JPH0246331B2 - - Google Patents
Info
- Publication number
- JPH0246331B2 JPH0246331B2 JP60020973A JP2097385A JPH0246331B2 JP H0246331 B2 JPH0246331 B2 JP H0246331B2 JP 60020973 A JP60020973 A JP 60020973A JP 2097385 A JP2097385 A JP 2097385A JP H0246331 B2 JPH0246331 B2 JP H0246331B2
- Authority
- JP
- Japan
- Prior art keywords
- chuck
- annular
- vacuum suction
- semiconductor wafer
- central
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000007246 mechanism Effects 0.000 claims description 49
- 239000004065 semiconductor Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 12
- 238000009423 ventilation Methods 0.000 claims description 12
- 238000005192 partition Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005273 aeration Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Jigs For Machine Tools (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、研削盤のバキユーム吸着機構を有す
るチヤツク機構のチヤツク本体を通気性部材と不
通気性部材との複数の環状部を設けたことによ
り、サイズの異なる半導体ウエハであつても確実
にバキユーム吸着することができる半導体ウエハ
のチヤツク機構に関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention provides a chuck body of a chuck mechanism having a vacuum suction mechanism for a grinding machine by providing a plurality of annular portions of air-permeable members and impermeable members. This invention relates to a chuck mechanism for semiconductor wafers that can reliably vacuum suction even semiconductor wafers of different sizes.
従来、この種のバキユーム吸着機構を有するチ
ヤツク機構では、チヤツク本体の略全体が通気性
を有するポーラスセラミツク等の部材で形成され
ており、研削する半導体ウエハの外径寸法に合わ
せて、チヤツク体を交換しなければならない等の
煩わしさが在しており、例えば、半導体ウエハが
４インチの場合は４インチ用のチヤツク本体を用
い、５インチの半導体ウエハの場合では５インチ
用のチヤツク体を、又、８インチの半導体ウエハ
の場合では８インチ用のチヤツク本体をと、その
都度、半導体ウエハの外径サイズに合わせてチヤ
ツク本体を交換しなければ確実に効率良くチヤツ
クすることはできなかつた。
Conventionally, in a chuck mechanism having this type of vacuum suction mechanism, almost the entire chuck body is made of a material such as porous ceramic that has air permeability, and the chuck body is adjusted to fit the outer diameter of the semiconductor wafer to be ground. For example, if the semiconductor wafer is 4 inches, a 4-inch chuck body is used, and if the semiconductor wafer is 5 inches, a 5-inch chuck body is used. In addition, in the case of an 8-inch semiconductor wafer, it is impossible to reliably and efficiently chuck an 8-inch chuck body unless the chuck body is replaced each time according to the outer diameter size of the semiconductor wafer.
つまり、チヤツク本体の外径が半導体ウエハの
外径より小さいとバキユーム吸着の吸引力はある
ものの、被研削物である半導体ウエハの外周縁が
チヤツク本体より膨出し研削の際の平坦精度が悪
化してしまい、チヤツク本体の外径が半導体ウエ
ハの外径より大きい場合には半導体ウエハの外周
より外方ではエアーを大量に吸引するのみで効率
的とはいえなく、チヤツク本体を交換していた。 In other words, if the outside diameter of the chuck body is smaller than the outside diameter of the semiconductor wafer, although the vacuum suction has a suction force, the outer periphery of the semiconductor wafer, which is the object to be ground, will bulge out from the chuck body and the flatness accuracy during grinding will deteriorate. Therefore, if the outer diameter of the chuck body is larger than the outer diameter of the semiconductor wafer, a large amount of air is sucked outside the periphery of the semiconductor wafer, which is not efficient, and the chuck body has to be replaced.
本発明は上記の事由に着目し鋭意研鑚の結果、
半導体ウエハの外径が異なつても、チヤツク本体
を交換することなく確実に半導体ウエハをチヤツ
クすることができるチヤツク機構を創作し、これ
を供せんとするものである。
The present invention focuses on the above reasons and as a result of intensive research,
To create and provide a chuck mechanism capable of reliably chucking a semiconductor wafer without replacing the chuck body even if the outer diameter of the semiconductor wafer is different.
