JPH038653B2 - - Google Patents
Info
- Publication number
- JPH038653B2 JPH038653B2 JP59209837A JP20983784A JPH038653B2 JP H038653 B2 JPH038653 B2 JP H038653B2 JP 59209837 A JP59209837 A JP 59209837A JP 20983784 A JP20983784 A JP 20983784A JP H038653 B2 JPH038653 B2 JP H038653B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- curing
- glycidyl ether
- resin composition
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 6
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 6
- 150000008065 acid anhydrides Chemical class 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 238000000576 coating method Methods 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 5
- 238000007605 air drying Methods 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- VMSIYTPWZLSMOH-UHFFFAOYSA-N 2-(dodecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCOCC1CO1 VMSIYTPWZLSMOH-UHFFFAOYSA-N 0.000 description 1
- KEKXMAURKVLACV-UHFFFAOYSA-N 2-(nonoxymethyl)oxirane Chemical compound CCCCCCCCCOCC1CO1 KEKXMAURKVLACV-UHFFFAOYSA-N 0.000 description 1
- HRWYHCYGVIJOEC-UHFFFAOYSA-N 2-(octoxymethyl)oxirane Chemical compound CCCCCCCCOCC1CO1 HRWYHCYGVIJOEC-UHFFFAOYSA-N 0.000 description 1
- NVKSMKFBUGBIGE-UHFFFAOYSA-N 2-(tetradecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCCCOCC1CO1 NVKSMKFBUGBIGE-UHFFFAOYSA-N 0.000 description 1
- HNJSJLKMMRCGKX-UHFFFAOYSA-N 2-(undecoxymethyl)oxirane Chemical compound CCCCCCCCCCCOCC1CO1 HNJSJLKMMRCGKX-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- -1 BDMA Chemical compound 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005486 sulfidation Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
〔産業上の利用分野〕
本発明は、電気部品、電子部品のコーテイング
用に適した液状エポキシ樹脂組成物に関するもの
である。特に、セラミツクコンデンサの中で、硬
化時の応力が大きく影響する高誘電率タイプのセ
ラミツクコンデンサや、フエライトを使用したコ
イル等に、最も適する液状エポキシ樹脂組成物に
関するものである。
〔従来技術〕
電気部品、電子部品のコーテイング材として
は、従来から使用されているものとして、フエノ
ール樹脂、エポキシ樹脂、ウレタン樹脂、ポリエ
ステル樹脂等が挙げられる。特に、セラミツクコ
ンデンサ、コイル等のコーテイング材として、フ
エノール樹脂及びエポキシ樹脂粉体塗料が主に用
いられている。
しかし、セラミツクコンデンサの高誘電率タイ
プのものの場合、樹脂硬化時の応力により大きく
影響を受ける。エポキシ樹脂粉体塗料や、ビスフ
エノールＡ型エポキシ樹脂を主成分とする塗料で
は、硬化時の応力が大きいためコンデンサの容量
変化が大きく、この用途には適用できないのが現
状である。
このため、主としてフエノール樹脂がセラミツ
クコンデンサのコーテイング材として用いられて
いた。しかし、フエノール樹脂塗料の場合必ず溶
剤を含んだ組成物であるので、硬化過程に於い
て、風乾（溶剤を揮発させる工程）が必要であ
り、この後に150℃以上の焼付工程をとらねばな
らない。通常の風乾は室温から60℃位で６時間以
上が必要であり、硬化過程に多くの時間を必要と
する。
〔発明の目的〕
本発明は、硬化工程が短かく、かつポツトライ
フが長く、硬化時の応力が小さい無溶剤タイプの
液状エポキシ樹脂組成物を提供することにある。
〔発明の構成〕
本発明は、(a)ポリブタジエン変性エポキシ樹
脂、(b)酸無水物硬化剤、(c)炭素数８〜15を有する
アルコールのグリシジルエーテル、からなること
を特徴とする無溶剤型液状エポキシ樹脂組成物を
要旨とするものである。
本発明において、ポリブタジエン変性エポキシ
樹脂とは直鎖状ポリブタジエンの両末端をグリシ
ジル化したものであり、通常分子量約500〜800の
液状化合物である。
炭素数８〜15を有するアルコールのグリシジル
エーテルは、前記エポキシ樹脂との相溶性のすぐ
れたエポキシ樹脂反応性希釈剤として添加される
もので、その添加量は前記エポキシ樹脂に対して
５〜15％（重量％、以下同じ）が好ましい。かか
るグリシジルエーテルは具体的にはオクチルグリ
シジルエーテル、ノニルグリシジルエーテル、ウ
ンデシルグリシジルエーテル、ラウリルグリシジ
ルエーテル、ミリスチルグリシジルエーテル等で
あるが、特にC12〜C14のアルコールのグリシジル
エーテルが好ましい。
このように、本発明のエポキシ樹脂組成物はポ
リブタジエン変性エポキシ樹脂と炭素数８〜15を
有するアルコールのグリシジルエーテルを併用し
ているので、通常の酸無水物を硬化剤として使用
することにより、耐湿性、耐熱性等コーテイング
剤としてのすぐれた特性を維持しながら、硬化時
の応力が小さいものとなる。
硬化剤は通常液状酸無水物を使用する。例え
ば、メチルテトラヒドロフタール酸無水物、メル
チヘキサヒドロフタール酸無水物、ドデセニルサ
クソニツク酸無水物、MTA−18などである。添
加量は、前記エポキシ樹脂に対して、40〜60％が
好ましい。
また、酸無水物酸化剤は、それのみでは硬化が
遅い場合、硬化促進剤を併用するのが好ましい。
硬化促進剤としては、イミダゾール系化合物、
DMP−30、BDMA等の第３級アミン、DBU塩
等がある。添加量は硬化剤に対して４〜７％であ
る。
更に、本発明のエポキシ樹脂組成物には通常無
機フイラーを添加する。無機フイラーは特に限定
されないが、シリカ、タルク、焼成クレー等が好
ましい。また、チキソトロピー付与剤が添加され
る。これは混合物（主剤及び硬化剤を混合した
物）の状態で、チキソトロピーの経時変化が少な
いものが好ましい。特に有機ベントナイト、酸化
ポリエチレン及びポリアマイド等が好ましい。
〔発明の効果〕
本発明の無溶剤型液状エポキシ樹脂組成物は次
のような特長を有している。
(1) 硬化工程が短縮される。従来のフエノール樹
脂コーテイング剤は風乾を必要とするが、無溶
剤タイプであるため、全く風乾を必要とせず
150℃５分間でタツクフリーの状態が得られ、
そのまま次工程へと移すことができる。
(2) 硫化時の応力が小さく、コンデンサ及びコイ
ルの容量変化が少ない。
(3) 耐湿、耐熱性等も十分にすぐれている。
(4) ポツトライフは８時間以上あり、通常の作業
において十分に使用可能な範囲である。
〔実施例〕
実施例及び比較例を以下に示す。
第１表に示すような配合の樹脂組成物を混合
し、ポツトライフ硬化時間、コンデンサの容量変
化率を測定し、第２表に示す結果を得た。
[Industrial Application Field] The present invention relates to a liquid epoxy resin composition suitable for coating electrical parts and electronic parts. In particular, the present invention relates to a liquid epoxy resin composition that is most suitable for ceramic capacitors of a high dielectric constant type that are greatly affected by stress during curing, coils using ferrite, and the like. [Prior Art] Conventionally used coating materials for electrical and electronic components include phenol resins, epoxy resins, urethane resins, and polyester resins. In particular, phenolic resin and epoxy resin powder coatings are mainly used as coating materials for ceramic capacitors, coils, etc. However, in the case of high dielectric constant type ceramic capacitors, it is greatly affected by stress during resin curing. Currently, epoxy resin powder coatings and coatings containing bisphenol A type epoxy resin as a main component cannot be used for this purpose because they have large stress during curing, which causes a large capacitance change. For this reason, phenolic resins have been mainly used as coating materials for ceramic capacitors. However, since phenolic resin paints always contain a solvent, air drying (a step to evaporate the solvent) is required during the curing process, followed by a baking process at 150°C or higher. Normal air drying requires 6 hours or more at room temperature to 60°C, and the curing process requires a lot of time. [Object of the Invention] An object of the present invention is to provide a solvent-free liquid epoxy resin composition that has a short curing process, a long pot life, and low stress during curing. [Structure of the Invention] The present invention provides a solvent-free product comprising (a) a polybutadiene-modified epoxy resin, (b) an acid anhydride curing agent, and (c) a glycidyl ether of an alcohol having 8 to 15 carbon atoms. The gist is a type liquid epoxy resin composition. In the present invention, the polybutadiene-modified epoxy resin is obtained by glycidylating both ends of linear polybutadiene, and is usually a liquid compound having a molecular weight of about 500 to 800. Glycidyl ether of alcohol having 8 to 15 carbon atoms is added as an epoxy resin-reactive diluent with excellent compatibility with the epoxy resin, and the amount added is 5 to 15% with respect to the epoxy resin. (% by weight, same hereinafter) is preferable. Specific examples of such glycidyl ether include octyl glycidyl ether, nonyl glycidyl ether, undecyl glycidyl ether, lauryl glycidyl ether, myristyl glycidyl ether, and particularly preferred are glycidyl ethers of C12 to C14 alcohols. As described above, since the epoxy resin composition of the present invention uses a polybutadiene-modified epoxy resin and a glycidyl ether of an alcohol having 8 to 15 carbon atoms, it has moisture resistance by using an ordinary acid anhydride as a curing agent. While maintaining excellent properties as a coating agent such as hardness and heat resistance, stress during curing is reduced. A liquid acid anhydride is usually used as a hardening agent. For example, methyltetrahydrophthalic anhydride, mertihexahydrophthalic anhydride, dodecenylsaxonic anhydride, MTA-18, and the like. The amount added is preferably 40 to 60% based on the epoxy resin. Further, when the acid anhydride oxidizing agent alone causes slow curing, it is preferable to use a curing accelerator in combination.
