JPH01118870U - - Google Patents
Info
- Publication number
- JPH01118870U JPH01118870U JP1357088U JP1357088U JPH01118870U JP H01118870 U JPH01118870 U JP H01118870U JP 1357088 U JP1357088 U JP 1357088U JP 1357088 U JP1357088 U JP 1357088U JP H01118870 U JPH01118870 U JP H01118870U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal sheet
- solder application
- metal screen
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000006071 cream Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図−１は本考案の一実施例に係るメタルスクリ
ーンの要部の断面図、図−２はメタルスクリーン
を用いたクリーム半田の塗布方法を示す説明図で
ある。
１１：メタルスクリーン、１２：メタルシート
、１３：穴、１４：離型性樹脂被膜。
FIG. 1 is a sectional view of a main part of a metal screen according to an embodiment of the present invention, and FIG. 2 is an explanatory diagram showing a method of applying cream solder using a metal screen. 11: Metal screen, 12: Metal sheet, 13: Hole, 14: Release resin coating.
Claims (1)
半田塗布位置に合わせて穴を形成してなるメタル
スクリーンにおいて、上記メタルシートの表面に
穴内面を含めて離型性樹脂被膜を設けたことを特
徴とするクリーム半田塗布用メタルスクリーン。 A metal screen comprising holes formed in a metal sheet in accordance with cream solder application positions on a printed circuit board, characterized in that a releasable resin coating is provided on the surface of the metal sheet, including the inner surfaces of the holes. Metal screen for solder application.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1357088U JPH01118870U (en) | 1988-02-05 | 1988-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1357088U JPH01118870U (en) | 1988-02-05 | 1988-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01118870U true JPH01118870U (en) | 1989-08-11 |
Family
ID=31223990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1357088U Pending JPH01118870U (en) | 1988-02-05 | 1988-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01118870U (en) |
-
1988
- 1988-02-05 JP JP1357088U patent/JPH01118870U/ja active Pending