JPH08250762A - Reflection optical coupling device - Google Patents
Reflection optical coupling deviceInfo
- Publication number
- JPH08250762A JPH08250762A JP4707195A JP4707195A JPH08250762A JP H08250762 A JPH08250762 A JP H08250762A JP 4707195 A JP4707195 A JP 4707195A JP 4707195 A JP4707195 A JP 4707195A JP H08250762 A JPH08250762 A JP H08250762A
- Authority
- JP
- Japan
- Prior art keywords
- light
- shielding
- coupling device
- resin
- optical coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、小型ＯＡ機器および精
密機器等に搭載され、発光チップより発した光がその前
面にある被検出物により反射した光を受光チップにより
検出することにより、被検出物の有無を無接点で識別す
る反射型光結合装置（反射型フォトインタラプタ）に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is mounted on small OA equipment and precision equipment, and detects the light emitted from a light emitting chip reflected by an object to be detected in front of the light emitting chip by a light receiving chip. The present invention relates to a reflection type optical coupling device (reflection type photo interrupter) for identifying the presence or absence of a detection object without contact.
【０００２】[0002]
【従来の技術】従来の反射型光結合装置の構造につい
て、図６および図７を参照して説明する。 図６は、従
来例による反射型光結合装置の製造工程を示す図であ
り、（ａ）乃至（ｄ）は平面図であり、（ｅ）乃至
（ｈ）は（ａ）乃至（ｄ）の平面図の領域ｅにおけるＥ
−Ｅ′断面図である。2. Description of the Related Art The structure of a conventional reflection type optical coupling device will be described with reference to FIGS. FIG. 6 is a diagram showing a manufacturing process of a reflection type optical coupling device according to a conventional example, (a) to (d) are plan views, and (e) to (h) are (a) to (d). E in area e of the plan view
It is a -E 'sectional view.
【０００３】図７は、従来例による反射型光結合装置の
構造図であり、同図（ａ）は平面図、同図（ｂ）は正面
図、同図（ｃ）は平面図のＦ−Ｆ′断面図を示してい
る。7A and 7B are structural views of a reflection type optical coupling device according to a conventional example. FIG. 7A is a plan view, FIG. 7B is a front view, and FIG. 7C is a plan view. The F'cross section is shown.
【０００４】図６に示すように従来の光結合装置は多連
のリードフレーム１０の発光側リード端子３に発光チッ
プ１が、受光側リード端子４に受光チップ２が搭載さ
れ、他方の発光側および受光側リード端子５，６のボン
ディング領域に両チップ１，２より金線９を使用して電
気的接続が施される［図６（ａ），（ｅ）］。As shown in FIG. 6, in the conventional optical coupling device, the light emitting chip 1 is mounted on the light emitting side lead terminal 3 of the multiple lead frame 10 and the light receiving chip 2 is mounted on the light receiving side lead terminal 4, and the other light emitting side is mounted. Also, the chips 1 and 2 are electrically connected to the bonding regions of the light-receiving side lead terminals 5 and 6 by using the gold wire 9 [FIGS. 6 (a) and 6 (e)].
【０００５】次に、トランスファーモールド方式により
両チップ１，２は、透光性樹脂１１により個別に被覆さ
れ、発光側透光性樹脂体１２および受光側透光性樹脂体
１３を形成する［図６（ｂ），（ｆ）］。Next, both chips 1 and 2 are individually covered by a translucent resin 11 by a transfer molding method to form a light emitting side translucent resin body 12 and a light receiving side translucent resin body 13 [FIG. 6 (b), (f)].
【０００６】これら両透光性樹脂体１２，１３の周囲
を、遮光性樹脂１５でモールド金型を使用してトランス
ファーモールド方式またはインジェクションモールド方
式により一体成形し遮光性樹脂体１６を形成する。The light-shielding resin body 16 is formed by integrally molding the periphery of both the light-transmitting resin bodies 12 and 13 with the light-shielding resin 15 using a molding die by a transfer molding method or an injection molding method.
【０００７】このとき、発光チップ１より出射する光が
通過する窓部１８および受光チップ２に入射する光が通
過する窓部１９は遮光性樹脂１５により被覆されない
［図６（ｃ），（ｇ）］。At this time, the window portion 18 through which the light emitted from the light emitting chip 1 passes and the window portion 19 through which the light incident on the light receiving chip 2 passes are not covered with the light-shielding resin 15 [FIGS. )].
【０００８】更に、タイバー部８，８′等をカットし、
必要に応じリードフォーミングすることにより図７に示
す個別の完成品となる。Further, by cutting the tie bar portions 8 and 8 ',
By carrying out lead forming as required, individual finished products shown in FIG. 7 are obtained.
【０００９】このとき、両透光性樹脂体１２，１３を遮
光性樹脂１５で周囲を被覆することにより、両透光性樹
脂体１２，１３が一定間隔で並置され分離するのを防止
している［図６（ｄ），（ｈ）］。At this time, by covering the both translucent resin bodies 12 and 13 with the light-shielding resin 15, it is possible to prevent the translucent resin bodies 12 and 13 from being juxtaposed and separated at regular intervals. [Fig. 6 (d), (h)].
【００１０】[0010]
【発明が解決しようとする課題】光学的特性上、図７の
遮光性樹脂体１６は、発光チップ１より出射した光が発
光側透光性樹脂体１２を通過し、直接、受光側透光性樹
脂体１３に入射しないよう発光側透光性樹脂体１２と受
光側透光性樹脂体１３との間に遮光壁１６′として存在
していれば問題ない。Due to the optical characteristics, in the light-shielding resin body 16 of FIG. 7, the light emitted from the light-emitting chip 1 passes through the light-emitting side light-transmitting resin body 12 and is directly received on the light-receiving side light-transmitting side. There is no problem as long as it exists as a light shielding wall 16 ′ between the light-transmitting side light-transmitting resin body 12 and the light-receiving side light-transmitting resin body 13 so as not to enter the light-transmitting resin body 13.
