JPH0342210A - Cutting method of slicing machine - Google Patents
Cutting method of slicing machineInfo
- Publication number
- JPH0342210A JPH0342210A JP17730989A JP17730989A JPH0342210A JP H0342210 A JPH0342210 A JP H0342210A JP 17730989 A JP17730989 A JP 17730989A JP 17730989 A JP17730989 A JP 17730989A JP H0342210 A JPH0342210 A JP H0342210A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- displacement
- wafer
- blade
- ingot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 14
- 238000006073 displacement reaction Methods 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 16
- 235000012431 wafers Nutrition 0.000 claims description 30
- 230000002093 peripheral effect Effects 0.000 abstract description 15
- 238000001514 detection method Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はスライシングマシンの切断方法に係り、特に柱
状体材料から薄片状のウェハを切断するスライシングマ
シンの切断方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cutting method using a slicing machine, and more particularly to a cutting method using a slicing machine for cutting a flaky wafer from a columnar material.
一般に、半導体ウェハは柱状体に形成されたシリコンイ
ンゴットからスライシングマシンの内周刃によって薄片
状に切り出されて製造される。内周刃は合金と呼ばれる
ドーナツ状に形成された金属の薄板からなるブレードで
、その内周縁にはダイヤモンド砥粒が固着され、回転し
ている内周刃に対してシリコンインゴットを水平に移動
することにより半導体ウェハに切断する。内周刃は切断
を重ねるにつれて目詰まり、砥粒の摩耗及び張り上げ精
度の不均一等により、刃先の切断抵抗が部位によって変
化する。このため、インゴットを切り込むにつれて刃先
が切断面からずれ、ウェハを所望の平坦形状に切断でき
ない原因となっている。Generally, semiconductor wafers are manufactured by cutting a silicon ingot formed into a columnar body into thin pieces using an inner circumferential blade of a slicing machine. The inner peripheral blade is a blade made of a donut-shaped metal thin plate called an alloy. Diamond abrasive grains are fixed to the inner peripheral edge of the blade, and the silicon ingot is moved horizontally against the rotating inner peripheral blade. By cutting into semiconductor wafers. As the inner circumferential blade repeatedly cuts, the cutting resistance of the cutting edge changes depending on the part due to clogging, abrasive grain wear, uneven tensioning accuracy, etc. For this reason, as the ingot is cut, the cutting edge shifts from the cutting surface, causing the wafer to be unable to be cut into a desired flat shape.
即ち、ウェハの形状は、切断刃がインゴットを切断した
軌跡であり、切断刃の変位とウェハの表面形状との間に
は高い相関関係が認められる。That is, the shape of the wafer is the trajectory of the cutting blade cutting the ingot, and a high correlation is recognized between the displacement of the cutting blade and the surface shape of the wafer.
切断刃変位が第７図のように変動すれば、つ工ハの表面
形状も第７図と同じような形状となり、ブレード変位と
ウェハの表面形状との間にはほぼ相似関係が見られる。If the cutting blade displacement changes as shown in FIG. 7, the surface shape of the wafer will also have a shape similar to that shown in FIG. 7, and a substantially similar relationship can be seen between the blade displacement and the wafer surface shape.
更に、ブレード変位が第８図のようなきれいな凸状の場
合は、ウェハの切断送り方向の断面形状だけでなく、切
断送り直角方向の断面形状も同様の凸状となり、椀形の
ウェハが切断されることが知られている。Furthermore, if the blade displacement has a clean convex shape as shown in Figure 8, not only the cross-sectional shape of the wafer in the cutting feed direction but also the cross-sectional shape in the direction perpendicular to the cutting feed will be similarly convex, and the bowl-shaped wafer will be cut. It is known that
従って、切断刃変位をコントロールすることによって、
ウェハの形状もコントロールすることができる。Therefore, by controlling the cutting blade displacement,
The shape of the wafer can also be controlled.
