JPH08148548A - Universal chuck - Google Patents
Universal chuckInfo
- Publication number
- JPH08148548A JPH08148548A JP6309490A JP30949094A JPH08148548A JP H08148548 A JPH08148548 A JP H08148548A JP 6309490 A JP6309490 A JP 6309490A JP 30949094 A JP30949094 A JP 30949094A JP H08148548 A JPH08148548 A JP H08148548A
- Authority
- JP
- Japan
- Prior art keywords
- annular
- mounting table
- disk
- chuck
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Jigs For Machine Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、平面自動研削盤等のバ
キューム機構と連通させたチャックへサイズの異なる半
導体ウエハを乗載させた場合でもチャックを交換するこ
と無く確実にバキューム吸着することができるユニバー
サルチャックに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is capable of reliably sucking a vacuum without exchanging a chuck even when semiconductor wafers of different sizes are mounted on the chuck which is in communication with a vacuum mechanism such as an automatic surface grinder. It concerns a universal chuck that can be done.
【０００２】[0002]
【従来技術】従来、この種のチャックは、該チャック本
体へ嵌着する円板状の乗載台の全体を一体のポーラスセ
ラミック等の通気性部材で形成しており、研削等の加工
を施す半導体ウエハの外径寸法に合わせて、チャックを
交換しなければ確実に効率良くバキューム吸着すること
はできなく煩わしさが存していた。2. Description of the Related Art Conventionally, in this type of chuck, the entire disk-shaped mounting table fitted to the chuck body is formed of an integral breathable member such as porous ceramic, and is subjected to processing such as grinding. If the chuck is not replaced in accordance with the outer diameter of the semiconductor wafer, the vacuum suction cannot be performed reliably and efficiently, which is troublesome.
【０００３】つまり、チャックの外径が半導体ウエハの
外径より小さいとバキューム吸着の吸引力はあるもの
の、被研削物である半導体ウエハの外周縁がチャックよ
り膨出し研削加工等の際の平坦精度が悪化してしまい、
逆に、チャックの外径が半導体ウエハの外径より大きい
場合には半導体ウエハの外周より外方ではエアを大量に
吸引するのみで効率的とはいえなく、従って、その都度
チャックを交換していた。That is, when the outer diameter of the chuck is smaller than the outer diameter of the semiconductor wafer, there is a suction force for vacuum suction, but the outer peripheral edge of the semiconductor wafer, which is the object to be ground, bulges out of the chuck, and the flatness accuracy is increased during grinding. Became worse,
On the other hand, if the outer diameter of the chuck is larger than the outer diameter of the semiconductor wafer, it is not efficient because only a large amount of air is sucked outside the outer periphery of the semiconductor wafer, and therefore the chuck must be replaced each time. It was
【０００４】その為に、本願出願人が先に開示した（平
成２年特許出願公告第４６３３１号）名称、フリーサイ
ズチャック機構は、チャック本体の中心部辺へ中央凹陥
部を形成し、中央凹陥部の外方へ同心状とした複数の環
状溝を環状部とした隔壁を有して形成し、中央凹陥部の
底面中心へはバキューム機構へ連通する貫通孔を穿設す
ると共に、中央凹陥部と夫々の環状溝とへは夫々通気性
部材で形成された円板部材と夫々の環状部材を上面を平
坦状にして嵌着固定させ、夫々の環状溝の底部へは夫々
の開閉弁を介設してバキューム機構へ繋がる通気通水機
構を夫々配設したものであり、研削加工等する半導体ウ
エハの外径のサイズに合わせてバキューム機構への開閉
弁を切り換えることによって、チャックの交換を不要と
したものである。Therefore, the name of the free size chuck mechanism, which was previously disclosed by the applicant of the present application (Japanese Patent Application Publication No. 46331 in 1990), forms a central concave portion on the central side of the chuck body, and the central concave portion is formed. A plurality of annular grooves that are concentric to the outside are formed with a partition wall that is an annular portion, and a through hole that communicates with the vacuum mechanism is formed in the center of the bottom surface of the central concave portion, and a central concave portion is formed. A disc member formed of a breathable member and each annular member are fitted and fixed to the respective annular grooves with their upper surfaces flattened, and respective opening / closing valves are provided at the bottoms of the respective annular grooves. Each of them is equipped with a ventilation and water flow mechanism that connects to the vacuum mechanism, and chucks need not be replaced by switching the open / close valve to the vacuum mechanism according to the size of the outer diameter of the semiconductor wafer to be ground. It was done.
【０００５】[0005]
【解決しようとする課題】然し乍、前述の従来の方法で
は従来レベルの品質の半導体ウエハであれば問題は無か
ったものの、昨今要求されるような超高精度の平坦精度
及び鏡面精度、並びに、極薄化、拡径化された半導体ウ
エハで対処できなく成っている実情であり、通気性部材
と不通気性部材との材質の相違による硬度差、強度差、
或いは、環境変化による温度差、バキュームの吸引圧の
バラツキ等によって半導体ウエハに０．５ミクロン程度
の傷又は跡が残留し、超高精度の平坦精度と、高精度の
鏡面加工、平坦加工ができない課題を有していた。However, in the above-mentioned conventional method, although there was no problem as long as the semiconductor wafer has a conventional level of quality, the flatness and mirror surface precision of ultra-high precision required recently, and It is the reality that it is not possible to deal with ultra-thin and expanded semiconductor wafers, hardness difference, strength difference due to difference in material of breathable member and impermeable member,
Or, scratches or traces of about 0.5 micron remain on the semiconductor wafer due to temperature differences due to environmental changes, variations in vacuum suction pressure, etc., and ultra-high precision flatness and high precision mirror surface processing, flatness processing cannot be performed. Had challenges.