【００１１】しかし、従来の反射型光結合装置では、図
７に示すように発光側透光性樹脂体１２と受光側透光性
樹脂体１３を一定間隔で並置し、互いに分離しないよう
機械的強度を確保するため、光の入射、出射部である窓
部１８，１９を除く、両透光性樹脂体１２，１３の周囲
全体を遮光性樹脂１５で被覆した構造となっている。 この構造は、上述したように光学的特性上、必要のない
箇所（Ｎ１，Ｎ２およびＮ３で示す）まで遮光性樹脂１
５で被覆しているため、反射型光結合装置が搭載される
ＯＡ機器および精密機器等の高密度実装化にともなう反
射型光結合装置の小型化、薄型化に対する強い要望を充
分、満足するものではなかった。However, in the conventional reflection type optical coupling device, as shown in FIG. 7, the light emitting side light-transmissive resin body 12 and the light receiving side light-transmissive resin body 13 are juxtaposed at regular intervals and mechanically arranged so as not to be separated from each other. In order to secure the strength, the entire periphery of the translucent resin bodies 12 and 13 is covered with the light shielding resin 15 except for the window portions 18 and 19 which are the light incident and emission portions. In this structure, as described above, the light-shielding resin 1 is applied to unnecessary portions (indicated by N1, N2, and N3) in terms of optical characteristics.
Since it is coated with 5, the strong demand for downsizing and thinning of the reflection type optical coupling device, which accompanies the high density mounting of OA equipment and precision equipment in which the reflection type optical coupling device is mounted, is sufficiently satisfied. Was not.
【００１２】ここで、従来の反射型光結合装置のパッケ
ージの横方向（Ｌ１）、縦方向（Ｗ１）および高さ方向
（Ｈ１）の外径寸法は、例えば、４ｍｍ×３ｍｍ×１．
７ｍｍ程度であり、この中で、光学的特性上、必要でな
い箇所の遮光性樹脂体１６の寸法は、横方向が、Ｎ１×
２＝０．６ｍｍ程度、縦方向が、Ｎ２×２＝０．６ｍｍ
程度、高さ方向が、Ｎ３＝０．４ｍｍ程度と、外径寸法
に占める割合が大きく、小型、薄型化の妨げとなってい
る。Here, the outer diameter dimension of the package of the conventional reflection type optical coupling device in the lateral direction (L1), the longitudinal direction (W1) and the height direction (H1) is, for example, 4 mm × 3 mm × 1.
It is about 7 mm, and in this, the dimension of the light-shielding resin body 16 which is not necessary in terms of optical characteristics is N1 × in the lateral direction.
2 = about 0.6 mm, vertical direction is N2 × 2 = 0.6 mm
In the degree and height direction, N3 = about 0.4 mm, which is a large proportion of the outer diameter dimension, which hinders reduction in size and thickness.
【００１３】また、従来の反射型光結合装置では、遮光
性樹脂体の形成をトランスファーモールド方式またはイ
ンジェクションモールド方式で実施していたため、モー
ルド金型が必要でありコストアップの要因になってい
た。Further, in the conventional reflection type optical coupling device, since the light-shielding resin body is formed by the transfer molding method or the injection molding method, a molding die is required, which causes a cost increase.
【００１４】本発明は、上記問題点に鑑みなされたもの
で、従来品に比べて大幅な小型、薄型化を実現した反射
型光結合装置を提供するものである。The present invention has been made in view of the above problems, and provides a reflection type optical coupling device which is significantly smaller and thinner than conventional products.
【００１５】[0015]
【課題を解決するための手段】前記目的を達成するた
め、本発明の反射型光結合装置は、一対の発光側リード
端子および受光側リード端子を有し、前記発光側リード
端子の一方の端子と前記受光側リード端子の一方の端子
が接続用フレーム部を介して連結されてなるリードフレ
ームと、該リードフレームの前記発光側および受光側リ
ード端子にそれぞれボンティングされた発光チップおよ
び受光チップと、該両チップを各々独立して透光性樹脂
にてモールドすることにより、前記接続用フレーム部の
両側に一定間隔をもって並置される発光側透光性樹脂体
および受光側透光性樹脂体と、一定間隔をもって並置さ
れた前記両透光性樹脂体の相対する側面間に形成された
遮光性物質とを備えてなることを特徴とする。In order to achieve the above object, a reflection type optical coupling device of the present invention has a pair of light emitting side lead terminals and light receiving side lead terminals, and one terminal of the light emitting side lead terminals. And a lead frame in which one terminal of the light receiving side lead terminal is connected via a connecting frame portion, and a light emitting chip and a light receiving chip respectively bonded to the light emitting side and light receiving side lead terminals of the lead frame. A light-emitting side light-transmissive resin body and a light-receiving side light-transmissive resin body which are arranged side by side on both sides of the connection frame part by molding the chips independently of each other with a light-transmissive resin. And a light-shielding substance formed between opposite side surfaces of the both translucent resin bodies arranged side by side at a constant interval.
【００１６】更に、請求項１記載の反射型光結合装置に
おいて、遮光性物質は、前記両透光性樹脂体の相対する
側面と前記接続用フレームに囲まれた空間に液状の遮光
性樹脂を注入、硬化された遮光性樹脂体であることを特
徴とする。Further, in the reflection-type optical coupling device according to claim 1, the light-shielding substance is a liquid light-shielding resin in a space surrounded by opposite side surfaces of the both light-transmitting resin bodies and the connecting frame. It is a light-shielding resin body that has been injected and cured.
【００１７】更に、請求項１記載の反射型光結合装置に
おいて、遮光性物質は、接続用フレームより延設され略
９０度の角度で折り曲げられた補助フレームと接続用フ
レームと両透光性樹脂体の相対する側面部とに囲まれた
空間に液状の遮光性樹脂を注入、硬化された遮光性樹脂
体であることを特徴とする。Further, in the reflection-type optical coupling device according to claim 1, the light-shielding substance is an auxiliary frame extending from the connecting frame and bent at an angle of about 90 degrees, the connecting frame, and the translucent resin. The light-shielding resin body is obtained by injecting a liquid light-shielding resin into a space surrounded by side surfaces of the body facing each other and curing the resin.
