JPH0370913B2 - - Google Patents
Info
- Publication number
- JPH0370913B2 JPH0370913B2 JP9053086A JP9053086A JPH0370913B2 JP H0370913 B2 JPH0370913 B2 JP H0370913B2 JP 9053086 A JP9053086 A JP 9053086A JP 9053086 A JP9053086 A JP 9053086A JP H0370913 B2 JPH0370913 B2 JP H0370913B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- mold
- lead
- resin
- optical coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- 230000003287 optical effect Effects 0.000 claims description 25
- 230000008878 coupling Effects 0.000 claims description 21
- 238000010168 coupling process Methods 0.000 claims description 21
- 238000005859 coupling reaction Methods 0.000 claims description 21
- 238000000465 moulding Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000005549 size reduction Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
Description
【発明の詳細な説明】
＜産業上の利用分野＞
本発明は発光素子及び受光素子が対向配置され
た光結合素子に関するもので、特に二重トランス
フアモールド構造の光結合素子の製造方法に関す
るものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an optical coupling device in which a light emitting element and a light receiving element are arranged facing each other, and particularly relates to a method for manufacturing an optical coupling device having a double transfer mold structure. It is.
＜発明の概要＞
アイソレーターとしての光結合素子いわゆるホ
トカプラは、機器制御の電子化に伴い、需要が伸
長している。一方機器や部品の小型化とりわけ電
子部品のチツプ部品化、面実装化に伴いホトカプ
ラも面実装に適した小型、薄型パツケージのもの
が要望されつつある。<Summary of the Invention> Demand for optical coupling elements, so-called photocouplers, serving as isolators is increasing as equipment control becomes electronic. On the other hand, with the miniaturization of equipment and components, especially the use of chip components and surface mounting of electronic components, there is a growing demand for photocouplers in small and thin packages suitable for surface mounting.
本発明は、発光素子と受光素子を対向させ、こ
れら素子を透光性樹脂により光路を形成して結合
し、更に外部周辺を遮光性樹脂により外装モール
ドしてなる二重トランスフアモールド構造の光結
合素子の製造方法において、透光性樹脂による内
装モールド時の金型に、発光素子と受光素子を搭
載する各リードのヘツダー部に対応して突出部を
設け、この突出部を内装モールド時の各ヘツダー
部の当たり止めとするとともに、外装モールド時
は突出部に対応して前記遮光性樹脂による台部を
形成することにより、所定の１次、２次間絶縁耐
圧を維持してかつとりわけ厚さ方向の寸法の小型
化を図つたものである。 The present invention provides an optical system with a double transfer mold structure, in which a light emitting element and a light receiving element are opposed to each other, these elements are connected by forming an optical path with a light-transmitting resin, and the outer periphery is externally molded with a light-shielding resin. In a method for manufacturing a coupling element, a protrusion is provided in a mold for interior molding using translucent resin, corresponding to the header portion of each lead on which a light emitting element and a light receiving element are mounted, and this protrusion is used for interior molding. In addition to stopping each header part from touching, when molding the exterior, by forming a base part made of the light-shielding resin corresponding to the protruding part, it is possible to maintain a predetermined dielectric strength voltage between the primary and secondary parts, and to maintain a particularly high thickness. The aim is to reduce the size in the horizontal direction.
＜従来の技術＞
第９図乃至第１１図はそれぞれ異なる従来の光
結合素子の構造を示す断面図である。<Prior Art> FIGS. 9 to 11 are cross-sectional views showing the structures of different conventional optical coupling elements.
第９図はいわゆる二重トランスフアモールド構
造の光結合素子であり、発光素子（発光ダイオー
ド）１と、受光素子２としてホトトランジスタあ
るいはホトダイオードと信号処理回路を集積化し
た素子を各々リード３，４に搭載し、それぞれ金
線５，５′によりワイヤボンドを行ない発光ダイ
オード１には応力緩和のためのプリコート６を施
した後、透光性樹脂７によりこれら全体を包むよ
うにモールドし、さらに外部周辺を遮光性樹脂８
でモールドしたものである。 FIG. 9 shows an optical coupling device with a so-called double transfer mold structure, in which a light emitting device (light emitting diode) 1 and a phototransistor or photodiode integrated device with a signal processing circuit as a light receiving device 2 are connected to leads 3 and 4, respectively. After wire bonding is performed with gold wires 5 and 5' respectively, and a precoat 6 is applied to the light emitting diode 1 to relieve stress, it is molded with a translucent resin 7 so as to wrap it all, and then the external periphery is coated. Light-shielding resin 8
It is molded with.
