JPH0270861U - - Google Patents
Info
- Publication number
- JPH0270861U JPH0270861U JP14693088U JP14693088U JPH0270861U JP H0270861 U JPH0270861 U JP H0270861U JP 14693088 U JP14693088 U JP 14693088U JP 14693088 U JP14693088 U JP 14693088U JP H0270861 U JPH0270861 U JP H0270861U
- Authority
- JP
- Japan
- Prior art keywords
- board
- solder
- soldering device
- jet nozzle
- curved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 3
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案半田付装置に使用する半田噴流
ノズルの斜視図、第２図は要部の縦断面図、第３
図は基板の端面図、第４図は基板の水平板部の半
田付け状態を示す一部切欠側面図、第５図は基板
の湾曲凹部の半田付け状態を示す一部切欠側面図
である。
Ａ……半田噴流ノズル、１……基板、１ａ，１
ｂ……水平板部、１ｃ……湾曲凹部、２……基板
進入側の側壁、２ａ，２ｂ……側壁部、３……基
板進出側の側壁、４……側板、５……ノズル部、
６……半田の波立ち防止板、７……ダクト。
Fig. 1 is a perspective view of the solder jet nozzle used in the soldering device of the present invention, Fig. 2 is a vertical cross-sectional view of the main parts, and Fig. 3 is a longitudinal sectional view of the main parts.
4 is a partially cutaway side view showing the soldered state of the horizontal plate portion of the board, and FIG. 5 is a partially cutaway side view showing the soldered state of the curved recessed portion of the board. A... Solder jet nozzle, 1... Board, 1a, 1
b...Horizontal plate part, 1c...Curved recessed part, 2...Side wall on the board entry side, 2a, 2b...Side wall part, 3...Side wall on the board exit side, 4...Side plate, 5...Nozzle part,
6... Solder ripple prevention plate, 7... Duct.
Claims (1)
基板を進入側から進出側方向に向け上向き傾斜搬
送する噴流式半田付装置において、 上記半田噴流ノズルを構成する少なくとも基板
進入側の側壁で、かつ、基板にあらかじめ形成さ
れた湾曲凹部に対応する一部を、基板の進出方向
に向け凹状に湾曲形成したことを特徴とする噴流
式半田付装置。[Scope of claim for utility model registration] Regarding the solder jetted from the solder jet nozzle,
In a jet soldering device that conveys a board upwardly and obliquely from an entry side to an exit side, at least one side wall of the solder jet nozzle on the board entry side and corresponding to a curved recess formed in advance on the board is provided. A jet soldering device characterized in that a part is curved in a concave shape toward the advancing direction of a board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14693088U JPH0270861U (en) | 1988-11-09 | 1988-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14693088U JPH0270861U (en) | 1988-11-09 | 1988-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270861U true JPH0270861U (en) | 1990-05-30 |
Family
ID=31416878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14693088U Pending JPH0270861U (en) | 1988-11-09 | 1988-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270861U (en) |
-
1988
- 1988-11-09 JP JP14693088U patent/JPH0270861U/ja active Pending