JPH02203594A - Multilayered printed wiring board - Google Patents
Multilayered printed wiring boardInfo
- Publication number
- JPH02203594A JPH02203594A JP2265589A JP2265589A JPH02203594A JP H02203594 A JPH02203594 A JP H02203594A JP 2265589 A JP2265589 A JP 2265589A JP 2265589 A JP2265589 A JP 2265589A JP H02203594 A JPH02203594 A JP H02203594A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- insulating layer
- multilayer printed
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims abstract description 37
- 239000000843 powder Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- 239000002966 varnish Substances 0.000 claims abstract description 8
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims abstract description 7
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 7
- 239000011229 interlayer Substances 0.000 claims abstract description 6
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 5
- 229920000642 polymer Polymers 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000001035 drying Methods 0.000 abstract description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 229920002313 fluoropolymer Polymers 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000009832 plasma treatment Methods 0.000 description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000005340 laminated glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- CKNCVRMXCLUOJI-UHFFFAOYSA-N 3,3'-dibromobisphenol A Chemical compound C=1C=C(O)C(Br)=CC=1C(C)(C)C1=CC=C(O)C(Br)=C1 CKNCVRMXCLUOJI-UHFFFAOYSA-N 0.000 description 1
- DGQOZCNCJKEVOA-UHFFFAOYSA-N 5-(2,5-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1CC(=O)OC1=O DGQOZCNCJKEVOA-UHFFFAOYSA-N 0.000 description 1
- GOYGTBXFJBGGLI-UHFFFAOYSA-N 7a-but-1-enyl-3a-methyl-4,5-dihydro-2-benzofuran-1,3-dione Chemical compound C1=CCCC2(C)C(=O)OC(=O)C21C=CCC GOYGTBXFJBGGLI-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PHAFDKCRJVKSSR-UHFFFAOYSA-N ethene hydrofluoride Chemical group F.C=C PHAFDKCRJVKSSR-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は大型コンピューター等の信号伝搬速度の高速化
が要求される機器類に使用する多層プリント配線板に関
し、さらに詳しくは内層信号回路に接する絶縁層として
特定の組成物を用いた多層プリント配線板に関するもの
である。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a multilayer printed wiring board used in equipment such as large-scale computers that requires high signal propagation speed, and more specifically relates to a multilayer printed wiring board that is connected to an inner layer signal circuit. The present invention relates to a multilayer printed wiring board using a specific composition as an insulating layer.
（従来技術）
多層プリント配線板は、通常片面又は両面銅張板をその
ままか又はエツチングして回路パターンを形成しておき
、これらをプリプレグ等で層間絶縁した状態で積層プレ
ス成形して得られる。(Prior Art) Multilayer printed wiring boards are usually obtained by laminating and press-molding single-sided or double-sided copper-clad boards, either as they are or etched to form a circuit pattern, and with interlayer insulation insulated with prepreg or the like.
又絶縁ペースト剤を回路層に塗布し単独で、又はプリプ
レグと併用して使われることもある。Insulating paste may also be applied to the circuit layer and used alone or in combination with prepreg.
近年信号伝搬速度の高速化が要求され、絶縁層はこのた
めに誘電率（以下εという）が低いことが必要とされて
いる。In recent years, there has been a demand for higher signal propagation speeds, and for this reason, insulating layers are required to have a low dielectric constant (hereinafter referred to as ε).
εは低い程良いが特に最近ではその要求値は３以下であ
ることが要求されて来ている。The lower ε is, the better; however, recently, the required value has been particularly required to be 3 or less.
しかしながら従来の絶縁層はεの３以下のものは見当た
らず、しかも低εのものは多層成形性、ドリル加工性、
耐熱性に劣り信頼性の高いものは得られていなかった。However, conventional insulating layers with an ε of less than 3 have not been found, and those with a low ε have good multilayer formability, drillability,
It was not possible to obtain a highly reliable product due to poor heat resistance.
