JPH0537008A - Photocoupler - Google Patents
PhotocouplerInfo
- Publication number
- JPH0537008A JPH0537008A JP3188735A JP18873591A JPH0537008A JP H0537008 A JPH0537008 A JP H0537008A JP 3188735 A JP3188735 A JP 3188735A JP 18873591 A JP18873591 A JP 18873591A JP H0537008 A JPH0537008 A JP H0537008A
- Authority
- JP
- Japan
- Prior art keywords
- resin body
- light emitting
- light
- receiving element
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、小型で面実装型の光結
合装置に関するするものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compact, surface-mount type optical coupling device.
【０００２】近年、家電製品、ＯＡ機器および産業機器
等は、現在軽薄短小の傾向がますます進んでいる。それ
に伴い、基板実装方法としては面実装方法が主流となっ
てきており、電子部品も面実装型の小型パッケージが望
まれている。これは、光結合装置に対しても強く、高密
度実装に適した製品開発が求められている。In recent years, home appliances, office automation equipment, industrial equipment, and the like are becoming lighter, thinner, smaller, and smaller. Along with this, a surface mounting method has become the mainstream as a board mounting method, and a small surface mounting type package for electronic components is also desired. This is also strong against optical coupling devices, and product development suitable for high-density mounting is required.
【０００３】[0003]
【従来の技術】図４，図５は、従来の面実装型の光結合
装置の代表的な内部構造図である。図４における第１従
来例の光結合装置は、外装樹脂体１内に発光素子２と受
光素子３が上下に対向配置され、半透明樹脂４でモール
ドした後、さらに不透明樹脂５でモールドする２重トラ
ンスファーモールド構造であり、４本のリード端子６は
外装樹脂体１の側面中央部より取り出し、ガルウィング
形状に形成されたものである。2. Description of the Related Art FIGS. 4 and 5 are typical internal structure diagrams of a conventional surface mount type optical coupling device. In the optical coupling device of the first conventional example in FIG. 4, the light emitting element 2 and the light receiving element 3 are vertically opposed to each other in the exterior resin body 1, and are molded with the semitransparent resin 4 and then with the opaque resin 5. It has a heavy transfer mold structure, and the four lead terminals 6 are taken out from the central portion of the side surface of the exterior resin body 1 and formed in a gull wing shape.
【０００４】図５における第２従来例の光結合装置は、
外装樹脂体７内に発光素子８と受光素子９がリード端子
１０の上面で面一にダイボンドされ、透明シリコン樹脂
１１で覆われており、さらにこれが不透明樹脂１２でモ
ールドされている。The optical coupling device of the second conventional example shown in FIG.
The light emitting element 8 and the light receiving element 9 are die-bonded flush with the upper surface of the lead terminal 10 in the exterior resin body 7, covered with a transparent silicon resin 11, and further molded with an opaque resin 12.
【０００５】この光結合装置は、発光素子８および受光
素子９を覆う透明シリコン樹脂１１の曲面上で光が反射
される反射型構造であり、４本のリード端子１０は、図
４と同様に外装樹脂体１の側面中央部より取り出し、ガ
ルウィング形状に形成されている。This optical coupling device has a reflection type structure in which light is reflected on the curved surface of the transparent silicon resin 11 that covers the light emitting element 8 and the light receiving element 9, and the four lead terminals 10 are the same as in FIG. It is taken out from the center of the side surface of the exterior resin body 1 and formed in a gull wing shape.
【０００６】[0006]
【発明が解決しようとする課題】上記の従来例におい
て、図４の構造では、発光素子２と受光素子３を上下に
対向させているが、両者間の絶縁性を保つために、発光
素子２と受光素子３の距離を１ｍｍ前後に保つ必要があ
る。そのために、外装樹脂体１の厚みが２ｍｍ以上とな
り、小型化が困難である。In the above-mentioned conventional example, in the structure of FIG. 4, the light emitting element 2 and the light receiving element 3 are vertically opposed to each other. However, in order to maintain insulation between them, the light emitting element 2 It is necessary to keep the distance between the light receiving element 3 and the light receiving element 3 around 1 mm. Therefore, the thickness of the exterior resin body 1 is 2 mm or more, and it is difficult to reduce the size.