本発明の構成は、チヤツク機構を構成する円盤
形状のチヤツク本体を不通気性部材で形成し、チ
ヤツク本体へ中央凹陥部を形成し、中央凹陥部の
外方へ複数の環状構を環状部とした隔壁を有して
形成し、中央凹陥部の底面中心へはバキユーム吸
着機構へ連通する貫通孔を穿設すると共に、中央
凹陥部をと夫々の環状溝とへは通気性部材で形成
された円板部材と夫々の環状部材を嵌入固定さ
せ、夫々の環状溝の底部へは開閉弁を介設してバ
キユーム吸着機構へ繋がる夫々の通気機構を夫々
配設した構成である。
The structure of the present invention is to form a disc-shaped chuck body constituting the chuck mechanism with an impermeable material, form a central concave portion in the chuck body, and extend a plurality of annular structures outward from the central concave portion. A through hole communicating with the vacuum suction mechanism is formed in the center of the bottom of the central recessed part, and a breathable material is formed between the central recessed part and each annular groove. The disk member and each annular member are fitted and fixed, and a respective ventilation mechanism is provided at the bottom of each annular groove to connect to the vacuum suction mechanism by interposing an on-off valve.
斯る目的を達成せしめた本発明の半導体ウエハ
のフリーサイズチヤツク機構における実施例を以
下図面によつて説明する。
Embodiments of the semiconductor wafer free size chuck mechanism of the present invention that achieve the above object will be described below with reference to the drawings.
第１図は本発明の実施例で複数箇所にチヤツク
機構を配した研削盤のロータリーテーブルＡの一
組のチヤツク本体１を誇張して現した平面概要図
であり、第２図は一実施例の要部の縦を断面状態
に見たチヤツク機構の概要説明図であり、第３図
は次実施例の要部縦断面図である。 FIG. 1 is an exaggerated plan view schematically showing a set of chuck bodies 1 of a rotary table A of a grinding machine in which chuck mechanisms are arranged at a plurality of locations according to an embodiment of the present invention, and FIG. FIG. 3 is a schematic explanatory diagram of the chuck mechanism as seen in a vertical cross-section of the main part of the chuck mechanism, and FIG. 3 is a longitudinal cross-sectional view of the main part of the next embodiment.
本発明は、研削盤のバキユーム吸着機構を有す
るチヤツク機構のチヤツク本体１を通気性部材と
不通気性部材との複数の環状部１ａを設けたこと
により、サイズの異なる半導体ウエハにあつても
確実にバキユーム吸着することができる半導体ウ
エハのチヤツク機構に関するものであり、半導体
ウエハをバキユーム吸着機構でチヤツクして研削
する研削盤のチヤツク機構において、前記チヤツ
ク機構を構成する円盤形状のチヤツク本体１を不
通気性部材で形成し、該チヤツク本体１の中心部
辺へ中央凹陥部２を形成し、該中央凹陥部２の外
方へ同心状とした複数の環状溝３を環状部１ａと
した隔壁を有して形成し、前記中央凹陥部２の底
面中心へは前記バキユーム吸着機構へ連通する貫
通孔４を穿設すると共に、前記中央凹陥部２と
夫々の環状溝３とへは夫々通気性部材で形成され
た円板部材５と夫々の環状部材を上面を平坦状に
して嵌入固定させ、前記夫々の環状溝３の底部へ
は夫々の開閉弁７を介設して前記バキユーム吸着
機構へ繋がる通気機構８を夫々配設したものであ
る。 The present invention provides a chuck main body 1 of a chuck mechanism having a vacuum suction mechanism of a grinding machine with a plurality of annular portions 1a made of air-permeable members and impermeable members, thereby ensuring reliable operation even when handling semiconductor wafers of different sizes. This invention relates to a chuck mechanism for a semiconductor wafer that is capable of vacuum-chucking a semiconductor wafer, and in the chuck mechanism of a grinding machine that grinds a semiconductor wafer by chucking it with a vacuum suction mechanism, the disc-shaped chuck body 1 constituting the chuck mechanism is not included. A partition wall is formed of an air-permeable material, has a central concave portion 2 formed at the center side of the chuck body 1, and has a plurality of annular grooves 3 concentrically extending outward from the central concave portion 2 as an annular portion 1a. A through hole 4 communicating with the vacuum suction mechanism is provided in the center of the bottom surface of the central recess 2, and a ventilation member is provided in the central recess 2 and each annular groove 3, respectively. The disk member 5 formed by the above and each annular member are fitted and fixed with their upper surfaces flat, and the respective on-off valves 7 are interposed at the bottoms of the respective annular grooves 3 to be connected to the vacuum suction mechanism. A ventilation mechanism 8 is provided in each case.
