JPH02125355U - - Google Patents

Info

Publication number
JPH02125355U
JPH02125355U JP3373789U JP3373789U JPH02125355U JP H02125355 U JPH02125355 U JP H02125355U JP 3373789 U JP3373789 U JP 3373789U JP 3373789 U JP3373789 U JP 3373789U JP H02125355 U JPH02125355 U JP H02125355U
Authority
JP
Japan
Prior art keywords
surface mount
view
dual
positioning
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3373789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3373789U priority Critical patent/JPH02125355U/ja
Publication of JPH02125355U publication Critical patent/JPH02125355U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例による表面実装用
ICを示す図でaは、実装状態の斜視図、bは、
その断面図、第2図は従来の一実施例で、aは、
実装状態の斜視図、bはその断面図である。また
1……印刷配線板、2……表面実装用IC、3…
…ランド、4……ハンダ、5……スルホールであ
る。なお、図中、同一符号は同一または相当部分
を示す。
FIG. 1 shows a surface-mounted IC according to an embodiment of the present invention, in which a is a perspective view of the mounted state, and b is a
Its cross-sectional view, FIG. 2, is a conventional example, and a is
A perspective view of the mounted state, and b is a sectional view thereof. In addition, 1... printed wiring board, 2... surface mount IC, 3...
...Land, 4...Solder, 5...Through hole. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面実装用のICにおいて、基板に実装する時
の位置決め用及び給電用を兼ねた兼用ピンを上記
ICに形成したことを特徴とする表面実装用IC
A surface mount IC characterized in that the IC is provided with dual-purpose pins for positioning and power supply when mounted on a board.
.
JP3373789U 1989-03-24 1989-03-24 Pending JPH02125355U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3373789U JPH02125355U (en) 1989-03-24 1989-03-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3373789U JPH02125355U (en) 1989-03-24 1989-03-24

Publications (1)

Publication Number Publication Date
JPH02125355U true JPH02125355U (en) 1990-10-16

Family

ID=31537638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3373789U Pending JPH02125355U (en) 1989-03-24 1989-03-24

Country Status (1)

Country Link
JP (1) JPH02125355U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313751U (en) * 1989-06-26 1991-02-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313751U (en) * 1989-06-26 1991-02-12

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