JPH0350335U - - Google Patents

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は本考案低温処理装置の一つ
の実施例を示すもので、第１図は平面図、第２図
は第１図の１−１線に沿う断面図、第３図Ａ乃至
Ｅは本考案低温処理装置の基板搭載トレーの各別
の変形例を示す平面図、第４図Ａ，Ｂは本考案低
温処理装置の他の実施例を示す断面図で、同図Ａ
は被処理基板載置時における状態を示し、同図Ｂ
は冷却時における状態を示す。 符号の説明、１，１ａ……基板搭載トレー、３
……被処理基板、７，８，９，１１，１３，１ａ
……形状記憶合金。 Figures 1 and 2 show one embodiment of the low temperature processing apparatus of the present invention, where Figure 1 is a plan view, Figure 2 is a sectional view taken along line 1-1 in Figure 1, and Figure 3 is a cross-sectional view taken along line 1-1 in Figure 1. A to E are plan views showing different modifications of the substrate mounting tray of the low temperature processing apparatus of the present invention, and FIGS. 4A and 4B are sectional views showing other embodiments of the low temperature processing apparatus of the present invention.
B shows the state when the substrate to be processed is placed;
indicates the state during cooling. Explanation of symbols, 1, 1a... Board mounting tray, 3
...Substrate to be processed, 7, 8, 9, 11, 13, 1a
...Shape memory alloy.

Claims (1)

【実用新案登録請求の範囲】 低温下で被処理基板を処理する低温処理装置に
おいて、 被処理基板を搭載する基板搭載トレーの少なく
とも一部を形状記憶合金により構成し、 上記基板搭載トレー上の被処理基板が、低温下
で上記形状記憶合金の働きにより基板搭載トレー
に対してより広い面積にて密着せしめられるよう
にしてなる ことを特徴とする低温処理装置。[Claims for Utility Model Registration] In a low-temperature processing apparatus that processes a substrate to be processed at low temperatures, at least a portion of a substrate mounting tray on which a substrate to be processed is mounted is made of a shape memory alloy, and the substrate on the substrate mounting tray is A low-temperature processing apparatus characterized in that a substrate to be processed can be brought into close contact with a substrate mounting tray over a wider area by the action of the shape memory alloy at low temperatures.