そこで、従来、実開昭６１−１２２８１１号公報記載の
結晶切断装置が提案されている。同公報によれば、内周
刃の変位を非接触式変位計で検出し、この検出データに
基づいてインゴットを軸方向に上下動して補正し、内周
刃がインゴットに対して水平となるよう制御し、インゴ
ットを切断するという方法である。Therefore, a crystal cutting device described in Japanese Utility Model Application Publication No. 61-122811 has been proposed. According to the publication, the displacement of the inner peripheral blade is detected by a non-contact displacement meter, and based on this detection data, the ingot is moved up and down in the axial direction to correct it, so that the inner peripheral blade becomes horizontal to the ingot. This is a method of controlling and cutting the ingot.
〔発明が解決しようとする！Ｊ！り
しかしながら、ウェハの表面形状は、水平面に限らず、
湾曲形状を必要とされる場合がある。[Invention tries to solve! J! However, the surface shape of the wafer is not limited to the horizontal plane.
A curved shape may be required.
本発明はこのような事情に鑑みてなされたもので、ウェ
ハを精度よく所定の湾曲形状に切断することのできるス
ライシングマシンの切断方法を提供することを目的とす
る。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a cutting method using a slicing machine that can accurately cut a wafer into a predetermined curved shape.
本発明は、前記目的を達成するために、装置本体に摺動
自在に支持された送りテーブルに、テーブルの移動方向
に直交して割出し送りするようにして柱状体材料が取り
付けられ、回転する切断刃によって該柱状体材料を薄片
状のウェハに切断するスライシングマシンの切断方法に
於いて、柱状体材料切断時の切断刃の変位を検出し、該
検出値とウェハが所定の湾曲形状となるよう予め設定さ
れた切断刃の変位の基準値とを比較し、前記柱状体材料
の軸方向移動量を制御して基準値との差分を無くすよう
補正して切断を行うことを特徴としている。In order to achieve the above object, the present invention has a columnar material attached to a feeding table slidably supported by an apparatus main body so as to be indexed and fed perpendicular to the moving direction of the table, and rotated. In the cutting method of a slicing machine that uses a cutting blade to cut the columnar material into flaky wafers, the displacement of the cutting blade when cutting the columnar material is detected, and the detected value and the wafer form a predetermined curved shape. The present invention is characterized in that cutting is performed by comparing the displacement of the cutting blade with a preset reference value, and controlling the amount of axial movement of the columnar material to correct the difference with the reference value.
本発明によれば、柱状体材料の切断中に切断刃の変位を
逐次検出し、この切断刃の変位量を予め設定された基準
値と比較してウェハが椀形等の所定の湾曲形状となるよ
う柱状体材料の軸方向駆動量を算出し、この軸方向駆動
量に基づいて柱状体材料を軸方向に駆動して切断刃の変
位を制御する。According to the present invention, the displacement of the cutting blade is sequentially detected while cutting the columnar material, and the amount of displacement of the cutting blade is compared with a preset reference value to determine whether the wafer has a predetermined curved shape such as a bowl shape. The axial drive amount of the columnar material is calculated so that the columnar material is driven in the axial direction based on this axial drive amount, and the displacement of the cutting blade is controlled by driving the columnar material in the axial direction.
これにより、ウェハを椀形等の所望の曲線形状に切断す
ることができる。Thereby, the wafer can be cut into a desired curved shape such as a bowl shape.
以下、添付図面に従って本発明に係るスライシングマシ
ンの切断方法の好ましい実施例を詳説する。Hereinafter, preferred embodiments of the cutting method of the slicing machine according to the present invention will be described in detail with reference to the accompanying drawings.
第１図は本発明に使用されるスライシングマシンの概略
を示す斜視図である。第１図に示すように、第１図のス
ライシングマシンは主に本体１０、送りテーブル１２、
支柱１４、割り出しスライダ１６等から構成されている
。本体１０には送りテーブルＩ２が矢印Ａ又はＢ方向に
摺動自在に設けられている。また、テーブル１２には支
柱（４が立設されると共に、支ｕ１４の刺刃には割り出
しスライダ１６が設けられ、割り出しスライダ１６はイ
ンゴット１８を上下動自在に支持している。FIG. 1 is a perspective view schematically showing a slicing machine used in the present invention. As shown in FIG. 1, the slicing machine shown in FIG. 1 mainly includes a main body 10, a feeding table 12,
It is composed of a support column 14, an index slider 16, and the like. A feed table I2 is provided on the main body 10 so as to be slidable in the direction of arrow A or B. Further, a support (4) is erected on the table 12, and an indexing slider 16 is provided on the stabbing blade of the support u14, and the indexing slider 16 supports an ingot 18 in a vertically movable manner.