【００１８】最後に、請求項１記載の反射型光結合装置
において、遮光性物質は、両透光性樹脂体の相対する側
面間の接続用フレーム上に搭載された金属壁あるいは遮
光性樹脂壁であることを特徴とする。Finally, in the reflection-type optical coupling device according to claim 1, the light-shielding substance is a metal wall or a light-shielding resin wall mounted on a connecting frame between opposite side surfaces of both translucent resin bodies. Is characterized in that.
【００１９】[0019]
【作用】上記構成により本発明の反射型光結合装置によ
れば、発光側透光性樹脂体と受光側透光性樹脂体間にだ
け遮光性物質を介在させた構造であるため、従来例に比
べて大幅な小型、薄型化を達成できる。According to the reflection type optical coupling device of the present invention having the above-described structure, since the light-shielding substance is interposed only between the light-transmitting side light-transmitting resin body and the light-receiving side light-transmitting resin body, the conventional example It is possible to achieve a significant reduction in size and thickness in comparison with.
【００２０】また、発光側リード端子と受光側リード端
子が接続用フレーム部で連結されたリードフレームを使
用しているため、受光側透光性樹脂体と発光側透光性樹
脂体を一定間隔で並置し、互いに分離しないように充分
な強度を確保できる。Further, since the lead frame in which the light emitting side lead terminal and the light receiving side lead terminal are connected by the connecting frame portion is used, the light receiving side translucent resin body and the light emitting side translucent resin body are arranged at a constant interval. It is possible to secure sufficient strength so that they will not be separated from each other.
【００２１】更に、遮光性樹脂量が従来例に比べて削減
できるので、コストダウンが可能となる。Further, since the amount of the light-shielding resin can be reduced as compared with the conventional example, the cost can be reduced.
【００２２】また、遮光性樹脂体の形成を、モールド金
型で実施しないため、このモールド金型が不要となる。Further, since the light-shielding resin body is not formed by the molding die, this molding die becomes unnecessary.
【００２３】[0023]
【実施例】本発明の反射型光結合装置は、一方の発光側
リード端子と一方の受光側リード端子が接続用フレーム
部で連結されたリードフレームに発光チップと受光チッ
プを搭載し、両チップを各々、独立して透光性樹脂でモ
ールドすることにより、発光側透光性樹脂体および受光
側透光性樹脂体を形成し、この両透光性樹脂体間にのみ
遮光性物質を介在させたものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A reflection type optical coupling device of the present invention has a light emitting chip and a light receiving chip mounted on a lead frame in which one light emitting side lead terminal and one light receiving side lead terminal are connected by a connecting frame portion. Each of them is independently molded with a light-transmitting resin to form a light-transmitting side light-transmitting resin body and a light-receiving side light-transmitting resin body, and a light-shielding substance is interposed only between the both light-transmitting resin bodies. It was made.
【００２４】以下、図面を参照して詳細に説明する。A detailed description will be given below with reference to the drawings.
【００２５】尚、実施例において、従来例と同一機能部
分には同一記号を付している。Incidentally, in the embodiment, the same functional portions as those of the conventional example are designated by the same symbols.
【００２６】図１は、本発明の第１実施例による反射型
光結合装置の製造工程図であり、（ａ）乃至（ｄ）は平
面図であり、（ｅ）乃至（ｈ）は（ａ）乃至（ｄ）の平
面図の領域ａにおけるＡ−Ａ′断面図である。 図２
は、本発明の第１実施例による反射型光結合装置の構造
を示す図であり、同図（ａ）は平面図、同図（ｂ）は正
面図、同図（ｃ）は側面図、同図（ｄ）は平面図のＢ−
Ｂ′断面図である。FIG. 1 is a manufacturing process diagram of a reflection type optical coupling device according to a first embodiment of the present invention, (a) to (d) are plan views, and (e) to (h) are (a). 7A to 7D are cross-sectional views taken along the line AA ′ in the region a of the plan views of FIGS. Figure 2
FIG. 1 is a diagram showing a structure of a reflection type optical coupling device according to a first embodiment of the present invention, FIG. 1 (a) is a plan view, FIG. 1 (b) is a front view, and FIG. 1 (c) is a side view. FIG. 3D is a plan view B-
It is a B'cross section.
【００２７】図２を参照して、本発明の第１実施例によ
る反射型光結合装置の製造方法を説明する。A method of manufacturing the reflection type optical coupling device according to the first embodiment of the present invention will be described with reference to FIG.
【００２８】まず、発光側リード端子３と受光側リード
端子６が接続用フレーム部７で連結された多連リードフ
レーム１０の発光側リード端子３に発光チップ１が、受
光側リード端子４に受光チップ２が搭載され、発光チッ
プ１より他方の発光側リード端子５に、受光チップ２よ
り他方の受光側リード端子６に、それぞれＡｕ線９等に
より電気的接続が施される。First, the light emitting chip 1 is received by the light emitting side lead terminal 3 of the multiple lead frame 10 in which the light emitting side lead terminal 3 and the light receiving side lead terminal 6 are connected by the connecting frame portion 7, and the light receiving side lead terminal 4 receives the light. The chip 2 is mounted, and the light emitting chip 1 is electrically connected to the other light emitting side lead terminal 5 and the light receiving chip 2 is electrically connected to the other light receiving side lead terminal 6 by Au wires 9 or the like.
【００２９】ここで、８，８′は多連のリード端子３，
４，５，６を連結するためのタイバー部である。Here, 8 and 8'are multiple lead terminals 3,
It is a tie bar portion for connecting 4, 5, and 6.
