JPH03274021A - Production of liquid crystal display device - Google Patents
Production of liquid crystal display deviceInfo
- Publication number
- JPH03274021A JPH03274021A JP7513090A JP7513090A JPH03274021A JP H03274021 A JPH03274021 A JP H03274021A JP 7513090 A JP7513090 A JP 7513090A JP 7513090 A JP7513090 A JP 7513090A JP H03274021 A JPH03274021 A JP H03274021A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- circuit board
- frame body
- display device
- film carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000000969 carrier Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 32
- 239000000758 substrate Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、液晶テレビやＯＡ機器の液晶デイスプレィ等
に用いられる液晶表示装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a liquid crystal display device used for liquid crystal televisions, liquid crystal displays of office automation equipment, and the like.
［従来の技術］
近年、液晶表示装置は、従来の陰極線管を用いた表示装
置に匹敵する表示性能が得られるようになり、＃＆極線
管に替わって、テレビやデイスプレィに広く用いられて
いる。液晶表示装置には、ドツトマトリックス型やアク
ティブマトリックス型の両者があるが、いずれも液晶パ
ネルと電子部品を搭載した回路基板及び駆動用ＩＣから
構成されている。[Prior Art] In recent years, liquid crystal display devices have come to offer display performance comparable to display devices using conventional cathode ray tubes, and are now widely used in televisions and displays, replacing cathode ray tubes. There is. There are both dot matrix type and active matrix type liquid crystal display devices, and both are composed of a liquid crystal panel, a circuit board on which electronic components are mounted, and a driving IC.
駆動回路モジュールの形態や開動回路基板の取り付は方
法は各種あるが、−数的に液晶パネルの３辺あるいは４
辺に画素本数に対応する外部接続端子が配置され、駆動
用ＩＣを搭載したフィルムキャリアが液晶パネルの外部
接続端子と電子部品を搭載した回路基板を橋渡しする形
態で接続される。There are various forms of the drive circuit module and various methods of mounting the open circuit board, but - numerically, it is possible to install the drive circuit module on three or four sides of the liquid crystal panel.
External connection terminals corresponding to the number of pixels are arranged on the sides, and a film carrier on which a driving IC is mounted is connected to bridge the external connection terminal of the liquid crystal panel and the circuit board on which electronic components are mounted.
液晶表示装置のコンパクト化を実現するために、表示エ
リアの外縁における実装エリアを極力小さくし、かつ薄
型化する必要がある。In order to make the liquid crystal display device more compact, it is necessary to make the mounting area at the outer edge of the display area as small as possible and to make it thinner.
従来例として、薄膜トランジスタ（ＴＰＴ）アクティブ
マトリックス型液晶表示装置における実装形態には、特
開昭６３−２５３３９０号公報に記載される第３図及び
第４図に示すものがある。第３図は従来の実施例におけ
る側面図、第４図は完成前の側面図である。As a conventional example, there is a mounting form of a thin film transistor (TPT) active matrix type liquid crystal display device as shown in FIGS. 3 and 4 described in Japanese Unexamined Patent Publication No. 63-253390. FIG. 3 is a side view of the conventional embodiment, and FIG. 4 is a side view before completion.
図中、（１）は液晶パネル、（２）はカラーフィルタ基
板、（３）はＴＦＴアレイ基板で、ＴＦＴアレイ基板の
各辺の端縁部には内部画素に繋がる外部接続端子（４）
を画素数に対応した数だけ並べて設けである。（５）は
フィルムキャリアで、駆動用ＩＣ（６）がインナーリー
ドボンディング（７）されており、アウターリードの一
端のＩＣ出力端子（８）はアレイ基板の外部接続端子（
４）に異方性導電膜で接続され、アウターリードの他端
（９）は回路基板（１２）の接続パッド（１０）に半田
付は接続される。回路基板上には、駆動用ＩＣのコント
ロール回路を構成するコントロールＩＣの他、ノイズ低
減用部品として抵抗チップ、コンデンサチップ、インダ
クタチップ、ポリウムチップ、トリマーコンデンサ等の
チップ部品からなる電子部品（１５）が搭載されている
。In the figure, (1) is a liquid crystal panel, (2) is a color filter substrate, and (3) is a TFT array substrate. At the edge of each side of the TFT array substrate, there are external connection terminals (4) connected to internal pixels.
are arranged in a number corresponding to the number of pixels. (5) is a film carrier, to which the driving IC (6) is bonded to the inner lead (7), and the IC output terminal (8) at one end of the outer lead is connected to the external connection terminal (8) of the array board.
4) with an anisotropic conductive film, and the other end (9) of the outer lead is connected to a connection pad (10) of a circuit board (12) by soldering. On the circuit board, in addition to the control IC that constitutes the control circuit of the drive IC, there are electronic components (15) consisting of chip components such as resistor chips, capacitor chips, inductor chips, polyimum chips, trimmer capacitors, etc. as noise reduction components. It is installed.
フィルムキャリア（５）には空隙部（１１）が複数箇所
に設けられており、第４図に示すように液晶パネルの各
辺でパネルの外部接続端子及び回路基板の接続バンドに
接続した後、第３図に示すように上記空隙部で内側に折
曲することにより回路基板が中段に位置する形態で液晶
パネル（１）、 回路基板（１２）及び駆動用Ｉ Ｃ（
６）が重層的に配置され、さらに各辺の回路基板は接続
リードにより相互接続される。回路基板（１２）は液晶
パネル（１）及びフィルムキャリア（５）のいずれにも
重ならない部分を有し、この部分に背の高い電子部品（
１５）が取り付けられる。The film carrier (5) is provided with a plurality of voids (11), and as shown in FIG. 4, after connecting each side of the liquid crystal panel to the external connection terminals of the panel and the connection band of the circuit board, As shown in FIG. 3, the liquid crystal panel (1), the circuit board (12), and the driving IC are bent inward at the gap so that the circuit board is located in the middle stage.
6) are arranged in a multilayered manner, and furthermore, the circuit boards on each side are interconnected by connection leads. The circuit board (12) has a portion that does not overlap with either the liquid crystal panel (1) or the film carrier (5), and tall electronic components (
15) is attached.
［発明が解決しようとする課題］
上記構成によると、液晶パネル下部に回路基板及びフィ
ルムキャリアに実装された駆動用ＩＣが配置されるため
、表示エリア外縁の実装寸法を小さくできる利点はある
ものの、フィルムキャリアのアウターリード接続後にベ
ースフィルム（１３）に設けた空隙部（１１）で巻取る
ように折曲し、ざらに各辺に接続された回路基板間を接
続リードで接続する必要があるため組立て作業性が悪い
。また、折曲する空隙部は、ベースフィルムがないため
機械的強度が弱く、接続端子数に伴いフィルムキャリア
の配線パターン（１４）のパターン幅が小さくなると、
断線する危険性があるだけでなく、導体が露出している
ため、パターン間隔が小さくなると電気的絶縁性が低下
するという課題があった。[Problems to be Solved by the Invention] According to the above configuration, since the driving IC mounted on the circuit board and the film carrier is arranged at the bottom of the liquid crystal panel, there is an advantage that the mounting dimensions at the outer edge of the display area can be reduced. After connecting the outer leads of the film carrier, it is necessary to bend the base film (13) so as to wind it up at the gap (11), and connect the circuit boards roughly connected to each side with connection leads. Poor assembly workability. In addition, the mechanical strength of the bending void is weak because there is no base film, and as the pattern width of the wiring pattern (14) of the film carrier becomes smaller as the number of connection terminals increases,
Not only is there a risk of wire breakage, but because the conductor is exposed, there is a problem that electrical insulation deteriorates as the pattern spacing becomes smaller.
この発明は上記のような課題を解消するためになされた
もので、組立て作業性がよく、かつ電気的絶縁性が低下
しないコンパクトな液晶表示装置を得ることを目的とす
る。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a compact liquid crystal display device that is easy to assemble and does not deteriorate in electrical insulation.
［課題を解決するための手段］
本発明による液晶表示装置は、回路基板として上記のチ
ップ状電子部品及びフィルムキャリアの駆動用ＩＣが収
納可能で、かつ液晶パネルが載置可能な立体的枠体回路
基板を使用するように構成したものである。[Means for Solving the Problems] A liquid crystal display device according to the present invention has a three-dimensional frame that can accommodate the above-mentioned chip-shaped electronic components and film carrier driving IC as a circuit board, and on which a liquid crystal panel can be placed. It is configured to use a circuit board.
［作用コ
本発明は、フィルムキャリアを枠体回路基板の側面、さ
らに下面に折り曲げることにより表示エリア外扉部に駆
動用ＩＣや回路基板を配置することがないため、駆動回
路部分の実装構造をコンパクトに形成することが可能と
なる。[Function] The present invention eliminates the need to arrange the drive IC and circuit board on the outer door of the display area by bending the film carrier to the side surface and further down of the frame circuit board. It becomes possible to form it compactly.
［実施例］ 以下、本発明の一実施例を図について説明する。[Example] An embodiment of the present invention will be described below with reference to the drawings.
第１図は３辺に複数個のフィルムキャリアを接続した液
晶パネルを、枠体上部の凹部に載置した状態を示す斜視
図である。また、第２図は、フィルムキャリアのアウタ
ーリード接続完了後の液晶表示装置の側面図である。FIG. 1 is a perspective view showing a state in which a liquid crystal panel with a plurality of film carriers connected on three sides is placed in a recessed portion in the upper part of the frame. Moreover, FIG. 2 is a side view of the liquid crystal display device after the connection of the outer leads of the film carrier is completed.
図中、（１）は液晶パネルで、ＴＦＴアレイ基板（３）
とカラーフィルタ基板（２）がシール（２０）で一体化
され、両基板間には液晶（２１）が充填されている。In the figure, (1) is the liquid crystal panel, and the TFT array substrate (3)
and a color filter substrate (2) are integrated with a seal (20), and a liquid crystal (21) is filled between the two substrates.
アレイ基板上には、内部のＴＰＴのソースラインあるい
はゲートラインに繋がる外部接続端子（４）が形成され
ており、フィルムキャリア（５）のアウターリード部（
８）が異方性導電膜で接続されいてる。フィルムキャリ
アには駆動用ＩＣ（６）がインナーリード部（７）でボ
ンディングされている。External connection terminals (4) connected to the source line or gate line of the internal TPT are formed on the array substrate, and the outer lead part (4) of the film carrier (5) is formed on the array substrate.
8) are connected by an anisotropic conductive film. A driving IC (6) is bonded to the film carrier through an inner lead portion (7).
（３ｏ）は枠体回路基板で、枠体上面には液晶パネルを
収納するための凹部（３１）、枠体側面には駆動用ＩＣ
を収納するための凹部（３２）、枠体下面には電子部品
を収納するための凹部（３３）が成型加工されている。(3o) is a frame circuit board, with a recess (31) on the top of the frame for housing the liquid crystal panel, and a drive IC on the side of the frame.
A recess (32) for accommodating electronic components, and a recess (33) for accommodating electronic components are molded on the lower surface of the frame.
また、枠体下面には、駆動用ＩＣ（６）のコントロール
回路を構成する配線パターン（１４）が形成されている
。Furthermore, a wiring pattern (14) constituting a control circuit for the drive IC (6) is formed on the lower surface of the frame.
液晶パネルの外部接続端子に接続されたフィルムキャリ
アは、枠体上面コーナ一部で枠体側面の凹部に開動用Ｉ
Ｃを収納する状態で直角に折り曲げられ、さらにフィル
ムキャリアのアウターリド他端は枠体表面の接続パッド
に半田付は接続される。さらに、枠体側面の凹部に収納
された駆動用ＩＣ（６）は保護コート（３４）が施され
る。The film carrier connected to the external connection terminal of the liquid crystal panel has an opening I in a recess on the side of the frame at a part of the top corner of the frame.
The film carrier is bent at right angles in a state where the film carrier C is accommodated, and the other end of the outer lid of the film carrier is soldered to a connection pad on the surface of the frame. Further, the drive IC (6) housed in the recess on the side surface of the frame is coated with a protective coat (34).
本発明の枠体回路基板は、例えば導体パターンを形成し
たフィルムを型内転写した射出成型加工された樹脂から
なり、枠体表面及び凹部の一部に所望の導体パターンが
形成されている。枠体上面には液晶パネルを載置するた
めの凹部、枠体側面にはフィルムキャリアの開動用ＩＣ
を収納するための凹部、枠体下面にはチップ部品を収納
するための凹部を有し、該凹部内に転写された配線パタ
ーンに接続されたチップ部品が枠体回路基板から突出し
ない凹部深さを有している。The frame circuit board of the present invention is made of, for example, an injection-molded resin in which a film on which a conductor pattern is formed is transferred in a mold, and a desired conductor pattern is formed on the frame surface and a part of the recess. The top of the frame has a recess for placing the liquid crystal panel, and the side of the frame has an IC for opening the film carrier.
The lower surface of the frame has a recess for storing the chip component, and the depth of the recess is such that the chip component connected to the wiring pattern transferred into the recess does not protrude from the frame circuit board. have.
実装手順は、まず所望の位置に成型加工した凹部を有す
る枠体回路基板の凹部内の配線パターン上に、上記の種
々のチップ部品を電気的接続する。In the mounting procedure, first, the various chip components described above are electrically connected to the wiring patterns in the recesses of the frame circuit board, which has recesses molded into desired positions.
次に該枠体回路基板上部の凹部に複数個のフィルムキャ
リアのアウターリードの一端を、外部接続端子に接続し
た液晶パネルを載置した後、フルムキャリアを枠体に沿
って枠体側面の凹部に開動用ＩＣを収納するように液晶
パネル下部方向に直角に折り曲げ、さらに枠体下面にフ
ィルムキャリアを折り曲げアウターリードの他端を、枠
体表面に形成された接続パッドに接続する。次に枠体側
面の駆動ＩＣを収納した凹部に、ＩＣ保護コートを施す
ことにより組立ては完了する。Next, one end of the outer leads of a plurality of film carriers is placed in the recess on the upper part of the frame circuit board, and the liquid crystal panel connected to the external connection terminal is placed, and then the film carrier is placed along the frame into the recess on the side of the frame. Then, bend the outer lead at right angles toward the bottom of the liquid crystal panel so as to accommodate the opening IC, and then fold the film carrier onto the lower surface of the frame and connect the other end of the outer lead to the connection pad formed on the surface of the frame. Next, an IC protective coat is applied to the recessed portion of the side surface of the frame housing the drive IC, thereby completing the assembly.
上記の実施例では、枠体回路基板として配線パターンを
型内転写した３次元形状の射出成型樹脂基板を使用した
が、立体成型された他の製造方法による樹脂基板やアル
ミ等の金属ベース基板も適用可能である。In the above example, a three-dimensional injection-molded resin substrate with a wiring pattern transferred inside the mold was used as the frame circuit board, but three-dimensionally molded resin substrates made by other manufacturing methods and metal-based substrates made of aluminum or the like may also be used. Applicable.
また、上記の実施例では、開動用ＩＣの収納凹部あるい
は電子部品の収納凹部を枠体回路基板の側面あるいは下
面に配置したが、液晶表示装置に要求される形態によっ
て、それぞれ枠体回路基板の下面あるいは側面に配置し
てもよい。Furthermore, in the above embodiment, the opening IC storage recess or the electronic component storage recess is arranged on the side or bottom surface of the frame circuit board, but depending on the form required for the liquid crystal display device, It may be placed on the bottom or side.
［発明の効果］
以上のように本発明によれば、上記の枠体回路基板の適
用により、従来のように回路基板を接続後にフィルムキ
ャリアを折り曲げたり、各辺の回路基板間をリードで相
互接続する必要がないため、液晶表示装置の駆動回路部
分の組立て作業性が良く、高信頼でコンパクト実装でき
るといった効果がある。[Effects of the Invention] As described above, according to the present invention, by applying the above-mentioned frame circuit board, the film carrier can be bent after connecting the circuit boards as in the conventional case, and the circuit boards on each side can be interconnected with leads. Since there is no need for connection, the drive circuit portion of the liquid crystal display device can be easily assembled, and has the advantage of being highly reliable and compactly packaged.
