JPH05279451A - Epoxy resin composition and its cured product - Google Patents
Epoxy resin composition and its cured productInfo
- Publication number
- JPH05279451A JPH05279451A JP10392492A JP10392492A JPH05279451A JP H05279451 A JPH05279451 A JP H05279451A JP 10392492 A JP10392492 A JP 10392492A JP 10392492 A JP10392492 A JP 10392492A JP H05279451 A JPH05279451 A JP H05279451A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- acid anhydride
- aluminum electrolytic
- anhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はエポキシ樹脂組成物に関
する。さらに詳しくはアルミ電解コンデンサーの封口に
適したエポキシ樹脂組成物及びその硬化物に関する。FIELD OF THE INVENTION The present invention relates to an epoxy resin composition. More specifically, it relates to an epoxy resin composition suitable for sealing aluminum electrolytic capacitors and a cured product thereof.
【０００２】[0002]
【従来の技術】アルミ電解コンデンサーの封口は従来ベ
ークライトあるいはベークライトとブチルゴムによる封
口が行われてきた。しかしながら、この方法では電解液
の蒸発を完全に防止する事が出来ず、又電機・電子部品
の組立て時に行われるハロゲン系溶剤による洗浄工程で
の洗浄液の浸入を完全に防止する事が不可能で、浸入し
た洗浄液によるアルミ電極の腐食が起こるという欠点が
ある。このためアルミ電解コンデンサーの高信頼性と長
寿命化は困難であった。この問題を解決する方法とし
て、従来の方法で封口した後さらにその上を樹脂で封口
する方法が提案され種々の検討がなされているが充分満
足できる結果が得られていない。すなわち、アルミ電解
コンデンサーは封口部に端子が２本以上出ているため、
きわめて作業性が悪く、封口する樹脂の粘度が高い場
合、樹脂を封口部に均一に広げる事が困難となり、人手
による作業が必要となり、生産性が悪い。また溶剤を用
いて粘度を下げたものは封口部に均一に樹脂を広げる事
は可能となるものの硬化時に溶剤が蒸発するため、その
硬化物は多孔質となり、ハロゲン系洗浄液の浸入を防止
する事が出来なくなる。また溶剤を用いない低粘度で耐
溶剤性に優れた樹脂はまだ見いだされていない。2. Description of the Related Art Sealing of aluminum electrolytic capacitors has conventionally been performed by using bakelite or bakelite and butyl rubber. However, this method cannot completely prevent the evaporation of the electrolytic solution, and it is impossible to completely prevent the infiltration of the cleaning solution in the cleaning process by the halogen-based solvent that is performed when assembling the electric / electronic parts. However, there is a drawback that the aluminum electrode is corroded by the infiltrated cleaning liquid. Therefore, it has been difficult to achieve high reliability and long life of the aluminum electrolytic capacitor. As a method for solving this problem, a method of sealing by a conventional method and then further sealing with a resin has been proposed and various investigations have been made, but satisfactory results have not been obtained. That is, since the aluminum electrolytic capacitor has two or more terminals on the sealing part,
When the workability is extremely poor and the sealing resin has a high viscosity, it becomes difficult to uniformly spread the resin over the sealing portion, and manual work is required, resulting in poor productivity. In addition, it is possible to evenly spread the resin on the sealing part if the viscosity is reduced by using a solvent, but since the solvent evaporates during curing, the cured product becomes porous and it is necessary to prevent the halogen-based cleaning liquid from entering. Can not be done. Further, a resin which does not use a solvent and has a low viscosity and excellent solvent resistance has not yet been found.
【０００３】[0003]
【発明が解決しようとする課題】低粘度で作業性に優
れ、かつ耐溶剤性に優れたアルミ電解コンデンサーの封
口用樹脂の開発が望まれている。It has been desired to develop a resin for sealing aluminum electrolytic capacitors, which has low viscosity, excellent workability, and excellent solvent resistance.