また第１０図のものは、遮光性樹脂８による外
装モールドを伴わないで透光性樹脂７のみで構成
された、いわゆる“一層モールドタイプ”の光結
合素子である。 Furthermore, the one shown in FIG. 10 is a so-called "single-layer mold type" optical coupling element that is constructed only of light-transmitting resin 7 without an exterior mold of light-shielding resin 8.
さらに、第１１図のものは発光ダイオード１及
び受光素子２を各リード３，４に搭載し、それぞ
れ金線５，５′によりワイヤボンドを行ない、各
素子１，２の相対向する光路となる部分をポツテ
イングにより透明シリコーン樹脂９で形成し、更
に外部周辺を遮光性樹脂８でモールドしたもので
ある。 Furthermore, in the one shown in FIG. 11, a light emitting diode 1 and a light receiving element 2 are mounted on each lead 3, 4, and wire bonded with gold wires 5, 5', respectively, to form an optical path for each element 1, 2 to face each other. The portion is formed of transparent silicone resin 9 by potting, and the outer periphery is further molded with light-shielding resin 8.
＜発明が解決しようとする問題点＞
上記従来例において、第９図の構造では、各素
子１，２が搭載されたリード３，４の素子搭載部
を充分覆うように透光性樹脂７によりトランスフ
アモールドされているため、１次、２次間の絶縁
破壊を生じやすい樹脂界面は第９図のＡに示す箇
所となり、デユアルインラインパツケージサイズ
で１次、２次間絶縁耐圧を5KVは十分に保証で
きる優れた構造となつている。しかし、小型、薄
型化を図るには多層構造となつているため制約が
大きい。<Problems to be Solved by the Invention> In the conventional example described above, in the structure shown in FIG. Because it is transfer-molded, the resin interface that is prone to dielectric breakdown between the primary and secondary is the location shown at A in Figure 9, and 5KV is sufficient for the dielectric strength voltage between the primary and secondary with the dual in-line package size. It has an excellent structure that can be guaranteed. However, since it has a multi-layered structure, there are significant restrictions in making it smaller and thinner.
そこで第１０図に示すように、外装モールドを
なくし、透光性樹脂７のみの一層モールド構造を
採用した光結合素子が提案されている。ところが
このような構造では、外乱光の影響をさけられな
い欠点がある。 Therefore, as shown in FIG. 10, an optical coupling element has been proposed that eliminates the exterior mold and adopts a single-layer molded structure using only a transparent resin 7. However, this structure has the disadvantage that it cannot avoid the influence of external light.
また第１１図の素子構造によれば、同図に示す
破線Ｂのところまで外装モールド部を小型、薄型
化できる。しかしこの構造では、透光性樹脂９と
遮光性樹脂８との境界部分におけるリード線間距
離が小さく、これら樹脂９，８の界面Ｃが一般に
要求される１次、２次間絶縁耐圧２〜5KVに対
して不十分であり、用いられる材料の線膨張係数
の差などから光結合素子として安全上極めて高い
信頼性が要求される絶縁耐圧を構造的に保証する
ことが困難である。 Further, according to the element structure shown in FIG. 11, the outer mold part can be made smaller and thinner up to the point of broken line B shown in the figure. However, in this structure, the distance between the lead wires at the boundary between the light-transmitting resin 9 and the light-shielding resin 8 is small, and the interface C between these resins 9 and 8 has a generally required dielectric strength voltage of 2 to 2. This is insufficient for 5KV, and due to differences in linear expansion coefficients of the materials used, it is difficult to structurally guarantee the dielectric strength, which requires extremely high reliability for safety as an optical coupling element.
本発明は上記従来の問題点に鑑みてなされたも
のであつて、その目的は、二重トランスフアモー
ルド構造の光結合素子において、絶縁耐圧を高い
信頼度で保障して、かつ小型、薄型化を達成でき
る光結合素子を提供することにある。 The present invention has been made in view of the above-mentioned conventional problems, and its purpose is to guarantee dielectric strength with high reliability in an optical coupling device with a double transfer mold structure, and to reduce the size and thickness of the device. The object of the present invention is to provide an optical coupling element that can achieve the following.