（発明が解決しようとする課題）
本発明の目的は多層プリント配線板の絶縁層のうち、少
なくとも内層信号回路に接する絶縁層のεが３以下であ
り、他の層との密着性、耐熱性に優れ、しかも加工性に
優れた信頼性の高い多層プリント配線板を提供するにあ
る。(Problems to be Solved by the Invention) The object of the present invention is to provide an insulating layer of a multilayer printed wiring board that is in contact with at least an inner layer signal circuit with an ε of 3 or less, and has good adhesion with other layers and heat resistance. To provide a highly reliable multilayer printed wiring board with excellent workability and excellent workability.
（課題を解決するための手段）
本発明は多層プリント配線板を構成する絶縁層のうち、
少なくとも内層信号回路に接する絶縁層がエポキシ変性
ポリブタジェンとエポキシ樹脂とカルボン酸無水物とを
ラジカル重合開始剤の存在の下に反応させてなる重合体
を主成分とする熱硬化性樹脂ワニス中の樹脂分１００重
量部に対して最大粒径が５０μｍ以下出あり、プラズマ
表面処理を行ったフッ素樹脂粉末を１０〜２００重量部
を配してなるペースト組成物を用いて絶縁層を形成した
多層グリント配線板である。(Means for Solving the Problems) The present invention provides that among the insulating layers constituting the multilayer printed wiring board,
A resin in a thermosetting resin varnish in which at least the insulating layer in contact with the inner layer signal circuit is mainly composed of a polymer obtained by reacting epoxy-modified polybutadiene, an epoxy resin, and a carboxylic acid anhydride in the presence of a radical polymerization initiator. Multilayer glint wiring in which an insulating layer is formed using a paste composition containing 10 to 200 parts by weight of fluororesin powder with a maximum particle size of 50 μm or less and subjected to plasma surface treatment per 100 parts by weight. It is a board.
（作用）
本発明においてエポキシ変性ポリブタジェンとしてはポ
リブタジェンの主鎖及び／又は末端にエポキシを付与し
たものであり、エポキシ樹脂としては例えばビスフェノ
ールＡタイプ、脂環式タイプなどの汎用エポキシ樹脂や
テトラブロモビスフェノールＡタイプ、ジブロモビスフ
ェノールＡタイプなどの難燃化エポキシ樹脂が挙げられ
る。(Function) In the present invention, the epoxy-modified polybutadiene is polybutadiene with epoxy added to the main chain and/or the terminal, and the epoxy resin includes, for example, general-purpose epoxy resins such as bisphenol A type and alicyclic type, and tetrabromobisphenol. Examples include flame retardant epoxy resins such as A type and dibromobisphenol A type.
カルボン酸無水物としてはクロレンド酸無水物、メチル
ブテニルテトラヒドロ無水フタル酸、アルケニルコハク
酸無水物、５−（２，５−ジオキソテトラヒドロフリル
）−３メチル３シクロヘキセン−１，２ジカルボン酸無
水物などが挙げられ、ラジカル重合開始剤としては例え
ばジクミルパーオキサイド、ｔ−ブチルパーベンゾエー
ト、Ｌ−ブチルパーオキシラウレート、ベンゾイルパー
オキサイド等有機過酸化物が挙げられる。Examples of carboxylic anhydrides include chlorendic anhydride, methylbutenyltetrahydrophthalic anhydride, alkenylsuccinic anhydride, 5-(2,5-dioxotetrahydrofuryl)-3methyl-3cyclohexene-1,2dicarboxylic anhydride Examples of the radical polymerization initiator include organic peroxides such as dicumyl peroxide, t-butyl perbenzoate, L-butyl peroxylaurate, and benzoyl peroxide.
これらをワニスとするためにジメチルホルムアミド、メ
チルセロソルブアセテート等の有機溶剤を１種または２
種以上使用する。To make these into varnish, one or two organic solvents such as dimethylformamide and methyl cellosolve acetate are added.
Use more than one species.
又フッ素樹脂粉末としては４フツ化エチレン樹脂、４フ
ッ化エチレン−６フツ化プロピレン共重合体ｍ脂、４フ
ッ化エチレン−パーフルオロアルキルビニルエーテル共
重合体樹脂粉末等があり、これらをプラズマ処理したも
のを用いる。Fluororesin powders include tetrafluoroethylene resin, tetrafluoroethylene-hexafluoropropylene copolymer resin, and tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin powder, which are plasma-treated. use something
プラズマ処理は通常の方法で行うが、反応容器内に仕込
んだ粉末全体を一様に処理するため、プラズマ処理中は
粉末を常時撹拌していることが必要である。Plasma treatment is carried out in a conventional manner, but in order to uniformly treat the entire powder charged in the reaction vessel, it is necessary to constantly stir the powder during plasma treatment.
フッ素樹脂粉末の最大粒径は多層プリント配線板をドリ
ル加工する際内壁粗さを小さくするため５０μｍ以下が
望ましい。粒子径が大きいと内壁粗さが大きくなり、内
壁粗さが大きいと耐薬品性、耐メツキ性更に電気特性に
悪影響を及ぼす。The maximum particle size of the fluororesin powder is desirably 50 μm or less in order to reduce inner wall roughness when drilling a multilayer printed wiring board. If the particle size is large, the inner wall roughness becomes large, and if the inner wall roughness is large, it adversely affects chemical resistance, plating resistance, and electrical properties.
ペースト組成としては、これらのワニス中の樹脂反応物
１００重量部に対してプラズマ処理をしたフッ素樹脂粉
末は１０〜２００重量部である。The paste composition includes 10 to 200 parts by weight of the plasma-treated fluororesin powder per 100 parts by weight of the resin reactant in these varnishes.
１０重量部以下では低ε化の効果が薄く、２００重量部
以上では結合剤としての熱硬化性樹脂の機能が低下し、
強度、外観等が悪くなる。If it is less than 10 parts by weight, the effect of lowering ε will be weak, and if it is more than 200 parts by weight, the function of the thermosetting resin as a binder will decrease.
Strength, appearance, etc. deteriorate.
添加量としては特に５０〜１８０重量部の範囲が好まし
い。The amount added is particularly preferably in the range of 50 to 180 parts by weight.
その他エポキシシランカップリング剤を添加することは
接着効果を上げるので望ましい。It is desirable to add another epoxy silane coupling agent because it improves the adhesive effect.
フッ素樹脂粉末、ワニスその他の添加物は混合時に全体
を均一に分散させることが重要である。It is important to uniformly disperse the fluororesin powder, varnish, and other additives throughout the mixture.
このようにして得たペーストを本発明の多層プリント配
線板を構成する内層材及び外層材の内側等に塗布するが
、少なくとも内層信号回路面及びまたはこれに接した面
に塗布する。The paste thus obtained is applied to the inside of the inner layer material and outer layer material constituting the multilayer printed wiring board of the present invention, and is applied at least to the inner layer signal circuit surface and/or the surface in contact therewith.
通常多層プリント配線板は信号層、グランド層、電源層
及び層間絶縁層等で構成されるが、本発明の多層プリン
ト配線板はこのうち少なくとも信号層に接する絶縁層が
本発明によるペーストより形成されたものである。Usually, a multilayer printed wiring board is composed of a signal layer, a ground layer, a power supply layer, an interlayer insulating layer, etc., but in the multilayer printed wiring board of the present invention, at least the insulating layer in contact with the signal layer is formed from the paste according to the present invention. It is something that
各の層を構成する基板の材質として樹脂はエポキシ樹脂
、ポリイミド樹脂、不飽和ポリエステル樹脂、フェノー
ル樹脂等が、基材としてガラス繊維、石英繊維、アラミ
ド繊維等が用いられる。Epoxy resin, polyimide resin, unsaturated polyester resin, phenol resin, etc. are used as the resin for the substrate constituting each layer, and glass fiber, quartz fiber, aramid fiber, etc. are used as the base material.