【０００７】また、リード端子６を外装樹脂体１の側面
中央部より取り出しているため、樹脂４，５のモールド
後、ガルウィング形状への成形工程が必要とんり、さら
にリード端子６の曲げ寸法のバラツキにより基板に実装
するとき、半田付け不良が発生し易い。Further, since the lead terminal 6 is taken out from the central portion of the side surface of the exterior resin body 1, a molding step into a gull wing shape is required after the molding of the resins 4 and 5, and the bending dimension of the lead terminal 6 is further increased. When mounting on a board due to the variation of, the soldering failure is likely to occur.
【０００８】図５の構造では、発光素子８と受光素子９
は、リード端子１０の上面側に位置しているため、外乱
光の影響を受け易い。また、リード端子１０の成形工程
の問題は、第１従来例の構造と同一の問題を有してい
る。In the structure of FIG. 5, the light emitting element 8 and the light receiving element 9 are provided.
Is located on the upper surface side of the lead terminal 10, and is therefore easily affected by ambient light. Further, the problem of the molding process of the lead terminal 10 has the same problem as the structure of the first conventional example.
【０００９】本発明は、上記に鑑み、モールド後のリー
ド端子のリードフォーミングを削除することができ、基
板に面実装するときの半田付け不良を抑制することがで
きる光結合装置の提供を目的とする。In view of the above, it is an object of the present invention to provide an optical coupling device capable of eliminating lead forming of a lead terminal after molding and suppressing soldering failure when surface mounting on a substrate. To do.
【００１０】[0010]
【課題を解決するための手段】本発明請求項１による課
題解決手段は、図１，２の如く、外装樹脂体２０内に発
光素子２１および受光素子２２が光学的に結合するよう
配置された光結合装置において、発光素子２１および受
光素子２２のリード端子２３，２４，２５，２６が前記
外装樹脂体２０の底面から該底面２７に沿って引き出さ
れたものである。According to a first aspect of the present invention, a light emitting element 21 and a light receiving element 22 are arranged in an exterior resin body 20 so as to be optically coupled to each other, as shown in FIGS. In the optical coupling device, the lead terminals 23, 24, 25 and 26 of the light emitting element 21 and the light receiving element 22 are drawn out from the bottom surface of the exterior resin body 20 along the bottom surface 27.
【００１１】また、請求項２による課題解決手段は、図
１，２の如く、基板２８に面実装される請求項１記載の
光結合装置であって、リード端子２３，２５に発光素子
２１と受光素子２２が面一でダイボンドされて反射型構
造とされ、前記発光素子２１および受光素子２２が、基
板２８と対向するようにリード端子２３，２５の下面に
配置されたものである。Further, the problem solving means according to claim 2 is the optical coupling device according to claim 1 which is surface-mounted on the substrate 28 as shown in FIGS. 1 and 2, and the light emitting element 21 is provided on the lead terminals 23 and 25. The light receiving element 22 is die-bonded flush to have a reflection type structure, and the light emitting element 21 and the light receiving element 22 are arranged on the lower surfaces of the lead terminals 23 and 25 so as to face the substrate 28.
【００１２】[0012]
【作用】上記請求項１による課題解決手段において、リ
ード端子２３〜２６を外装樹脂体２０の底面２７に沿っ
て引き出しているので、リード端子２３〜２６をそのま
ま基板２８に半田付けすることにより面実装できるた
め、モールド後のリード端子の折曲げ工程を削除し、折
曲げ不良による半田付け不良も防ぐ。In the means for solving the problems according to the above-mentioned claim 1, since the lead terminals 23 to 26 are drawn out along the bottom surface 27 of the exterior resin body 20, the lead terminals 23 to 26 are directly attached to the substrate 28 by soldering to form a surface. Since it can be mounted, the step of bending the lead terminal after molding is eliminated, and soldering failure due to bending failure is also prevented.
【００１３】また、請求項２による課題解決手段におい
て、受発光素子２１，２２をリード端子２３，２５の下
面に面一でダイボンドして、外装樹脂体２０の底面２７
と対向するよう配置しているため、外装樹脂体２０の厚
みを小とし、上方からの外乱光を防ぐ。Further, in the means for solving the problem according to claim 2, the light emitting / receiving elements 21, 22 are die-bonded to the lower surfaces of the lead terminals 23, 25 so as to be flush with each other, and the bottom surface 27 of the exterior resin body 20.
Since the external resin body 20 is disposed so as to face the external resin body 20, the thickness of the external resin body 20 is reduced, and ambient light from above is prevented.