即ち、本発明は、平面自動研削盤等のロータリ
ーテーブルＡの複数箇所へ等間隔を有して配設さ
れた夫々のチヤツク機構はバキユーム吸着機構
（図示しない）へ連通しているものであり、該バ
キユーム吸着機構は空気を吸引して負圧をかける
と共に、送水を可能とするポンプ等と通気通水系
Ｂから成るものであり、研削する半導体ウエハを
吸着させるためのチヤツク機構には円盤形状のチ
ヤツク本体１を嵌置するものである。 That is, in the present invention, each of the chuck mechanisms arranged at equal intervals at a plurality of locations on a rotary table A of a surface automatic grinder or the like communicates with a vacuum suction mechanism (not shown), The vacuum suction mechanism sucks air and applies negative pressure, and is composed of a pump, etc. that enables water supply, and an aeration/water flow system B. The chuck mechanism for suctioning the semiconductor wafer to be ground has a disk shape. The chuck main body 1 is inserted into the chuck.
前記チヤツク本体１はセラミツク等の不通気性
部材で形成し中心部辺へは後にポーラスセラミツ
ク等の通気性部材で形成した円板部材５を嵌入固
定させる中央凹陥部２を形成し、該中央凹陥部２
の底面の中心部へは通気及び通水をするためのバ
キユーム吸着機構へ連通させる貫通孔４を穿設し
たものである。 The chuck main body 1 is formed of an air-impermeable material such as ceramic, and a central recess 2 is formed on the central side thereof into which a disc member 5 formed of an air-permeable material such as porous ceramic is inserted and fixed. Part 2
A through hole 4 is bored in the center of the bottom surface of the vacuum cleaner to communicate with a vacuum suction mechanism for ventilation and water passage.
そして、後にポーラスセラミツク等の通気性部
材で形成した複数の環状部材６を嵌入固定させる
中央凹陥部２の外方で且つ同心状の複数の環状溝
３を環状部１ａとした隔壁を有して形成したもの
であり、つまり、前記中央凹陥部２を中心とした
複数の環状溝３を環状部１ａと外周部１ｂとを残
留立設させて形成し、環状部１ａと外周部１ｂと
は平坦状の上面を有して一体的に形成されるもの
である。 It has a partition wall with a plurality of concentric annular grooves 3 as the annular portion 1a outside the central recessed portion 2 into which a plurality of annular members 6 formed of an air-permeable material such as porous ceramic are later fitted and fixed. In other words, a plurality of annular grooves 3 centered on the central concave portion 2 are formed by leaving the annular portion 1a and the outer peripheral portion 1b upright, and the annular portion 1a and the outer peripheral portion 1b are flat. It is integrally formed with a shaped upper surface.
前記中央凹陥部２へは内側形状と合致する形状
のポーラスセラミツク等の通気性部材で形成され
た円板部材５を嵌入固定させると共に、前記複数
の環状溝３へは、該夫々の環状溝３の形状と合致
する形状のポーラスセラミツク等の通気性部材で
形成された夫々の環状部材６を密着状態で夫々嵌
入固定させ、夫々の上面は平坦状にしたものであ
る。 A disc member 5 made of a breathable material such as porous ceramic and having a shape that matches the inner shape is fitted into the central recess 2 and fixed therein, and each annular groove 3 is inserted into the plurality of annular grooves 3. Each annular member 6 made of an air-permeable material such as porous ceramic having a shape that matches the shape of the annular member 6 is fitted and fixed in a close contact state, and the upper surface of each member is made flat.
前記夫々の環状溝３の底部には通気通水のため
に夫々の開閉弁７を介設して通気通水系Ｂを経て
バキユーム吸着機構へ繋がる通気機構８を夫々配
設したものである。 At the bottom of each of the annular grooves 3, a respective opening/closing valve 7 is interposed for ventilation and water flow, and a ventilation mechanism 8 is provided, which is connected to the vacuum adsorption mechanism via the ventilation and water flow system B.