【０００６】[0006]
【課題を解決するための手段】本発明は、前述の課題に
鑑みて、鋭意研鑽の結果、前述の課題の解決を図ること
を目的とするものであって、円板状乗載台と隣接する環
状乗載台との間の環状空隙部及び環状乗載台と隣接する
環状乗載台との間の環状空隙部へ空隙部用不通気部材と
して焼結後の硬度が前記夫々の乗載台の材質の硬度と略
同等か又は若干低い硬度の材質のペースト状焼結剤と混
和させたガラス繊維を塗布焼結したことと、更に、空隙
部用不通気部材として充填後の硬度が前記夫々の乗載台
の材質の硬度と同等か又は若干低い硬度の材質の充填剤
を充填したことと、加えて、空隙部用不通気部材として
粘着後の硬度が夫々の乗載台の材質の硬度と略同等か又
は若干低い硬度の材質の粘着テープを貼着したよって、
外径サイズの相違する半導体ウエハであっても自在に且
つ確実に吸着でき、加えて、ミクロ単位の傷又は跡を残
留さないユニバーサルチャックを提供することを目的と
するものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and as a result of intensive studies, it is an object of the present invention to solve the above-mentioned problems. To the annular space between the annular mounting table and the annular mounting table adjacent to the annular mounting table. The glass fiber mixed with a paste-like sintering agent having a hardness substantially equal to or slightly lower than the hardness of the table material is applied and sintered, and further, the hardness after filling as an air-impermeable member for voids is the above-mentioned. In addition to filling with a filler of a material whose hardness is equal to or slightly lower than the hardness of each mounting table, in addition, the hardness after adhesion as an air-impermeable member for voids is different from that of each mounting table. Since an adhesive tape made of a material having hardness almost equal to or slightly lower than the hardness is attached,
It is an object of the present invention to provide a universal chuck which can freely and surely adsorb even semiconductor wafers having different outer diameter sizes and which does not leave scratches or marks in micro units.
【０００７】[0007]
【発明の構成】本発明の構成は、チャック本体と、チャ
ック本体へ形成した凹陥部と、凹陥部の底面へ貫設させ
た通気通水機構と、凹陥部の外方へ立設した複数の環状
仕切と、通気通水機構と複数の環状仕切によって仕切ら
れた環状隔溝とを連通させる切替バルブと、凹陥部へ嵌
着する円板状乗載台と、円板状乗載台の外方へ嵌着する
複数の環状乗載台とから成る研削盤のチャックにおい
て、円板状乗載台と隣接する環状乗載台との間の環状空
隙部及び環状乗載台と隣接する環状乗載台との間の環状
空隙部へ空隙部用不通気部材として焼結後の硬度が夫々
の乗載台の材質の硬度と略同等か又は若干低い硬度の材
質のペースト状焼結剤と混和させたガラス繊維を塗布焼
結した構成であり、更に、空隙部用不通気部材として充
填後の硬度が夫々の乗載台の材質の硬度と略同等か又は
若干低い硬度の材質の充填剤を充填した構成であり、加
えて、空隙部用不通気部材として粘着後の硬度が夫々の
乗載台の材質の硬度と略同等か又は若干低い硬度の材質
の粘着テープを貼着した構成である。The structure of the present invention comprises a chuck body, a concave portion formed in the chuck body, a ventilation / water passage mechanism penetrating the bottom surface of the concave portion, and a plurality of standing members provided outside the concave portion. A ring-shaped partition, a switching valve that connects the ventilation water flow mechanism and the ring-shaped partition that is partitioned by a plurality of ring-shaped partitions, a disk-shaped mounting base that fits into the recess, and the outside of the disk-shaped mounting base. In a chuck of a grinding machine including a plurality of annular mounting bases that are fitted to each other, an annular gap between the disk-shaped mounting base and an adjacent annular mounting base and an annular mounting adjacent to the annular mounting base. Mix into an annular gap between the mounting table and a paste-like sintering agent of a material whose hardness after sintering as an air-impermeable member for the space is approximately equal to or slightly lower than the hardness of the material of each mounting table. The glass fiber is applied and sintered, and further, the hardness after filling as an air-impermeable member for voids is different. The hardness of the mounting base is the same as the hardness of the mounting base, or is filled with a filler having a hardness slightly lower than that of the mounting base. The adhesive tape is made of a material having a hardness substantially equal to or slightly lower than the above.