【００３０】尚、本実施例では、発光チップ１を搭載す
る発光側リード端子３とＡｕ線９等によりワイヤーボン
ドされる受光側リード端子６を接続用フレーム部７で連
結しているが、Ａｕ線９等によりワイヤーボンドされる
発光側リード端子５と受光チップ２を搭載する受光側リ
ード端子４を接続用フレーム部７で連結してもよい［図
１（ａ），（ｅ）］。In this embodiment, the light emitting side lead terminal 3 on which the light emitting chip 1 is mounted and the light receiving side lead terminal 6 wire-bonded by the Au wire 9 or the like are connected by the connecting frame portion 7. The light emitting side lead terminal 5 wire-bonded by the wire 9 or the like and the light receiving side lead terminal 4 on which the light receiving chip 2 is mounted may be connected by the connecting frame portion 7 [FIGS. 1 (a) and 1 (e)].
【００３１】次に、発光チップ１および発光側リード端
子３，５の一部と、受光チップ２および受光側リード端
子４，６の一部を、各々独立してエポキシ樹脂等の透光
性樹脂１１を用いてトランスファーモールド方式等でモ
ールドすることにより発光側透光性樹脂体１２および受
光側透光性樹脂体１３が形成される。Next, a part of the light emitting chip 1 and the light emitting side lead terminals 3 and 5 and a part of the light receiving chip 2 and the light receiving side lead terminals 4 and 6 are independently provided with a transparent resin such as epoxy resin. A light emitting side translucent resin body 12 and a light receiving side translucent resin body 13 are formed by molding using 11 by a transfer molding method or the like.
【００３２】この時、両透光性樹脂体１２，１３の形状
として、相対する側面の両端部に突起部１４を設けるこ
とにより、両透光性樹脂体１２，１３の相対する側面間
の間隔が両端部では小さく、中央部では比較的大きくな
るようにする［図１（ｂ），（ｆ）］。At this time, as the shape of the both translucent resin bodies 12 and 13, by providing the protrusions 14 at both ends of the opposite side surfaces, the distance between the opposite side surfaces of the both translucent resin bodies 12 and 13 is increased. Is small at both ends and relatively large at the center [FIGS. 1 (b) and 1 (f)].
【００３３】次に、底面が接続用フレーム７で、側面が
突起部１４を含む両透光性樹脂体１２，１３の相対する
面で囲まれた空間に液状の遮光性樹脂１５をポッティン
グ法により充填することにより遮光性樹脂体１６を形成
する［図１（ｃ），（ｇ）］。Next, the liquid shielding resin 15 is potted in a space surrounded by the connecting frames 7 on the bottom surface and the opposing surfaces of the translucent resin bodies 12, 13 including the protrusions 14 on the side surfaces. The light-shielding resin body 16 is formed by filling [FIG. 1 (c), (g)].
【００３４】最後に、リード端子３，４，５，６を連結
しているタイバー部８，８′等をカットし、必要に応じ
て、両透光性樹脂体１２，１３より外部に導出している
リード端子３，４，５，６をフォーミングすることによ
り単品の図２に示す完成品となる。［図１（ｄ），
（ｈ）］。Finally, the tie bar portions 8, 8'connecting the lead terminals 3, 4, 5, 6 and the like are cut and, if necessary, led out from the both translucent resin bodies 12, 13. By forming the lead terminals 3, 4, 5 and 6 which are formed, a single product as shown in FIG. 2 is obtained. [Fig. 1 (d),
(H)].
【００３５】ここで、遮光性樹脂１５としては、例えば
熱硬化性エポキシ樹脂が使用される。この遮光性樹脂１
５の充填方法は、熱硬化性エポキシ樹脂の主剤と硬化剤
とを混合、撹拌し、脱泡した後、ディスペンサーによっ
て両透光性樹脂体１２，１３の相対する面と接続用フレ
ーム部７に囲まれた空間に脱泡された液状のエポキシ樹
脂が注入される。その後、加熱することによって、注入
された液状の熱硬化性樹脂であるエポキシ樹脂が硬化さ
れ、遮光性樹脂体１６が形成される。Here, as the light-shielding resin 15, for example, a thermosetting epoxy resin is used. This light-shielding resin 1
In the filling method of 5, the thermosetting epoxy resin main component and the curing agent are mixed, stirred, and defoamed, and then the dispenser dispenses the opposing surfaces of the translucent resin bodies 12 and 13 onto the connecting frame portion 7. The defoamed liquid epoxy resin is injected into the enclosed space. Then, by heating, the injected epoxy resin, which is a liquid thermosetting resin, is cured, and the light shielding resin body 16 is formed.
【００３６】尚、上記充填方法では、主剤と硬化剤とか
らなる２液性のエポキシ樹脂を用いたが、１液性のエポ
キシ樹脂を使用してもよい。In the above filling method, the two-component epoxy resin composed of the main agent and the curing agent was used, but a one-component epoxy resin may be used.
【００３７】両透光性樹脂体１２，１３間の間隔を中央
部（Ｃ２）で比較的大きく（０．５ｍｍ程度）している
のは、ディスペンサーにて液状の遮光性樹脂１５を注入
する際、ディスペンサーの先端が挿入できる領域を確保
するためである。The distance between the two light-transmissive resin bodies 12 and 13 is relatively large (about 0.5 mm) at the central portion (C2) when the liquid light-shielding resin 15 is injected by the dispenser. This is to secure an area into which the tip of the dispenser can be inserted.
【００３８】また、両透光性樹脂体１２，１３の両端部
の相対する突起部１４の間隔（Ｃ１）は、０．１５〜
０．３ｍｍ、好ましくは、０．２ｍｍ程度とするのがよ
い。The interval (C1) between the projecting portions 14 facing each other at both ends of the translucent resin bodies 12 and 13 is 0.15 to 0.15.
It is about 0.3 mm, preferably about 0.2 mm.