多層プリント配線板として用いられる基板としてはこれ
らのうち１種類でも２種類以上の組み合わせであっても
差し支えない。The substrate used as a multilayer printed wiring board may be one type or a combination of two or more of these types.
ペースト塗布後は乾燥し本来の構成に従って組み合わせ
てた後、加熱加圧成形して一体化し本発明の多層プリン
ト配線板とする。After applying the paste, it is dried and assembled according to the original structure, and then heated and pressure molded to form a single piece to form the multilayer printed wiring board of the present invention.
（実施例）
実施例１
１．２結合が９０％、エポキシ当ｆｆ１５５０のエポキ
シ変性ポリブタジェン２３．２１！Ｅ量部、臭素化ビス
フェノールＡ型エポキシ樹脂２３．３重量部、５−（２
，５−ジオキソテトラフリル）−３−メチル−３−シク
ロヘキセン−１，２−ジカルボン酸無水物１１．６１１
１部、ジクミルパーオキサイド０．３重量部をメチルイ
ソブチルケトン２３．２重量部とジメチルホルムアミド
１８．６ｆＥ量部に混合溶解して樹脂含有量５８．３重
量％のワニスを調整した。(Example) Example 1 Epoxy-modified polybutadiene with 90% 1.2 bond and epoxy ff1550 23.21! E amount parts, brominated bisphenol A type epoxy resin 23.3 parts by weight, 5-(2
,5-dioxotetrafuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic acid anhydride 11.611
A varnish having a resin content of 58.3% by weight was prepared by mixing and dissolving 1 part of dicumyl peroxide and 0.3 parts by weight of dicumyl peroxide in 23.2 parts by weight of methyl isobutyl ketone and 18.6 parts by weight of dimethylformamide.
４フツ化エチレン樹脂粉末のプラズマ処理は粉末２００
ｇを容量２リツターの反応容器に入れ、１３．５６ＭＨ
ｚの電源を使用、外部電極方式でＡｒをガスとし０．Ｏ
ｌトルの真空度、ｉｏｏｗの電力で６０分間行った。Plasma treatment of tetrafluoroethylene resin powder is powder 200.
g into a 2 liter reaction vessel and the mixture was heated to 13.56MH
z power supply is used, and Ar gas is used as an external electrode method. O
It was carried out for 60 minutes at a vacuum level of 1 torr and a power of ioow.
尚、プラズマ処理反応容器内は撹拌装置を用い撹拌した
。The inside of the plasma treatment reaction vessel was stirred using a stirring device.
調整したワニスにプラズマ処理した最大粒径２０μｍの
４７フ化エチレン樹脂粉末５８．３重量部、メチルセル
ソルブ２１ｔ量部を力ａえ、更にγ−グリシドキシズロ
ビルトリメトキシシラン１重量部（３０モルＰＰＭ）を
添加し、通常のホモジナイザーでｌｏｏｏｏｒｐｍ５分
間撹拌混合しペースト状組成物を得た。58.3 parts by weight of a plasma-treated 47 fluoride ethylene resin powder with a maximum particle size of 20 μm and 21 t parts of methyl cellosolve were added to the prepared varnish, and 1 part by weight of γ-glycidoxyduroyltrimethoxysilane ( 30 mol PPM) was added thereto, and the mixture was stirred and mixed for 5 minutes at LOOOORPM using an ordinary homogenizer to obtain a paste composition.
