JPH0380600A - Electronic component inspection device - Google Patents
Electronic component inspection deviceInfo
- Publication number
- JPH0380600A JPH0380600A JP1215963A JP21596389A JPH0380600A JP H0380600 A JPH0380600 A JP H0380600A JP 1215963 A JP1215963 A JP 1215963A JP 21596389 A JP21596389 A JP 21596389A JP H0380600 A JPH0380600 A JP H0380600A
- Authority
- JP
- Japan
- Prior art keywords
- light
- lead
- leads
- received
- aligned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000004907 flux Effects 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 230000002950 deficient Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 101100514842 Xenopus laevis mtus1 gene Proteins 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、フラットパッケージＩＣ等の電子部品のリー
ド列を構成する複数本のリードの揃いの様子を検査する
電子部品検査装置に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention is an electronic component inspection method that inspects the alignment of a plurality of leads that constitute a lead row of an electronic component such as a flat package IC. Regarding equipment.
（従来の技術）
電子部品例えば第７図に示すようなフラットパッケージ
ＩＣＩは、パッケージ２の側辺に多数本のり−ド３ａを
並設したリード列３を有している。このようなＩＣＩに
おいては、一部のリード３ａが他よりも浮上がっている
等の不揃いがあると、基板へのはんだ付は時に未接続や
導通不良等の一接続不良を生ずる虞があるため、基板へ
の実装前にリード３ａの揃いの様子を検査して良品、不
良品を選別することが行われている。(Prior Art) An electronic component, for example, a flat package ICI as shown in FIG. 7, has a lead row 3 on the side of the package 2 in which a large number of leads 3a are arranged in parallel. In such an ICI, if there is an irregularity such as some leads 3a being higher than others, there is a risk of one connection failure such as no connection or poor continuity when soldering to the board. Before mounting on a board, the alignment of the leads 3a is inspected to select good products and defective products.
かかる検査を行うための装置としては、第７図に示すよ
うに、光源４からＩＣＩに光を照射し、そのＩＣＩをＣ
ＣＤカメラ５により認識し、図示しない画像処理装置に
よりその投影像を基に良品。As shown in FIG. 7, an apparatus for performing such an inspection is such that the ICI is irradiated with light from a light source 4 and the ICI is
It is recognized by the CD camera 5 and determined to be non-defective based on the projected image by an image processing device (not shown).
不良品の判定を行うものがある。このものは、−部のリ
ード３ｂが他よりも浮上がっていると、第８図に示すよ
うに、投影像６（ハツチングして示す）に、リード３ｂ
の先端が他のリード３ａよりも凹んでしまうことによる
欠損部７が検出されるようになり、この欠損部７の有無
によって全てのリード３ａが揃っているかどうかすなわ
ちリードの曲がりがないかどうかを判定するものである
。There is something that determines whether a product is defective. In this case, if the negative part of the lead 3b is higher than the others, the projected image 6 (shown by hatching) will show the lead 3b as shown in FIG.
A defect 7 caused by the tip of the lead 3a being recessed more than the other leads 3a is now detected, and the presence or absence of this defect 7 can be used to determine whether all the leads 3a are aligned, that is, whether the leads are bent. It is something to judge.
（発明が解決しようとする課題）
しかしながら、上記従来の装置では、ＣＣＤカメラ５及
び画像処理装置を用いて上方からの矧影像６によって欠
損部７を検出するようにしてり゛るため、リード３ｂの
浮上がり量がある程度大きくないと欠落部７を検出でき
ず、検出精度がさほど良いものではなかった。また、Ｃ
ＣＤカメラ空の設備導入のため、設備費用としても高価
になってしまうという欠点もあった。(Problem to be Solved by the Invention) However, in the above-mentioned conventional device, the defect portion 7 is detected using a rectangular image 6 from above using a CCD camera 5 and an image processing device. The missing portion 7 could not be detected unless the floating amount was large to a certain extent, and the detection accuracy was not very good. Also, C
There was also the drawback that equipment costs were high because the CD camera was not installed.