As curing accelerators, imidazole compounds,
Examples include DMP-30, tertiary amines such as BDMA, and DBU salts. The amount added is 4 to 7% based on the hardening agent. Furthermore, an inorganic filler is usually added to the epoxy resin composition of the present invention. The inorganic filler is not particularly limited, but silica, talc, calcined clay, etc. are preferred. Additionally, a thixotropy agent is added. This is preferably in the form of a mixture (a mixture of the base agent and the curing agent), which exhibits little change in thixotropy over time. Particularly preferred are organic bentonite, polyethylene oxide, polyamide, and the like. [Effects of the Invention] The solvent-free liquid epoxy resin composition of the present invention has the following features. (1) The curing process is shortened. Conventional phenolic resin coating agents require air drying, but since it is a solvent-free type, air drying is not required at all.
A tack-free state can be obtained in 5 minutes at 150℃.
You can move on to the next process as is. (2) Stress during sulfidation is small, and capacitance changes in capacitors and coils are small. (3) Moisture resistance, heat resistance, etc. are also sufficiently excellent. (4) The pot life is 8 hours or more, which is sufficient for normal work. [Example] Examples and comparative examples are shown below. Resin compositions having the formulations shown in Table 1 were mixed, and the pot life curing time and capacitance change rate were measured, and the results shown in Table 2 were obtained.
【表】【table】
【表】【table】
【表】
（測定方法）
１ ゲルタイム
150℃熱板上に樹脂組成物を混合したものを約
１ｇとり、ストツプウオツチにてゲル化するまで
の時間を測定した。
２ ポツトライフ
樹脂組成物を約100ｇ混合し、25℃の恒温槽に
放置し、初期混合物粘度から、２倍粘度に達した
時間をポツトライフとした。
３ コンデンサ容量変化率
チタン酸バリウム系セラミツクを素子として用
い、無外装のコンテンサーの容量を初期値とし、
樹脂外装後４日間放置しコンデンサの容量を測定
し、初期値に対する容量の変化率を求めた。
コンデンサ容量変化率（％＝
＝（４日後の容量）−（初期値）／（初期値）
コンデンサの容量は、約10nFを使用した。[Table] (Measurement method) 1. Gel time Approximately 1 g of the resin composition mixture was placed on a 150°C hot plate, and the time until gelation was measured using a stopwatch. 2 Pot Life Approximately 100 g of the resin composition was mixed and left in a constant temperature bath at 25°C, and the time when the viscosity of the mixture reached twice the initial viscosity was defined as the pot life. 3 Capacitance change rate Using barium titanate ceramic as the element, the initial value is the capacitance of the uncoated capacitor,
The capacitor was left for 4 days after being covered with resin, and the capacitance of the capacitor was measured, and the rate of change in capacitance with respect to the initial value was determined. Rate of change in capacitor capacity (%==(capacity after 4 days)−(initial value)/(initial value) The capacitance of the capacitor used was approximately 10 nF.
Claims (1)
ルエーテルからなることを特徴とする無溶剤型
液状エポキシ樹脂組成物。[Claims] 1. A solvent-free liquid epoxy resin composition comprising: (a) a polybutadiene-modified epoxy resin; (b) an acid anhydride curing agent; and (c) a glycidyl ether of an alcohol having 8 to 15 carbon atoms. thing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20983784A JPS6189222A (en) | 1984-10-08 | 1984-10-08 | Liquid epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20983784A JPS6189222A (en) | 1984-10-08 | 1984-10-08 | Liquid epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6189222A JPS6189222A (en) | 1986-05-07 |
| JPH038653B2 true JPH038653B2 (en) | 1991-02-06 |
Family
ID=16579434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20983784A Granted JPS6189222A (en) | 1984-10-08 | 1984-10-08 | Liquid epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6189222A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2676459B2 (en) * | 1992-07-24 | 1997-11-17 | 阪本薬品工業株式会社 | Reactive diluent for epoxy resin |
| EP2566908B1 (en) * | 2010-05-05 | 2017-12-06 | Tyco Electronics Services GmbH | Potting for electronic components |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471198A (en) * | 1977-11-18 | 1979-06-07 | Mitsubishi Petrochem Co Ltd | Epoxy resin composition |
| JPS5712037A (en) * | 1980-06-27 | 1982-01-21 | Hitachi Ltd | Epoxy-modified butadiene resin composition |
-
1984
- 1984-10-08 JP JP20983784A patent/JPS6189222A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471198A (en) * | 1977-11-18 | 1979-06-07 | Mitsubishi Petrochem Co Ltd | Epoxy resin composition |
| JPS5712037A (en) * | 1980-06-27 | 1982-01-21 | Hitachi Ltd | Epoxy-modified butadiene resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6189222A (en) | 1986-05-07 |
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