JPH0378906A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPH0378906A JPH0378906A JP1216657A JP21665789A JPH0378906A JP H0378906 A JPH0378906 A JP H0378906A JP 1216657 A JP1216657 A JP 1216657A JP 21665789 A JP21665789 A JP 21665789A JP H0378906 A JPH0378906 A JP H0378906A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- metal
- alloy
- conductive paste
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 30
- 239000000956 alloy Substances 0.000 claims abstract description 30
- 229910017518 Cu Zn Inorganic materials 0.000 claims abstract description 9
- 229910017752 Cu-Zn Inorganic materials 0.000 claims abstract description 9
- 229910017943 Cu—Zn Inorganic materials 0.000 claims abstract description 9
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 claims abstract description 6
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 5
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 5
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 3
- 229910052709 silver Inorganic materials 0.000 claims abstract description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 abstract description 14
- 238000007254 oxidation reaction Methods 0.000 abstract description 14
- 229910000510 noble metal Inorganic materials 0.000 abstract description 12
- 239000004020 conductor Substances 0.000 abstract description 11
- 229910002482 Cu–Ni Inorganic materials 0.000 abstract description 9
- 229910052737 gold Inorganic materials 0.000 abstract description 4
- 230000005012 migration Effects 0.000 abstract description 2
- 238000013508 migration Methods 0.000 abstract description 2
- 238000005246 galvanizing Methods 0.000 abstract 2
- 238000007747 plating Methods 0.000 description 19
- 239000012298 atmosphere Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000010953 base metal Substances 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- 238000009692 water atomization Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009689 gas atomisation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VZUGBLTVBZJZOE-KRWDZBQOSA-N n-[3-[(4s)-2-amino-1,4-dimethyl-6-oxo-5h-pyrimidin-4-yl]phenyl]-5-chloropyrimidine-2-carboxamide Chemical compound N1=C(N)N(C)C(=O)C[C@@]1(C)C1=CC=CC(NC(=O)C=2N=CC(Cl)=CN=2)=C1 VZUGBLTVBZJZOE-KRWDZBQOSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、チップコンデンサー、チップ抵抗等の導体電
極の形成あるいはハイブリッドＩＣ基板における配線パ
ターンの形成に好適に用いられる導電性ペーストに間す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a conductive paste that is suitably used for forming conductor electrodes of chip capacitors, chip resistors, etc., or for forming wiring patterns on hybrid IC boards.
［従来の技術及び解決すべき課題］
近年、セラミック積層チップコンデンサーやセラミック
チップ抵抗の導体電極用あるいはハイブリッドＩＣ基板
における配線パターンの形成用導電性ペーストにはＡｇ
、 Ａｇ−Ｐｄ、 Ｐ ｔ、 Ａｕ等の貴金属粉末が導
電フィラーとして用いられている。しかし、これらの貴
金属粉末は高価であるため、ＣｕやＮｉ等の卑金属粉末
を用いた導電性ペーストの開発が行われているが、これ
ら卑金属粉末を用いた導電性ペーストは、大気中６００
〜１０００℃の高温で焼成すると金属粉末が酸化して所
望の導電性を得ることができない。そのため、焼成雰囲
気を窒素ガスにすることが試みられているが、焼成雰囲
気を窒素ガスのみにすると焼成導体にバーンアウトしき
れなかった炭素分が残存して導体抵抗や半田付性に悪影
響を残すこととなり、この問題を回避するためには１０
ｐｐｍ程度の酸素を含有するように焼成雰囲気を厳密に
調整することが不可欠で、そのためには高度の技術力を
必要としコストアップとなる欠点があった。[Prior art and problems to be solved] In recent years, Ag has been used as a conductive paste for conductive electrodes of ceramic multilayer chip capacitors and ceramic chip resistors, or for forming wiring patterns on hybrid IC boards.
, Ag-Pd, Pt, Au, and other noble metal powders are used as conductive fillers. However, since these noble metal powders are expensive, conductive pastes using base metal powders such as Cu and Ni are being developed.
If fired at a high temperature of ~1000°C, the metal powder will oxidize and the desired conductivity cannot be obtained. Therefore, attempts have been made to use nitrogen gas as the firing atmosphere, but if the firing atmosphere is nitrogen gas only, unburned carbon remains in the fired conductor, adversely affecting conductor resistance and solderability. Therefore, in order to avoid this problem, 10
It is essential to strictly adjust the firing atmosphere to contain oxygen on the order of ppm, which requires a high level of technical skill and has the drawback of increasing costs.
また、卑金属を合金化した合金粉末を用いた導電性ペー
ストも知られているが、合金化しても酸化の問題は完全
には解決されていなかった。Furthermore, conductive pastes using alloy powders made by alloying base metals are also known, but even with alloying, the problem of oxidation has not been completely solved.
本発明は、上記課題を解決するため、合金化した金属粉
末の表面に貴金属のメツキを施すことにより金属粉末の
耐酸化性を向上させ、酸素濃度が１１０００ｐｐ程度の
雰囲気中における焼成によっても十分な導電性とハンダ
付性を確保できる導電性ペーストを提供するものである
。In order to solve the above-mentioned problems, the present invention improves the oxidation resistance of the metal powder by plating the surface of the alloyed metal powder with a noble metal, and the oxidation resistance of the metal powder is improved even by firing in an atmosphere with an oxygen concentration of about 11,000 pp. The present invention provides a conductive paste that can ensure conductivity and solderability.
［課題解決のための手段］
本発明者らは、純金属例えば銅の粉末上に貴金属をメツ
キしたものは、銅粉の酸化が優先的に生じ、貴金属の酸
化の効果が小さいが、合金粉末としたものは、母材金属
の導電性は純金属に比べて劣るが耐酸化性が向上し貴金
属メツキによりさらに表面での耐酸化性が向上すること
に着目し本発明に到ったものである。[Means for Solving the Problems] The present inventors have discovered that when a pure metal such as copper powder is plated with a noble metal, the oxidation of the copper powder occurs preferentially and the effect of oxidation of the noble metal is small; The present invention was developed by focusing on the fact that although the conductivity of the base metal is inferior to that of pure metal, it has improved oxidation resistance, and that plating with precious metals further improves the oxidation resistance on the surface. be.
すなわち、本発明は、金属粉末、ガラスフリット、有機
質ビヒクルを主成分とする導電性ペーストにおいて、前
記金属粉末としてＣｕ−Ｎｉ合金粉末またはＣｕ−Ｚｎ
合金粉末の表面にＡｕ、Ｐｔ、Ｐｄ、Ｒｕ、Ａｇの群か
ら選はれたいずれか１種の金属をコーティングしてなる
金属粉末を使用したことを特徴とするものである。That is, the present invention provides a conductive paste containing metal powder, glass frit, and an organic vehicle as main components, in which Cu-Ni alloy powder or Cu-Zn alloy powder is used as the metal powder.
The present invention is characterized in that a metal powder is used in which the surface of the alloy powder is coated with any one metal selected from the group of Au, Pt, Pd, Ru, and Ag.
本発明において、合金化した金属としてＣｕ−Ｎｉ、Ｃ
ｕ−Ｚｎを用いる理由は、合金そのものがＣｕに比較し
て耐酸化性であり、かつ導電性も許容範囲のものであり
、耐マイグレーション性、メツキ性に優れているからで
ある。In the present invention, the alloyed metals include Cu-Ni, C
The reason why u-Zn is used is that the alloy itself has higher oxidation resistance than Cu, has acceptable conductivity, and has excellent migration resistance and plating performance.
本発明のＣｕ−Ｎｉ合金におけるＮｉの含有量は５〜５
０重量％の範囲であり、Ｎｉの含有量が多くなるにした
がって耐酸化性は向上するが導電性が低下するため、好
ましくはＮｉ１Ｏ〜２０重量％のものがよい。The Ni content in the Cu-Ni alloy of the present invention is 5 to 5
The Ni content is in the range of 0% by weight, and as the Ni content increases, the oxidation resistance improves but the conductivity decreases, so it is preferably Ni1O to 20% by weight.
また、Ｃｕ−Ｚｎ合金におけるＺｎの含有量は５〜６０
重量％の範囲であり、Ｚｎの含有量が多くなるにしたが
フて耐酸化性は向上するが導電性が低下するため、好ま
しくはＺｎ２０〜４０重量％のものがよい。In addition, the Zn content in the Cu-Zn alloy is 5 to 60
As the Zn content increases, the oxidation resistance improves but the conductivity decreases, so it is preferably 20 to 40% by weight.
さらに、本発明におけるＣｕ−Ｎｉ合金、Ｃｕ−Ｚｎ合
金には、必要に応じてその他の元素を少量、例えば、Ａ
１、Ｂ、Ｂｅ、Ｓｎを０．１〜５重量％の範囲で添加し
ても差し支えない。Furthermore, the Cu-Ni alloy and Cu-Zn alloy in the present invention may contain small amounts of other elements, such as A.
1, B, Be, and Sn may be added in an amount of 0.1 to 5% by weight.
本発明の合金粉末は、特にその製法を限定するものでは
ないが、たとえば、Ｃｕ−ＮｉあるいはＣｕ−Ｚｎの溶
湯を水アトマイズあるいはガスアトマイズすることによ
り微粉化し、ついで、得られた粉末を水素還元により表
面酸化のない粉体とし、さらに分級して０．１〜５μｍ
程度の粉末とすることによって得ることができる。The manufacturing method of the alloy powder of the present invention is not particularly limited, but for example, a molten Cu-Ni or Cu-Zn is pulverized by water atomization or gas atomization, and then the obtained powder is subjected to hydrogen reduction. Powder with no surface oxidation, further classified to 0.1-5μm
It can be obtained by making it into a powder.
合金粉末表面への貴金属のコーティングは、無電解メツ
キが好ましく、メツキしようとする貴金属を含有するメ
ツキ液に合金粉末を入れ、加熱攪はんすることにより容
易に実施できる。Coating of the noble metal onto the surface of the alloy powder is preferably carried out by electroless plating, which can be easily carried out by adding the alloy powder to a plating solution containing the noble metal to be plated and heating and stirring.
貴金属のメッキ厚は、０．Ｏ１〜１μｍ程度が好ましい
。なお、実際には、金属粉末上のメッキ厚は、被破壊で
は測定できず測定には手間がかかるので、便宜上、被メ
ツキ粉末（合金粉末）に対するメツキ金属の重量比で管
理することができ 本発明の金属粉末における合金粉末
に対する貴金属メツキの重量比は、０．１〜５０重量％
程度が好ましい。The plating thickness of precious metal is 0. The thickness is preferably about 1 to 1 μm. Note that in reality, the plating thickness on metal powder cannot be measured by destruction and it takes time to measure, so for convenience, it can be managed by the weight ratio of the plating metal to the powder to be plated (alloy powder). The weight ratio of the noble metal plating to the alloy powder in the metal powder of the invention is 0.1 to 50% by weight.
degree is preferred.
上記の重量比が０．１重量％以下になると、ミクロンレ
ベルの粉末の場合、メッキ厚が０．０００３μｍと小さ
くなり、高温に加熱すると容易に貴金属が合金中に拡散
していき、耐酸化性の効果が得られなくなる。また、重
量比が５０重量％を越えるとコストアップとなる。When the above weight ratio becomes 0.1% by weight or less, the plating thickness becomes as small as 0.0003μm in the case of micron-level powder, and when heated to high temperatures, the precious metal easily diffuses into the alloy, resulting in poor oxidation resistance. effect will no longer be obtained. Moreover, if the weight ratio exceeds 50% by weight, the cost will increase.
上記のようにして得られた貴金属メツキ合金粉末は、Ｐ
ｂｏ−Ｂ２０３−９ ｉ０２等のガラスフリット、エチ
ルセルローズ、ターピネオール、ブチルカルピトール等
からなる有機質ビヒクルとともに三本ロールで混練され
て導電性ペーストとなる。The noble metal plated alloy powder obtained as described above is P
A conductive paste is obtained by kneading in a triple roll with a glass frit such as bo-B203-9 i02 and an organic vehicle consisting of ethyl cellulose, terpineol, butyl calpitol, etc.
本発明の導電性ペーストは、誘電体と重ねて焼成すれば
チップコンデンサー用の電極に、また抵抗体と接続して
焼成すればチップ抵抗用の電極に、そして、セラミック
板上に印刷して焼成すればハイブリッドＩＣ回路板の配
線材として使用できる。The conductive paste of the present invention can be used as an electrode for a chip capacitor if it is layered with a dielectric and fired, or as an electrode for a chip resistor if it is connected to a resistor and fired, and then printed on a ceramic plate and fired. Then, it can be used as a wiring material for hybrid IC circuit boards.
なお、本発明の導電性ペーストは、酸素濃度が１００
ｐｐｍ以上の雰囲気中５００〜１０００℃での焼成が可
能で、雰囲気中の酸素濃度は１１０００ｐｐ程度まで許
容される。Note that the conductive paste of the present invention has an oxygen concentration of 100
Firing is possible at 500 to 1000° C. in an atmosphere of ppm or more, and oxygen concentration in the atmosphere is allowed up to about 11000 ppm.
［実施例コ
実施例１〜１Ｏ
Ｎｉ２０重量％のＣｕ−Ｎｉ合金（Ｃｕ−２０％Ｎｉと
表す）及びＺｎ４０重量％のＣｕ−Ｚｎ合金（Ｃｕ−４
０％Ｚｎと表す）をそれぞれ約１４００℃の溶湯とし、
水アトマイズにより合金粉を得た。[Example Examples 1 to 1O Cu-Ni alloy containing 20 wt% Ni (expressed as Cu-20%Ni) and Cu-Zn alloy containing 40 wt% Zn (Cu-4
0% Zn) as a molten metal at approximately 1400°C,
Alloy powder was obtained by water atomization.