本発明は上記事情に鑑みてなされたもので、その目的は
、リードの揃いの様子を精度良く検出でき、しかも安価
に製造することのできる電子部品検査装置を提供するに
ある。The present invention has been made in view of the above circumstances, and its object is to provide an electronic component inspection device that can accurately detect the alignment of leads and can be manufactured at low cost.
［発明の構成］
（課題を解決するための手段）
本発明の電子部品検査装置は、電子部品のリード列に向
けて平行光束を照射する投光部と、リード列を通過した
平行光束を受光する受光部と、この受光部の受光量とリ
ードが揃っている場合の基準受光量とを比較してリード
が揃っているかどうかを判定する判定手段とを具備した
ところに特徴を有する。[Structure of the Invention] (Means for Solving the Problems) The electronic component inspection device of the present invention includes a light projecting section that irradiates a parallel light beam toward a lead array of an electronic component, and a light receiving section that receives the parallel light beam that has passed through the lead array. The present invention is characterized in that it is equipped with a light receiving section, and a determining means for comparing the amount of light received by the light receiving section with a reference amount of light received when the leads are aligned, and determining whether or not the leads are aligned.
（作用）
上記手段によれば、投光部からの平行光束はその一部が
リードに遮断され、そのリードに相当する陰影を有した
状態で受光部に受光される。このとき、リードが揃って
いる場合には、全てのリードの陰影がラップして遮光量
が少なくなるから受光部の受光量が大きくなり、リード
が不揃いの場合には、陰影が大きくなるからその分量光
量が小さくなる。従って、判定手段により受光部の受光
量とリードが揃っている場合の基準受光量とを比較すれ
ば、リードが揃っているかどうかを判定することができ
る。(Function) According to the above means, part of the parallel light beam from the light projecting section is blocked by the lead, and the light is received by the light receiving section with a shadow corresponding to the lead. At this time, if the leads are aligned, the shadows of all the leads overlap and the amount of light shielded is reduced, so the amount of light received by the light receiving section is increased.If the leads are not aligned, the shadows are large and the amount of light received by the light receiving section is increased. The amount of light becomes smaller. Therefore, by comparing the amount of light received by the light receiving section with the reference amount of light received when the leads are aligned, the determining means can determine whether the leads are aligned.
この場合、受光量の検出により判定を行うものであるか
ら、リードに微少な浮上がりがあっても受光部の受光量
は基準受光量とは異なってくるがら、検出精度を比較的
高くすることができ、また、カメラ等の高価な部品を必
要としないので、装置コストが安価になる。In this case, the determination is made by detecting the amount of received light, so even if there is a slight lift in the lead, the amount of light received by the light receiving section will differ from the standard amount of received light, but the detection accuracy can be made relatively high. Furthermore, since expensive parts such as a camera are not required, the cost of the device is reduced.
（実施例）
以下本発明をＩＣ実装装置に組込まれた検査装置に適用
した第１実施例について、第１図乃至第４図を参照して
説明する。(Embodiment) A first embodiment in which the present invention is applied to an inspection device incorporated in an IC mounting apparatus will be described below with reference to FIGS. 1 to 4.
まず、電子部品たるＩＣ１１は、第１図及び第２図に示
すように、四角形のパッケージ１２の各側辺にリード列
１３乃至１６を有しており、各リード列１３乃至１６は
、夫々多数本のリード１３ａ乃至１６ａが並設されて構
成されている。First, the IC 11, which is an electronic component, has lead rows 13 to 16 on each side of a rectangular package 12, as shown in FIGS. Book leads 13a to 16a are arranged in parallel.
