JPH0173944U - - Google Patents

Info

Publication number
JPH0173944U
JPH0173944U JP1987170623U JP17062387U JPH0173944U JP H0173944 U JPH0173944 U JP H0173944U JP 1987170623 U JP1987170623 U JP 1987170623U JP 17062387 U JP17062387 U JP 17062387U JP H0173944 U JPH0173944 U JP H0173944U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
semiconductor chip
resin
adhere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987170623U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987170623U priority Critical patent/JPH0173944U/ja
Publication of JPH0173944U publication Critical patent/JPH0173944U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,bは本考案の一実施例を示す斜視図
、第2図は従来例を示す斜視図である。 4:半導体チツプ、5:プリント基板、6:孔
、7:樹脂、8:端子。
1A and 1B are perspective views showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional example. 4: semiconductor chip, 5: printed circuit board, 6: hole, 7: resin, 8: terminal.

Claims (1)

【実用新案登録請求の範囲】 半導体チツプを搭載し、該半導体チツプを流動
性樹脂で封止させるプリント基板であつて、 前記樹脂の所望被着領域端部に予め複数個の孔
が形成されてなることを特徴とするプリント基板
[Claims for Utility Model Registration] A printed circuit board on which a semiconductor chip is mounted and the semiconductor chip is sealed with a fluid resin, wherein a plurality of holes are formed in advance at the end of a desired area for the resin to adhere. A printed circuit board characterized by:
JP1987170623U 1987-11-06 1987-11-06 Pending JPH0173944U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987170623U JPH0173944U (en) 1987-11-06 1987-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987170623U JPH0173944U (en) 1987-11-06 1987-11-06

Publications (1)

Publication Number Publication Date
JPH0173944U true JPH0173944U (en) 1989-05-18

Family

ID=31461726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987170623U Pending JPH0173944U (en) 1987-11-06 1987-11-06

Country Status (1)

Country Link
JP (1) JPH0173944U (en)

Similar Documents

Publication Publication Date Title
JPS62184775U (en)
JPS6350169U (en)
JPH0173944U (en)
JPH0418474U (en)
JPS61192479U (en)
JPH03102762U (en)
JPS62112170U (en)
JPS6338368U (en)
JPS63124772U (en)
JPS62191155U (en)
JPS61153371U (en)
JPS61142474U (en)
JPH0282127U (en)
JPS639148U (en)
JPS5829845U (en) Lead pin shape of ceramic multilayer wiring board
JPH01101843U (en)
JPS6430878U (en)
JPS62104477U (en)
JPS62109479U (en)
JPS6346857U (en)
JPS6291442U (en)
JPS6245868U (en)
JPS62103275U (en)
JPS64337U (en)
JPS62122370U (en)