得られたペースト状組成物を用いて、第１図に示す様に
０ 、５ ｍｍ厚の両面銅張ポリイミド−ガラス積層板
の銅箔部分をエツチングにより回路加工した内層材の両
面に該ペーストをスクリーン印刷法で塗布、乾燥し両側
に３５μｍ厚の銅箔を配し、１７０℃、 ５５ｋｇ／ａ
ｍ”、 ２．５時間プレスして多層プリント配線板を得
た。Using the obtained paste composition, as shown in Fig. 1, the paste was applied to both sides of the inner layer material in which the copper foil part of a double-sided copper-clad polyimide glass laminate with a thickness of 0.5 mm was processed into a circuit by etching. Coated by screen printing method, dried, 35μm thick copper foil placed on both sides, 170℃, 55kg/a
m'' and pressed for 2.5 hours to obtain a multilayer printed wiring board.
得られた多層プリント配線板の評価結果を第１表に示す
。Table 1 shows the evaluation results of the obtained multilayer printed wiring board.
比較例１
実施例１の第１図に示す構成においてペーストを用いる
代わりに、０ 、１ ｍｍ厚のポリイミド−ガラスプリ
プレグを用いた他は実施例１と同様にして多層プリント
配線板を得た。Comparative Example 1 A multilayer printed wiring board was obtained in the same manner as in Example 1 except that a 0.1 mm thick polyimide-glass prepreg was used instead of the paste in the structure shown in FIG. 1 of Example 1.
得られた多層プリント配線板の評価結果を第１表に示す
。Table 1 shows the evaluation results of the obtained multilayer printed wiring board.
比較例２
４７ツ化エチレン樹脂粉末の最大粒径が１００μｍであ
る以外は実施例と同様にしてペーストを得、多層プリン
ト配線板を得た。Comparative Example 2 A paste was obtained in the same manner as in Example except that the maximum particle size of the 47-ethylene chloride resin powder was 100 μm, and a multilayer printed wiring board was obtained.
得られた多層プリント配線板の評価結果を第１表に示す
。Table 1 shows the evaluation results of the obtained multilayer printed wiring board.
比較例３
４７ツ化エチレン樹脂粉末の配合量を５重量部とした以
外は実施例と同様にしてペーストを得、多層プリント配
線板を得た。Comparative Example 3 A paste was obtained in the same manner as in Example except that the amount of 47-ethylene chloride resin powder was changed to 5 parts by weight, and a multilayer printed wiring board was obtained.
得られた多層プリント配線板の評価結果を第１表に示す
。Table 1 shows the evaluation results of the obtained multilayer printed wiring board.
比較例４
４フツ化エチレン樹脂粉末の配合量を２１０重量部とし
た以外は実施例と同様にしてペーストを得、多層プリン
ト配線板を得た。Comparative Example 4 A paste was obtained in the same manner as in Example except that the amount of tetrafluoroethylene resin powder was 210 parts by weight, and a multilayer printed wiring board was obtained.
得られた多層プリント配線板の評価結果を第１表に示す
。Table 1 shows the evaluation results of the obtained multilayer printed wiring board.
第１表から明らかなように本発明の多層プリント配線板
は低εであり、板厚精度もコントロールし易く、多層成
形性も非常に優れており、その他の性能も比較例に示す
多層プリント配線板と比べても非常に優れたものである
。As is clear from Table 1, the multilayer printed wiring board of the present invention has a low ε, the board thickness accuracy is easy to control, and the multilayer formability is very excellent. It is very superior compared to the board.
（以下余白）
（発明の効果）
本発明の多層プリント配線板は少なくとも信号回路に接
する絶縁層がエポキシ変性ポリブタジェン、エポキシ樹
脂、カルボン酸無水物をラジカル重合開始剤の存在下で
反応させたプレスとプラズマ処理したフッ素樹脂粉末と
を必須成分とするペーストからなり、このペーストを銅
箔の片側に塗布後乾燥し、このペースト面に更に銅箔を
重ねプレスして形成した両面銅張板はＪ Ｉ ５−Ｃ−
６４８１に準拠して評価した結果、εが２．８であった
。(Left space below) (Effects of the invention) The multilayer printed wiring board of the present invention has at least the insulating layer in contact with the signal circuit formed using a press made by reacting epoxy-modified polybutadiene, epoxy resin, and carboxylic acid anhydride in the presence of a radical polymerization initiator. The double-sided copper clad board is made of a paste containing plasma-treated fluororesin powder as an essential component.This paste is applied to one side of the copper foil, dried, and then another layer of copper foil is placed on the paste surface and pressed to form a double-sided copper clad board. 5-C-
As a result of evaluation based on 6481, ε was 2.8.