図示はしないが、ＩＣ実装装置は、ｔｃｌｌが供給され
る部品供給部、基板が搬入されＩＣＩＩの実装作業が行
われる作業台、吸着ノズル１７（第１図参照）により前
記部品供給部の１０１１を吸着しそれを前記作業台まで
移送して基板に実装する実装ヘッド等から構成されてい
る。そして図示しないマイクロコンピュータからなる制
御装置により、所定のプログラムに従ってＩＣＩＩの実
装作業が自動的に行なわれるようになっているこのとき
、基板への実装前に、本実施例に係る検査装置１８によ
りＩＣ１１のリードの揃いの様子を検査して良品、不良
品を選別し、リード１３ａ乃至１６ａが不揃いのＩＣＩ
Ｉは排除されて良品のＩＣＩＩのみが基板に実装される
ようになっている。Although not shown, the IC mounting apparatus includes a component supply section to which tclll is supplied, a work table on which the board is carried and ICII mounting work is performed, and a suction nozzle 17 (see FIG. 1) to pick up the component supply section 1011. It consists of a mounting head and the like that picks up the material, transfers it to the workbench, and mounts it on the board. Then, a control device including a microcomputer (not shown) automatically performs the ICII mounting work according to a predetermined program. The ICIs with leads 13a to 16a that are not aligned are inspected to select good products and defective products.
I is excluded so that only good ICII is mounted on the board.
ここで、本実施例に係る検査装置１８について述べる。Here, the inspection device 18 according to this embodiment will be described.
このリード検査装置１８は、第１図及び第２図に示すよ
うに、基台１９上に、投光部２゜とこれに対向する受光
部２１とを備えて構成されている。投光部２０は、図示
はしないが半導体レーザ装置及び光学系を備えて構成さ
れ、受光部２１へ向けてレーザビームよりなる平行光束
２２を出力するようになっている。一方、受光部２１は
、前記平行光束２２が照射される部位に縦長なスリット
２３（第３図参照）を有すると共に、このスリット２３
を透過した光を受ける光センサ（図示せず）を備え、そ
の受光量に応じた大きさの電気信号を判定手段に出力す
るようになっている。判定手段は、前記制御装置に含ま
れて構成されており、後述するように、予めリード１３
ａ乃至１６ａが揃っている場合の基準受光量が入力され
るようになっていて、この基準受光量に基づいてリド１
３ａ乃至１６ａが揃っているかどうかを判するようにな
っている。尚、制御装置は、前記先部２０の作動制御も
行うようになっている。As shown in FIGS. 1 and 2, this lead inspection device 18 is constructed of a base 19, and includes a light projecting section 2.degree. and a light receiving section 21 facing thereto. Although not shown, the light projecting section 20 includes a semiconductor laser device and an optical system, and outputs a parallel light beam 22 consisting of a laser beam toward the light receiving section 21 . On the other hand, the light receiving section 21 has a vertically elongated slit 23 (see FIG. 3) in a region where the parallel light beam 22 is irradiated, and this slit 23
The device is equipped with an optical sensor (not shown) that receives the transmitted light, and outputs an electrical signal having a magnitude corresponding to the amount of received light to the determining means. The determination means is configured to be included in the control device, and as described later, the lead 13 is
The standard amount of received light when all the items a to 16a are aligned is input, and the lid 1 is adjusted based on this standard amount of received light.
It is determined whether 3a to 16a are aligned. Note that the control device also controls the operation of the tip portion 20.
次に、上記構成の作用について述べる。Next, the operation of the above configuration will be described.
吸着ノズル１７に吸着されたＩＣ１１は、節回乃至第３
図に示すように、検査装置１８の段部２０と受光部２１
との中間部位に、まず、リド列１３が平行光束２２の光
路にあってリード３ａの並び方向に平行光束２２が照射
される位に移送される。そして、投光部２０から平行光
２２が照射されリード列１３を通過して受光部１に受光
される。判定手段は、この受光部２１受光した受光量と
予め設定されているリード１ａが揃っている場合の基準
受光量とを比較してのようにリード１３ａの揃いを判定
する。The IC 11 adsorbed by the suction nozzle 17 is
As shown in the figure, the stepped portion 20 and the light receiving portion 21 of the inspection device 18
First, the lead array 13 is moved to a position intermediate between the leads 3a and the leads 3a so that the lead array 13 is in the optical path of the parallel light beam 22 and is irradiated with the parallel light beam 22 in the direction in which the leads 3a are arranged. Then, parallel light 22 is emitted from the light projecting section 20, passes through the lead array 13, and is received by the light receiving section 1. The determining means determines whether the leads 13a are aligned by comparing the amount of light received by the light receiving section 21 with a preset reference amount of light received when the leads 1a are aligned.