【００３９】その理由は、Ｃ１＝０．２ｍｍ程度であれ
ば、両透光性樹脂体１２，１３の相対する面と接続用フ
レーム部７に囲まれた空間に液状の遮光性樹脂１５を注
入した際に、表面張力により外部に液状の遮光性樹脂１
５が流出せず、所望の空間内に液状の遮光性樹脂１５が
注入できる。The reason is that if C1 = 0.2 mm, the liquid light-shielding resin 15 is injected into the space surrounded by the facing surfaces of both the light-transmitting resin bodies 12 and 13 and the connecting frame portion 7. When exposed to light, the light-shielding resin 1 is liquid due to surface tension.
5 does not flow out, and the liquid light-shielding resin 15 can be injected into the desired space.
【００４０】また、発光チップ１より発せられた光が直
接、受光チップ２に到達するのを防ぐ光の遮断の面から
考えると遮光性樹脂１５の厚さ（Ｃ１）は、０．１５ｍ
ｍあれば充分である。Further, in consideration of the light blocking for preventing the light emitted from the light emitting chip 1 from directly reaching the light receiving chip 2, the thickness (C1) of the light shielding resin 15 is 0.15 m.
m is sufficient.
【００４１】このことは、以下の実験結果によって立証
できる。This can be proved by the following experimental results.
【００４２】透過型光結合装置を用い、遮光性樹脂壁の
厚さが０．１５ｍｍの場合、発光チップより発せられた
光が遮光性樹脂壁を通して受光チップに到達した光によ
り受光チップに発生する出力は、光電流Ｉｃ＝２２ｎＡ
（発光チップの順電流ＩＦ＝１０ｍＡ，受光チップのＣ
−Ｅ間電圧ＶＣＥ＝５Ｖ）であった。この値は、暗電流
ＩＣＥＯ（ＩＦ＝０ｍＡ）の一般的な許容値の１００ｎ
Ａ以内であり、完全に光が遮断されていることがわか
る。When the thickness of the light shielding resin wall is 0.15 mm using the transmissive optical coupling device, the light emitted from the light emitting chip is generated in the light receiving chip by the light reaching the light receiving chip through the light shielding resin wall. Output is photocurrent Ic = 22nA
(Forward current IF of light emitting chip = 10 mA, C of light receiving chip
-E voltage VCE = 5V). This value is 100n, which is a general allowable value of dark current ICEO (IF = 0 mA).
It is within A and it can be seen that the light is completely blocked.
【００４３】図３は、本発明の第２実施例による反射型
光結合装置の製造工程図であり、（ａ）乃至（ｅ）は平
面図であり、（ｆ）乃至（ｊ）は（ａ）乃至（ｅ）の平
面図の領域ｃにおけるＣ−Ｃ′断面図である。FIG. 3 is a manufacturing process diagram of a reflection type optical coupling device according to a second embodiment of the present invention, (a) to (e) are plan views, and (f) to (j) are (a). 6A to 6E are cross-sectional views taken along the line C-C ′ in the region c of the plan views of FIGS.
【００４４】図４は、本発明の第２実施例による反射型
光結合装置の構造を示す図であり、同図（ａ）は平面
図、同図（ｂ）は正面図、同図（ｃ）は側面図、同図
（ｄ）は平面図のＤ−Ｄ′断面図である。4A and 4B are views showing the structure of a reflection type optical coupling device according to a second embodiment of the present invention. FIG. 4A is a plan view, FIG. 4B is a front view, and FIG. ) Is a side view, and FIG. 6D is a cross-sectional view taken along the line D-D 'in the plan view.
【００４５】本発明の第２実施例による反射型光結合装
置の製造方法を図３を参照して説明する。A method of manufacturing the reflection type optical coupling device according to the second embodiment of the present invention will be described with reference to FIG.
【００４６】まず、一対の発光側リード端子３，５と一
対の受光側リード端子４，６を有し、一方の発光側リー
ド端子３と一方の受光側リード端子６が接続用フレーム
部７で連結され、かつ接続用フレーム部７よりタイバー
部８，８′に延設された補助フレーム１７，１７′から
成る多連のリードフレーム１０の発光側リード端子３に
発光チップ１が、受光側リード端子４に受光チップ２が
搭載され、発光チップ１より他方の発光側リード端子５
に、受光チップ２より他方の受光側リード端子６に、Ａ
ｕ線９等により電気的接続が施される。First, a pair of light emitting side lead terminals 3 and 5 and a pair of light receiving side lead terminals 4 and 6 are provided, and one light emitting side lead terminal 3 and one light receiving side lead terminal 6 are connection frame portions 7. The light emitting chip 1 is connected to the light emitting side lead terminal 3 of the multiple lead frame 10 composed of auxiliary frames 17 and 17 'connected to each other and extending from the connecting frame portion 7 to the tie bar portions 8 and 8'. The light-receiving chip 2 is mounted on the terminal 4, and the other light-emitting side lead terminal 5 than the light-emitting chip 1 is mounted.
From the light receiving chip 2 to the other lead terminal 6 on the light receiving side,
Electrical connection is made by the u wire 9 or the like.
【００４７】尚、第１実施例と同様に、発光側リード端
子５と受光側リード端子４を接続用フレーム７で連結し
てもよい［図３（ａ），（ｆ）］。As in the first embodiment, the light emitting side lead terminal 5 and the light receiving side lead terminal 4 may be connected by the connecting frame 7 [FIGS. 3 (a) and 3 (f)].
【００４８】次に、発光チップ１および発光側リード端
子３，５の一部と、受光チップ２および受光側リード端
子４，６の一部を各々、独立してエポキシ樹脂等の遮光
性樹脂１１を用いて、トランスファーモールド方式等で
モールドすることにより発光側透光性樹脂体１２および
受光側透光性樹脂体１３が形成される「図３（ｂ），
（ｇ）］。Next, a part of the light emitting chip 1 and the lead terminals 3 and 5 on the light emitting side and a part of the light receiving chip 2 and the lead terminals 4 and 6 on the light receiving side are independently provided with a light shielding resin 11 such as an epoxy resin. Is used to form the light-transmitting-side translucent resin body 12 and the light-receiving-side translucent resin body 13 by molding using a transfer molding method or the like (FIG. 3B,
(G)].