＜問題点を解決するための手段＞
本発明は、各リードに発光素子と受光素子を搭
載し、前記各リードに搭載した前記発光素子と受
光素子を対向配置し、前記リードの一部外端部を
残して全体に、透光性樹脂により前記発光素子と
受光素子間の光路を形成する内装モールド、及び
さらにその外部周辺の遮光性樹脂よりなる外装モ
ールドをそれぞれ施してなる二重トランスフアモ
ールド構造の光結合素子の製造方法において、前
記内装モールド時の金型は、前記発光素子と受光
素子を搭載する前記各リードのヘツダー部に対応
して突出部が設けられ、前記突出部を前記内装モ
ールド時の前記各ヘツダー部の当たり止めとする
とともに、前記外装モールド時は前記突出部に対
応して前記遮光性樹脂による台部を形成してなる
を特徴とする。<Means for Solving the Problems> The present invention includes mounting a light emitting element and a light receiving element on each lead, arranging the light emitting element and the light receiving element mounted on each lead to face each other, and disposing a part of the outer end of the lead. A double transfer mold comprising an interior mold made of translucent resin to form an optical path between the light emitting element and the light receiving element, and an exterior mold made of light shielding resin around the outside of the interior mold, except for a portion thereof. In the method for manufacturing an optical coupling device having a structure, the mold for molding the interior is provided with a protrusion corresponding to a header portion of each lead on which the light emitting element and the light receiving element are mounted, and the protrusion is connected to the interior. The present invention is characterized in that it serves as a stopper for each of the header portions during molding, and that a platform portion made of the light-shielding resin is formed corresponding to the protruding portion during the exterior molding.
＜作用＞
本発明の製造方法により、内装モールドの金型
の突出部は、二重トランスフアモールド構造の光
結合素子の薄型化を図る際において、ヘツダー部
のふらつきを抑えて正確なギヤツプを維持でき、
また外装モール時に前記突出部に対応した遮光性
樹脂による台部を形成することにより、ヘツダー
部外方周辺部への遮光性樹脂の回り込みを防止す
る。そして少なくともヘツダー部とリード間で１
次、２次間の絶縁耐圧を確保するために必要な沿
面距離を容易に確保できるとともに、各リードの
素子搭載部の裏側部分のみ露出するようにして或
いはごく薄い層をなすようにして透光性樹脂でモ
ールドする構造により、寸法上の小型化、とりわ
け薄型化を図ることができる。<Function> According to the manufacturing method of the present invention, the protruding part of the interior mold can maintain an accurate gap by suppressing the wobbling of the header part when thinning an optical coupling element with a double transfer mold structure. I can do it,
Further, by forming a base portion made of light-shielding resin corresponding to the protruding portion during the exterior molding, the light-shielding resin is prevented from going around to the outer peripheral portion of the header portion. And at least 1 between the header and the lead.
In addition to easily securing the creepage distance necessary to ensure the dielectric strength between the secondary and secondary components, it is also possible to expose only the back side of the element mounting portion of each lead or to form a very thin layer to transmit light. By molding the structure with a synthetic resin, it is possible to achieve size reduction, especially thinness.
＜実施例＞
以下、本発明に係る光結合素子の一実施例につ
き詳細に説明を行う。<Example> Hereinafter, one example of the optical coupling device according to the present invention will be described in detail.
第１図乃至第３図は本発明に係る光結合素子の
一実施例の断面図。第４図乃至第６図はその製造
工程を説明する図。第７図及び第８図は完成品の
斜視図である。第４図のように、発光ダイオード
１は落しこみ加工の施されたリード３上に搭載さ
れ、金線５によりワイヤボンドが行なわれた後、
応力緩和のためのプリコート６が施される。また
同様に、受光素子２は、もう一方のリード４上に
搭載され、金線５′によりワイヤボンドが行なわ
れた後、前記リード３に搭載された発光ダイオー
ド１と対向させて配置し、両素子１，２を含め覆
うように透光性樹脂７により１次モールドされ
る。このモールド時、金型に設けた突出部によ
り、各リードのヘツダー部のふらつきが抑られ正
確なギヤツプの維持を可能にするとともに、第５
図及び第６図の示すように、リードのチツプが搭
載された箇所（ヘツダー部）の裏側の位置９，
９′では、第９図及び第１０図の従来例のような
厚みのある透光性樹脂層は設けられていない。ト
ランスフアモールドされる状態では、リード３，
４のヘツダー部９，９′は金型のキヤビテイー面
に当接するかもしくは極めて近接した状態にあた
り、そこに樹脂７はごく薄く浸入するか、もしく
は浸入せずリードが露出する形状となる。 1 to 3 are cross-sectional views of an embodiment of the optical coupling device according to the present invention. FIG. 4 to FIG. 6 are diagrams explaining the manufacturing process. FIGS. 7 and 8 are perspective views of the finished product. As shown in FIG. 4, the light emitting diode 1 is mounted on a recessed lead 3, and after wire bonding is performed with a gold wire 5,
A precoat 6 is applied to relieve stress. Similarly, the light receiving element 2 is mounted on the other lead 4, and after wire bonding is performed with the gold wire 5', it is placed facing the light emitting diode 1 mounted on the lead 3. Primary molding is performed with a translucent resin 7 so as to cover the elements 1 and 2 as well. During this molding, the protrusion provided on the mold suppresses the wobbling of the header portion of each lead, making it possible to maintain an accurate gap, and also making it possible to maintain an accurate gap.
