JPH0262721U - - Google Patents
Info
- Publication number
- JPH0262721U JPH0262721U JP14257088U JP14257088U JPH0262721U JP H0262721 U JPH0262721 U JP H0262721U JP 14257088 U JP14257088 U JP 14257088U JP 14257088 U JP14257088 U JP 14257088U JP H0262721 U JPH0262721 U JP H0262721U
- Authority
- JP
- Japan
- Prior art keywords
- package
- integrated circuit
- molding
- recessed portion
- attachment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 3
- 238000001721 transfer moulding Methods 0.000 claims 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、この考案の好適な実施例を示す斜視
図である。第２図は、第１図に示すものを成形す
るための金型及び被成形部品の断面図である。第
３図は、他のアタツチメントを例示した側面図で
ある。
１……パツケージ、２……雄コネクタ部、３…
…複数の端子部、４……回路基板、５……電子素
子、６……アタツチメント。
FIG. 1 is a perspective view showing a preferred embodiment of this invention. FIG. 2 is a sectional view of a mold and a molded part for molding what is shown in FIG. 1. FIG. 3 is a side view illustrating another attachment. 1...Package cage, 2...Male connector part, 3...
...A plurality of terminal parts, 4...Circuit board, 5...Electronic element, 6...Attachment.
Claims (1)
形成したパツケージに於いて、前記パツケージは
成形前に予め端子部に挾着され成形後に取外し可
能なアタツチメントによる凹部を有し該凹部を雄
コネクタ部として構成したことを特徴とする集積
回路パツケージ。 In a package in which an integrated circuit is formed using a transfer molding mold, the package has a recessed portion formed by an attachment that is clamped to a terminal portion before molding and can be removed after molding, and the recessed portion is configured as a male connector portion. An integrated circuit package characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14257088U JPH0526741Y2 (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14257088U JPH0526741Y2 (en) | 1988-10-31 | 1988-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0262721U true JPH0262721U (en) | 1990-05-10 |
| JPH0526741Y2 JPH0526741Y2 (en) | 1993-07-07 |
Family
ID=31408644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14257088U Expired - Lifetime JPH0526741Y2 (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526741Y2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303327A (en) * | 2005-04-22 | 2006-11-02 | Denso Corp | Electronic circuit device and its manufacturing method |
| JP2009033065A (en) * | 2007-07-30 | 2009-02-12 | Mitsubishi Electric Corp | Fin-integrated semiconductor module, and manufacturing method thereof |
| JP2011528858A (en) * | 2008-07-24 | 2011-11-24 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Seal frame and method for covering components |
| JP2018146264A (en) * | 2017-03-01 | 2018-09-20 | 矢崎総業株式会社 | Insulation state detection device |
-
1988
- 1988-10-31 JP JP14257088U patent/JPH0526741Y2/ja not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303327A (en) * | 2005-04-22 | 2006-11-02 | Denso Corp | Electronic circuit device and its manufacturing method |
| JP4548199B2 (en) * | 2005-04-22 | 2010-09-22 | 株式会社デンソー | Method for manufacturing electronic circuit device |
| JP2009033065A (en) * | 2007-07-30 | 2009-02-12 | Mitsubishi Electric Corp | Fin-integrated semiconductor module, and manufacturing method thereof |
| JP2011528858A (en) * | 2008-07-24 | 2011-11-24 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Seal frame and method for covering components |
| JP2018146264A (en) * | 2017-03-01 | 2018-09-20 | 矢崎総業株式会社 | Insulation state detection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526741Y2 (en) | 1993-07-07 |