【００４９】次に、タイバー部８，８′の不要部分をカ
ットし、発光側リード端子３，５および受光側リード端
子４，６と補助フレーム１７，１７′を切り離す［図３
（ｃ），（ｈ）］。Next, unnecessary portions of the tie bar portions 8 and 8'are cut and the light emitting side lead terminals 3 and 5 and the light receiving side lead terminals 4 and 6 and the auxiliary frames 17 and 17 'are separated [FIG.
(C), (h)].
【００５０】その後、補助フレーム１７，１７′を遮光
性樹脂体１２，１３が形成されている側に略９０度の角
度で折曲する［図３（ｄ），（ｉ）］。After that, the auxiliary frames 17 and 17 'are bent toward the side where the light shielding resin bodies 12 and 13 are formed at an angle of approximately 90 degrees [FIGS. 3 (d) and 3 (i)].
【００５１】次に、底面が接続用フレーム部７で、側面
が折曲された補助フレーム１７，１７′および両透光性
樹脂体１２，１３の相対する面で囲まれた空間に液状の
遮光性樹脂１５を充填することにより遮光性樹脂体１６
が形成される。遮光性樹脂１５としては、例えば熱硬化
性エポキシ樹脂が使用される。Next, liquid shielding is performed in the space surrounded by the connecting frame portion 7 on the bottom surface, the auxiliary frames 17 and 17 'whose side surfaces are bent, and the opposing surfaces of the two translucent resin bodies 12 and 13. Of the light-shielding resin body 16 by filling it with the resin 15
Is formed. As the light-shielding resin 15, for example, a thermosetting epoxy resin is used.
【００５２】また、遮光性樹脂１５の充填方法は、第１
実施例と同様であり説明を省略する［図３（ｅ），
（ｊ）］。The method of filling the light-shielding resin 15 is the first
The description is omitted because it is similar to the embodiment [FIG.
(J)].
【００５３】ここで、折曲された補助フレーム１７，１
７′と両透光性樹脂体１２，１３との間に隙間（０．１
５ｍｍ〜０．３ｍｍ程度）があっても、注入された液状
の遮光性樹脂１５の表面張力により、液状の遮光性樹脂
１５が空間外に流出することはない。Here, the bent auxiliary frames 17, 1
7'and a gap between the translucent resin bodies 12 and 13 (0.1
5 mm to 0.3 mm), the liquid light-shielding resin 15 does not flow out of the space due to the surface tension of the injected liquid light-shielding resin 15.
【００５４】最後に、多連に連結しているフレーム（図
示せず）をカットし、必要に応じて、両透光性樹脂体１
２，１３より外部に導出しているリード端子３，４，
５，６をフォーミングすることにより単品の図４に示す
完成品となる。Finally, the frames (not shown) that are connected in series are cut and, if necessary, the translucent resin body 1
Lead terminals 3, 4, which are led out from 2, 13 to the outside
By forming 5 and 6, a single product as shown in FIG. 4 is obtained.
【００５５】以上説明したように、本発明の第１および
第２実施例の反射型光結合装置によれば、接続用フレー
ム部７により発光側透光性樹脂体１２と受光側透光性樹
脂体１３の間隔を固定し、両透光性樹脂体１２，１３間
にのみ遮光性樹脂体１６を形成しているので、従来の反
射型光結合装置と同程度の強度を確保し、かつ大幅な小
型化、薄型化が達成できる。As described above, according to the reflection type optical coupling device of the first and second embodiments of the present invention, the light emitting side transparent resin body 12 and the light receiving side transparent resin are formed by the connecting frame portion 7. Since the interval between the bodies 13 is fixed and the light-shielding resin body 16 is formed only between the two light-transmitting resin bodies 12 and 13, the same strength as that of the conventional reflection-type optical coupling device is secured, and a large amount can be secured. It is possible to achieve miniaturization and thinning.
【００５６】例えば、第１および第２実施例の反射型光
結合装置のパッケージの横方向（Ｌ２）、縦方向（Ｗ
２）および高さ方向（Ｈ２）の外径寸法は、３．６ｍｍ
×２．４ｍｍ×１．３ｍｍ程度となり、従来の反射型光
結合装置に比べて、パッケージ体積が約４５％縮小でき
る。For example, the package of the reflection type optical coupling device of the first and second embodiments has a horizontal direction (L2) and a vertical direction (W).
2) and the outer diameter in the height direction (H2) is 3.6 mm
It becomes about 2.4 mm × 1.3 mm, and the package volume can be reduced by about 45% as compared with the conventional reflection type optical coupling device.
【００５７】また、遮光性樹脂の量も従来品と比較する
と、約１／７程度に低減される。Also, the amount of the light-shielding resin is reduced to about 1/7 as compared with the conventional product.
【００５８】更に、従来、モールド金型にて形成してい
た遮光性樹脂体をポッティング法にて形成するため、モ
ールド金型が不要となる。Furthermore, since the light-shielding resin body which has been conventionally formed by the molding die is formed by the potting method, the molding die becomes unnecessary.
【００５９】図５は、本発明の第３実施例による反射型
光結合装置の構造を示す図であり、同図（ａ）は平面
図、同図（ｂ）は正面図、同図（ｃ）は側面図である。5A and 5B are views showing the structure of a reflection type optical coupling device according to a third embodiment of the present invention. FIG. 5A is a plan view, FIG. 5B is a front view, and FIG. ) Is a side view.
【００６０】第３実施例の反射型光結合装置は、第１実
施例と同形状のリードフレームを使用し、第１実施例と
同様の方法でリード端子３，４に発光チップおよび受光
チップを搭載し、両チップよりリード端子５，６にＡｕ
線等で電気的接続を行い、その後、遮光性樹脂１１によ
り発光側および受光側を各々、独立してモールドするこ
とにより発光側透光性樹脂体１２および受光側透光性樹
脂体１３を形成する。 この時、図１（ｂ）に示す透光性樹脂による突起部１４
は設けない。The reflective optical coupling device of the third embodiment uses a lead frame having the same shape as that of the first embodiment, and the light emitting chip and the light receiving chip are attached to the lead terminals 3 and 4 in the same manner as in the first embodiment. It is mounted and Au is attached to the lead terminals 5 and 6 from both chips.
The light-emitting side and the light-receiving side are electrically connected with a wire or the like, and then the light-emitting side and the light-receiving side are independently molded with the light-shielding resin 11 to form the light-emitting side translucent resin body 12 and the light-receiving side translucent resin body 13. To do. At this time, the protrusion 14 made of the transparent resin shown in FIG.
Is not provided.
【００６１】その後、両透光性樹脂体１２，１３間に露
出している接続用フレーム部７上に接着剤２０を塗布
し、接着剤２０を塗布した領域に金属または遮光性樹脂
から成る遮光壁２１を搭載し、加熱することにより接着
剤２０を硬化し、遮光壁２１を固定する。接着剤２０と
しては、例えばエポキシ系の熱硬化性樹脂が使用され
る。After that, the adhesive 20 is applied on the connecting frame portion 7 exposed between the translucent resin bodies 12 and 13, and the region where the adhesive 20 is applied is shielded from light by a metal or a light-shielding resin. The wall 21 is mounted, and the adhesive 20 is hardened by heating to fix the light shielding wall 21. As the adhesive 20, for example, an epoxy thermosetting resin is used.
【００６２】この金属または遮光性樹脂から成る遮光壁
２１により、発光側透光性樹脂体１２より発せられた光
が、直接受光側透光性樹脂体１３に入射することが防止
できる。The light shielding wall 21 made of metal or light shielding resin can prevent the light emitted from the light emitting side light transmitting resin body 12 from directly entering the light receiving side light transmitting resin body 13.
【００６３】[0063]
【発明の効果】以上のように、本発明の反射型光結合装
置は、一方の発光側リード端子と一方の受光側リード端
子が接続用フレーム部で連結されたリードフレームを使
用し、発光側透光性樹脂体と受光側透光性樹脂体の相対
する側面間にのみ遮光性物質を介在するように構成した
ので、発光側透光性樹脂体と受光側透光性樹脂体を一定
間隔で並置し、互いに分離しないように充分な強度を確
保しつつ、従来例に比べて大幅な小型化、薄型化を達成
できる。つまり、反射型光結合装置の搭載機器であるＯ
Ａ機器および精密機器等の高密度実装化に充分対応でき
る。As described above, the reflection type optical coupling device of the present invention uses the lead frame in which one light emitting side lead terminal and one light receiving side lead terminal are connected by the connecting frame portion. Since the light-shielding substance is interposed only between the opposite sides of the light-transmitting resin body and the light-receiving side light-transmitting resin body, the light-emitting side light-transmitting resin body and the light-receiving side light-transmitting resin body are spaced at a constant distance. It is possible to achieve a significant reduction in size and thickness compared with the conventional example while ensuring sufficient strength so that they are not juxtaposed with each other. In other words, O, which is a device equipped with the reflection type optical coupling device,
Sufficiently compatible with high-density mounting of equipment A and precision equipment.
【００６４】また、遮光性樹脂体を形成する樹脂量が、
従来例に比べて１／７程度に削減できるので、反射型光
結合装置のコストダウンが可能となる。The amount of resin forming the light-shielding resin is
Since it can be reduced to about 1/7 as compared with the conventional example, the cost of the reflection type optical coupling device can be reduced.
【００６５】更に、遮光性樹脂体の形成をモールド金型
で実施しないため、このモールド金型が不要となる。Further, since the light-shielding resin body is not formed by the molding die, this molding die becomes unnecessary.
【図１】本発明の第１実施例による反射型光結合装置の
製造工程図であり、（ａ）乃至（ｄ）は平面図であり、
（ｅ）乃至（ｈ）は（ａ）乃至（ｄ）の断面図である。FIG. 1 is a manufacturing process diagram of a reflective optical coupling device according to a first embodiment of the present invention, in which (a) to (d) are plan views;
(E) thru | or (h) are sectional views of (a) to (d).
【図２】同じく構造を示す図であり、図（ａ）は平面
図、図（ｂ）は正面図、図（ｃ）は側面図、図（ｄ）は
平面図のＢ−Ｂ′断面図である。2A and 2B are views showing the same structure, wherein FIG. 2A is a plan view, FIG. 2B is a front view, FIG. 2C is a side view, and FIG. 2D is a plan view taken along the line BB '. Is.
【図３】本発明の第２実施例による反射型光結合装置の
製造工程図であり、（ａ）乃至（ｅ）は平面図であり、
（ｆ）乃至（ｊ）は（ａ）乃至（ｅ）の断面図である。FIG. 3 is a manufacturing process diagram of a reflective optical coupling device according to a second embodiment of the present invention, in which (a) to (e) are plan views;
(F) to (j) are sectional views of (a) to (e).
【図４】同じく構造を示す図であり、図（ａ）は平面
図、図（ｂ）は正面図、図（ｃ）は側面図、図（ｄ）は
平面図のＤ−Ｄ′断面図である。4A and 4B are views showing the same structure, FIG. 4A is a plan view, FIG. 4B is a front view, FIG. 4C is a side view, and FIG. Is.
【図５】本発明の第３実施例による反射型光結合装置の
構造を示す図であり、図（ａ）は平面図、図（ｂ）は正
面図、図（ｃ）は側面図である。5A and 5B are views showing a structure of a reflection type optical coupling device according to a third embodiment of the present invention, FIG. 5A is a plan view, FIG. 5B is a front view, and FIG. .