【００１４】[0014]
【実施例】図１は本発明の一実施例を示す光結合装置の
側面断面図、図２はその底面図、図３は樹脂注入型方式
を示す概略図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a side sectional view of an optical coupling device showing an embodiment of the present invention, FIG. 2 is a bottom view thereof, and FIG. 3 is a schematic view showing a resin injection type system.
【００１５】図１，２の如く、本実施例の小型で面実装
型の光結合装置は、外装樹脂体２０内で発光素子２１お
よび受光素子２２がリード端子２３，２５の下面に面一
でダイボンドされた反射型フォトカプラである。As shown in FIGS. 1 and 2, in the small-sized surface-mount type optical coupling device of this embodiment, the light emitting element 21 and the light receiving element 22 are flush with the lower surfaces of the lead terminals 23 and 25 in the exterior resin body 20. It is a die-bonded reflective photocoupler.
【００１６】すなわち、発光素子２１および受光素子２
２は、外装樹脂体２０の底面２７と対向するよう配置さ
れている。また、受発光素子２１，２２のリード端子２
３，２４，２５，２６は、外装樹脂体２０の底面２７か
ら該底面２７に沿って引き出されている。That is, the light emitting element 21 and the light receiving element 2
2 is arranged so as to face the bottom surface 27 of the exterior resin body 20. In addition, the lead terminals 2 of the light emitting / receiving elements 21 and 22.
3, 24, 25 and 26 are drawn out from the bottom surface 27 of the exterior resin body 20 along the bottom surface 27.
【００１７】前記外装樹脂体２０は、エポキシ樹脂等の
不透明樹脂により箱形に形成されている。The exterior resin body 20 is formed in a box shape with an opaque resin such as an epoxy resin.
【００１８】リード端子２３，２４，２５，２６は、予
め折曲げ加工が施されている。前記発光素子２１は、リ
ード端子２３の載置部２３ａの下面にダイボンドされ、
ボンディングワイヤ２９を介してリード端子２４のリー
ド部２４ａに内部結線されている。The lead terminals 23, 24, 25 and 26 are preliminarily bent. The light emitting element 21 is die-bonded to the lower surface of the mounting portion 23a of the lead terminal 23,
It is internally connected to the lead portion 24 a of the lead terminal 24 via the bonding wire 29.
【００１９】前記受光素子２２は、リード端子２５の載
置部２５ａの下面にダイボンドされ、ボンディングワイ
ヤ２９ａを介してリード端子２６のリード部２６ａに内
部結線されている。The light receiving element 22 is die-bonded to the lower surface of the mounting portion 25a of the lead terminal 25 and internally connected to the lead portion 26a of the lead terminal 26 via the bonding wire 29a.
【００２０】これら発光素子２１および受光素子２２
は、透明シリコン製の封止樹脂体３０により一体的に封
止されている。封止樹脂体３０は、その外周面上で発光
素子２１からの光を受光素子２２に反射するよう、その
外周曲面形状が設定された反射型構造になっている。そ
して、この透明な封止樹脂体３０は、さらにエポキシ樹
脂等の不透明な外装樹脂体２０によりモールドされてい
る。These light emitting element 21 and light receiving element 22
Are integrally sealed by a sealing resin body 30 made of transparent silicon. The sealing resin body 30 has a reflective structure in which the outer peripheral curved surface shape is set so that the light from the light emitting element 21 is reflected by the light receiving element 22 on the outer peripheral surface thereof. The transparent sealing resin body 30 is further molded with an opaque exterior resin body 20 such as an epoxy resin.
【００２１】このとき、予め折曲げ加工したリード端子
２３〜２６の下端水平脚部２３ｂ〜２６ｂが、外装樹脂
体２０の底面２７から引出されるようモールドされる。At this time, the lower end horizontal leg portions 23b to 26b of the lead terminals 23 to 26 which have been bent in advance are molded so as to be pulled out from the bottom surface 27 of the exterior resin body 20.