【０００４】[0004]
【課題を解決するための手段】本発明者らは、前記した
課題を解決すべく鋭意研究を重ねた結果、本発明を完成
させたものである。即ち本発明は、 ａ．エポキシ樹脂がヘキサヒドロフタル酸ジグリシジル
エステル、レゾルシノールジグリシジルエーテル、アリ
サイクリックジエポキシカルボキシレート及びビスフェ
ノールＦジグリシジルエーテルから選ばれる１種又は２
種以上であるエポキシ樹脂 ｂ．酸無水物硬化剤 ｃ．硬化促進剤 からなるエポキシ樹脂組成物及びその硬化物を提供する
ものである。The present inventors have completed the present invention as a result of intensive studies to solve the above-mentioned problems. That is, the present invention comprises: a. The epoxy resin is one or two selected from hexahydrophthalic acid diglycidyl ester, resorcinol diglycidyl ether, alicyclic diepoxy carboxylate and bisphenol F diglycidyl ether.
One or more epoxy resin b. Acid anhydride curing agent c. An epoxy resin composition comprising a curing accelerator and a cured product thereof are provided.
【０００５】低粘度で作業性に優れかつ耐溶剤性に優れ
るエポキシ樹脂組成物は限られた組成のエポキシ樹脂及
び硬化剤の組み合わせで可能になるものであり、本発明
で使用するエポキシ樹脂は前記した４種類のエポキシ樹
脂の１種以上からなる、エポキシ樹脂であるがヘキサヒ
ドロフタル酸ジグリシジルエステルは単独で用いる事も
できるが、使用する硬化剤の種類にもよるが耐熱性が若
干劣るため、他の３種のエポキシ樹脂の１種以上と併用
した方が好ましい。An epoxy resin composition having a low viscosity, excellent workability and excellent solvent resistance can be obtained by combining an epoxy resin and a curing agent having a limited composition, and the epoxy resin used in the present invention is the above-mentioned. Hexahydrophthalic acid diglycidyl ester, which is an epoxy resin consisting of one or more of the above-mentioned four kinds of epoxy resins, can be used alone, but the heat resistance is slightly inferior depending on the type of curing agent used. , And it is preferable to use in combination with at least one of the other three epoxy resins.
【０００６】又レゾルシノールジグリシジルエーテルは
０〜５０重量％の範囲で用いるのが好ましい。これより
使用量が多い場合、保存中に結晶が析出する場合があ
る。また封口するアルミ電解コンデンサーの口径が大き
い場合、その硬化物にクラックが生じる場合があり、ク
ラックからの洗浄液の浸入が起り耐薬品性を低下させる
原因となる事がある。Further, resorcinol diglycidyl ether is preferably used in the range of 0 to 50% by weight. If the amount used is larger than this, crystals may precipitate during storage. In addition, when the diameter of the aluminum electrolytic capacitor to be sealed is large, cracks may occur in the cured product, and the cleaning liquid may infiltrate through the cracks, resulting in a decrease in chemical resistance.
【０００７】アリサイクリックジエポキシカルボキシレ
ートは、例えば商品名セロキサイド（ダイセル化学社
製）で市販されている環式脂肪族エポキシ樹脂で０〜５
０重量％の範囲で用いるのが好ましい。この範囲より使
用量が多い場合、封口するアルミ電解コンデンサーの口
径が大きい場合、クラックが生じ易くなり耐薬品性を低
下させる原因となる事がある。また、ビスフェノールＦ
ジグリシジルエーテルの使用量は０〜５０重量％の範囲
で用いるのが好ましい。これより使用量が多い場合、粘
度が高くなり過ぎて作業性に問題を生ずる。本発明で使
用するエポキシ樹脂の粘度は、２５０〜１０００センチ
ポイズに収まるように各エポキシ化合物を使用するのが
好ましい。Alicyclic diepoxy carboxylate is, for example, a cycloaliphatic epoxy resin marketed under the trade name Celoxide (manufactured by Daicel Chemical Co., Ltd.), which is 0-5.