割り出しスライダ１６には後述するようにインゴット１
８の位置を制御する図示しない圧電素子が内蔵されてい
る。本体１０中央部には内周刃２０が配設され、内周刃
２０の近傍には内周刃２０の軸方向の変位を検出する変
位センサ３２（第３図図示）が設置されている。Ingot 1 is placed on the indexing slider 16 as described later.
A piezoelectric element (not shown) for controlling the position of 8 is built-in. An inner peripheral blade 20 is disposed at the center of the main body 10, and a displacement sensor 32 (shown in FIG. 3) is installed near the inner peripheral blade 20 to detect displacement of the internal peripheral blade 20 in the axial direction.
第２図は割り出しスライダ１６の構造を示した略断面図
、第３図は本発明に係るスライシングマシンの切断方法
の制御系を示した説明図である。FIG. 2 is a schematic sectional view showing the structure of the indexing slider 16, and FIG. 3 is an explanatory view showing a control system for the cutting method of the slicing machine according to the present invention.
第２１！Ｉに示すように、割り出しスライダ１６はイン
ゴット１８を保持する保持具２６を有しており、保持具
２６には第３図に示すように４Ｎの圧電素子２８Ａ、２
８Ｂ、２８Ｃ，２８Ｄが内蔵されている（第２図では２
個のみ図示）。圧電素子２８Ａ〜２８Ｄにはピエゾ素子
等が好適である。圧電素子２８Ａ〜２８Ｄはスライシン
グマシン内部の制御部３０と接続され、制御部３０から
の作動信号によって駆動され、インゴット１８の上下位
置を制御する。21st! As shown in FIG. 3, the index slider 16 has a holder 26 that holds the ingot 18, and the holder 26 has 4N piezoelectric elements 28A and 2 as shown in FIG.
8B, 28C, and 28D are built in (2 in Figure 2).
(only pieces shown). A piezo element or the like is suitable for the piezoelectric elements 28A to 28D. The piezoelectric elements 28A to 28D are connected to a control unit 30 inside the slicing machine, are driven by an operation signal from the control unit 30, and control the vertical position of the ingot 18.
また、制御部３０には加工後の半導体ウェハが所定形状
となるために必要なブレード変位の基準カーブ、例えば
球面の一部、サインカーブの一部等のデータが予め入力
されている。更に、制御部３０は内周刃２０の近傍に設
置された変位センサ３２と接続され、変位センサ３２は
インゴット１８を切断中の内周刃２０の軸方向の変位量
を検出し、この変位量は制御部３０に逐次、人力されて
いる。制御部３０はこの変位量とウェハが椀形となるよ
うに予め入力された切断刃変位の基準カーブとを比較し
て切断刃の変位がが基準カーブに乗るよう切断中にイン
ボッ）１８を回転軸方向に駆動する出力信号を各圧電素
子２８Ａ〜２８Ｄに出力する。このときの内周刃２０の
変位量とインゴット１８の軸方向駆動量との関係はフィ
ードバック制御によって制御される。Furthermore, data on a reference curve of the blade displacement necessary for the processed semiconductor wafer to have a predetermined shape, such as a part of a spherical surface, a part of a sine curve, etc., is input into the control unit 30 in advance. Furthermore, the control unit 30 is connected to a displacement sensor 32 installed near the inner peripheral blade 20, and the displacement sensor 32 detects the amount of displacement in the axial direction of the inner peripheral blade 20 while cutting the ingot 18. are manually input to the control section 30 one after another. The control unit 30 compares this amount of displacement with a reference curve of cutting blade displacement inputted in advance so that the wafer becomes bowl-shaped, and rotates the inboard 18 during cutting so that the displacement of the cutting blade matches the reference curve. An output signal for driving in the axial direction is output to each piezoelectric element 28A to 28D. At this time, the relationship between the displacement amount of the inner circumferential cutter 20 and the axial drive amount of the ingot 18 is controlled by feedback control.