得られた合金粉を５００℃で水素気流中で還元した後、
分級して平均粒径２．５μｍのＣｕ−Ｎｉ合金粉末およ
びＣｕ−Ｚｎ合金粉末を得た。After reducing the obtained alloy powder at 500°C in a hydrogen stream,
It was classified to obtain Cu-Ni alloy powder and Cu-Zn alloy powder with an average particle size of 2.5 μm.
得られた合金粉末を高純度化学研究新製のＡｕ、Ｐｔ、
Ｐｄ、Ｒｕ、Ａｇのそれぞれのメツキ液（商品名： Ｋ
−２４Ｎ、Ｐｔ−１０，Ｐｄ−１０、Ｒｕ−１０、Ｓ−
７００）（５０〜７０℃に調整）に攪はんしながら浸漬
して、合金粉末表面にそれぞれの金属をメツキした。メ
ツキ金属の合金粉末に対する割合は、約３０重量％とな
るようコントロールした。The obtained alloy powder was made of high-purity chemical research products such as Au, Pt,
Pd, Ru, Ag plating liquid (product name: K
-24N, Pt-10, Pd-10, Ru-10, S-
700) (adjusted to 50 to 70°C) while stirring to plate each metal on the surface of the alloy powder. The ratio of plating metal to alloy powder was controlled to be about 30% by weight.
得られた金属粉末１００重量部に対して、ガラスフリッ
ト（日本電気硝子■製、商品名： ＧＡ−４）１０重量
部、エチルセルローズ４重量部、ターピネオール２０重
量部の割合で配合して三本ロールで混練して１０種類の
導電性ペーストを得た。To 100 parts by weight of the obtained metal powder, 10 parts by weight of glass frit (manufactured by Nippon Electric Glass ■, trade name: GA-4), 4 parts by weight of ethyl cellulose, and 20 parts by weight of terpineol were mixed and three pieces were prepared. Ten types of conductive pastes were obtained by kneading with a roll.
得られた導電性ペーストのそれぞれをセラミック板上に
印刷した後、５００ ｐｐｍの酸素を含有する窒素雰囲
気中で７００℃で２０分間焼成して導体回路を形成した
。それぞれの導体の電気抵抗を測定し体積抵抗率を算出
した結果を第１表にまとめた。Each of the obtained conductive pastes was printed on a ceramic plate and then baked at 700° C. for 20 minutes in a nitrogen atmosphere containing 500 ppm of oxygen to form a conductor circuit. The electrical resistance of each conductor was measured and the volume resistivity was calculated, and the results are summarized in Table 1.
また、得られた上記導電性ペーストをそれぞれセラミッ
ク板上に５０Ｘ５０ｍｍのサイズに印刷・焼成したのち
、導体表面をフラックス処理して２６０℃のハンダ浴に
浸漬してハンダ付性を評価した。結果を第１表に併記し
た。Further, each of the above-obtained conductive pastes was printed and fired on a ceramic plate in a size of 50 x 50 mm, and then the conductor surface was treated with flux and immersed in a 260° C. solder bath to evaluate solderability. The results are also listed in Table 1.
比較例１〜３
比較例１．２として、上記実施例において製造したＣｕ
−２０％Ｎｉ合金粉末およびＣｕ−４０％Ｚｎ合金粉末
をメツキ処理せずにそのまま金属粉末として用いて実施
例と同様にしてペーストとした。Comparative Examples 1 to 3 As Comparative Example 1.2, the Cu produced in the above example
-20%Ni alloy powder and Cu-40%Zn alloy powder were used as metal powders as they were without being plated, and pastes were prepared in the same manner as in the examples.
また、比較例３として、上記実施例と同様の製法で得た
平均粒径２．５μｍのＣｕ粉末の表面に、Ａｕメツキを
３０重量％の割合で施した金属粉末を用いて上記実施例
と同様にペーストとした。In addition, as Comparative Example 3, a metal powder in which 30% by weight of Au plating was applied to the surface of Cu powder with an average particle size of 2.5 μm obtained by the same manufacturing method as in the above example was used. It was made into a paste in the same way.
これらペーストを上記実施例と同様にしてセラミック板
上に印刷し焼成した後、導体の電気抵抗を測定して体積
抵抗率を算出した。また、ハンダ付性についても上記実
施例と同様にして評価した。These pastes were printed on a ceramic plate and fired in the same manner as in the above example, and then the electrical resistance of the conductor was measured to calculate the volume resistivity. Further, solderability was also evaluated in the same manner as in the above examples.