It is preferably used in the range of 0% by weight. If the amount used exceeds this range, or if the diameter of the aluminum electrolytic capacitor to be sealed is large, cracks are likely to occur, which may cause deterioration in chemical resistance. Also, bisphenol F
The amount of diglycidyl ether used is preferably in the range of 0 to 50% by weight. If the amount used is larger than this, the viscosity becomes too high, causing a problem in workability. It is preferable to use each epoxy compound so that the epoxy resin used in the present invention has a viscosity of 250 to 1000 centipoise.
【０００８】次に本発明で使用する酸無水物硬化剤とし
て好ましい例としてはポリアゼライン酸無水物、メチル
テトラヒドロ無水フタル酸、メチルヘキサヒドロ無水フ
タル酸及びそれらの変性による可撓性酸無水物が挙げら
れる。ここで可撓性酸無水物とは上記酸無水物にシリコ
ン化合物を添加あるいは付加したもの、あるいはポリヒ
ドロキシアルカン、ポリオキシアルキレンエーテルの付
加物で、これらは例えばリカシッドＨＦ−０４、ＨＦー
２４Ｂ、ＨＦ−０４（商品名：新日本理化社製）の名で
市販されている。酸無水物硬化剤の使用量は、エポキシ
樹脂に対し０．８〜１．１化学当量好ましくは０．９な
いし１．０化学当量である。Next, preferable examples of the acid anhydride curing agent used in the present invention are polyazelaic acid anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride and flexible acid anhydrides obtained by modification thereof. Can be mentioned. Here, the flexible acid anhydride is a product obtained by adding or adding a silicon compound to the above acid anhydride, or an addition product of polyhydroxyalkane or polyoxyalkylene ether, and these are, for example, RIKACID HF-04, HF-24B, It is commercially available under the name of HF-04 (trade name: manufactured by Shin Nippon Rika Co., Ltd.). The amount of the acid anhydride curing agent used is 0.8 to 1.1 chemical equivalents, preferably 0.9 to 1.0 chemical equivalents, relative to the epoxy resin.
【０００９】本発明で使用する硬化促進剤の例としては
通常のエポキシ樹脂の硬化に用いられる例えばイミダゾ
ール類、トリスジアミノメチルアミノフェノール、トリ
フェニルホスフィン、１、８ージアザビシクロ（５、
４、０、）ウンデセンー７（ＤＢＵ）及びその塩類など
が挙げられ、その使用量は任意であるが通常エポキシ樹
脂１００部に対し０．５〜５．０好ましくは１〜３重量
部である。Examples of the curing accelerator used in the present invention include imidazoles, trisdiaminomethylaminophenol, triphenylphosphine, 1,8-diazabicyclo (5, which are used for curing ordinary epoxy resins.
4,0,) undecene-7 (DBU) and salts thereof and the like, and the amount thereof is optional, but is usually 0.5 to 5.0, preferably 1 to 3 parts by weight, relative to 100 parts of the epoxy resin.
【００１０】本発明のエポキシ樹脂組成物は、前記した
４種類のエポキシ樹脂のうち１種以上の所定量を量りと
り、所定量の酸無水物硬化剤及び硬化促進剤を加え均一
に撹拌する事により容易に得ることができる。アルミ電
解コンデンサーの封口は例えば所定量のエポキシ樹脂組
成物を必要であれば加熱してアルミ電解コンデンサーの
封口部に滴下し、必要であればスピンをかけ、封口部に
均一に広げた後、８０〜１５０℃好ましくは８５〜１１
０℃の温度で１〜１０時間硬化することによって行われ
る。本発明のエポキシ樹脂組成物は低粘度で、作業性、
耐溶剤性に優れ、このものはアルミ電解コンデンサーの
封口に適する。この樹脂組成物を用いる事により長寿命
化のためのアルミ電解コンデンサーの樹脂封口が人手に
よらず、機械による方法でも可能である。The epoxy resin composition of the present invention is prepared by measuring a predetermined amount of at least one of the above-mentioned four kinds of epoxy resins, adding a predetermined amount of an acid anhydride curing agent and a curing accelerator, and stirring the mixture uniformly. Can be easily obtained. For sealing the aluminum electrolytic capacitor, for example, a predetermined amount of an epoxy resin composition is heated if necessary and dropped on the sealing part of the aluminum electrolytic capacitor, spun if necessary and spread evenly on the sealing part, and then 80 ~ 150 ° C, preferably 85-11
It is carried out by curing at a temperature of 0 ° C. for 1 to 10 hours. The epoxy resin composition of the present invention has a low viscosity, workability,
It has excellent solvent resistance and is suitable for sealing aluminum electrolytic capacitors. By using this resin composition, the sealing of the resin of the aluminum electrolytic capacitor for extending the life can be done by a mechanical method instead of manual labor.