As shown in the figure and Fig. 6, position 9 on the back side of the part where the lead tip is mounted (header part),
9' is not provided with a thick transparent resin layer unlike the conventional examples shown in FIGS. 9 and 10. In the transfer molded state, lead 3,
The header portions 9, 9' of 4 are in contact with or very close to the cavity surface of the mold, and the resin 7 either infiltrates very thinly there or does not infiltrate and the leads are exposed.
第５図及び第６図のように、透光性樹脂７によ
る１次モールドが完了した状態で、バリとりがな
され、１次モードルよりひとまわり大きなキヤビ
テイーをもつモールド金型を用いて遮光性樹脂８
により透光性樹脂７の外部周辺を覆うようにモー
ルドする。その後、リードフオーミングして第７
図及び第８図に示すような完成品となる。なお１
４は、極性判別のために設けた段差である。この
完成品の断面は第１図乃至第３図に示すようにな
り、外装モールド時において、前記１次モールド
金型の突出部に対応して外装樹脂（遮光性樹脂）
８による台部を形成し、ヘツダー部９，９′外方
周辺部への遮光性樹脂の回り込みを防止してい
る。すなわち、この構造では、第１図のＤ，
D′（ヘツダー部９，９′とリード３，４間）で示
されるような界面が形成されることとなり、従来
の第９図のＡでしめされる界面長さの少なくとも
半分を確実に確保して、１次、２次間の絶縁耐圧
を保証する。なお、第２図の実施例はリードをヘ
ツダー部９′の手前で特にもう一つ段１２を設け
て、ヘツダー部９′と樹脂界面間を十分な間隙と
したものである。 As shown in FIGS. 5 and 6, after the primary molding with the light-transmitting resin 7 is completed, burrs are removed, and the light-shielding resin is molded using a mold with a cavity slightly larger than the primary mold. 8
The resin is molded so as to cover the outer periphery of the translucent resin 7. After that, lead forming and the 7th
The finished product will be as shown in Figures and Figure 8. Note 1
4 is a step provided for polarity determination. The cross section of this finished product is as shown in Figures 1 to 3. During exterior molding, exterior resin (light-shielding resin) is applied to the protrusion of the primary mold.
8 to form a base portion to prevent the light-shielding resin from going around to the outer peripheral portions of the header portions 9, 9'. That is, in this structure, D in FIG.
An interface as shown by D' (between header portions 9, 9' and leads 3, 4) will be formed, ensuring at least half of the conventional interface length shown by A in Figure 9. This ensures the dielectric strength between the primary and secondary. In the embodiment shown in FIG. 2, another stage 12 is provided in front of the header portion 9' for the lead to provide a sufficient gap between the header portion 9' and the resin interface.
以上のベた２重モールドに用いる材料、とりわ
け１次モールド用透光性樹脂７は、外装樹脂８と
同一主成分の樹脂を用い、かつ適量の充填剤を加
えることにより、機械的強度を向上させ、外装樹
脂８と線膨張係数の近似を図ることができ、信頼
性上有効かつ不可欠である。 The materials used for the solid double mold described above, especially the transparent resin 7 for the primary mold, are made of resin with the same main component as the exterior resin 8, and are improved in mechanical strength by adding an appropriate amount of filler. This allows the linear expansion coefficient to be approximated to that of the exterior resin 8, which is effective and essential in terms of reliability.
