JPH023302B2 - - Google Patents
Info
- Publication number
- JPH023302B2 JPH023302B2 JP60120366A JP12036685A JPH023302B2 JP H023302 B2 JPH023302 B2 JP H023302B2 JP 60120366 A JP60120366 A JP 60120366A JP 12036685 A JP12036685 A JP 12036685A JP H023302 B2 JPH023302 B2 JP H023302B2
- Authority
- JP
- Japan
- Prior art keywords
- movable beam
- film
- semiconductor device
- substrate
- polysilicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 27
- 229920005591 polysilicon Polymers 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 20
- 239000003513 alkali Substances 0.000 claims description 8
- 150000004767 nitrides Chemical class 0.000 description 12
- 125000006850 spacer group Chemical group 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 238000001259 photo etching Methods 0.000 description 9
- 238000005530 etching Methods 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
Landscapes
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60120366A JPS61105861A (ja) | 1985-06-05 | 1985-06-05 | 梁構造体を有する半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60120366A JPS61105861A (ja) | 1985-06-05 | 1985-06-05 | 梁構造体を有する半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58163270A Division JPS6055655A (ja) | 1983-09-07 | 1983-09-07 | 梁構造体を有する半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61105861A JPS61105861A (ja) | 1986-05-23 |
JPH023302B2 true JPH023302B2 (fr) | 1990-01-23 |
Family
ID=14784416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60120366A Granted JPS61105861A (ja) | 1985-06-05 | 1985-06-05 | 梁構造体を有する半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61105861A (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19961299B4 (de) * | 1999-12-18 | 2009-04-30 | Robert Bosch Gmbh | Sensor zur Erkennung des Klopfens bei einer Brennkraftmaschine |
EP1310136B1 (fr) * | 2000-08-11 | 2006-03-22 | Knowles Electronics, LLC | Transducteur a bande large miniature |
-
1985
- 1985-06-05 JP JP60120366A patent/JPS61105861A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61105861A (ja) | 1986-05-23 |
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