【００１１】[0011]
【実施例】以下実施例によって本発明を具体的に説明す
る。The present invention will be specifically described with reference to the following examples.
【００１２】実施例１ レゾルシノールジグリシジルエーテル（ＲＧＥーＨ、日
本化薬社製、エポキシ当量１２０）５０ｇ、アリサイク
リックジエポキシカルボキシレート（セロキサイド２０
２１、ダイセル化学社製、エポキシ当量１３３）１５
ｇ、ビスフェノールＦジグリシジルエーテル（ＲＥー３
０４、日本化薬社製、エポキシ当量１７０）３５ｇ、メ
チルヘキサヒドロ無水フタル酸（リカシッドＭＨ−７０
０，新日本理化社製）１２０ｇ及び１、８ージアザビシ
クロ（５、４、０）ウンデセンー７２ｇを混合し、均一
に撹拌して本発明のエポキシ樹脂組成物を得た（２５℃
の粘度２５０センチポイズ）。Example 1 50 g of resorcinol diglycidyl ether (RGE-H, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 120), alicyclic diepoxy carboxylate (celoxide 20)
21, manufactured by Daicel Chemical Industries, epoxy equivalent 133) 15
g, bisphenol F diglycidyl ether (RE-3
04, Nippon Kayaku Co., Ltd., epoxy equivalent 170) 35 g, methylhexahydrophthalic anhydride (Ricacid MH-70)
0, manufactured by Shin Nihon Rika Co., Ltd.) and 72 g of 1,8-diazabicyclo (5,4,0) undecene were mixed and stirred uniformly to obtain an epoxy resin composition of the present invention (25 ° C.).
Viscosity of 250 centipoise).
【００１３】次にこうして得られたエポキシ樹脂組成物
を３５ｍｍφのアルミ電解コンデンサー（端子２本付
き）の封口部にディスペンサーを用い１．０ｇ滴下し
た。この時樹脂組成物の広がりは良好で均一に広がっ
た。１１０℃で２時間硬化した後、トリクロルエタンで
２５℃、１０分間の浸漬テストを行ったところ外観に変
化なく、またアルミ電解コンデンサー内部のガス分析を
行ったところ異常（洗浄液の浸入）はなかった。Next, 1.0 g of the epoxy resin composition thus obtained was dropped into a sealing portion of a 35 mmφ aluminum electrolytic capacitor (with two terminals) using a dispenser. At this time, the resin composition spread well and spread uniformly. After curing at 110 ° C for 2 hours, an immersion test was performed with trichloroethane at 25 ° C for 10 minutes, the appearance did not change, and gas analysis inside the aluminum electrolytic capacitor showed no abnormality (infiltration of cleaning liquid). ..
【００１４】実施例２ 実施例１で使用したメチルヘキサヒドロ無水フタル酸１
２０ｇの代りにメチルヘキサヒドロ無水フタル酸６８
ｇ、可撓性酸無水物硬化剤（リカシッドＨＦ−２４Ｂ、
新日本理化社製）６８ｇを用いた他は実施例１と同様に
して本発明のエポキシ樹脂組成物を得た（２５℃の粘度
４５０センチポイズ）。次に実施例１と同様にしてアル
ミ電解コンデンサーの封口を行った。樹脂の広がりは良
好であり又、浸漬テストの結果でも異常は認められなか
った。Example 2 Methylhexahydrophthalic anhydride 1 used in Example 1
20 g instead of methylhexahydrophthalic anhydride 68
g, flexible acid anhydride curing agent (Ricacid HF-24B,
An epoxy resin composition of the present invention was obtained in the same manner as in Example 1 except that 68 g (manufactured by Shin Nippon Rika Co., Ltd.) was used (viscosity 450 centipoise at 25 ° C.). Next, the aluminum electrolytic capacitor was sealed in the same manner as in Example 1. The resin spread was good, and no abnormalities were observed in the results of the immersion test.