本発明は、先ず、前記チヤツク機構のチヤツク
本体１の上へ被加工物である半導体ウエハを移送
アーム等の手段によつて中心位置へ載置し、半導
体ウエハが載置されるとバキユーム吸着機構と、
該バキユーム機構に連通した中央の貫通孔４と
夫々の通気機構８とによつて負荷がかかり、半導
体ウエハの下面がチヤツク本体１の上面に確りと
吸着されるものであるが、本発明は図示の如く、
チヤツク本体１の中心部辺の通気性部材で形成さ
れた円板部材５の部分と、その外周へ環状の不通
気性部材の環状部１ａと通気性部材の環状部材６
とが交互に形成されているために、通気性部材で
形成された円板部材５と環状部材６の部分のみに
負圧がかかるものであり、チヤツク本体１の外周
部１ｂと複数の環状部１ａとは夫々隔壁と成り、
夫々の通気機構８に介設した夫々の開閉弁７の開
閉によつて、任意の位置の環状溝３へ嵌入固定し
た環状部材６へ負圧をかけれるものであり、半導
体ウエハのサイズに合致する位置のみの開閉弁７
を操作するものである。 In the present invention, first, a semiconductor wafer as a workpiece is placed on the chuck body 1 of the chuck mechanism at a central position by means such as a transfer arm, and when the semiconductor wafer is placed, a vacuum suction mechanism and,
A load is applied by the central through-hole 4 communicating with the vacuum mechanism and each ventilation mechanism 8, and the lower surface of the semiconductor wafer is firmly attracted to the upper surface of the chuck body 1, but the present invention is not shown in the drawings. Like,
A portion of the disc member 5 formed of a breathable member near the center of the chuck body 1, an annular portion 1a of an annular impermeable member and an annular member 6 of a breathable member around the outer periphery thereof.
Since these are alternately formed, negative pressure is applied only to the disc member 5 and the annular member 6, which are made of a breathable material, and the outer circumference 1b of the chuck body 1 and the plurality of annular parts 1a is a partition wall,
By opening and closing the respective on-off valves 7 provided in the respective ventilation mechanisms 8, negative pressure can be applied to the annular member 6 that is fitted and fixed into the annular groove 3 at an arbitrary position, which matches the size of the semiconductor wafer. Opening/closing valve 7 only for the position where
It is used to operate.
チヤツク本体１の中心部辺の中央凹陥部２へ嵌
入固定した円板部材５へはバキユーム吸着機構を
作動させると絶えず貫通孔４を介して負圧がかか
るものである。 When the vacuum suction mechanism is activated, negative pressure is constantly applied to the disk member 5 fitted and fixed in the central recess 2 on the center side of the chuck body 1 through the through hole 4.
本発明の実施例の第２図は開閉弁７をコツク式
のものを介設したものであり、第３図に図示した
開閉弁７はボルト挿入式のものした次実施例で有
り、ボルトを緩締させることによつて通気機構８
を構成させるものである。 FIG. 2 of the embodiment of the present invention has a Kotsuk type on-off valve 7 interposed therein, and the on-off valve 7 shown in FIG. 3 is the next embodiment with a bolt insertion type. By loosening the ventilation mechanism 8
This is what makes up the following.
又、半導体ウエハをチヤツク機構のチヤツク本
体１の上面から取外す際には、バキユーム吸着を
開放し移送アームへ備えた吸着パツト等で吸着し
て持ち上げて取り外すものであり、そして、送水
することによつてチヤツク本体１及びその周辺を
洗浄するものである。 Furthermore, when removing a semiconductor wafer from the top surface of the chuck body 1 of the chuck mechanism, the vacuum suction is released and the wafer is picked up and removed using a suction pad provided on the transfer arm, and then the semiconductor wafer is removed by supplying water. This is used to clean the chuck body 1 and its surroundings.
以上の如く構成した本発明の半導体ウエハのフ
リーサイズチヤツク機構は、外径の異なる半導体
ウエハにあつてもチヤツク本体を交換することな
く充分に対応できるものであり、その貢献性は計
り知れないものがあり、極めて有意義な効果を奏
することができるものである。
The free-size chuck mechanism for semiconductor wafers of the present invention constructed as described above can sufficiently handle semiconductor wafers with different outer diameters without replacing the chuck body, and its contribution is immeasurable. This is something that can have extremely significant effects.
第１図は本発明の実施例で複数箇所にチヤツク
機構を配した研削盤のロータリーテーブルの一組
のチヤツク本体を誇張して現した平面概要図であ
る。第２図は一実施例の要部の縦を断面状態に見
たチヤツク機構の概要説明図である。第３図は次
実施例の要部縦断面図である。
Ａ……ロータリーテーブル、Ｂ……通気通水
系。１……チヤツク本体、１ａ……還状部、１ｂ
……外周部、２……中央凹陥部、３……環状溝、
４……貫通孔、５……円板部材、６……環状部
材、７……開閉弁、８……通気機溝。
FIG. 1 is an exaggerated plan view showing a set of chuck bodies of a rotary table of a grinding machine in which chuck mechanisms are arranged at a plurality of locations according to an embodiment of the present invention. FIG. 2 is a schematic explanatory diagram of the chuck mechanism of one embodiment, as seen in a vertical cross-section of the main parts. FIG. 3 is a vertical sectional view of the main part of the next embodiment. A... Rotary table, B... Ventilation and water flow system. 1...chuck body, 1a... circular part, 1b
...Outer peripheral part, 2...Central recessed part, 3...Annular groove,
4... Through hole, 5... Disc member, 6... Annular member, 7... On-off valve, 8... Ventilator groove.