従って本発明の多層プリント配線板は信号層に接する絶
縁層が低ε化されており、このため信号伝搬速度を高速
化することができる。Therefore, in the multilayer printed wiring board of the present invention, the insulating layer in contact with the signal layer has a low ε, and therefore the signal propagation speed can be increased.
その他、本発明で用いるペーストは熱硬化性樹脂が結合
剤になっていること、フッ素樹脂粉末のグラズマ表面処
理、カップリング剤の添加等がフッ素樹脂−熱硬化性樹
脂間、ペーストによる絶縁層−銅箔または信号層間の接
着性を向上させているため多層成形性、ドリル加工性、
耐熱性等が良好である。In addition, the paste used in the present invention uses a thermosetting resin as a binder, the glazma surface treatment of the fluororesin powder, the addition of a coupling agent, etc. Improved adhesion between copper foil or signal layers allows for multilayer formability, drilling workability,
Good heat resistance etc.
４、4,
第１図は本発明の多層プリント配線板の１例を示す図で
ある。
図中 ｌ：内面粗化した銅箔、２：両面回路を有するポ
リイミド−ガラス積層板からなる内層材、３：絶縁ペー
スト層（ペーストを塗布、乾燥後プレスした後の絶縁層
）を示す。
第
図FIG. 1 is a diagram showing an example of a multilayer printed wiring board of the present invention. In the figure, 1 shows a copper foil with a roughened inner surface, 2 shows an inner layer made of a polyimide-glass laminate having double-sided circuits, and 3 shows an insulating paste layer (an insulating layer after applying the paste, drying, and pressing). Diagram
Claims (1)
ポキシ変性ポリブタジエンとエポキシ樹脂とカルボン酸
無水物とをラジカル重合開始剤の存在の下に反応させて
なる重合体を主成分とする熱硬化性樹脂ワニス中の樹脂
分１００重量部に対して最大粒径が５０μｍ以下であり
、プラズマ表面処理を行ウたフッ素樹脂粉末を１０〜２
００重量部を配してなるペースト組成物からなる多層プ
リント配線板。(1) As an interlayer insulating layer, the insulating layer in contact with the signal circuit is a thermosetting material whose main component is a polymer obtained by reacting epoxy-modified polybutadiene, epoxy resin, and carboxylic acid anhydride in the presence of a radical polymerization initiator. 10 to 2 parts of fluororesin powder, which has a maximum particle size of 50 μm or less and has been subjected to plasma surface treatment, is added to 100 parts by weight of the resin content in the varnish.
A multilayer printed wiring board comprising a paste composition containing 0.00 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2265589A JPH02203594A (en) | 1989-02-02 | 1989-02-02 | Multilayered printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2265589A JPH02203594A (en) | 1989-02-02 | 1989-02-02 | Multilayered printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02203594A true JPH02203594A (en) | 1990-08-13 |
Family
ID=12088856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2265589A Pending JPH02203594A (en) | 1989-02-02 | 1989-02-02 | Multilayered printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02203594A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001254002A (en) * | 2000-03-10 | 2001-09-18 | Nippon Kayaku Co Ltd | Resin composition, its film and its cured product |
-
1989
- 1989-02-02 JP JP2265589A patent/JPH02203594A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001254002A (en) * | 2000-03-10 | 2001-09-18 | Nippon Kayaku Co Ltd | Resin composition, its film and its cured product |
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