JPS61122811U - - Google Patents
Info
- Publication number
- JPS61122811U JPS61122811U JP559385U JP559385U JPS61122811U JP S61122811 U JPS61122811 U JP S61122811U JP 559385 U JP559385 U JP 559385U JP 559385 U JP559385 U JP 559385U JP S61122811 U JPS61122811 U JP S61122811U
- Authority
- JP
- Japan
- Prior art keywords
- detector
- feeding mechanism
- cutting
- rotating blade
- axial displacement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第1図は本考案を実施した結晶切断装置の一例
についての要部説明図、第2図は従来の結晶切断
装置の概略説明図で、イは側面図、ロは平面図で
ある。第3図はブレード変位とウエハの反りとの
相関関係を示すグラフで、イは結晶インゴツト切
削時のブレード刃先の挙動を表示し、ロは得られ
たウエハの反りを示している。
図中、1:ダイヤモンド切刃、2:ブレード、
3:結晶インゴツト、4:ウエハ、5:支持板、
6:噴射ノズル、7:検出器、8:制御機構、9
:送り機構、10:理想的切断面。
FIG. 1 is an explanatory view of essential parts of an example of a crystal cutting apparatus embodying the present invention, and FIG. 2 is a schematic explanatory view of a conventional crystal cutting apparatus, with A being a side view and B being a plan view. FIG. 3 is a graph showing the correlation between blade displacement and wafer warpage, where (a) shows the behavior of the blade edge during cutting of a crystal ingot, and (b) shows the warpage of the obtained wafer. In the figure, 1: diamond cutting edge, 2: blade,
3: Crystal ingot, 4: Wafer, 5: Support plate,
6: Injection nozzle, 7: Detector, 8: Control mechanism, 9
: Feeding mechanism, 10: Ideal cutting surface.
Claims (1)
を軸方向に相対移動させる送り機構と、前記切削
部分の近傍にあつて回転ブレードの軸方向変位を
検出する検出器と、該検出器からの信号に基づい
て前記軸方向変位を解消すべく前記送り機構に指
令を送る制御機構とを具備せしめたことを特徴と
する結晶切断装置。 a feeding mechanism that relatively moves the crystal ingot and a rotating blade for cutting it in the axial direction; a detector that is located near the cutting portion and detects the axial displacement of the rotating blade; and based on a signal from the detector. and a control mechanism that sends a command to the feeding mechanism to eliminate the axial displacement.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP559385U JPS61122811U (en) | 1985-01-19 | 1985-01-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP559385U JPS61122811U (en) | 1985-01-19 | 1985-01-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61122811U true JPS61122811U (en) | 1986-08-02 |
Family
ID=30482238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP559385U Pending JPS61122811U (en) | 1985-01-19 | 1985-01-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61122811U (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01275010A (en) * | 1988-04-26 | 1989-11-02 | Mazda Motor Corp | Slicing machine |
JPH031536A (en) * | 1989-05-29 | 1991-01-08 | Naoetsu Denshi Kogyo Kk | Method and device for halving signal wafer of semiconductor |
JPH0342210A (en) * | 1989-07-10 | 1991-02-22 | Tokyo Seimitsu Co Ltd | Cutting method of slicing machine |
JPH0349906A (en) * | 1989-07-17 | 1991-03-04 | Toyo Eitetsuku Kk | Slicing device |
JPH0349907A (en) * | 1989-07-17 | 1991-03-04 | Toyo Eitetsuku Kk | Slicing device |
JPH03173610A (en) * | 1989-02-27 | 1991-07-26 | Wacker Chemitronic Ges Elektron Grundstoffe Mbh | Method of slicing rod-like work piece into sheets using inner periphery blade saw and inner periphery blade saw using said method |
JPH0415508U (en) * | 1990-05-29 | 1992-02-07 | ||
JPH08267446A (en) * | 1995-03-23 | 1996-10-15 | Wacker Siltronic G Fuer Halbleitermaterialien Mbh | Wire saw and method to cut wafer from workpiece |
-
1985
- 1985-01-19 JP JP559385U patent/JPS61122811U/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01275010A (en) * | 1988-04-26 | 1989-11-02 | Mazda Motor Corp | Slicing machine |
JPH03173610A (en) * | 1989-02-27 | 1991-07-26 | Wacker Chemitronic Ges Elektron Grundstoffe Mbh | Method of slicing rod-like work piece into sheets using inner periphery blade saw and inner periphery blade saw using said method |
JPH031536A (en) * | 1989-05-29 | 1991-01-08 | Naoetsu Denshi Kogyo Kk | Method and device for halving signal wafer of semiconductor |
JPH0342210A (en) * | 1989-07-10 | 1991-02-22 | Tokyo Seimitsu Co Ltd | Cutting method of slicing machine |
JPH0349906A (en) * | 1989-07-17 | 1991-03-04 | Toyo Eitetsuku Kk | Slicing device |
JPH0349907A (en) * | 1989-07-17 | 1991-03-04 | Toyo Eitetsuku Kk | Slicing device |
JPH0415508U (en) * | 1990-05-29 | 1992-02-07 | ||
JPH08267446A (en) * | 1995-03-23 | 1996-10-15 | Wacker Siltronic G Fuer Halbleitermaterialien Mbh | Wire saw and method to cut wafer from workpiece |
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