【００１５】実施例３ 実施例１で使用したエポキシ樹脂全量１００ｇの代りに
ヘキサヒドロ無水フタル酸ジグリシジルエステル（ＡＫ
ー６０１、日本化薬社製、エポキシ当量１５４）１００
ｇを、またメチルヘキサヒドロ無水フタル酸１２０ｇの
代りにメチルテトラヒドロ無水フタル酸（ペンタハード
５０００、東燃石化社製）７０ｇ、可撓性酸無水物硬化
剤（リカシッドＨＦ−０４、新日本理化社製）３０ｇを
用いた他は実施例１と同様にして本発明のエポキシ樹脂
組成物を得た（２５℃の粘度２５０センチポイズ）。次
に実施例１と同様にしてアルミ電解コンデンサーの封口
を行った。樹脂の広がりは良好であり又、浸漬テストの
結果でも異常は認められなかった。Example 3 Hexahydrophthalic anhydride diglycidyl ester (AK) was used in place of 100 g of the epoxy resin used in Example 1.
-601, Nippon Kayaku Co., Ltd., epoxy equivalent 154) 100
g instead of 120 g of methylhexahydrophthalic anhydride, 70 g of methyltetrahydrophthalic anhydride (Pentahard 5000, manufactured by Tonenshi Kagaku Co., Ltd.), a flexible acid anhydride curing agent (Rikacid HF-04, manufactured by Shin Nippon Rika Co., Ltd.) ) The epoxy resin composition of the present invention was obtained in the same manner as in Example 1 except that 30 g was used (viscosity at 25 ° C. 250 centipoise). Next, the aluminum electrolytic capacitor was sealed in the same manner as in Example 1. The resin spread was good, and no abnormalities were observed in the results of the immersion test.
【００１６】実施例４ 実施例１で使用した３種のエポキシ樹脂の代りにヘキサ
ヒドロ無水フタル酸ジグリシジルエステル５０ｇ、ビス
フェノールＦジグリシジルエーテル５０ｇを用い、また
メチルヘキサヒドロ無水フタル酸１２０ｇを１００ｇに
代えた他は、実施例１と同様にして本発明のエポキシ樹
脂組成物を得た（２５℃の粘度３５０センチポイズ）。
次に実施例１と同様にしてアルミ電解コンデンサーの封
口を行った。樹脂の広がりは良好であり又、浸漬テスト
の結果でも異常は認められなかった。Example 4 50 g of hexahydrophthalic anhydride diglycidyl ester and 50 g of bisphenol F diglycidyl ether were used in place of the three epoxy resins used in Example 1, and 120 g of methylhexahydrophthalic anhydride was replaced with 100 g. An epoxy resin composition of the present invention was obtained in the same manner as in Example 1 except for the above (viscosity at 25 ° C: 350 centipoise).
Next, the aluminum electrolytic capacitor was sealed in the same manner as in Example 1. The resin spread was good, and no abnormalities were observed in the results of the immersion test.