【図６】従来例による反射型光結合装置の製造工程図で
あり、（ａ）乃至（ｄ）は平面図であり、（ｅ）乃至
（ｈ）は（ａ）乃至（ｄ）の断面図である。6A to 6D are manufacturing process diagrams of a reflection-type optical coupling device according to a conventional example, FIGS. 6A to 6D are plan views, and FIGS. 6E to 6H are cross-sectional views of FIGS. Is.
【図７】同じく構造を示す図であり、図（ａ）は平面
図、図（ｂ）は正面図、図（ｃ）は平面図のＦ−Ｆ′断
面図である。7A and 7B are views showing the same structure, FIG. 7A is a plan view, FIG. 7B is a front view, and FIG. 7C is a sectional view taken along the line FF ′ of the plan view.
１ 発光チップ ２ 受光チップ ３，４ 発光側リード端子 ５，６ 受光側リード端子 ７ 接続用フレーム部 １０ リードフレーム １１ 透光性樹脂 １２ 発光側透光性樹脂体 １３ 受光側透光性樹脂体 １６ 遮光性樹脂体 DESCRIPTION OF SYMBOLS 1 Light emitting chip 2 Light receiving chip 3,4 Light emitting side lead terminal 5,6 Light receiving side lead terminal 7 Connection frame part 10 Lead frame 11 Light transmitting resin 12 Light emitting side light transmitting resin body 13 Light receiving side light transmitting resin body 16 Light-shielding resin body
Claims (4)
リード端子および前記一対の発光側リード端子の一方の
端子と前記一対の受光側リード端子の一方の端子とを連
結する接続用フレーム部から構成されるリードフレーム
と、 該リードフレームの前記発光側および受光側リード端子
にそれぞれボンティングされた発光チップおよび受光チ
ップと、 該両チップを各々独立して透光性樹脂にてモールドする
ことにより、前記接続用フレーム部の両側に一定間隔を
もって並置される発光側透光性樹脂体および受光側透光
性樹脂体と、 一定間隔をもって並置された前記両透光性樹脂体の相対
する側面間に形成された遮光性物質と、 を備えてなることを特徴とする反射型光結合装置。1. A connecting frame portion for connecting one terminal of a pair of light emitting side lead terminals, a pair of light receiving side lead terminals, and the pair of light emitting side lead terminals to one terminal of the pair of light receiving side lead terminals. And a light-emitting chip and a light-receiving chip respectively bonded to the light-emitting-side and light-receiving-side lead terminals of the lead frame, and both chips are independently molded with a light-transmissive resin. Thus, the light-transmitting-side translucent resin body and the light-receiving-side translucent resin body are juxtaposed on both sides of the connecting frame portion at regular intervals, and the opposite side surfaces of the both translucent resin bodies juxtaposed at regular intervals. A reflection-type optical coupling device, comprising: a light-shielding substance formed between the two.
の相対する側面と前記接続用フレームに囲まれた空間に
遮光性樹脂を注入、硬化された遮光性樹脂体であること
を特徴とする請求項１記載の反射型光結合装置。2. The light-shielding substance is a light-shielding resin body obtained by injecting and curing the light-shielding resin into a space surrounded by opposite side surfaces of the both light-transmitting resin bodies and the connection frame. The reflective optical coupling device according to claim 1, which is characterized in that.
より延設され略９０度の角度で折曲された補助フレーム
と前記接続用フレームと前記両透光性樹脂体の相対する
側面部とに囲まれた空間に遮光性樹脂を注入、硬化され
た遮光性樹脂体であることを特徴とする請求項１記載の
反射型光結合装置。3. The light shielding material extends from the connection frame and is bent at an angle of about 90 degrees, an auxiliary frame, the connection frame, and side surfaces of the translucent resin body facing each other. The reflection type optical coupling device according to claim 1, wherein the reflection type optical coupling device is a light shielding resin body obtained by injecting and curing a light shielding resin into a space surrounded by.
の相対する側面間の前記接続用フレーム上に搭載された
金属壁あるいは遮光性樹脂壁であることを特徴とする請
求項１記載の反射型光結合装置。4. The light-shielding substance is a metal wall or a light-shielding resin wall mounted on the connecting frame between opposite side surfaces of the both light-transmitting resin bodies. The reflective optical coupling device described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4707195A JP3143351B2 (en) | 1995-03-07 | 1995-03-07 | Reflective optical coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4707195A JP3143351B2 (en) | 1995-03-07 | 1995-03-07 | Reflective optical coupling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08250762A true JPH08250762A (en) | 1996-09-27 |
| JP3143351B2 JP3143351B2 (en) | 2001-03-07 |
Family
ID=12764942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4707195A Expired - Fee Related JP3143351B2 (en) | 1995-03-07 | 1995-03-07 | Reflective optical coupling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3143351B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002061853A1 (en) * | 2001-01-30 | 2002-08-08 | Infineon Technologies Ag | A lead frame for an opto-coupler |
| JP2007088026A (en) * | 2005-09-20 | 2007-04-05 | Rohm Co Ltd | Optical communication module and its fabrication process |
| KR101049487B1 (en) * | 2010-05-12 | 2011-07-15 | 주식회사 루멘스 | Light emitting diode package |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6288222B1 (en) | 2000-02-16 | 2001-09-11 | Neose Technologies, Inc. | Method of filtration of a dairy stream |
| BRPI0618261A2 (en) | 2005-11-04 | 2011-08-23 | Arla Foods Amba | concentrate and composition derived from a naturally occurring sialyl lactose enriched milk product, process for preparing same and product |
-
1995
- 1995-03-07 JP JP4707195A patent/JP3143351B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002061853A1 (en) * | 2001-01-30 | 2002-08-08 | Infineon Technologies Ag | A lead frame for an opto-coupler |
| JP2007088026A (en) * | 2005-09-20 | 2007-04-05 | Rohm Co Ltd | Optical communication module and its fabrication process |
| KR101049487B1 (en) * | 2010-05-12 | 2011-07-15 | 주식회사 루멘스 | Light emitting diode package |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3143351B2 (en) | 2001-03-07 |
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