第↓図は３辺に複数個のフィルムキャリアを接続した液
晶パネルを、枠体上部の凹部に載置した状態を示す斜視
図、第２図はフィルムキャリアのアウターリード接続完
了後の液晶表示装置の側面断面図、第３図は従来の実施
例を示す側面断面図、第４図は第３図のフィルムキャリ
アの折り曲げ前の状態を示す側面図である。
図において（１）は液晶パネル、（２）はカラーフィル
タ基板、（３）はＴＦＴアレイ基板、（４）は外部接続
端子、（５）はフィルムキャリア、（６）は駆動用ＩＣ
１（７）はアウターリードボンディング、（８）はＩＣ
出力端子、（９）はアウターリード、（１０）は接続パ
ッド、（１１）は空隙部、（１２）は回路基板、（１３
）はベースフィルム、（１４）は配線パターン、（１５
）は電子部品、（２０）はシール＋ （２１）は液晶
、（３０）は枠体回路基板、（３１）は液晶パネル収納
凹部、（３２）は駆動用ＩＣ収納凹部、（３３）は電子
部品収納凹部。
（３４）は保護コートである。
なお、図中、同一符号は同一または相当部分を示す。Figure ↓ is a perspective view showing a liquid crystal panel with multiple film carriers connected on three sides placed in the recess at the top of the frame. Figure 2 is a liquid crystal display device after the outer leads of the film carrier have been connected. 3 is a side sectional view showing a conventional embodiment, and FIG. 4 is a side view showing the state of the film carrier of FIG. 3 before being folded. In the figure, (1) is a liquid crystal panel, (2) is a color filter substrate, (3) is a TFT array substrate, (4) is an external connection terminal, (5) is a film carrier, and (6) is a drive IC.
1 (7) is outer lead bonding, (8) is IC
Output terminal, (9) outer lead, (10) connection pad, (11) gap, (12) circuit board, (13)
) is the base film, (14) is the wiring pattern, (15
) is an electronic component, (20) is a seal + (21) is a liquid crystal, (30) is a frame circuit board, (31) is a liquid crystal panel storage recess, (32) is a drive IC storage recess, (33) is an electronic Parts storage recess. (34) is a protective coat. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
載したフィルムキャリアから構成され、上記液晶パネル
と上記回路基板を複数個のフィルムキャリアで接続され
る構造を有する液晶表示装置において、上記回路基板が
電子部品及びフィルムキャリアの駆動用ＩＣの収納と、
液晶パネルの載置が可能な３次元的な枠体回路基板から
なることを特徴とする液晶表示装置の製造方法。In a liquid crystal display device comprising a liquid crystal panel, a circuit board, an electronic component, and a film carrier on which a driving IC is mounted, and having a structure in which the liquid crystal panel and the circuit board are connected by a plurality of film carriers, the circuit board is Storage of electronic components and film carrier drive IC,
A method for manufacturing a liquid crystal display device, comprising a three-dimensional frame circuit board on which a liquid crystal panel can be placed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2075130A JP2822558B2 (en) | 1990-03-23 | 1990-03-23 | Liquid crystal display device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2075130A JP2822558B2 (en) | 1990-03-23 | 1990-03-23 | Liquid crystal display device and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03274021A true JPH03274021A (en) | 1991-12-05 |
| JP2822558B2 JP2822558B2 (en) | 1998-11-11 |
Family
ID=13567309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2075130A Expired - Fee Related JP2822558B2 (en) | 1990-03-23 | 1990-03-23 | Liquid crystal display device and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2822558B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002108231A (en) * | 2000-09-27 | 2002-04-10 | Fujitsu Ltd | Connection member and matrix-type display device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4111174B2 (en) | 2003-08-08 | 2008-07-02 | セイコーエプソン株式会社 | Electro-optical panel, electro-optical device and electronic apparatus |
| JP4207768B2 (en) | 2003-12-16 | 2009-01-14 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112107A (en) * | 1984-06-27 | 1986-01-20 | Rohm Co Ltd | Input circuit of hall element |
| JPS622022U (en) * | 1985-06-19 | 1987-01-08 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60159149A (en) * | 1984-01-27 | 1985-08-20 | Daido Metal Kogyo Kk | Aluminum-base sintered sliding member containing oil and its manufacture |
-
1990
- 1990-03-23 JP JP2075130A patent/JP2822558B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112107A (en) * | 1984-06-27 | 1986-01-20 | Rohm Co Ltd | Input circuit of hall element |
| JPS622022U (en) * | 1985-06-19 | 1987-01-08 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002108231A (en) * | 2000-09-27 | 2002-04-10 | Fujitsu Ltd | Connection member and matrix-type display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2822558B2 (en) | 1998-11-11 |
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| LAPS | Cancellation because of no payment of annual fees |