【００１７】実施例５ 実施例１で使用した３種のエポキシ樹脂の代りにアリサ
イクリックジエポキシカルボキシレート（セロキサイド
２０２１、ダイセル化学社製、エポキシ当量１３３）５
０ｇ、ビスフェノールＦジグリシジルエーテル（ＲＥー
３０４、日本化薬社製、エポキシ当量１７０）５０ｇ、
硬化剤として用いたメチルヘキサヒドロ無水フタル酸
（リカシッドＭＨ−７００，新日本理化社製）１２０ｇ
の代りにメチルテトラヒドロ無水フタル酸（ペンタハー
ド５０００、東燃石化社製）４３ｇ、可撓性酸無水物硬
化剤（リカシッドＨＦ−２４Ｂ、新日本理化社製）４３
ｇ、ポリアゼライン酸無水物（リカシッドＰＡＺー９
０、新日本理化社製）１３ｇを用いた他は、実施例１と
同様にして本発明のエポキシ樹脂組成物を得た（２５℃
の粘度２８０センチポイズ）。次に実施例１と同様にし
てアルミ電解コンデンサーの封口を行った。樹脂の広が
りは良好であり又、浸漬テストの結果でも異常は認めら
れなかった。Example 5 Instead of the three kinds of epoxy resins used in Example 1, Alicyclic diepoxycarboxylate (Celoxide 2021, manufactured by Daicel Chemical Co., Ltd., epoxy equivalent 133) 5
0 g, bisphenol F diglycidyl ether (RE-304, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 170) 50 g,
120 g of methylhexahydrophthalic anhydride (Ricacid MH-700, manufactured by Shin Nippon Rika Co., Ltd.) used as a curing agent
43 g of methyltetrahydrophthalic anhydride (Pentahard 5000, manufactured by Tonenshi Kagaku Co., Ltd.), a flexible acid anhydride curing agent (Ricacid HF-24B, manufactured by Shin Nippon Rika Co., Ltd.) instead of 43
g, polyazelaic anhydride (Ricacid PAZ-9
0, manufactured by Shin Nippon Rika Co., Ltd.) was used, and the epoxy resin composition of the present invention was obtained in the same manner as in Example 1 (25 ° C.).
Viscosity of 280 centipoise). Next, the aluminum electrolytic capacitor was sealed in the same manner as in Example 1. The resin spread was good, and no abnormalities were observed in the results of the immersion test.
【００１８】実施例６ 実施例１で使用したメチルヘキサヒドロ無水フタル酸１
２０ｇの代りに、メチルヘキサヒドロ無水フタル酸５０
ｇ、可撓性酸無水物硬化剤（リカシッドＨＦ−０４、新
日本理化社製）５０ｇ、ポリアゼライン酸無水物（リカ
シッドＰＡＺー９０、新日本理化社製）２０ｇを用いた
他は、実施例１と同様にして本発明のエポキシ樹脂組成
物を得た（２５℃の粘度３００センチポイズ）。次に実
施例１と同様にしてアルミ電解コンデンサーの封口を行
った。樹脂の広がりは良好であり又、浸漬テストの結果
でも異常は認められなかった。Example 6 Methylhexahydrophthalic anhydride 1 used in Example 1
Instead of 20 g, methyl hexahydrophthalic anhydride 50
g, a flexible acid anhydride curing agent (Rikacid HF-04, manufactured by Shin Nippon Rika Co., Ltd.) 50 g, polyazelaine acid anhydride (Ricacid PAZ-90, manufactured by Shin Nihon Rika Co., Ltd.) 20 g An epoxy resin composition of the present invention was obtained in the same manner as 1 (viscosity at 25 ° C. 300 centipoise). Next, the aluminum electrolytic capacitor was sealed in the same manner as in Example 1. The resin spread was good, and no abnormalities were observed in the results of the immersion test.
【００１９】比較例１ 実施例１で使用した３種のエポキシ樹脂の全量１００ｇ
の代わりにビスフェノールＡジグリシジルエーテル（エ
ピコート８２８、油化シェル社製、エポキシ当量１８
５）１００ｇを、メチルヘキサヒドロ無水フタル酸１２
０ｇを８０ｇに代えた他は実施例１と同様にしてエポキ
シ樹脂組成物を得た（２５℃の粘度１５００センチポイ
ズ）。得られたエポキシ樹脂組成物を用い、実施例１と
同様にしてアルミ電解コンデンサーの封口を行ったが樹
脂組成物の広がりが悪く、封口部に均一に広がらずヘラ
で広げる必要があった。また実施例１と同様の浸漬テス
トでは、外観は変化なかったもののガス分析の結果では
トリクロルエタンの浸入が認められた。これはクラック
に起因するものと思われる。Comparative Example 1 The total amount of the three epoxy resins used in Example 1 was 100 g.
