JPH03243793A - Method for electroplating electrically conductive fine powder - Google Patents
Method for electroplating electrically conductive fine powderInfo
- Publication number
- JPH03243793A JPH03243793A JP4034490A JP4034490A JPH03243793A JP H03243793 A JPH03243793 A JP H03243793A JP 4034490 A JP4034490 A JP 4034490A JP 4034490 A JP4034490 A JP 4034490A JP H03243793 A JPH03243793 A JP H03243793A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- fine powder
- conductive fine
- electroplating
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 28
- 238000009713 electroplating Methods 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 15
- 238000003756 stirring Methods 0.000 claims abstract description 9
- 239000008151 electrolyte solution Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 abstract description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 229910001111 Fine metal Inorganic materials 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000005611 electricity Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は導電性微粉末の電気メッキ方法に関し、詳しく
は導電性微粉末を陰極に接しかつ攪拌、静置を繰り返し
ながら電気メンキを行う方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for electroplating conductive fine powder, and more specifically, a method in which electroplating is performed by bringing conductive fine powder into contact with a cathode and repeating stirring and standing still. Regarding.
本発明方法で得られる電気メッキ導電性微粉末は、導電
性フィラー、触媒、粉末冶金、焼結促進剤などの用途に
適用される。The electroplated conductive fine powder obtained by the method of the present invention can be used as a conductive filler, catalyst, powder metallurgy, sintering accelerator, and the like.
Ｓ電性微粉末に対する金属メッキ方法としては、無電解
メッキを利用する方法が知られている。しかしこの方法
では無電解メッキ液を使用するためにコストが高くなり
、特に金属微粉末の場合にはメッキされる金属とメンキ
金属との組み合わせが限定されるとともに、直換メッキ
しかできないなどの制約を受ける。As a metal plating method for S-conductive fine powder, a method using electroless plating is known. However, this method is expensive because it uses an electroless plating solution, and especially in the case of fine metal powder, the combinations of the metal to be plated and the coating metal are limited, and there are limitations such as direct plating only. receive.
しかしながら現時点では無電解メッキによらない電気メ
ッキを利用する方法は、実用上知られていない
（発明が解決しようとする！ｌＩｌ！！〕導電性微粉末
を金属メッキする方法として、電気メンキによる方法は
実用上知られていないが、比較的小物製品をメッキする
場合には、バレルメンキ方法が知られている。However, at present, there is no practically known method that utilizes electroplating that does not involve electroless plating (this invention attempts to solve the problem!lIl!!) As a method of metal plating conductive fine powder, there is a method using electroplating. Although this is not known in practice, the barrel coating method is known when plating relatively small products.
しかしバレルメッキ装置をそのまま利用しても、導電性
微粉末は効率よくメッキできない、この理由しては、バ
レルを回転または撮動させると導電性微粉末が懸渇状に
乱流してしまうため、メッキされる導電性微粉末に電気
が流れないためと考えられる。However, even if the barrel plating equipment is used as is, conductive fine powder cannot be plated efficiently.The reason for this is that when the barrel is rotated or moved, the conductive fine powder flows turbulently. This is thought to be because electricity does not flow through the conductive fine powder being plated.
これを避けるためにバレルの回転を遅くすると、導電性
微粉末がうまく攪拌されないために、表面層のみがメッ
キされ内面はメッキされなくなる。If the rotation of the barrel is slowed down to avoid this, the conductive fine powder will not be stirred well, so only the surface layer will be plated and the inner surface will not be plated.
以上のことより、導電性微粉末が電解液中で懸濁せずか
つ導電性微粉末の表面層が更新されることが必要となり
、かかる電気メッキ方法について鋭意研究した結果、本
発明に至ったものである。From the above, it became necessary for the conductive fine powder to not be suspended in the electrolytic solution and for the surface layer of the conductive fine powder to be renewed.As a result of intensive research on such an electroplating method, the present invention was achieved. It is something.
本発明は、導電性微粉末の電気メッキ方法において、上
部に陽極、下部に陰極を有する電解液中で導電性微粉末
を１Ｅ攪拌、静置を繰り返すか、または通電しながら攪
拌、静置を繰り返して電気メッキを行うことを特徴とす
る。The present invention is an electroplating method for conductive fine powder, in which conductive fine powder is repeatedly stirred and left to stand for 1E in an electrolytic solution having an anode at the top and a cathode at the bottom, or stirred and left to stand while energized. It is characterized by repeated electroplating.
本発明における導電性微粉末としては、ニッケル、コバ
ルト、銅などの金属微粉末や炭素粉末などがあげられる
。またメッキ金属および電解液の組成については、すで
に電気メッキにおいて知られているものの中から適宜選
択して利用でき、特に限定されるものではない。Examples of the conductive fine powder in the present invention include metal fine powder such as nickel, cobalt, and copper, and carbon powder. Furthermore, the compositions of the plating metal and the electrolytic solution can be appropriately selected from those already known in electroplating, and are not particularly limited.
電気メッキを行う際の通電、攪拌および静置におけるそ
れぞれの条件についても、特に限定されるものではない
。The conditions for energization, stirring, and standing during electroplating are not particularly limited either.
導電性微粉末を陰極に接しかつ攪拌、静置を繰り返すこ
とにより、導電性微粉末の表面層は更新されて効率よく
均一に電気メッキされる。By bringing the conductive fine powder into contact with the cathode and repeating stirring and standing, the surface layer of the conductive fine powder is renewed and electroplated efficiently and uniformly.
以下に実施例を示して、本発明を説明する。The present invention will be explained below with reference to Examples.
実施例１
ｆｆ拌機を備えた内径７０■の円筒形ビーカーの底部に
、直径６０■の陰極ｗ４板を設置した。このビーカーの
中に、希塩酸で前処理した平均粒子径１．５〜２μｍの
球状銅微粉末１５ｇとニッケル電解液３００ｄ（硫酸ニ
ッケルＮ ｉＳ Ｏａ・７Ｈ２０，２４０ｇ／ｌ、塩化
ニッケルＮ ｉ ＣＩｇ・６Ｈ２０，４５ｇ／／！、お
よびほう酸３５ｇ／ｊりを入れた。Example 1 A cathode W4 plate with a diameter of 60 cm was installed at the bottom of a cylindrical beaker with an inner diameter of 70 cm equipped with an ff stirrer. In this beaker, 15 g of spherical fine copper powder with an average particle diameter of 1.5 to 2 μm pretreated with dilute hydrochloric acid and 300 d of nickel electrolyte (nickel sulfate N iS Oa 7H20, 240 g/l, nickel chloride N i CIg 6H20 , 45 g//!, and 35 g/j of boric acid.
陽極にニッケル板を使用し電流０．５Ａになるように電
圧を調整して、通電を３０秒間、攪拌を１５秒問および
静置を１５秒間繰り返しながら、９５分間電気メッキを
行ったところ、第１表の結果を得た。A nickel plate was used as an anode, the voltage was adjusted so that the current was 0.5A, and electroplating was performed for 95 minutes by repeating electricity for 30 seconds, stirring for 15 seconds, and standing still for 15 seconds. The results shown in Table 1 were obtained.
実施例２
実施例１において連続的に７０分間通電しながら攪拌を
１５秒問および静置を４５秒間繰り返す以外は、同一の
条件下で電気メッキを行ったところ、第１表の結果を得
た。Example 2 Electroplating was performed under the same conditions as in Example 1, except that electricity was continuously applied for 70 minutes, stirring was repeated for 15 seconds, and standing was repeated for 45 seconds, and the results shown in Table 1 were obtained. .
第１表
〔発明の効果〕
本発明の電気メッキ方法により、安価でかつ従来困難で
あった導電性微粉末への電気メンキが可能となり、しか
も効率よく均一は電気メッキを行えるため、工業上のメ
リフトはきわめて大である。Table 1 [Effects of the Invention] The electroplating method of the present invention enables electroplating of conductive fine powder at low cost, which has been difficult in the past, and enables efficient and uniform electroplating. Melifth is extremely large.
Claims (1)
微粉末を通電、攪拌、静置を繰り返すか、または通電し
ながら攪拌、静置を繰り返して電気メッキを行うことを
特徴とする導電性微粉末の電気メッキ方法。A conductive method characterized by performing electroplating by repeating energizing, stirring, and standing still of conductive fine powder in an electrolytic solution having an anode at the top and a cathode at the bottom, or by repeating stirring and standing still while energizing. Electroplating method of fine powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4034490A JPH03243793A (en) | 1990-02-21 | 1990-02-21 | Method for electroplating electrically conductive fine powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4034490A JPH03243793A (en) | 1990-02-21 | 1990-02-21 | Method for electroplating electrically conductive fine powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03243793A true JPH03243793A (en) | 1991-10-30 |
Family
ID=12578016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4034490A Pending JPH03243793A (en) | 1990-02-21 | 1990-02-21 | Method for electroplating electrically conductive fine powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03243793A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006097111A (en) * | 2004-09-30 | 2006-04-13 | Matsushita Electric Ind Co Ltd | Method for producing metal-carrying electrically conductive powder and catalyst using the same |
-
1990
- 1990-02-21 JP JP4034490A patent/JPH03243793A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006097111A (en) * | 2004-09-30 | 2006-04-13 | Matsushita Electric Ind Co Ltd | Method for producing metal-carrying electrically conductive powder and catalyst using the same |
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