それらの結果を第１表に併記した。The results are also listed in Table 1.
実施例１１〜１４
実施例１〜５で得たと同じ平均粒径２．５μｍのＣｕ−
２０％Ｎｉ合金粉末の表面にＡｇメツキ（メツキ液：
Ｓ−７００）を施して金属粉末を得た。Examples 11-14 Cu-
Ag plating (plating liquid:
S-700) to obtain metal powder.
この際、メツキ時間を変えることによりＡｇメツキ付着
量を母材合金粉末に対して５％、１０％、２０％、４０
％となるよう調整した。なお、この場合のメツキ厚さは
、粒子をすべて粒径２．５μｍの滑らかな球体とした場
合、それぞれ０．０６μｍ、０．１３ μｍ、０．２５
μｍ、０．５ μｍである。At this time, by changing the plating time, the amount of Ag plating deposited was 5%, 10%, 20%, and 40% relative to the base alloy powder.
Adjusted to be %. In addition, the plating thickness in this case is 0.06 μm, 0.13 μm, and 0.25 μm, respectively, when all particles are smooth spheres with a particle size of 2.5 μm.
μm, 0.5 μm.
得られた金属粉末を実施例１〜１０と同様な方法でペー
ストとし、同様に印刷したのち、８００ｐｐｍの酸素を
含む窒素雰囲気中で７００℃で２０分間焼成して導体を
形成した。得られた導体について体積抵抗率およびハン
ダ付性を評価し、それらの結果も第１表に示した。The obtained metal powder was made into a paste in the same manner as in Examples 1 to 10, printed in the same manner, and then fired at 700° C. for 20 minutes in a nitrogen atmosphere containing 800 ppm of oxygen to form a conductor. The obtained conductor was evaluated for volume resistivity and solderability, and the results are also shown in Table 1.
第１表から明らかなように、卑金属合金粉末表面に貴金
属メツキを施した金属粉末を使用した本発明の導電性ペ
ーストにおいては、メ・フキをしない金属粉末あるいは
銅粉末表面に貴金属メツキをした金属粉末を使用したも
のに比較して初期の体積抵抗率が著しく小さく、経時変
化も極めて小さい。また、ハンダ付性についても良好な
結果が得られている。As is clear from Table 1, in the conductive paste of the present invention, which uses metal powder with noble metal plating on the surface of base metal alloy powder, metal powder without coating or copper powder with noble metal plating on the surface The initial volume resistivity is significantly lower than that using powder, and the change over time is also extremely small. Also, good results were obtained regarding solderability.
（以下余白）
［発明の効果］
以上説明したように、本発明の導電性ペーストによれば
、母材に卑金属の合金を使用しているため安価であり、
導電フィラーが耐酸化性であるために体積抵抗率が低く
かつ安定性に優れ、ハンダ付性にも優れた導体を提供す
ることができる。したがって、本発明は工業的に極めて
有用である。(The following is a blank space) [Effects of the Invention] As explained above, the conductive paste of the present invention uses a base metal alloy as the base material, so it is inexpensive;
Since the conductive filler is oxidation resistant, it is possible to provide a conductor with low volume resistivity, excellent stability, and excellent solderability. Therefore, the present invention is extremely useful industrially.
Claims (1)
とする導電性ペーストにおいて、前記金属粉末としてＣ
ｕ−Ｎｉ合金粉末またはＣｕ−Ｚｎ合金粉末の表面にＡ
ｕ、Ｐｔ、Ｐｄ、Ｒｕ、Ａｇの群から選ばれたいずれか
１種の金属をコーティングしてなる金属粉末を用いるこ
とを特徴とする導電性ペースト。In a conductive paste containing metal powder, glass frit, and an organic vehicle as main components, C as the metal powder.
A on the surface of u-Ni alloy powder or Cu-Zn alloy powder
A conductive paste characterized by using metal powder coated with any one metal selected from the group consisting of u, Pt, Pd, Ru, and Ag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1216657A JPH0378906A (en) | 1989-08-23 | 1989-08-23 | Conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1216657A JPH0378906A (en) | 1989-08-23 | 1989-08-23 | Conductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0378906A true JPH0378906A (en) | 1991-04-04 |
Family
ID=16691891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1216657A Pending JPH0378906A (en) | 1989-08-23 | 1989-08-23 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0378906A (en) |
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1989
- 1989-08-23 JP JP1216657A patent/JPH0378906A/en active Pending
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