【０００８】[0008]
【発明の作用】本発明はチャックの円板状乗載台と隣接
する環状乗載台との間の環状空隙部及び環状乗載台と隣
接する環状乗載台との間の環状空隙部への空隙部用不通
気部材として焼結後の硬度が夫々の乗載台の材質の硬度
と略同等か又は若干低い硬度の材質のペースト状焼結剤
と混和させたガラス繊維を塗布焼結させるか、又は、空
隙部用不通気部材として充填後の硬度が夫々の乗載台の
材質の硬度と略同等か又は若干低い硬度の材質の充填剤
を充填させるか、或いは、空隙部用不通気部材として粘
着後の硬度が夫々の乗載台の材質の硬度と略同等か又は
若干低い硬度の材質の粘着テープを貼着させたことによ
って、チャックを交換することなくサイズの相違する半
導体ウエハを確実に吸着させることができるものであ
る。INDUSTRIAL APPLICABILITY The present invention provides an annular space between the disk-shaped mounting table of the chuck and the adjacent annular mounting table and an annular space between the annular mounting table and the adjacent annular mounting table. As an air-impermeable member for voids, the glass fiber mixed with a paste-like sintering agent whose hardness after sintering is substantially equal to or slightly lower than the hardness of the material of each mounting table is applied and sintered. Or, as a void-impermeable member for voids, a filler made of a material whose hardness after filling is approximately equal to or slightly lower than the hardness of the material of each mounting table, or is impermeable to voids As a member, by sticking an adhesive tape made of a material whose hardness after adhesion is substantially equal to or slightly lower than that of the material of each mounting table, semiconductor wafers of different sizes can be used without replacing the chuck. It can be surely adsorbed.
【０００９】[0009]
【発明の実施例】以下、実施例の図面によって、本発明
のユニバーサルチャックを具体的に説明する。BEST MODE FOR CARRYING OUT THE INVENTION The universal chuck of the present invention will be described in detail below with reference to the drawings of the embodiments.
【００１０】図１は本発明のユニバーサルチャックの実
施例を説明するための要部断面図であり、図２は本発明
のユニバーサルチャックの実施例の平面図である。FIG. 1 is a sectional view of an essential part for explaining an embodiment of a universal chuck of the present invention, and FIG. 2 is a plan view of an embodiment of the universal chuck of the present invention.
【００１１】本発明は、平面自動研削盤等のバキューム
機構と連通させたチャック１へサイズの異なる半導体ウ
エハＷを乗載させた場合でもチャック１を交換すること
無く確実にバキューム吸着することができるユニバーサ
ルチャック１に関するものであり、不通気性部材で形成
した円盤形状のチャック本体２と、該チャック本体２の
中心辺へ形成した凹陥部３と、該凹陥部３の底面の中心
へ貫設させたバキューム機構及び通水機構へ連通する通
気通水機構４と、前記凹陥部３の外方へ同心状に立設し
た複数の環状仕切５と、該通気通水機構４と複数の環状
仕切５によって仕切られた夫々の環状隔溝６とを連通さ
せる夫々の切換バルブ７と、前記凹陥部３の上方へ嵌着
する円板状乗載台８と、該円板状乗載台８の外方へ同心
状に且つ上面を平坦状にして嵌着する夫々サイズの相違
する複数の環状乗載台９とから成る半導体ウエハＷをバ
キューム吸着して研削する研削盤のチャック１におい
て、前記円板状乗載台８と隣接する環状乗載台９との間
の環状空隙部１０及び環状乗載台９と隣接する環状乗載
台９との間の環状空隙部１０へ空隙部用不通気部材１１
として焼結後の硬度が前記夫々の乗載台の材質の硬度と
略同等か又は若干低い硬度の材質のペースト状焼結剤と
混和させたガラス繊維を塗布焼結したものである。According to the present invention, even when semiconductor wafers W having different sizes are mounted on the chuck 1 in communication with a vacuum mechanism such as a surface automatic grinding machine, the vacuum suction can be surely performed without exchanging the chuck 1. The present invention relates to a universal chuck 1, which has a disk-shaped chuck body 2 formed of an impermeable member, a recessed portion 3 formed in the central side of the chuck body 2, and a recessed portion 3 which penetrates the center of the bottom surface of the recessed portion 3. Ventilation mechanism 4 communicating with the vacuum mechanism and the water passage mechanism, a plurality of annular partitions 5 that are erected concentrically outside the recessed portion 3, the ventilation water passage mechanism 4 and a plurality of annular partitions 5 Each switching valve 7 communicating with each annular partition 6 partitioned by, a disk-shaped mounting base 8 fitted above the recessed portion 3, and an outer side of the disk-shaped mounting base 8. Concentric towards In a chuck 1 of a grinder for vacuum-sucking and grinding a semiconductor wafer W, which is composed of a plurality of annular mounting bases 9 each of which is fitted in a circular shape, and adjacent to the disk-shaped mounting base 8. To the annular space 10 between the mounting base 9 and the annular space 10 between the annular mounting base 9 and the adjacent annular mounting base 9 to the space impermeable member 11
A glass fiber mixed with a paste-like sintering agent having a material whose hardness after sintering is substantially equal to or slightly lower than the hardness of the material of each mounting table is applied and sintered.