Instead of bisphenol A diglycidyl ether (Epicoat 828, Yuka Shell Co., epoxy equivalent 18
5) 100 g of methyl hexahydrophthalic anhydride 12
An epoxy resin composition was obtained in the same manner as in Example 1 except that 0 g was replaced with 80 g (viscosity at 25 ° C. was 1500 centipoise). Using the obtained epoxy resin composition, an aluminum electrolytic capacitor was sealed in the same manner as in Example 1, but the resin composition spread poorly and it was necessary to spread it with a spatula instead of spreading it uniformly in the sealing portion. Further, in the same immersion test as in Example 1, the appearance was not changed, but the infiltration of trichloroethane was confirmed by the gas analysis result. This is probably due to cracks.
【００２０】[0020]
【発明の効果】低粘度で、作業性に優れたエポキシ樹脂
組成物がえられた。このものはアルミ電解コンデンサー
の封口に適しこの樹脂組成物を用いる事により長寿命化
のためのアルミ電解コンデンサーの樹脂封口が人手によ
らず、機械による方法で可能である。このエポキシ樹脂
組成物の硬化物は耐溶剤性が優れている。EFFECT OF THE INVENTION An epoxy resin composition having a low viscosity and excellent workability was obtained. This product is suitable for sealing an aluminum electrolytic capacitor, and by using this resin composition, the resin sealing of an aluminum electrolytic capacitor for prolonging the life can be performed by a mechanical method without requiring manual labor. The cured product of this epoxy resin composition has excellent solvent resistance.
Claims (3)
ジグリシジルエステル、レゾルシノールジグリシジルエ
ーテル、アリサイクリックジエポキシカルボキシレート
及びビスフェノールＦジグリシジルエーテルから選ばれ
る１種又は２種以上であるエポキシ樹脂 ｂ．酸無水物硬化剤 ｃ．硬化促進剤 からなるエポキシ樹脂組成物。1. A. An epoxy resin in which the epoxy resin is one or more selected from hexahydrophthalic acid diglycidyl ester, resorcinol diglycidyl ether, alicyclic diepoxy carboxylate and bisphenol F diglycidyl ether b. Acid anhydride curing agent c. An epoxy resin composition comprising a curing accelerator.
物、メチルテトラヒドロ無水フタル酸、メチルヘキサヒ
ドロ無水フタル酸及びそれらの変性による可撓性酸無水
物である請求項１に記載のエポキシ樹脂組成物。2. The epoxy according to claim 1, wherein the acid anhydride curing agent is polyazelaic acid anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride and a flexible acid anhydride obtained by modification thereof. Resin composition.
化物。3. A cured product of the epoxy resin composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10392492A JPH05279451A (en) | 1992-03-31 | 1992-03-31 | Epoxy resin composition and its cured product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10392492A JPH05279451A (en) | 1992-03-31 | 1992-03-31 | Epoxy resin composition and its cured product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05279451A true JPH05279451A (en) | 1993-10-26 |
Family
ID=14366982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10392492A Pending JPH05279451A (en) | 1992-03-31 | 1992-03-31 | Epoxy resin composition and its cured product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05279451A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004104683A1 (en) * | 2003-05-21 | 2004-12-02 | Nippon Kayaku Kabushiki Kaisha | Sealant for liquid crystal and liquid-crystal display cell made with the same |
| CN100460963C (en) * | 2003-05-21 | 2009-02-11 | 日本化药株式会社 | Sealant for liquid crystal and liquid-crystal display cell made with the same |
| US7781543B2 (en) | 2002-09-05 | 2010-08-24 | Daicel Chemical Industries, Ltd. | Curable alicyclic diepoxy resin composition |
| US7786224B2 (en) * | 2001-03-23 | 2010-08-31 | Daicel Chemical Industries, Ltd | Liquid composition of alicyclic diepoxide, curing agent and/or curing accelerator |