即ち、このとき、受光部２１では、平行光束２がリード
列１３に遮断された分に相当する陰ができた状態で受光
されるようになるが、リ−１３ａが揃っている場合には
、第４図（ａ）にすように、陰影２４（ハツチングして
示す）は全てのリード１３ａがラップした状態となる。That is, at this time, the light receiving unit 21 receives the parallel light beam 2 with a shadow corresponding to the amount blocked by the lead array 13, but when the leads 13a are aligned, As shown in FIG. 4(a), the shade 24 (indicated by hatching) is a state in which all the leads 13a are wrapped.
このときの受光部２１の受光量が予め判定手段に基準受
光量として入力されており、従って、受光部２１の受光
量がこの基準受光量に一致すれば、現在検査されている
リード列１３のリード１３ａが揃っていると判定され、
引続き、吸着ノズル１７が９０度ずつ回転されてリード
列１４，１５．１６の揃いが順次判定されるようになる
。The amount of light received by the light receiving section 21 at this time is input in advance to the determination means as the reference amount of received light. Therefore, if the amount of light received by the light receiving section 21 matches this reference amount of received light, the amount of light received by the lead array 13 currently being inspected is It is determined that the leads 13a are aligned,
Subsequently, the suction nozzle 17 is rotated by 90 degrees, and the alignment of the lead rows 14, 15, and 16 is sequentially determined.
一方、第３図に示すように、例えばリード列１３のなか
に浮上がっているリード１３ｂがあると、第４図（ｂ）
に示すように、受光部２１に陰影２４の他に浮上がって
いるリード１３ｂに対応する陰影２５（同じくハツチン
グして示す）が生ずるようになる。従って、この場合に
は陰影２５の分だけ基準受光量よりも受光量が少なくな
るから、判定手段はリード１３ａが不揃いであると判定
する。制御装置は、この判定手段が不揃いと判定したＩ
ＣＩＩを不良品として排除し、この後新たなＩＣＩＩに
ついての検査装置１８による検査が行われる。On the other hand, as shown in FIG. 3, if there is a lead 13b floating in the lead row 13, for example, as shown in FIG.
As shown in FIG. 2, in addition to the shadow 24, a shadow 25 (also shown hatched) corresponding to the raised lead 13b appears on the light receiving portion 21. Therefore, in this case, since the amount of received light is less than the reference amount of received light by the shadow 25, the determining means determines that the leads 13a are not aligned. The control device determines that the I
The CII is rejected as a defective product, and then a new ICII is inspected by the inspection device 18.
以上のようにして検査装置１８にてリード１＝ａの揃い
が判定され、リード１３ａが揃った良ＳのＩＣ１１のみ
が基板に実装される。As described above, the inspection device 18 determines whether the leads 1=a are aligned, and only ICs 11 of good S quality with the leads 13a aligned are mounted on the board.
このように、本実施例では、アナログ出力で凌る受光量
の検出により微小な浮上りをも判定すＺことができるか
ら、リード３ｂの浮上がり量がよる程度大きくないと欠
落部７を検出できなかった従来のものに比べて、検出精
度を向上させることができる。しかも、平行光束２２を
照射する投黄部２０とそれを受光する光センサを有する
受光ｍ２１とからり一ド１３ａが揃っているかどうかを
検査することができるから、ＣＣＤカメラ５を用いてい
た従来のものと異なり、極めて安価に製迅することがで
きる。In this way, in this embodiment, even minute lifting can be determined by detecting the amount of received light, which is superior to analog output. Detection accuracy can be improved compared to conventional methods. In addition, it is possible to inspect whether the yellow projecting unit 20 that emits the parallel light beam 22, the light receiving unit m21 having a light sensor that receives the yellow light, and the trigger door 13a are aligned. Unlike the above, it can be manufactured very quickly and at low cost.