【００１２】更に、不通気性部材で形成した円盤形状の
チャック本体２と、該チャック本体２の中心辺へ形成し
た凹陥部３と、該凹陥部３の底面の中心へ貫設させたバ
キューム機構及び通水機構へ連通する通気通水機構４
と、前記凹陥部３の外方へ同心状に立設した複数の環状
仕切５と、該通気通水機構４と複数の環状仕切５によっ
て仕切られた夫々の環状隔溝６とを連通させる夫々の切
換バルブ７と、前記凹陥部３の上方へ嵌着する円板状乗
載台８と、該円板状乗載台８の外方へ同心状に且つ上面
を平坦状にして嵌着する夫々サイズの相違する複数の環
状乗載台９とから成る半導体ウエハＷをバキューム吸着
して研削する研削盤のチャック１において、前記円板状
乗載台８と隣接する環状乗載台９との間の環状空隙部１
０及び環状乗載台９と隣接する環状乗載台９との間の環
状空隙部１０へ空隙部用不通気部材１１として充填後の
硬度が前記夫々の乗載台の材質の硬度と同等か又は若干
低い硬度の材質の充填剤を充填したものである。Further, a disk-shaped chuck body 2 formed of an impermeable member, a concave portion 3 formed on the central side of the chuck body 2, and a vacuum mechanism penetrating the center of the bottom surface of the concave portion 3. And a ventilation water passage mechanism 4 communicating with the water passage mechanism
And a plurality of annular partitions 5 which are erected concentrically on the outside of the recessed portion 3, and the respective annular partition grooves 6 which are partitioned by the ventilation water passage mechanism 4 and the plurality of annular partitions 5. Switching valve 7, a disk-shaped mounting table 8 that is fitted over the recessed portion 3, and a disk-shaped mounting table 8 that is concentrically fitted to the outside of the disk-shaped mounting table 8 and has a flat upper surface. In a chuck 1 of a grinder that vacuum chucks and grinds a semiconductor wafer W, which is composed of a plurality of annular loading platforms 9 each having a different size, the disk-shaped loading platform 8 and an annular loading platform 9 adjacent to each other are used. Annular space 1 between
0 and the hardness after filling the annular void 10 between the annular loading platform 9 and the adjacent annular loading platform 9 as the void impermeable member 11 is equal to the hardness of the material of each of the loading platforms. Alternatively, the filler is filled with a material having a slightly lower hardness.
【００１３】加えて、不通気性部材で形成した円盤形状
のチャック本体２と、該チャック本体２の中心辺へ形成
した凹陥部３と、該凹陥部３の底面の中心へ貫設させた
バキューム機構及び通水機構へ連通する通気通水機構４
と、前記凹陥部３の外方へ同心状に立設した複数の環状
仕切５と、該通気通水機構４と複数の環状仕切５によっ
て仕切られた夫々の環状隔溝６とを連通させる夫々の切
換バルブ７と、前記凹陥部３の上方へ嵌着する円板状乗
載台８と、該円板状乗載台８の外方へ同心状に且つ上面
を平坦状にして嵌着する夫々サイズの相違する複数の環
状乗載台９とから成る半導体ウエハＷをバキューム吸着
して研削する研削盤のチャック１において、前記円板状
乗載台８と隣接する環状乗載台９との間の環状空隙部１
０及び環状乗載台９と隣接する環状乗載台９との間の環
状空隙部１０へ空隙部用不通気部材１１として粘着後の
硬度が前記夫々の乗載台の材質の硬度と同等か又は若干
低い硬度の材質の粘着テープを貼着したものである。In addition, a disk-shaped chuck body 2 formed of an impermeable member, a concave portion 3 formed on the central side of the chuck body 2, and a vacuum formed at the center of the bottom surface of the concave portion 3. Aeration and water passage mechanism 4 communicating with the mechanism and water passage mechanism
And a plurality of annular partitions 5 which are erected concentrically on the outside of the recessed portion 3, and the respective annular partition grooves 6 which are partitioned by the ventilation water passage mechanism 4 and the plurality of annular partitions 5. Switching valve 7, a disk-shaped mounting table 8 that is fitted over the recessed portion 3, and a disk-shaped mounting table 8 that is concentrically fitted to the outside of the disk-shaped mounting table 8 and has a flat upper surface. In a chuck 1 of a grinder that vacuum chucks and grinds a semiconductor wafer W, which is composed of a plurality of annular loading platforms 9 each having a different size, the disk-shaped loading platform 8 and an annular loading platform 9 adjacent to each other are used. Annular space 1 between
0 or the annular mounting base 9 and the annular mounting space 9 between the adjacent mounting bases 9 have the hardness after being adhered as the space impermeable member 11 to the annular space 10 equal to the hardness of the material of each of the mounting bases. Alternatively, an adhesive tape made of a material having a slightly lower hardness is attached.
【００１４】即ち、本発明は、平面自動研削盤等のロー
タリーテーブルの複数箇所へ等間隔を有して配設された
夫々のチャック１はバキューム機構（図示しない）へ連
通しているものであり、該バキューム機構は空気を吸引
して負圧をかけると共に、送水を可能とするポンプ等と
通気通水系から成るものであり、研削する半導体ウエハ
Ｗを吸着させるためのチャック１には円盤形状のチャッ
ク本体２を嵌置するものである。That is, according to the present invention, each chuck 1 arranged at a plurality of positions of a rotary table such as a surface automatic grinding machine at equal intervals is communicated with a vacuum mechanism (not shown). The vacuum mechanism is composed of a pump or the like and a ventilation water flow system capable of sucking air to apply a negative pressure and also capable of sending water, and the chuck 1 for adsorbing the semiconductor wafer W to be ground has a disk shape. The chuck body 2 is placed.