前記の如く構成したスライシングマシンヲ用いた本発明
に係る方法はインゴット１８を切断する場合以下のよう
に行われる。例えば、第４図に示される軌跡で切断した
い場合、予め制８Ｂ３０に加工後のウェハを椀形とする
第４図のブレード変位データ（基準カーブ）を入力して
おく。切断中、制御＃部３０には逐次、内周刃２０の変
位量が入力されており、この変位量と予め人力された前
記基準力、−ブとを比較することにより、インゴット■
８の軸方向駆動量が算出される。そして、切断中、制御
部３０から各圧電素子２８Ａ〜２８Ｄに前記軸方向駆動
量に応じた駆動信号が出力される。次いで、各圧電素子
２８Ａ〜２８Ｄはこの駆動信号に基づいてインゴット１
８を軸方向に適宜微動させ、加工後のウェハが第６図に
示される椀形となるようインゴット１８が軸方向に移動
して切断される。The method according to the present invention using the slicing machine configured as described above is performed as follows when cutting the ingot 18. For example, if it is desired to cut along the trajectory shown in FIG. 4, the blade displacement data (reference curve) shown in FIG. 4, which makes the wafer after processing into a bowl shape, is input in advance into the control 8B30. During cutting, the amount of displacement of the inner peripheral blade 20 is sequentially inputted to the control # section 30, and by comparing this amount of displacement with the reference force, -b, manually applied in advance, the ingot
The axial drive amount of 8 is calculated. During cutting, a drive signal corresponding to the axial drive amount is output from the control section 30 to each of the piezoelectric elements 28A to 28D. Next, each piezoelectric element 28A to 28D moves the ingot 1 based on this drive signal.
8 is appropriately moved slightly in the axial direction, and the ingot 18 is moved and cut in the axial direction so that the processed wafer becomes bowl-shaped as shown in FIG.
第５図は第４図のΔＢ拡大図で、切断時の基準カーブと
内周刃２０の変位量との関係を示している。即ち、切断
中、第５図のように変位量が基準カーブ（破ｖＡ）から
はずれた時、制御部３０は圧電素子２８Ａ〜２８Ｄを作
動してインゴット１８を軸方向へ動かし、内周刃２０の
変位量が基準カーブに戻るように制御する。FIG. 5 is an enlarged view of ΔB in FIG. 4, showing the relationship between the reference curve during cutting and the amount of displacement of the inner peripheral blade 20. That is, during cutting, when the amount of displacement deviates from the reference curve (broken vA) as shown in FIG. control so that the amount of displacement returns to the reference curve.
第６図は、切断後のウェハ３４の端面形状を示す側面図
である。第６図のウェハ３４は切断後に例えば約ＩＯμ
ｍの反り量を有するように椀形に切断されたものである
。FIG. 6 is a side view showing the shape of the end face of the wafer 34 after cutting. After cutting, the wafer 34 in FIG.
It is cut into a bowl shape with a warp amount of m.
このように、切断中の内周刃２０の変位量を補正してウ
ェハが椀形となるようインゴット１８の軸方向位置を制
御しているので加工後のウェハを正確な椀形に切断する
ことができる。In this way, since the axial position of the ingot 18 is controlled so that the wafer becomes bowl-shaped by correcting the amount of displacement of the inner peripheral blade 20 during cutting, the wafer after processing can be cut into an accurate bowl-shape. I can do it.
以上説明したように、本発明に係るスライシングマシン
の切断方法によれば、切断中の切断刃の変位量を検出し
、この変位量と基２１１１値を比較して、その差分を無
くすよう補正しながら柱状体材料の切断を行う。これに
より、ウェハを所定の湾曲形状に切断することができる
。As explained above, according to the cutting method of the slicing machine according to the present invention, the amount of displacement of the cutting blade during cutting is detected, this amount of displacement is compared with the base 2111 value, and correction is made to eliminate the difference. While cutting the columnar material. Thereby, the wafer can be cut into a predetermined curved shape.
第１図は本発明に係るスライシングマシンの切断方法に
使用されるスライシングマシンの概略を示す斜視図、第
２図はインゴット保持部の１１ｔ造を示した略断面図、
第３図は本発明に係るスライシングマシンの切断方法の
＠御系を示した説明図、第４図は内周刃の変位量の基準
カーブを示したグラフ、第５図は第４図の一部拡大図、
第６図は切断後のウェハの形状を示す側面図、第７図、
第８図は切断刃の変位と切断ストローク〈インゴット送
り量）との関係を示した特性図である。
１８・・・インゴット、 ２０・・・内周刃、 ２
８Ａ。
２８Ｂ、２８Ｃ，２８Ｄ・・・圧電素子、 ３０・・
・制御部、 ３２・・・変位センサ。FIG. 1 is a perspective view schematically showing a slicing machine used in the cutting method of a slicing machine according to the present invention, and FIG. 2 is a schematic cross-sectional view showing an 11-t structure of an ingot holding part.
Fig. 3 is an explanatory diagram showing the @ control system of the cutting method of the slicing machine according to the present invention, Fig. 4 is a graph showing the reference curve of the displacement amount of the inner circumferential blade, and Fig. Enlarged view of section,
Fig. 6 is a side view showing the shape of the wafer after cutting; Fig. 7;
FIG. 8 is a characteristic diagram showing the relationship between the displacement of the cutting blade and the cutting stroke (ingot feed amount). 18... Ingot, 20... Inner peripheral blade, 2
8A. 28B, 28C, 28D...piezoelectric element, 30...
-Control unit, 32...Displacement sensor.
Claims (1)
ーブルの移動方向に直交して割出し送りするようにして
柱状体材料が取り付けられ、回転する切断刃によって該
柱状体材料を薄片状のウェハに切断するスライシングマ
シンの切断方法に於いて、 柱状体材料切断時の切断刃の変位を検出し、該検出値と
ウェハが所定の湾曲形状となるよう予め設定された切断
刃の変位の基準値とを比較し、前記柱状体材料の軸方向
移動量を制御して基準値との差分を無くすよう補正して
切断を行うことを特徴とするスライシングマシンの切断
方法。[Claims] A columnar material is attached to a feeding table slidably supported by the device main body so as to be indexed and fed perpendicular to the moving direction of the table, and the columnar material is cut by a rotating cutting blade. In the cutting method of a slicing machine that cuts material into flaky wafers, the displacement of the cutting blade when cutting the columnar material is detected, and the detected value and the wafer are cut in a preset shape so that the wafer has a predetermined curved shape. A cutting method for a slicing machine, characterized in that the blade displacement is compared with a reference value, and the axial movement amount of the columnar material is controlled to correct and cut so as to eliminate the difference with the reference value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1177309A JP2599996B2 (en) | 1989-07-10 | 1989-07-10 | Cutting method of slicing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1177309A JP2599996B2 (en) | 1989-07-10 | 1989-07-10 | Cutting method of slicing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0342210A true JPH0342210A (en) | 1991-02-22 |
| JP2599996B2 JP2599996B2 (en) | 1997-04-16 |
Family
ID=16028731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1177309A Expired - Fee Related JP2599996B2 (en) | 1989-07-10 | 1989-07-10 | Cutting method of slicing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2599996B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03272809A (en) * | 1990-03-22 | 1991-12-04 | Toyo A Tec Kk | Cutting method and slicing apparatus for workpiece |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61122811U (en) * | 1985-01-19 | 1986-08-02 | ||
| JPS63134206A (en) * | 1986-11-26 | 1988-06-06 | 三菱マテリアル株式会社 | Method of detecting defective cutting of wafer |
-
1989
- 1989-07-10 JP JP1177309A patent/JP2599996B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61122811U (en) * | 1985-01-19 | 1986-08-02 | ||
| JPS63134206A (en) * | 1986-11-26 | 1988-06-06 | 三菱マテリアル株式会社 | Method of detecting defective cutting of wafer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03272809A (en) * | 1990-03-22 | 1991-12-04 | Toyo A Tec Kk | Cutting method and slicing apparatus for workpiece |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2599996B2 (en) | 1997-04-16 |
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