a pressure of 3 kg/cm^2 or more. A heat-curable anisotropically conductive connecting member characterized in that the relationship with adhesion strength F_C is F_S<F_C. 2) The above-mentioned insulating adhesive contains 100 parts by weight of a liquid epoxy resin, 20 to 1000 parts by weight of a heat-curable latent curing agent and a thermoplastic resin, and 5 to 500 parts by weight of a tackifier, and the liquid epoxy resin The connecting member according to claim 1, wherein the viscosity of the thermoplastic resin at 10 to 50°C is 1000 poise or less, and the melting temperature of the thermoplastic resin is 80°C or higher. 3) The connecting member according to claim 1, wherein the conductive particles have an average particle diameter of 5 to 25 μm. 4) The connection member according to Claims 1 and 3, wherein the thickness of the anisotropic conductive adhesive layer is 1.2 times or more and 100 μm or less the average particle diameter of the conductive particles.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2295060A JPH0777136B2 (en) | 1990-10-31 | 1990-10-31 | Thermosetting anisotropic conductive connection member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2295060A JPH0777136B2 (en) | 1990-10-31 | 1990-10-31 | Thermosetting anisotropic conductive connection member |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04169080A true JPH04169080A (en) | 1992-06-17 |
JPH0777136B2 JPH0777136B2 (en) | 1995-08-16 |
Family
ID=17815798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2295060A Expired - Fee Related JPH0777136B2 (en) | 1990-10-31 | 1990-10-31 | Thermosetting anisotropic conductive connection member |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0777136B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0824270A3 (en) * | 1996-08-06 | 1999-06-09 | Hitachi Chemical Co., Ltd. | A method of mounting a plurality of electronic parts on a circuit board |
JP2008300360A (en) * | 1995-02-07 | 2008-12-11 | Hitachi Chem Co Ltd | Connecting method of electrode |
JP2011061241A (en) * | 2006-04-26 | 2011-03-24 | Hitachi Chem Co Ltd | Adhesive |
JP2015135748A (en) * | 2014-01-17 | 2015-07-27 | デクセリアルズ株式会社 | Anisotropic conductive film, connection structure, method for manufacturing connection structure, and apparatus for manufacturing connection structure |
KR20160130768A (en) * | 2014-03-07 | 2016-11-14 | 데쿠세리아루즈 가부시키가이샤 | Anisotropic conductive film and method for producing same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6155809A (en) * | 1984-08-27 | 1986-03-20 | 日立化成工業株式会社 | Conductive adhesive film wind |
JPS62117206A (en) * | 1985-11-18 | 1987-05-28 | 株式会社リコー | Anisotropic conductive sheet |
-
1990
- 1990-10-31 JP JP2295060A patent/JPH0777136B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6155809A (en) * | 1984-08-27 | 1986-03-20 | 日立化成工業株式会社 | Conductive adhesive film wind |
JPS62117206A (en) * | 1985-11-18 | 1987-05-28 | 株式会社リコー | Anisotropic conductive sheet |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008300360A (en) * | 1995-02-07 | 2008-12-11 | Hitachi Chem Co Ltd | Connecting method of electrode |
EP0824270A3 (en) * | 1996-08-06 | 1999-06-09 | Hitachi Chemical Co., Ltd. | A method of mounting a plurality of electronic parts on a circuit board |
US6158115A (en) * | 1996-08-06 | 2000-12-12 | Hitachi Chemical Company, Ltd. | Method of mounting a plurality of electronic parts on a circuit board |
US6479757B1 (en) | 1996-08-06 | 2002-11-12 | Hitachi Chemical Company, Ltd. | Method of mounting a plurality of electronic parts on a circuit board |
US6841022B2 (en) | 1996-08-06 | 2005-01-11 | Hitachi Chemical Company, Ltd. | Adhesive-coated electronic parts on a connection sheet |
JP2011061241A (en) * | 2006-04-26 | 2011-03-24 | Hitachi Chem Co Ltd | Adhesive |
JP2011066448A (en) * | 2006-04-26 | 2011-03-31 | Hitachi Chem Co Ltd | Bonding tape and solar cell module using the same |
JP2012216843A (en) * | 2006-04-26 | 2012-11-08 | Hitachi Chem Co Ltd | Adhesive tape and solar cell module using the same |
US8969706B2 (en) | 2006-04-26 | 2015-03-03 | Hitachi Chemical Company, Ltd. | Adhesive tape and solar cell module using the same |
US8969707B2 (en) | 2006-04-26 | 2015-03-03 | Hitachi Chemical Company, Ltd. | Adhesive tape and solar cell module using the same |
JP2015135748A (en) * | 2014-01-17 | 2015-07-27 | デクセリアルズ株式会社 | Anisotropic conductive film, connection structure, method for manufacturing connection structure, and apparatus for manufacturing connection structure |
KR20160130768A (en) * | 2014-03-07 | 2016-11-14 | 데쿠세리아루즈 가부시키가이샤 | Anisotropic conductive film and method for producing same |
Also Published As
Publication number | Publication date |
---|---|
JPH0777136B2 (en) | 1995-08-16 |
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