Claims (1)
クして研削する研削盤のチヤツク機構において、 前記チヤツク機構を構成する円盤形状のチヤツ
ク本体を不通気性部材で形成し、該チヤツク本体
の中心部辺へ中央凹陥部を形成し、該中央凹陥部
の外方へ同心状とした複数の環状溝を環状部とし
た隔壁を有して形成し、前記中央凹陥部の底面中
心へは前記バキユーム吸着機構へ連通する貫通孔
を穿設すると共に、前記中央凹陥部と夫々の環状
溝とへは夫々通気性部材で形成された円板部材と
夫々の環状部材を上面を平坦状にして嵌入固定さ
せ、前記夫々の環状溝の底部へは夫々の開閉弁を
介設して前記バキユーム吸着機構へ繋がる通気機
構を夫々配設したことを特徴とするウエハのフリ
ーサイズチヤツク機構。[Scope of Claims] 1. In a chuck mechanism of a grinding machine that chucks and grinds a semiconductor wafer with a vacuum suction mechanism, a disc-shaped chuck body constituting the chuck mechanism is formed of an impermeable material, and the chuck body is A central concave portion is formed on the side of the central portion, and a partition wall is formed with a plurality of annular grooves formed concentrically outward from the central concave portion, and the central concave portion has a partition wall with a plurality of annular grooves arranged concentrically outward from the central concave portion. A through hole communicating with the vacuum suction mechanism is drilled, and a disc member formed of a breathable material and each annular member are respectively fitted into the central recess and each annular groove with their upper surfaces flat. A one-size-fits-all wafer chuck mechanism, characterized in that the chuck mechanism is fixed, and a ventilation mechanism connected to the vacuum suction mechanism is provided at the bottom of each of the annular grooves by interposing a respective on-off valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2097385A JPS61182738A (en) | 1985-02-07 | 1985-02-07 | Free size chucking mechanism for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2097385A JPS61182738A (en) | 1985-02-07 | 1985-02-07 | Free size chucking mechanism for wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61182738A JPS61182738A (en) | 1986-08-15 |
| JPH0246331B2 true JPH0246331B2 (en) | 1990-10-15 |
Family
ID=12042109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2097385A Granted JPS61182738A (en) | 1985-02-07 | 1985-02-07 | Free size chucking mechanism for wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61182738A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0332538A (en) * | 1989-06-28 | 1991-02-13 | Disco Abrasive Syst Ltd | Universal chuck table |
| JPH0332537A (en) * | 1989-06-28 | 1991-02-13 | Disco Abrasive Syst Ltd | Universal chuck table |
| JP2841851B2 (en) * | 1990-11-27 | 1998-12-24 | 日本電気株式会社 | Polishing apparatus and polishing method for silicon substrate |
| JPH081464A (en) * | 1992-06-17 | 1996-01-09 | Shibayama Kikai Kk | Automatic change-over device for universal chuck mechanism |
| JP2001024051A (en) | 1999-07-09 | 2001-01-26 | Tokyo Seimitsu Co Ltd | Wafer vacuum chuck pad |
| JP2003059872A (en) * | 2001-08-17 | 2003-02-28 | Disco Abrasive Syst Ltd | Grinding apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56164549A (en) * | 1980-05-23 | 1981-12-17 | Disco Abrasive Sys Ltd | Mounting method by positioning |
| JPS58180026A (en) * | 1982-04-15 | 1983-10-21 | Nippon Telegr & Teleph Corp <Ntt> | Attracting board for grinding wafer |
| JPS5930631A (en) * | 1982-08-13 | 1984-02-18 | Hitachi Ltd | Attractive holding device |
-
1985
- 1985-02-07 JP JP2097385A patent/JPS61182738A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56164549A (en) * | 1980-05-23 | 1981-12-17 | Disco Abrasive Sys Ltd | Mounting method by positioning |
| JPS58180026A (en) * | 1982-04-15 | 1983-10-21 | Nippon Telegr & Teleph Corp <Ntt> | Attracting board for grinding wafer |
| JPS5930631A (en) * | 1982-08-13 | 1984-02-18 | Hitachi Ltd | Attractive holding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61182738A (en) | 1986-08-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |