JPH0278299U - - Google Patents
Info
- Publication number
- JPH0278299U JPH0278299U JP15638088U JP15638088U JPH0278299U JP H0278299 U JPH0278299 U JP H0278299U JP 15638088 U JP15638088 U JP 15638088U JP 15638088 U JP15638088 U JP 15638088U JP H0278299 U JPH0278299 U JP H0278299U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- nozzle
- water
- receiving plate
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は、この考案の一実施例を示すワーク固
定装置の断面図であり、第２図の―部位を示
し、第２図は、同実施例の断面図であり、第１図
の―部位を示し、第３図は、同実施例の加工
時の拡大部分断面図、第４図は、従来のワーク固
定装置を示す断面図、第５図は、従来例の加工時
の拡大部分断面図である。
７…ノズル、１１…ワーク固定装置、１３…（
固定治具）セツト板、１３ａ…スリツト、１９…
水受板、２３…（固定治具）天板、２３ａ…スリ
ツト、Ｗ…ワーク、Ｐ…高圧水。
FIG. 1 is a cross-sectional view of a workpiece fixing device showing an embodiment of this invention, showing the part shown in FIG. 2, and FIG. Fig. 3 is an enlarged partial sectional view of the same embodiment during processing, Fig. 4 is a sectional view showing a conventional workpiece fixing device, and Fig. 5 is an enlarged partial sectional view of the conventional example during processing. It is a diagram. 7... Nozzle, 11... Work fixing device, 13... (
Fixing jig) Set plate, 13a...slit, 19...
Water receiving plate, 23... (fixing jig) top plate, 23a... slit, W... workpiece, P... high pressure water.
Claims (1)
ズルを移動させ、前記ワークを加工するウオータ
ジエツトカツテイングに使用されるワーク固定装
置であつて、 前記ノズルとの間に前記ワークを配置させて前
記ワークを固定する固定治具と、前記ノズルから
の前記高圧水を受ける水受板とを具備し、 前記固定治具に、加工時における前記ワークを
貫通する高圧水の軌跡に沿つて、前記ワークを貫
通する高圧水だけを通過可能な幅のスリツトが穿
設され、 前記水受板が、加工時の前記ノズルと反対側の
前記固定治具のスリツト形成部位から離れた位置
に配置されていることを特徴とするウオータジエ
ツトカツテイング用ワーク固定装置。[Claims for Utility Model Registration] A workpiece fixing device used for water jet cutting that processes the workpiece by jetting high-pressure water from a nozzle onto the workpiece and moving the nozzle between the workpiece and the nozzle. a fixing jig for arranging the workpiece and fixing the workpiece; and a water receiving plate for receiving the high-pressure water from the nozzle; A slit having a width that allows only the high-pressure water to pass through the workpiece is bored along the trajectory of the water receiving plate, and the water receiving plate is formed from the slit forming part of the fixing jig on the opposite side of the nozzle during processing. A workpiece fixing device for water jet cutting, characterized in that it is placed at a remote location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15638088U JPH0278299U (en) | 1988-11-30 | 1988-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15638088U JPH0278299U (en) | 1988-11-30 | 1988-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0278299U true JPH0278299U (en) | 1990-06-15 |
Family
ID=31434869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15638088U Pending JPH0278299U (en) | 1988-11-30 | 1988-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0278299U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010110852A (en) * | 2008-11-05 | 2010-05-20 | Calsonic Kansei Corp | Trimming machining device for multiple production workpieces |
| US8884424B2 (en) | 2010-01-13 | 2014-11-11 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
| US9349611B2 (en) | 2010-03-22 | 2016-05-24 | Advanced Semiconductor Engineering, Inc. | Stackable semiconductor package and manufacturing method thereof |
| US9406658B2 (en) | 2010-12-17 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Embedded component device and manufacturing methods thereof |
-
1988
- 1988-11-30 JP JP15638088U patent/JPH0278299U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010110852A (en) * | 2008-11-05 | 2010-05-20 | Calsonic Kansei Corp | Trimming machining device for multiple production workpieces |
| US8884424B2 (en) | 2010-01-13 | 2014-11-11 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
| US9196597B2 (en) | 2010-01-13 | 2015-11-24 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
| US9349611B2 (en) | 2010-03-22 | 2016-05-24 | Advanced Semiconductor Engineering, Inc. | Stackable semiconductor package and manufacturing method thereof |
| US9406658B2 (en) | 2010-12-17 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Embedded component device and manufacturing methods thereof |