【００１５】そして、前記チャック１の上方へは所定の
加工を施すダイアモンドカップホイール等の加工具を下
端に取着した数本のスピンドル軸（図示しない）を垂下
させ、該スピンドル軸の下方には間欠的に自転停止を繰
り返すロータリーテーブルの面上へ複数の自転する円盤
状のチャック１が配設され、該チャック１へは半導体ウ
エハＷが吸着され、該半導体ウエハＷと共にチャック１
が回転を始めると同時に上方から加工具を取着したスピ
ンドル軸が降下し、求められる厚さに研削加工され、所
定の加工を施された後にスピンドル軸は上昇するもので
ある。Above the chuck 1, several spindle shafts (not shown) having processing tools such as a diamond cup wheel for performing a predetermined processing attached to the lower end are hung down, and below the spindle shafts. A plurality of disc-shaped chucks 1 that rotate are arranged on the surface of a rotary table that intermittently repeats rotation, and a semiconductor wafer W is attracted to the chuck 1, and the chucks 1 together with the semiconductor wafer W are chucked.
At the same time that the rotating shaft starts rotating, the spindle shaft to which the processing tool is attached descends from above, is ground to the required thickness, and after the predetermined machining is performed, the spindle shaft rises.
【００１６】次いで、ロータリーテーブルの回動によっ
て次の停止位置へ進行し、次のスピンドル軸の下方で研
削加工等を施され、順次諸加工が完了し、所定の位置に
おいて半導体ウエハＷの研削面は洗浄され、半導体ウエ
ハＷはチャック１よりバキューム吸着を開放され取り外
され、チャック１は洗浄され、ロータリーテーブルは一
定の停止速度を保ち前述の工程を繰返しながらエンドレ
ス的に回転するものである。Next, the rotary table is rotated to advance to the next stop position, where grinding is performed below the next spindle shaft, and various processes are sequentially completed. At a predetermined position, the ground surface of the semiconductor wafer W is ground. The semiconductor wafer W is cleaned, the vacuum suction is released from the chuck 1 and removed, the chuck 1 is cleaned, and the rotary table keeps a constant stop speed and is rotated endlessly while repeating the above-mentioned steps.
【００１７】前述の様な平面自動研削盤のチャック本体
２はセラミック等の不通気性部材で円盤形状に形成し、
中心辺へは後述するポーラスセラミック等の通気性部材
で形成した円板状乗載台８を嵌着固定させる凹陥部３を
形成し、該凹陥部３の底面の中心へは通気及び通水をす
るためのバキューム機構及び通水機構へ連通させる通気
通水機構４を配設したものである。The chuck body 2 of the automatic surface grinding machine as described above is formed in a disk shape from an impermeable member such as ceramic.
A concave portion 3 into which a disk-shaped mounting table 8 formed of a breathable member such as porous ceramic described later is fitted and fixed is formed on the center side, and ventilation and water flow are performed to the center of the bottom surface of the concave portion 3. The ventilation mechanism 4 is provided for communicating with the vacuum mechanism and the water passage mechanism.
【００１８】次に、前記凹陥部３の外方へは後述するポ
ーラスセラミック等の通気性部材で形成した夫々サイズ
の相違する複数の環状乗載台９を上方に嵌着させる複数
の環状仕切５を同心状に立設したものであり、該複数の
環状仕切５によって仕切られた環状隔溝６と通気通水機
構４とは夫々の切換バルブ７を介して連通させさせてい
るものである。Next, a plurality of annular partitions 5 are formed on the outside of the recessed portion 3 and are fitted with a plurality of annular mounting bases 9 of different sizes, each of which is formed of a breathable member such as a porous ceramic described later. Are erected concentrically, and the annular partition groove 6 partitioned by the plurality of annular partitions 5 and the ventilation water passage mechanism 4 are made to communicate with each other via respective switching valves 7.
【００１９】そして、前記凹陥部３の上方へは凹陥部３
を覆うように内側形状と合致する形状のポーラスセラミ
ック等の通気性部材で形成された円板状乗載台８を嵌着
させると共に、前記複数の環状仕切５の上方へは夫々の
環状隔溝６の形状と合致する形状のポーラスセラミック
等の通気性部材で形成された環状乗載台９を密着状態で
嵌着させるものであり、前記円板状乗載台８と夫々の環
状乗載台９とは同心状に且つ上面を平坦状にしたもので
ある。Then, the concave portion 3 is provided above the concave portion 3.
A disk-shaped mounting table 8 formed of a breathable member such as a porous ceramic having a shape matching the inner shape is fitted so as to cover the inner shape, and each of the annular partition grooves 5 is provided above the plurality of annular partitions 5. An annular mounting table 9 formed of a breathable member such as a porous ceramic having a shape matching the shape of 6 is fitted in a close contact state, and the circular disk-shaped mounting table 8 and the respective annular mounting tables are mounted. 9 is concentric and has a flat upper surface.
【００２０】本発明のユニバーサルチャック１は円板状
乗載台８と隣接する環状乗載台９との間の環状空隙部１
０及び環状乗載台９と隣接する環状乗載台９との間の環
状空隙部１０へ空隙部用不通気部材１１として焼結後の
硬度が前記夫々の乗載台の材質の硬度と略同等か又は若
干低い硬度の材質のペースト状焼結剤と混和させたガラ
ス繊維を塗布焼結したことによって、円板状乗載台８と
夫々の環状乗載台９との間の環状空隙部１０が一体化
し、研削加工後の半導体ウエハＷのチャック１の吸着面
に傷及び跡を残留させることを皆無としたものである。The universal chuck 1 of the present invention has an annular gap 1 between a disk-shaped mounting table 8 and an adjacent annular mounting table 9.
0 and an annular void 10 between the annular loading platform 9 and the adjacent annular loading platform 9 have hardness after sintering as a void impermeable member 11 that is substantially the same as the hardness of the material of each of the loading platforms. An annular gap between the disk-shaped mounting base 8 and each annular mounting base 9 by applying and sintering glass fibers mixed with a paste-like sintering agent of a material having the same or slightly lower hardness. 10 is integrated, and scratches and marks are not left on the suction surface of the chuck 1 of the semiconductor wafer W after grinding.
【００２１】更に、本発明では空隙部用不通気部材１１
として充填後の硬度が夫々の乗載台の材質の硬度と同等
か又は若干低い硬度の材質の充填剤を充填したものであ
る。Further, in the present invention, the air-impermeable member 11 for voids is used.
The filling material is filled with a filler having a hardness that is equal to or slightly lower than the hardness of the material of each mounting table.
【００２２】加えて、空隙部用不通気部材１１として粘
着後の硬度が前記夫々の乗載台の材質の硬度と同等か又
は若干低い硬度の材質の粘着テープを貼着したものであ
る。In addition, as the air-impermeable member 11 for the void portion, an adhesive tape made of a material whose hardness after adhesion is equal to or slightly lower than the hardness of the material of each of the mounting tables is attached.
【００２３】本発明は、先ず、前記チャック１の上面へ
被加工物である半導体ウエハＷを移送アーム等の手段に
よって中心位置へ乗載させ、半導体ウエハＷが乗載され
るとバキューム機構と連通した中央の通気通水機構４と
によって負圧がかかり、半導体ウエハＷの下面がチャッ
ク１の上面に確りとバキューム吸着されるものであり、
チャック本体２の中心に位置する円板状乗載台８と、該
円板状乗載台８の外周へ嵌着した複数の環状乗載台９は
空隙部用不通気部材１１を介して一体化しているもので
ある。According to the present invention, first, a semiconductor wafer W, which is a workpiece, is mounted on the upper surface of the chuck 1 at a central position by means of a transfer arm or the like, and when the semiconductor wafer W is mounted, it communicates with a vacuum mechanism. Negative pressure is applied by the central ventilation water flow mechanism 4 and the lower surface of the semiconductor wafer W is securely vacuum-adsorbed to the upper surface of the chuck 1.
A disk-shaped mounting table 8 located at the center of the chuck body 2 and a plurality of annular mounting tables 9 fitted to the outer periphery of the disk-shaped mounting table 8 are integrated via a gap impermeable member 11 It has become.
【００２４】つまり、チャック１の上面に半導体ウエハ
Ｗを乗載させ、バキューム機構を作動させて夫々の切換
バルブ７を全て閉鎖すると円板状乗載台８のみに負圧が
かかるものであり、次いで、チャック本体２の凹陥部３
の隣接する外方に位置する環状仕切５によって仕切られ
る環状隔溝６に連通した切換バルブ７を開放すると中央
の円板状乗載台８と隣接する環状乗載台９に負圧がかか
るものであり、順次、任意の位置の環状隔溝６と連通し
た夫々の切換バルブ７を開閉することにより、サイズの
相違する半導体ウエハＷであってもチャック１を交換す
ることなく、確実にバキューム吸着できるできるもので
ある。That is, when the semiconductor wafer W is mounted on the upper surface of the chuck 1 and the vacuum mechanism is operated to close all the switching valves 7, negative pressure is applied only to the disk-shaped mounting table 8. Next, the concave portion 3 of the chuck body 2
A negative pressure is applied to the central disk-shaped mounting table 8 and the adjacent annular mounting table 9 when the switching valve 7 that communicates with the annular partition groove 6 that is partitioned by the annular partition 5 located outside of Therefore, by sequentially opening and closing the respective switching valves 7 communicating with the annular groove 6 at an arbitrary position, even if the semiconductor wafers W having different sizes are used, the vacuum suction can be surely performed without exchanging the chuck 1. You can do it.
【００２４】[0024]
【発明の効果】前述の如く構成した本発明の半導体ウエ
ハのユニバーサルチャックは円板状乗載台と隣接する環
状乗載台との間の環状空隙部及び環状乗載台と隣接する
環状乗載台との間の環状空隙部へ空隙部用不通気部材と
して焼結後の硬度が夫々の乗載台の材質の硬度と略同等
か又は若干低い硬度の材質のペースト状焼結剤と混和さ
せたガラス繊維を塗布焼結させ、更に、空隙部用不通気
部材として充填後の硬度が夫々の乗載台の材質の硬度と
略同等か又は若干低い硬度の材質の充填剤を充填させ、
加えて、空隙部用不通気部材として粘着後の硬度が夫々
の乗載台の材質の硬度と略同等か又は若干低い硬度の材
質の粘着テープを貼着させたことによって、外径の相違
する半導体ウエハにあってもチャック本体を交換するこ
となく、且つ、半導体ウエハにミクロ単位の傷又は跡を
残留させることないものであり、超高精度の平坦加工を
施すために、その貢献性は計り知れないものがあり、極
めて有意義な効果を奏することができるものである。The universal chuck for semiconductor wafers of the present invention constructed as described above has an annular gap between the disk-shaped mounting table and the adjacent annular mounting table and an annular mounting section adjacent to the annular mounting table. To the annular space between the base and the air-permeable member for the space, mixed with a paste-like sintering agent of a material whose hardness after sintering is approximately equal to or slightly lower than the hardness of the material of each mounting table. The glass fiber is applied and sintered, and further, a filler of a material whose hardness after filling as a void impermeable member is approximately equal to or slightly lower than the hardness of the material of each mounting table,
In addition, the outer diameter is different by sticking an adhesive tape made of a material whose hardness after adhesion is approximately the same as or slightly lower than the hardness of the material of each mounting table as the air-impermeable member for voids. Even if it is a semiconductor wafer, it does not require replacement of the chuck body and does not leave microscopic scratches or marks on the semiconductor wafer. There are things that are unknown, and it is possible to produce extremely significant effects.
【図１】図１は本発明のユニバーサルチャックの実施例
を説明するための要部断面図である。FIG. 1 is a sectional view of an essential part for explaining an embodiment of a universal chuck of the present invention.
【図２】図２は本発明のユニバーサルチャックの実施例
の平面図である。FIG. 2 is a plan view of an embodiment of the universal chuck of the present invention.
１ チャック ２ チャック本体 ３ 凹陥部 ４ 通気通水機構 ５ 環状仕切 ６ 環状隔溝 ７ 切換バルブ ８ 円板状乗載台 ９ 環状乗載台 １０ 環状空隙部 １１ 空隙部用不通気部材 Ｒ ロータリーテーブル Ｗ 半導体ウエハ DESCRIPTION OF SYMBOLS 1 Chuck 2 Chuck main body 3 Recessed portion 4 Ventilation / water flow mechanism 5 Annular partition 6 Annular partition groove 7 Switching valve 8 Disc-shaped mounting table 9 Annular mounting table 10 Annular void portion 11 Airtight member for rotary portion R Rotary table W Semiconductor wafer
Claims (3)
ク本体と、該チャック本体の中心辺へ形成した凹陥部
と、該凹陥部の底面の中心へ貫設させたバキューム機構
及び通水機構へ連通する通気通水機構と、前記凹陥部の
外方へ同心状に立設した複数の環状仕切と、該通気通水
機構と複数の環状仕切によって仕切られた夫々の環状隔
溝とを連通させる夫々の切替バルブと、前記凹陥部の上
方へ嵌着する円板状乗載台と、該円板状乗載台の外方へ
同心状に且つ上面を平坦状にして嵌着する夫々サイズの
相違する複数の環状乗載台とから成る半導体ウエハをバ
キューム吸着して研削する研削盤のチャックにおいて、
前記円板状乗載台と隣接する環状乗載台との間の環状空
隙部及び環状乗載台と隣接する環状乗載台との間の環状
空隙部へ空隙部用不通気部材として焼結後の硬度が前記
夫々の乗載台の材質の硬度と略同等か又は若干低い硬度
の材質のペースト状焼結剤と混和させたガラス繊維を塗
布焼結したことを特徴とするユニバーサルチャック。1. A disk-shaped chuck body formed of an impermeable member, a recess formed in the central side of the chuck body, and a vacuum mechanism and a water passage mechanism penetrating the center of the bottom surface of the recess. To communicate with the ventilation passage mechanism, a plurality of annular partitions that are erected concentrically outside the recess, and the ventilation passage mechanism and the respective annular partitions that are partitioned by the plurality of annular partitions. Respective switching valves, a disk-shaped mounting table that is fitted above the recessed portion, and a size that is concentrically fitted to the outside of the disk-shaped mounting table and has a flat upper surface. In a chuck of a grinding machine for vacuum-sucking and grinding a semiconductor wafer consisting of a plurality of annular loading tables different in
Sintering as an air-impermeable member for the cavity into an annular gap between the disk-shaped loading platform and the adjacent annular loading platform and an annular void between the annular loading platform and the adjacent annular loading platform A universal chuck characterized in that a glass fiber mixed with a paste-like sintering agent of a material whose hardness afterward is substantially the same as or slightly lower than the hardness of the material of the respective mounting tables is applied and sintered.