＜発明の効果＞
以上述べてきたように本発明によれば、二重ト
ランスフアモールド構造の光結合素子の製造方法
において、内装モールド時の金型に、発光素子と
受光素子を搭載する各リードのヘツダー部に対応
して突出部を設け、突出部を前記内装モールド時
の各ヘツダー部の当たり止めとするとともに、外
装モールド時は前記突出部に対応して前記遮光性
樹脂による台部を形成するようにするものであ
り、容易に寸法上の小型化とりわけ薄型化が達成
でき、しかも１次、２次間の絶縁耐圧も安定して
確保できる光結合素子が提供できる。<Effects of the Invention> As described above, according to the present invention, in the method for manufacturing an optical coupling device with a double transfer mold structure, each lead on which a light emitting element and a light receiving element are mounted is placed in a mold during interior molding. Protruding parts are provided corresponding to the header parts, and the protruding parts are used as abutment stops for each header part when molding the interior, and a base part made of the light-shielding resin is formed corresponding to the protruding parts when molding the exterior. Accordingly, it is possible to provide an optical coupling element that can easily achieve size reduction, particularly thinness, and can stably ensure dielectric strength between the primary and secondary elements.
第１図乃至第３図は本発明に係る光結合素子の
夫々異なる実施例の断面図、第４図乃至第６図は
その製造工程の説明図、第７図及び第８図は完成
品の外観斜視図、第９図乃至第１１図は夫々異な
る従来例の断面図である。
１：発光ダイオード、２：受光素子、３，４：
リード、７：透光性樹脂、８：遮光性樹脂、９，
９′：ヘツダー部。
1 to 3 are cross-sectional views of different embodiments of the optical coupling device according to the present invention, FIGS. 4 to 6 are illustrations of the manufacturing process, and FIGS. 7 and 8 are diagrams of the finished product. The external perspective view and FIGS. 9 to 11 are sectional views of different conventional examples. 1: Light emitting diode, 2: Light receiving element, 3, 4:
Lead, 7: Translucent resin, 8: Light-shielding resin, 9,
9': Header section.
Claims (1)
記各リードに搭載した前記発光素子と受光素子を
対向配置し、前記リードの一部外端部を残して全
体に、透光性樹脂により前記発光素子と受光素子
間の光路を形成する内装モールド、及びさらにそ
の外部周辺の遮光性樹脂よりなる外装モールドを
それぞれ施してなる二重トランスフアモールド構
造の光結合素子の製造方法において、前記内装モ
ールド時の金型は、前記発光素子と受光素子を搭
載する前記各リードのヘツダー部に対応して突出
部が設けられ、前記突出部を前記内装モールド時
の前記各ヘツダー部の当たり止めとするととも
に、前記外装モールド時は前記突出部に対応して
前記遮光性樹脂による台部を形成してなるを特徴
とする光結合素子の製造方法。1 A light-emitting element and a light-receiving element are mounted on each lead, the light-emitting element and the light-receiving element mounted on each lead are arranged facing each other, and the entire lead is covered with a translucent resin except for a part of the outer end. In the method for manufacturing an optical coupling element having a double transfer mold structure, the optical coupling element has a double transfer mold structure, which includes an interior mold forming an optical path between a light emitting element and a light receiving element, and an exterior mold made of a light-shielding resin around the outside of the interior mold. The mold is provided with protrusions corresponding to the header portions of the leads on which the light-emitting element and the light-receiving element are mounted, and the protrusions serve as abutment stops for the header portions when molding the interior. . A method for manufacturing an optical coupling element, characterized in that during the exterior molding, a pedestal made of the light-shielding resin is formed corresponding to the protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61090530A JPS62247575A (en) | 1986-04-18 | 1986-04-18 | Optical coupling element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61090530A JPS62247575A (en) | 1986-04-18 | 1986-04-18 | Optical coupling element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62247575A JPS62247575A (en) | 1987-10-28 |
| JPH0370913B2 true JPH0370913B2 (en) | 1991-11-11 |
Family
ID=14000967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61090530A Granted JPS62247575A (en) | 1986-04-18 | 1986-04-18 | Optical coupling element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62247575A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2809709B2 (en) * | 1989-06-14 | 1998-10-15 | 松下電子工業株式会社 | Semiconductor device |
| JPH0350351U (en) * | 1989-09-22 | 1991-05-16 | ||
| JP2534412Y2 (en) * | 1990-07-12 | 1997-04-30 | シャープ株式会社 | Surface mount optical coupling device |
| JP2005159137A (en) | 2003-11-27 | 2005-06-16 | Sharp Corp | Optical semiconductor device and electronic apparatus using it |
-
1986
- 1986-04-18 JP JP61090530A patent/JPS62247575A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62247575A (en) | 1987-10-28 |
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