JPH02146875U - - Google Patents
Info
- Publication number
- JPH02146875U JPH02146875U JP5440089U JP5440089U JPH02146875U JP H02146875 U JPH02146875 U JP H02146875U JP 5440089 U JP5440089 U JP 5440089U JP 5440089 U JP5440089 U JP 5440089U JP H02146875 U JPH02146875 U JP H02146875U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- land
- mounted component
- component
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 239000006071 cream Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Screen Printers (AREA)
Description
第１図は、この考案の一実施例によるハンダ印
刷機のハンダマスクの穴形状と基板の部品ランド
形状との対応を示す図、第２図は、この考案の一
実施例によるハンダ塗布後の部品ランド拡大図、
第３図は、この考案の一実施例による部品搭載後
のランド拡大図、第４図は従来技術のハンダ印刷
機のハンダマスクの穴形状と基板の部品ランド形
状との対応図、第５図は従来技術のハンダ塗布後
の部品ランド拡大図、第６図は従来技術の部品搭
載後のランド拡大図である。
図において、１……プリント印刷配線板（本分
中では単に基板）、２……部品ランド、３……ク
リームハンダマスク（本文中では単にハンダマス
ク）、４……部品ランド２上のハンダ塗布ケ所、
５……ハンダマスクの穴、６……クリームハンダ
（本文中では単にハンダ）、７……部品ピンであ
る。なお、各図中、同一符号は同一又は相当部分
を示す。
FIG. 1 is a diagram showing the correspondence between the hole shape of the solder mask of a solder printing machine according to an embodiment of this invention and the component land shape of a board, and FIG. Enlarged view of parts land,
Fig. 3 is an enlarged view of a land after mounting a component according to an embodiment of this invention, Fig. 4 is a correspondence diagram of the hole shape of a solder mask of a conventional solder printing machine and the shape of a component land of a board, and Fig. 5 6 is an enlarged view of a component land after solder application according to the prior art, and FIG. 6 is an enlarged view of a land after component mounting according to the prior art. In the figure, 1...Printed wiring board (simply board in this text), 2...Component land, 3...Cream solder mask (simply solder mask in text), 4...Solder application on component land 2 Places,
5...Solder mask hole, 6...Cream solder (simply solder in the text), 7...Component pin. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
る時に用いるクリームハンダマスクにおいて、面
実装部品ランドの一部もマスクし、ハンダ塗布面
積を小さくすることを特徴とするハンダ印刷機。 A solder printing machine characterized in that, in a cream solder mask used when applying cream solder to a surface-mounted component mounting board, a part of the surface-mounted component land is also masked to reduce the solder application area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5440089U JPH02146875U (en) | 1989-05-11 | 1989-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5440089U JPH02146875U (en) | 1989-05-11 | 1989-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146875U true JPH02146875U (en) | 1990-12-13 |
Family
ID=31576433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5440089U Pending JPH02146875U (en) | 1989-05-11 | 1989-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146875U (en) |
-
1989
- 1989-05-11 JP JP5440089U patent/JPH02146875U/ja active Pending