ク本体と、該チャック本体の中心辺へ形成した凹陥部
と、該凹陥部の底面の中心へ貫設させたバキューム機構
及び通水機構へ連通する通気通水機構と、前記凹陥部の
外方へ同心状に立設した複数の環状仕切と、該通気通水
機構と複数の環状仕切によって仕切られた夫々の環状隔
溝とを連通させる夫々の切替バルブと、前記凹陥部の上
方へ嵌着する円板状乗載台と、該円板状乗載台の外方へ
同心状に且つ上面を平坦状にして嵌着する夫々サイズの
相違する複数の環状乗載台とから成る半導体ウエハをバ
キューム吸着して研削する研削盤のチャックにおいて、
前記円板状乗載台と隣接する環状乗載台との間の環状空
隙部及び環状乗載台と隣接する環状乗載台との間の環状
空隙部へ空隙部用不通気部材として充填後の硬度が前記
夫々の乗載台の材質の硬度と同等か又は若干低い硬度の
材質の充填剤を充填したことを特徴とするユニバーサル
チャック。2. A disc-shaped chuck body formed of an impermeable member, a recess formed in the center of the chuck body, and a vacuum mechanism and a water passage mechanism penetrating the center of the bottom surface of the recess. To communicate with the ventilation passage mechanism, a plurality of annular partitions that are erected concentrically outside the recess, and the ventilation passage mechanism and the respective annular partitions that are partitioned by the plurality of annular partitions. Respective switching valves, a disk-shaped mounting table that is fitted above the recessed portion, and a size that is concentrically fitted to the outside of the disk-shaped mounting table and has a flat upper surface. In a chuck of a grinding machine for vacuum-sucking and grinding a semiconductor wafer consisting of a plurality of annular loading tables different in
After filling the annular space between the disk-shaped mounting table and the adjacent annular mounting table and the annular space between the annular mounting table and the adjacent annular mounting table as a space impermeable member A universal chuck having a hardness equal to or slightly lower than the hardness of the material of each of the mounting tables.
ク本体と、該チャック本体の中心辺へ形成した凹陥部
と、該凹陥部の底面の中心へ貫設させたバキューム機構
及び通水機構へ連通する通気通水機構と、前記凹陥部の
外方へ同心状に立設した複数の環状仕切と、該通気通水
機構と複数の環状仕切によって仕切られた夫々の環状隔
溝とを連通させる夫々の切替バルブと、前記凹陥部の上
方へ嵌着する円板状乗載台と、該円板状乗載台の外方へ
同心状に且つ上面を平坦状にして嵌着する夫々サイズの
相違する複数の環状乗載台とから成る半導体ウエハをバ
キューム吸着して研削する研削盤のチャックにおいて、
前記円板状乗載台と隣接する環状乗載台との間の環状空
隙部及び環状乗載台と隣接する環状乗載台との間の環状
空隙部へ空隙部用不通気部材として粘着後の硬度が前記
夫々の乗載台の材質の硬度と同等か又は若干低い硬度の
材質の粘着テープを貼着したことを特徴とするユニバー
サルチャック。3. A disk-shaped chuck body formed of an impermeable member, a concave portion formed on the central side of the chuck body, and a vacuum mechanism and a water passage mechanism penetrating the center of the bottom surface of the concave portion. To communicate with the ventilation passage mechanism, a plurality of annular partitions that are erected concentrically outside the recess, and the ventilation passage mechanism and the respective annular partitions that are partitioned by the plurality of annular partitions. Respective switching valves, a disk-shaped mounting table that is fitted above the recessed portion, and a size that is concentrically fitted to the outside of the disk-shaped mounting table and has a flat upper surface. In a chuck of a grinding machine for vacuum-sucking and grinding a semiconductor wafer consisting of a plurality of annular loading tables different in
After adhering to the annular gap between the disc-shaped mounting table and the adjacent annular mounting table and the annular gap between the annular mounting table and the adjacent annular mounting table as a void impermeable member The universal chuck is characterized in that an adhesive tape made of a material whose hardness is equal to or slightly lower than the hardness of the material of each of the mounting tables is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6309490A JPH08148548A (en) | 1994-11-21 | 1994-11-21 | Universal chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6309490A JPH08148548A (en) | 1994-11-21 | 1994-11-21 | Universal chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08148548A true JPH08148548A (en) | 1996-06-07 |
Family
ID=17993624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6309490A Pending JPH08148548A (en) | 1994-11-21 | 1994-11-21 | Universal chuck |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08148548A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005092564A1 (en) * | 2004-03-25 | 2005-10-06 | Ibiden Co., Ltd. | Vacuum chuck and suction board |
| CN105364588A (en) * | 2015-12-08 | 2016-03-02 | 南京信息工程大学 | Rotating vacuum airtight clamp |
| JP2020145295A (en) * | 2019-03-06 | 2020-09-10 | 株式会社東京精密 | Wafer holding device |
-
1994
- 1994-11-21 JP JP6309490A patent/JPH08148548A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005092564A1 (en) * | 2004-03-25 | 2005-10-06 | Ibiden Co., Ltd. | Vacuum chuck and suction board |
| KR100753302B1 (en) * | 2004-03-25 | 2007-08-29 | 이비덴 가부시키가이샤 | Vacuum chuck, suction board, polishing device, and method for manufacturing of semiconductor wafer |
| US7654887B2 (en) | 2004-03-25 | 2010-02-02 | Ibiden Co., Ltd. | Vacuum chuck and suction board |
| CN105364588A (en) * | 2015-12-08 | 2016-03-02 | 南京信息工程大学 | Rotating vacuum airtight clamp |
| JP2020145295A (en) * | 2019-03-06 | 2020-09-10 | 株式会社東京精密 | Wafer holding device |
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