【００２２】このモールド方法としては、一般的にトラ
ンスファーモールド成形が主流であるが、本実施例で
は、図３に示す方法も採用できる。すなわち、連続する
凹形の注入型の凹部３１に、封止樹脂体３０で封止した
受発光素子２１，２２を挿入し、そのリード端子２３〜
２６の脚部２３ｂ〜２６ｂを凹部３１の仕切壁３２の上
面に掛け、この凹部３１にエポキシ樹脂を注入塗布す
る。そして、樹脂の硬化後に取り出して、脚部２３ｂ〜
２６ｂの中央のＸ点において切断する。As the molding method, transfer molding is generally the mainstream, but in the present embodiment, the method shown in FIG. 3 can also be adopted. That is, the light emitting and receiving elements 21 and 22 sealed with the sealing resin body 30 are inserted into the continuous recessed injection-type concave portions 31, and the lead terminals 23 to
The leg portions 23b to 26b of 26 are hung on the upper surface of the partition wall 32 of the recess 31, and the recess 31 is filled with epoxy resin. Then, after the resin is cured, the resin is taken out, and the leg portions 23b to
Cut at point X in the center of 26b.
【００２３】そうすれば、モールドのパーティング面
が、外装樹脂体２０の底面２７となり、この底面２７か
らリード端子２３〜２６がストレートに取り出されるこ
とになる。そのため、２３〜２６をモールド後に成形す
る工程が削除される。Then, the parting surface of the mold becomes the bottom surface 27 of the exterior resin body 20, and the lead terminals 23 to 26 are taken out straight from the bottom surface 27. Therefore, the step of molding 23 to 26 after molding is deleted.
【００２４】そして、従来のようにモールド後に成形す
ると、リード端子の曲げ寸法のバラツキなどにより、基
板２８に実装するときの半田付け不良が発生し易いが、
上記成形工程が削除されているため、半田付け不良の抑
制ができる。If molding is performed after molding as in the conventional case, soldering failure during mounting on the substrate 28 is likely to occur due to variations in the bending dimensions of the lead terminals.
Since the molding step is omitted, it is possible to suppress defective soldering.
【００２５】また、発光素子２１および受光素子２２を
面一にダイボンドしたために、第１従来例のような外装
樹脂体２０の厚みは、必要なく小型化できる。さらに、
発光素子２１および受光素子２２をリード端子２３，２
５の下面に取り付けたため、第２従来例のような上方か
らの外乱光の影響は、少なくなる。Further, since the light emitting element 21 and the light receiving element 22 are die-bonded flush with each other, the thickness of the exterior resin body 20 as in the first conventional example can be reduced without necessity. further,
The light emitting element 21 and the light receiving element 22 are connected to lead terminals 23, 2
Since it is attached to the lower surface of No. 5, the influence of ambient light from above as in the second conventional example is reduced.
【００２６】なお、下方からの外乱光に対しては、面実
装時に、外装樹脂体２０の底面２７が基板２８に密接す
るため、その影響は少ない。It should be noted that the ambient light from below is less affected by the bottom surface 27 of the exterior resin body 20 being in close contact with the substrate 28 during surface mounting.
【００２７】なお、本発明は、上記実施例に限定される
ものではなく、本発明の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。The present invention is not limited to the above embodiment, and it goes without saying that many modifications and changes can be made to the above embodiment within the scope of the present invention.
【００２８】例えば、外装樹脂体２０として、エポキシ
樹脂が採用したが、反射効果を高めるために反射用フィ
ラーを含んだ白色系エポキシ樹脂を使用してもよい。For example, although the epoxy resin is used as the exterior resin body 20, a white epoxy resin containing a filler for reflection may be used to enhance the reflection effect.
【００２９】[0029]
【発明の効果】以上の説明から明らかな通り、本発明請
求項１によると、リード端子を外装樹脂体の底面に沿っ
て引き出して、モールドのパーティング面を外装樹脂体
の底面にしているため、モールド後のリード端子の折曲
げ工程を削除し、折曲げ不良による半田付け不良も防ぐ
ことができる。As is apparent from the above description, according to claim 1 of the present invention, the lead terminal is pulled out along the bottom surface of the exterior resin body, and the parting surface of the mold is the bottom surface of the exterior resin body. It is possible to eliminate the step of bending the lead terminal after molding and prevent soldering failure due to bending failure.
