JPH0336140U - - Google Patents
Info
- Publication number
- JPH0336140U JPH0336140U JP9807489U JP9807489U JPH0336140U JP H0336140 U JPH0336140 U JP H0336140U JP 9807489 U JP9807489 U JP 9807489U JP 9807489 U JP9807489 U JP 9807489U JP H0336140 U JPH0336140 U JP H0336140U
- Authority
- JP
- Japan
- Prior art keywords
- package
- terminal hole
- view
- substrate
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂはこの考案の一実施例であるＩＣ
パツケージの平面図および正面図、第２図は第１
図のＩＣパツケージの組立状態を示す正面断面図
、第３図は従来のＩＣパツケージの組立状態を示
す正面図である。
図において、１，６……ＩＣパツケージ、３…
…基板、４……基板３の配線用ピン、５……ＩＣ
パツケージの端子孔である。なお、図中、同一符
号は同一、または相当部分を示す。
Figures 1a and b show an IC that is an embodiment of this invention.
The plan view and front view of the package, Figure 2 is
FIG. 3 is a front sectional view showing the assembled state of the IC package in the figure, and FIG. 3 is a front view showing the assembled state of the conventional IC package. In the figure, 1, 6...IC package, 3...
... Board, 4... Wiring pin of board 3, 5... IC
This is the terminal hole of the package. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
徴とする半導体装置。 A semiconductor device characterized by having a terminal hole for mounting on a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9807489U JPH0336140U (en) | 1989-08-22 | 1989-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9807489U JPH0336140U (en) | 1989-08-22 | 1989-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336140U true JPH0336140U (en) | 1991-04-09 |
Family
ID=31647191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9807489U Pending JPH0336140U (en) | 1989-08-22 | 1989-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336140U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004228451A (en) * | 2003-01-27 | 2004-08-12 | Nec Engineering Ltd | Lsi package element for packaging |
-
1989
- 1989-08-22 JP JP9807489U patent/JPH0336140U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004228451A (en) * | 2003-01-27 | 2004-08-12 | Nec Engineering Ltd | Lsi package element for packaging |