JPS6418779U - - Google Patents
Info
- Publication number
- JPS6418779U JPS6418779U JP11437087U JP11437087U JPS6418779U JP S6418779 U JPS6418779 U JP S6418779U JP 11437087 U JP11437087 U JP 11437087U JP 11437087 U JP11437087 U JP 11437087U JP S6418779 U JPS6418779 U JP S6418779U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- integrally formed
- board
- substrate part
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001746 injection moulding Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第１図はこの考案のプリント回路基板の一実施
例を示す一部を切欠断面によつて示した斜視図、
第２図はその射出成形装置における射出成形金型
の断面図、第３図はその型締時における要部断面
図、第４図はスライド型の平面図である。
１０……プリント回路基板、１１……基板部、
１３……回路パターン、１４……端子金具、１５
……接続部、１６……通電部、２１……固定型、
２２……ピン、２３……キヤビテイ、３１……可
動型、４０……キヤリアシート、４１……回路パ
ターン、５０……スライド型。
FIG. 1 is a partially cutaway perspective view showing an embodiment of the printed circuit board of this invention;
FIG. 2 is a cross-sectional view of the injection mold in the injection molding apparatus, FIG. 3 is a cross-sectional view of the main part during clamping, and FIG. 4 is a plan view of the slide mold. 10... Printed circuit board, 11... Board part,
13...Circuit pattern, 14...Terminal fitting, 15
... Connection part, 16 ... Current-carrying part, 21 ... Fixed type,
22... Pin, 23... Cavity, 31... Movable type, 40... Carrier sheet, 41... Circuit pattern, 50... Slide type.
Claims (1)
ンを一体に形成するとともに前記回路パターンと
接続する端子金具を備えた接続部を前記基板部と
一体に形成したことを特徴とするプリント回路基
板。 A printed circuit board, characterized in that a circuit pattern is integrally formed on the surface side of the substrate part during injection molding of the substrate part, and a connecting part provided with a terminal fitting to be connected to the circuit pattern is integrally formed with the board part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11437087U JPS6418779U (en) | 1987-07-24 | 1987-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11437087U JPS6418779U (en) | 1987-07-24 | 1987-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6418779U true JPS6418779U (en) | 1989-01-30 |
Family
ID=31355052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11437087U Pending JPS6418779U (en) | 1987-07-24 | 1987-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418779U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01228190A (en) * | 1988-03-08 | 1989-09-12 | Hokuriku Denki Kogyo Kk | Circuit board |
| JPH07288369A (en) * | 1994-12-05 | 1995-10-31 | Hokuriku Electric Ind Co Ltd | Circuit board and its manufacturing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52126756A (en) * | 1976-04-16 | 1977-10-24 | Matsushita Electric Ind Co Ltd | Inserttmolding method of preparing electroconductive plate for mounting electronic parts |
| JPS6232686A (en) * | 1985-08-06 | 1987-02-12 | キヤノン株式会社 | Manufacture of molding with conductor layer |
-
1987
- 1987-07-24 JP JP11437087U patent/JPS6418779U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52126756A (en) * | 1976-04-16 | 1977-10-24 | Matsushita Electric Ind Co Ltd | Inserttmolding method of preparing electroconductive plate for mounting electronic parts |
| JPS6232686A (en) * | 1985-08-06 | 1987-02-12 | キヤノン株式会社 | Manufacture of molding with conductor layer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01228190A (en) * | 1988-03-08 | 1989-09-12 | Hokuriku Denki Kogyo Kk | Circuit board |
| JPH07288369A (en) * | 1994-12-05 | 1995-10-31 | Hokuriku Electric Ind Co Ltd | Circuit board and its manufacturing method |