【００３０】また、請求項２によると、受発光素子をリ
ード端子の下面に面一でダイボンドして、外装樹脂体の
底面と対向するよう配置しているため、外装樹脂体の厚
みを小とし、上方からの外乱光を防ぎ、さらに下方から
の外乱光に対しては、面実装時に、外装樹脂体の底面が
基板に密接するため、その影響は少ないといった優れた
効果がある。Further, according to the present invention, since the light emitting / receiving element is die-bonded to the lower surface of the lead terminal so as to be flush therewith and arranged so as to face the bottom surface of the exterior resin body, the thickness of the exterior resin body can be made small. Further, there is an excellent effect that the ambient light from above is prevented and the ambient light from below is less affected because the bottom surface of the exterior resin body is in close contact with the substrate during surface mounting.
【図１】図１は本発明の一実施例を示す光結合装置の側
面断面図である。FIG. 1 is a side sectional view of an optical coupling device showing an embodiment of the present invention.
【図２】図２は同じくその底面図である。FIG. 2 is a bottom view of the same.
【図３】図３は樹脂注型方式を示す概略図である。FIG. 3 is a schematic view showing a resin casting method.
【図４】図４は第１従来例を示す光結合装置の側面断面
図である。FIG. 4 is a side sectional view of an optical coupling device showing a first conventional example.
【図５】図５は第２従来例を示す光結合装置の側面断面
図である。FIG. 5 is a side sectional view of an optical coupling device showing a second conventional example.
２０ 外装樹脂体 ２１ 発光素子 ２２ 受光素子 ２３，２４，２５，２６ リード端子 ２７ 底面 ２８ 基板 20 Exterior resin body 21 Light emitting element 22 Light receiving element 23, 24, 25, 26 Lead terminals 27 Bottom 28 substrate
Claims (2)
が光学的に結合するよう配置された光結合装置におい
て、発光素子および受光素子のリード端子が前記外装樹
脂体の底面から該底面に沿って引き出されたことを特徴
とする光結合装置。1. In an optical coupling device in which a light emitting element and a light receiving element are arranged to be optically coupled to each other in an outer resin body, lead terminals of the light emitting element and the light receiving element extend from a bottom surface of the outer resin body along the bottom surface. An optical coupling device characterized by being pulled out.
合装置であって、リード端子に発光素子と受光素子が面
一でダイボンドされて反射型構造とされ、前記発光素子
および受光素子が、基板と対向するようにリード端子の
下面に配置されたことを特徴とする光結合装置。2. The optical coupling device according to claim 1, which is surface-mounted on a substrate, wherein the light emitting element and the light receiving element are die-bonded flush with each other to a lead terminal to form a reflection type structure. Is arranged on the lower surface of the lead terminal so as to face the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3188735A JPH0537008A (en) | 1991-07-29 | 1991-07-29 | Photocoupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3188735A JPH0537008A (en) | 1991-07-29 | 1991-07-29 | Photocoupler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0537008A true JPH0537008A (en) | 1993-02-12 |
Family
ID=16228860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3188735A Pending JPH0537008A (en) | 1991-07-29 | 1991-07-29 | Photocoupler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537008A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999060632A1 (en) * | 1998-05-20 | 1999-11-25 | Rohm Co., Ltd. | Reflective sensor |
| WO2001050540A1 (en) * | 1999-12-30 | 2001-07-12 | Osram Opto Semiconductors Gmbh | Surface mountable light diode light source and method for producing a light diode light source |
| US11251327B2 (en) * | 2018-12-24 | 2022-02-15 | CT Micro International Corporation | Photocoupler |
-
1991
- 1991-07-29 JP JP3188735A patent/JPH0537008A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999060632A1 (en) * | 1998-05-20 | 1999-11-25 | Rohm Co., Ltd. | Reflective sensor |
| KR100391065B1 (en) * | 1998-05-20 | 2003-07-12 | 로무 가부시키가이샤 | Reflective sensor |
| WO2001050540A1 (en) * | 1999-12-30 | 2001-07-12 | Osram Opto Semiconductors Gmbh | Surface mountable light diode light source and method for producing a light diode light source |
| US7098588B2 (en) | 1999-12-30 | 2006-08-29 | Osram Opto Semiconductors Gmbh | Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source |
| CN100375299C (en) * | 1999-12-30 | 2008-03-12 | 奥斯兰姆奥普托半导体有限责任公司 | Surface mountable light diode light source and method for producing light diode light source |
| US7534634B2 (en) | 1999-12-30 | 2009-05-19 | Osram Gmbh | Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source |
| US11251327B2 (en) * | 2018-12-24 | 2022-02-15 | CT Micro International Corporation | Photocoupler |
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