第５図は本発明の第２実施例を示すもので、上記第１実
施例と穴なるところは、反射鏡２６乃至２８を設けた点
にある。これら反射鏡２６乃至２８は、投光部２９から
の平行光束３ｏが９０度ずつ折曲がって受光部３１に達
するように配設されており、その他の構成は上記第１実
施例と同様となっている。これにより、Ｉｃ１１を図示
のように配置することにより、−度に４辺全てのリード
１３ａ乃至１６ａの揃いを判定でき、短時間で検査を行
うことができるものである。FIG. 5 shows a second embodiment of the present invention, which differs from the first embodiment in that reflecting mirrors 26 to 28 are provided. These reflecting mirrors 26 to 28 are arranged so that the parallel light beam 3o from the light projecting section 29 is bent by 90 degrees and reaches the light receiving section 31, and the other configurations are the same as in the first embodiment. ing. By arranging the ICs 11 as shown in the figure, it is possible to determine the alignment of the leads 13a to 16a on all four sides at the same time, and the inspection can be performed in a short time.
また、第６図は本発明の第３実施例を示すもので、上記
第１実施例と異なるところは、投光部（図示せず）と受
光部３２との間に棒状の遮光体３３を設けた点にある。FIG. 6 shows a third embodiment of the present invention, which differs from the first embodiment in that a rod-shaped light shielding body 33 is provided between a light projecting section (not shown) and a light receiving section 32. It is at the point that I have set.
この遮光体３３は、ＩＣ１１のリード１３ａと路間等の
厚さ寸法を有し、ＩＣＩＩはリード列１３がこの遮光体
３３の陰に位置するように配置され、リード１３ａが揃
っている場合にはそれらの陰影が遮光体３３の陰影にラ
ップするようになっている。その他の構成は上記第１実
施例と同様であり、これにより、第１実施例と同様の作
用、効果が得られる他、基準受光量の設定が実際のＩｃ
１１を用いずとも遮光体３３に基づいて行うことができ
る利点がある。This light shielding body 33 has a thickness dimension such as between the leads 13a of the IC 11 and the path, and the ICII is arranged so that the lead row 13 is located in the shadow of this light shielding body 33, and when the leads 13a are aligned. These shadows overlap the shadows of the light shielding body 33. The rest of the configuration is the same as that of the first embodiment, and as a result, the same functions and effects as those of the first embodiment can be obtained, and the setting of the reference amount of received light can be adjusted to the actual Ic.
There is an advantage that it can be performed based on the light shielding body 33 without using the light shielding body 11.
尚、上記実施例では本発明をＩＣ実装装置に組込んだも
のについて説明したが、それに限らず工Ｃの生産工程で
の検査用に適用しても良い。その他、本発明は上記各実
施例に限定されるものではなく、例えば投光部及び受光
部を複数組設けて同時に４辺あるいは２辺のリード列に
対してリードの揃いを検査させるようにしても良い等、
要旨を逸脱しない範囲内で適宜変更して実施し得るもの
である。In the above embodiment, the present invention has been described as being incorporated into an IC mounting apparatus, but the present invention is not limited thereto, and may be applied to inspections in the production process of the machine C. In addition, the present invention is not limited to the above-mentioned embodiments; for example, a plurality of sets of light emitting parts and light receiving parts may be provided to simultaneously inspect lead alignment on four sides or two sides. Good, etc.
The invention may be modified and implemented as appropriate without departing from the gist of the invention.
［発明の効果］
以上の説明にて明らかなように、本発明の電子部品検査
装置によれば、カメラ認識によるＩＣのリード曲がり検
出ではなく、光線の照射によりＩＣのリード曲がりを検
出するようにしたので、リードの不揃いすなわちリード
曲がりを精度良く検出でき、しかも安価に製造すること
ができるという優れた効果を奏する。[Effects of the Invention] As is clear from the above description, according to the electronic component inspection apparatus of the present invention, bending of IC leads is detected not by camera recognition but by irradiation with a light beam. Therefore, it is possible to detect lead misalignment, that is, lead bending, with high accuracy, and to manufacture the device at a low cost, which is an excellent effect.
第１図乃至第４図は本発明の第１実施例を示すもので、
第１図はリード検査装置の概略的な正面図、第２図は同
上面図、第３図は第２図の■−■線に沿う縦断側面図、
第４図は受光部の受光状態を示す図であり、第５図は本
発明の第２実施例を示す第２図相当図、第６図は本発明
の第３実施例を示す第３図相当図である。また、第７図
は従来例を示す第１図相当図、第８図は従来例を示すＣ
ＣＤカメラが取込んだＩＣの投影像を示す図である。
図面中、１１はＩＣ（電子部品）、１３乃至１６はリー
ド列、１３ａ乃至１６ａはリード、１８は検査装置、２
０．２９は投光部、２１，３１゜３２は受光部、２２．
３０は平行光束、２６乃至２８は反射鏡、３３は遮光体
を示す。1 to 4 show a first embodiment of the present invention,
Fig. 1 is a schematic front view of the lead inspection device, Fig. 2 is a top view of the same, Fig. 3 is a vertical side view taken along the line ■-■ in Fig. 2,
FIG. 4 is a diagram showing the light receiving state of the light receiving section, FIG. 5 is a diagram corresponding to FIG. 2 showing the second embodiment of the present invention, and FIG. 6 is a diagram showing the third embodiment of the present invention. This is a corresponding diagram. In addition, Fig. 7 is a diagram equivalent to Fig. 1 showing a conventional example, and Fig. 8 is a diagram equivalent to Fig. 1 showing a conventional example.
FIG. 3 is a diagram showing a projected image of an IC captured by a CD camera. In the drawing, 11 is an IC (electronic component), 13 to 16 are lead rows, 13a to 16a are leads, 18 is an inspection device, and 2
0.29 is a light emitting part, 21,31°32 is a light receiving part, 22.
30 is a parallel light beam, 26 to 28 are reflecting mirrors, and 33 is a light shielding body.
Claims (1)
部品を検査する電子部品検査装置において、前記電子部
品のリード列に向けて平行光束を照射する投光部と、前
記リード列を通過した前記平行光束を受光する受光部と
、この受光部の受光量とリードが揃っている場合の基準
受光量とを比較して前記リードが揃っているかどうかを
判定する判定手段とを具備したことを特徴とする電子部
品検査装置。1. In an electronic component inspection apparatus for inspecting an electronic component including a lead array in which a plurality of leads are arranged in parallel, a light projecting section that irradiates a parallel light beam toward the lead array of the electronic component; It is characterized by comprising a light receiving section that receives a parallel light beam, and a determining means that compares the amount of light received by the light receiving section with a reference amount of received light when the leads are aligned, and determines whether the leads are aligned. Electronic component inspection equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1215963A JPH0380600A (en) | 1989-08-24 | 1989-08-24 | Electronic component inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1215963A JPH0380600A (en) | 1989-08-24 | 1989-08-24 | Electronic component inspection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0380600A true JPH0380600A (en) | 1991-04-05 |
Family
ID=16681143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1215963A Pending JPH0380600A (en) | 1989-08-24 | 1989-08-24 | Electronic component inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0380600A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104596A (en) * | 1992-08-07 | 1994-04-15 | Yamaha Motor Co Ltd | Method and system for loading component |
| JPH06152195A (en) * | 1992-11-05 | 1994-05-31 | Yamaha Motor Co Ltd | Detecting equipment for component suction state of mounting machine |
| US7113398B2 (en) | 2001-12-27 | 2006-09-26 | Fujitsu Limited | Removable storage device unit |
-
1989
- 1989-08-24 JP JP1215963A patent/JPH0380600A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104596A (en) * | 1992-08-07 | 1994-04-15 | Yamaha Motor Co Ltd | Method and system for loading component |
| JPH06152195A (en) * | 1992-11-05 | 1994-05-31 | Yamaha Motor Co Ltd | Detecting equipment for component suction state of mounting machine |
| US7113398B2 (en) | 2001-12-27 | 2006-09-26 | Fujitsu Limited | Removable storage device unit |
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