| US20120208924A1 (en) * | 2009-07-14 | 2012-08-16 | Abb Research Ltd | Epoxy resin composition |
| CN107578922A (en) * | 2017-09-21 | 2018-01-12 | 南通新三能电子有限公司 | A kind of welding needle type aluminium electrolutic capacitor and its manufacture method |
| WO2023063000A1 (en) * | 2021-10-14 | 2023-04-20 | 三菱瓦斯化学株式会社 | Epoxy resin composition, cured product thereof, prepreg, fiber-reinforced composite material, and high-pressure gas container |
-
1992
- 1992-03-31 JP JP10392492A patent/JPH05279451A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7786224B2 (en) * | 2001-03-23 | 2010-08-31 | Daicel Chemical Industries, Ltd | Liquid composition of alicyclic diepoxide, curing agent and/or curing accelerator |
| US7781543B2 (en) | 2002-09-05 | 2010-08-24 | Daicel Chemical Industries, Ltd. | Curable alicyclic diepoxy resin composition |
| WO2004104683A1 (en) * | 2003-05-21 | 2004-12-02 | Nippon Kayaku Kabushiki Kaisha | Sealant for liquid crystal and liquid-crystal display cell made with the same |
| CN100460963C (en) * | 2003-05-21 | 2009-02-11 | 日本化药株式会社 | Sealant for liquid crystal and liquid-crystal display cell made with the same |
| US7678433B2 (en) | 2003-05-21 | 2010-03-16 | Nippon Kayaku Kabushiki Kaisha | Sealant for liquid crystal and liquid-crystal display cell made with the same |
| US20120208924A1 (en) * | 2009-07-14 | 2012-08-16 | Abb Research Ltd | Epoxy resin composition |
| CN107578922A (en) * | 2017-09-21 | 2018-01-12 | 南通新三能电子有限公司 | A kind of welding needle type aluminium electrolutic capacitor and its manufacture method |
| WO2023063000A1 (en) * | 2021-10-14 | 2023-04-20 | 三菱瓦斯化学株式会社 | Epoxy resin composition, cured product thereof, prepreg, fiber-reinforced composite material, and high-pressure gas container |
| JP7279868B1 (en) * | 2021-10-14 | 2023-05-23 | 三菱瓦斯化学株式会社 | Epoxy resin composition and its cured product, prepreg, fiber-reinforced composite material, high-pressure gas container |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH05279451A (en) | Epoxy resin composition and its cured product | |
| JPS60124617A (en) | Resin-sealed emitter | |
| JP2933244B2 (en) | Epoxy resin composition | |
| JPH06192396A (en) | One pack type epoxy resin composition | |
| JP3196245B2 (en) | One-part type thermosetting epoxy resin composition | |
| JP4273374B2 (en) | Epoxy resin composition for sealing electronic parts | |
| JPS63268724A (en) | Liquid epoxy resin composition | |
| JPH05311047A (en) | Liquid epoxy resin composition | |
| JPH065464A (en) | Epoxy resin composition for capacitor | |
| JP2724499B2 (en) | Epoxy resin composition | |
| JP2646391B2 (en) | Liquid epoxy resin composition | |
| JP2933243B2 (en) | Liquid epoxy resin composition | |
| JPS6159327B2 (en) | ||
| JPH1192549A (en) | Liquid epoxy resin composition | |
| JP2002145991A (en) | 2-phenylimidazole-phosphric acid salt as accelerator for acid anhydride curatives in one-component epoxy composition | |
| JPS6011525A (en) | Production of low-viscosity impregnating epoxy resin | |
| JPH039920A (en) | Low-viscosity epoxy resin composition | |
| JPS6251971B2 (en) | ||
| JPH07238145A (en) | Epoxy resin composition | |
| JPH0246627B2 (en) | INSATSUKAIROYOSETSUCHAKUZAI | |
| JPH07224153A (en) | Curing accelerator for epoxy resin | |
| JPH03174434A (en) | Epoxy resin composition for sealing semiconductor | |
| JPH07228670A (en) | Resin composition | |
| JPH03185022A (en) | Liquid epoxy resin composition | |
| JPH06298907A (en) | Epoxy resin composition for impregnation and its cured material |