JPH03102762U - - Google Patents
Info
- Publication number
- JPH03102762U JPH03102762U JP1129290U JP1129290U JPH03102762U JP H03102762 U JPH03102762 U JP H03102762U JP 1129290 U JP1129290 U JP 1129290U JP 1129290 U JP1129290 U JP 1129290U JP H03102762 U JPH03102762 U JP H03102762U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- transfer mold
- paste
- electrodes
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来例の断面図である。
１……チツプ部品、２……Ａｇペースト、３…
…ランド、４……ＰＷＢ、５……ＰＷＢ接着板。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1...Chip parts, 2...Ag paste, 3...
...Land, 4...PWB, 5...PWB adhesive board.
Claims (1)
リント配線基板にチツプ部品搭載用のスルーホー
ルを設けたチツプ部品を埋め込みＡｇペーストで
電極接続することを特徴とするトランスフアーモ
ールド型混成ＩＣ。 A transfer mold type hybrid IC characterized in that a printed wiring board used in a transfer mold structure is provided with a through hole for mounting a chip component, and a chip component is embedded and electrodes are connected using Ag paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1129290U JPH03102762U (en) | 1990-02-06 | 1990-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1129290U JPH03102762U (en) | 1990-02-06 | 1990-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102762U true JPH03102762U (en) | 1991-10-25 |
Family
ID=31514825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1129290U Pending JPH03102762U (en) | 1990-02-06 | 1990-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102762U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008159542A (en) * | 2006-12-26 | 2008-07-10 | Nichifu Co Ltd | Terminal block for flat covered wire |
| WO2015087546A1 (en) * | 2013-12-13 | 2015-06-18 | 三菱重工オートモーティブサーマルシステムズ株式会社 | Affixing structure for electronic component |
-
1990
- 1990-02-06 JP JP1129290U patent/JPH03102762U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008159542A (en) * | 2006-12-26 | 2008-07-10 | Nichifu Co Ltd | Terminal block for flat covered wire |
| WO2015087546A1 (en) * | 2013-12-13 | 2015-06-18 | 三菱重工オートモーティブサーマルシステムズ株式会社 | Affixing structure for electronic component |
| US10149385B2 (en) | 2013-12-13 | 2018-12-04 | Mitsubishi Heavy Industries Thermal Systems, Ltd. | Affixing structure for electronic component |