JPH0350335U - - Google Patents

Info

Publication number
JPH0350335U
JPH0350335U JP11197589U JP11197589U JPH0350335U JP H0350335 U JPH0350335 U JP H0350335U JP 11197589 U JP11197589 U JP 11197589U JP 11197589 U JP11197589 U JP 11197589U JP H0350335 U JPH0350335 U JP H0350335U
Authority
JP
Japan
Prior art keywords
substrate
processed
mounting tray
low
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11197589U
Other languages
English (en)
Other versions
JP2501798Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11197589U priority Critical patent/JP2501798Y2/ja
Publication of JPH0350335U publication Critical patent/JPH0350335U/ja
Application granted granted Critical
Publication of JP2501798Y2 publication Critical patent/JP2501798Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)

Description

【図面の簡単な説明】
第１図及び第２図は本考案低温処理装置の一つ
の実施例を示すもので、第１図は平面図、第２図
は第１図の１−１線に沿う断面図、第３図Ａ乃至
Ｅは本考案低温処理装置の基板搭載トレーの各別
の変形例を示す平面図、第４図Ａ，Ｂは本考案低
温処理装置の他の実施例を示す断面図で、同図Ａ
は被処理基板載置時における状態を示し、同図Ｂ
は冷却時における状態を示す。 符号の説明、１，１ａ……基板搭載トレー、３
……被処理基板、７，８，９，１１，１３，１ａ
……形状記憶合金。

Claims (1)

  1. 【実用新案登録請求の範囲】 低温下で被処理基板を処理する低温処理装置に
    おいて、 被処理基板を搭載する基板搭載トレーの少なく
    とも一部を形状記憶合金により構成し、 上記基板搭載トレー上の被処理基板が、低温下
    で上記形状記憶合金の働きにより基板搭載トレー
    に対してより広い面積にて密着せしめられるよう
    にしてなる ことを特徴とする低温処理装置。
JP11197589U 1989-09-25 1989-09-25 低温処理装置 Expired - Fee Related JP2501798Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11197589U JP2501798Y2 (ja) 1989-09-25 1989-09-25 低温処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11197589U JP2501798Y2 (ja) 1989-09-25 1989-09-25 低温処理装置

Publications (2)

Publication Number Publication Date
JPH0350335U true JPH0350335U (ja) 1991-05-16
JP2501798Y2 JP2501798Y2 (ja) 1996-06-19

Family

ID=31660432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11197589U Expired - Fee Related JP2501798Y2 (ja) 1989-09-25 1989-09-25 低温処理装置

Country Status (1)

Country Link
JP (1) JP2501798Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106460276A (zh) * 2015-03-24 2017-02-22 株式会社爱克斯山崎 多片布的缝合以及其缝合用缝纫机

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106460276A (zh) * 2015-03-24 2017-02-22 株式会社爱克斯山崎 多片布的缝合以及其缝合用缝纫机

Also Published As

Publication number Publication date
JP2501798Y2 (ja) 1996-06-19

Similar Documents

Publication Publication Date Title
JPS63193833U (ja)
JPH0350335U (ja)
JPS6188291U (ja)
JPH0331296U (ja)
JPH038446U (ja)
JPS6239643U (ja)
JPH0258393U (ja)
JPH0323994U (ja)
JPS63197345U (ja)
JPS6444644U (ja)
JPS6379646U (ja)
JPH033744U (ja)
JPS646406U (ja)
JPS63186524U (ja)
JPS61171247U (ja)
JPH0179846U (ja)
JPS6172894U (ja)
JPS624093U (ja)
JPH0170341U (ja)
JPH0361352U (ja)
JPS6232542U (ja)
JPS6261641U (ja)
JPS62171113U (ja)
JPS63198124U (ja)
JPH028144U (ja)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees