JPH0350317U - - Google Patents
Info
- Publication number
- JPH0350317U JPH0350317U JP11061489U JP11061489U JPH0350317U JP H0350317 U JPH0350317 U JP H0350317U JP 11061489 U JP11061489 U JP 11061489U JP 11061489 U JP11061489 U JP 11061489U JP H0350317 U JPH0350317 U JP H0350317U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- terminal
- conductive path
- conductive
- removal hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000007796 conventional method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、この考案の好適な実施例を成形する
金型及び樹脂モールド部品の要部の垂直断面図、
第２図は第１図に示す金型によつて成形されたも
のの斜視図、第３図は第１図に示す端子と導電路
の接続部を示した斜視図、第４図は第２図の矢視
Ａ−Ａ方向断面図である。第５図は、従来の技術
を説明する要部の垂直断面図、第６図は従来の技
術に於ける暫定基板及び導電路を説明する斜視図
である。
１……導電路、２……端子、３……樹脂パツケ
ージ、４……離脱穴、５……導電樹脂部。
FIG. 1 is a vertical sectional view of the main parts of a mold and resin molded parts for molding a preferred embodiment of this invention;
Fig. 2 is a perspective view of the product molded by the mold shown in Fig. 1, Fig. 3 is a perspective view showing the terminal and conductive path connections shown in Fig. FIG. FIG. 5 is a vertical sectional view of a main part of the conventional technique, and FIG. 6 is a perspective view of a temporary board and conductive path in the conventional technique. DESCRIPTION OF SYMBOLS 1... Conductive path, 2... Terminal, 3... Resin package, 4... Separation hole, 5... Conductive resin part.
Claims (1)
に接続する端子と、少なくとも該端子の前記導電
路に対する接続部をモールドするとともに端子押
えピンの離脱穴を形成した樹脂パツケージと、前
記離脱穴に導電樹脂を注入後硬化した導電樹脂部
とを具備することを特徴とする樹脂モールド部品
の端子接続構造。 A conductive path forming a predetermined pattern, a terminal connected to the conductive path, a resin package in which at least a connecting portion of the terminal to the conductive path is molded and a removal hole for a terminal holding pin is formed, and a resin package in which a removal hole is formed for a terminal holding pin. 1. A terminal connection structure for a resin molded component, comprising a conductive resin portion in which a conductive resin is injected and then cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11061489U JPH0350317U (en) | 1989-09-21 | 1989-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11061489U JPH0350317U (en) | 1989-09-21 | 1989-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350317U true JPH0350317U (en) | 1991-05-16 |
Family
ID=31659138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11061489U Pending JPH0350317U (en) | 1989-09-21 | 1989-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350317U (en) |
-
1989
- 1989-09-21 JP JP11061489U patent/JPH0350317U/ja active Pending