JPH0212180B2 - - Google Patents

Info

Publication number: JPH0212180B2
Authority: JP; Japan
Prior art keywords: epoxy resin; copper; experimental example; prepreg; brominated
Prior art date: 1982-01-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP57007130A

Other languages

English (en)

Japanese (ja)

Other versions

JPS58124643A (ja

Inventor

Yoshitomo Tsutsumi

Shigeyoshi Nakamura

Hiroshi Fukukawa

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Toshiba Chemical Products Co Ltd

Original Assignee

Toshiba Chemical Products Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1982-01-20

Filing date

1982-01-20

Publication date

1990-03-19

1982-01-20 Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd

1982-01-20 Priority to JP713082A priority Critical patent/JPS58124643A/ja

1983-07-25 Publication of JPS58124643A publication Critical patent/JPS58124643A/ja

1990-03-19 Publication of JPH0212180B2 publication Critical patent/JPH0212180B2/ja

Status Granted legal-status Critical Current

Links

239000003822 epoxy resin Substances 0.000 claims description 74
229920000647 polyepoxide Polymers 0.000 claims description 74
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
239000011889 copper foil Substances 0.000 claims description 8
239000000203 mixture Substances 0.000 claims description 8
WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 7
GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 7
229910052794 bromium Inorganic materials 0.000 claims description 7
229920005989 resin Polymers 0.000 claims description 6
239000011347 resin Substances 0.000 claims description 6
239000000463 material Substances 0.000 claims description 5
238000002156 mixing Methods 0.000 claims description 4
239000002966 varnish Substances 0.000 description 17
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 16
QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 10
229920003986 novolac Polymers 0.000 description 10
229920003319 Araldite® Polymers 0.000 description 9
YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 9
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
239000003795 chemical substances by application Substances 0.000 description 7
230000000052 comparative effect Effects 0.000 description 7
239000000126 substance Substances 0.000 description 7
239000004593 Epoxy Substances 0.000 description 6
125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 6
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 5
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
229930003836 cresol Natural products 0.000 description 5
229910052802 copper Inorganic materials 0.000 description 4
239000010949 copper Substances 0.000 description 4
ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
230000000694 effects Effects 0.000 description 3
239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
239000000758 substrate Substances 0.000 description 3
RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
239000000654 additive Substances 0.000 description 2
230000031709 bromination Effects 0.000 description 2
238000005893 bromination reaction Methods 0.000 description 2
238000004132 cross linking Methods 0.000 description 2
230000007547 defect Effects 0.000 description 2
238000010586 diagram Methods 0.000 description 2
239000003063 flame retardant Substances 0.000 description 2
239000011521 glass Substances 0.000 description 2
238000010438 heat treatment Methods 0.000 description 2
KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
SHYARJUKNREDGB-UHFFFAOYSA-N 2-ethyl-5-methyl-4,5-dihydro-1h-imidazole Chemical compound CCC1=NCC(C)N1 SHYARJUKNREDGB-UHFFFAOYSA-N 0.000 description 1
LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
VWSLLSXLURJCDF-UHFFFAOYSA-N 2-methyl-4,5-dihydro-1h-imidazole Chemical compound CC1=NCCN1 VWSLLSXLURJCDF-UHFFFAOYSA-N 0.000 description 1
VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
229930185605 Bisphenol Natural products 0.000 description 1
MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
150000008065 acid anhydrides Chemical class 0.000 description 1
125000003118 aryl group Chemical group 0.000 description 1
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
239000000470 constituent Substances 0.000 description 1
230000002542 deteriorative effect Effects 0.000 description 1
239000003085 diluting agent Substances 0.000 description 1
CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
239000004744 fabric Substances 0.000 description 1
239000000945 filler Substances 0.000 description 1
229910052739 hydrogen Inorganic materials 0.000 description 1
239000001257 hydrogen Substances 0.000 description 1
125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
150000002460 imidazoles Chemical class 0.000 description 1
150000002462 imidazolines Chemical class 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
238000000034 method Methods 0.000 description 1
125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
239000003607 modifier Substances 0.000 description 1
238000000465 moulding Methods 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
125000002524 organometallic group Chemical group 0.000 description 1
239000000049 pigment Substances 0.000 description 1
238000003825 pressing Methods 0.000 description 1
239000011342 resin composition Substances 0.000 description 1
238000004904 shortening Methods 0.000 description 1
229910000077 silane Inorganic materials 0.000 description 1
150000003512 tertiary amines Chemical class 0.000 description 1
-1 trade name Chemical compound 0.000 description 1
239000011800 void material Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

Laminated Bodies (AREA)

JP713082A 1982-01-20 1982-01-20 銅張積層板 Granted JPS58124643A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP713082A JPS58124643A (ja)	1982-01-20	1982-01-20	銅張積層板

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP713082A JPS58124643A (ja)	1982-01-20	1982-01-20	銅張積層板

Publications (2)

Publication Number	Publication Date
JPS58124643A JPS58124643A (ja)	1983-07-25
JPH0212180B2 true JPH0212180B2 (zh)	1990-03-19

Family

ID=11657491

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP713082A Granted JPS58124643A (ja)	1982-01-20	1982-01-20	銅張積層板

Country Status (1)

Country	Link
JP (1)	JPS58124643A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6262747A (ja) *	1985-09-14	1987-03-19	松下電工株式会社	積層板
JPS62167044A (ja) *	1986-01-20	1987-07-23	東芝ケミカル株式会社	銅張積層板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5145636A (ja) *	1974-10-17	1976-04-19	Nippon Steel Corp	Shoseigatasenkoyosetsuyofuratsukusu oyobi sonoseizohoho

1982
- 1982-01-20 JP JP713082A patent/JPS58124643A/ja active Granted

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5145636A (ja) *	1974-10-17	1976-04-19	Nippon Steel Corp	Shoseigatasenkoyosetsuyofuratsukusu oyobi sonoseizohoho

Also Published As

Publication number	Publication date
JPS58124643A (ja)	1983-07-25

Publication	Publication Date	Title
WO2006109744A1 (ja)	2006-10-19	エポキシ樹脂組成物
JP2002003711A (ja)	2002-01-09	熱可塑性ポリヒドロキシポリエーテル樹脂を含有する硬化性樹脂組成物
US5405931A (en)	1995-04-11	Epoxy resin compositions for use in electrical laminates
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JP2003119253A (ja)	2003-04-23	エポキシ樹脂組成物
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JPH0212180B2 (zh)	1990-03-19
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US6265469B1 (en)	2001-07-24	Epoxy resin adhesive for flexible printed circuits
JPH0959346A (ja)	1997-03-04	積層板用エポキシ樹脂組成物
JPH09143247A (ja)	1997-06-03	積層板用樹脂組成物、プリプレグ及び積層板
EP0394965A2 (en)	1990-10-31	Resin composition for laminate
JP2833433B2 (ja)	1998-12-09	積層板用エポキシ樹脂組成物および積層板の製造法
JP3226515B2 (ja)	2001-11-05	エポキシ基を含む含燐化合物の樹脂組成物およびその用途
US5661223A (en)	1997-08-26	Composition of phenolic resin-modified epoxy resin and straight chain polymer
JP4567132B2 (ja)	2010-10-20	エポキシ樹脂組成物
JP3009947B2 (ja)	2000-02-14	エポキシ樹脂組成物
US5364925A (en)	1994-11-15	Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
JP3010534B2 (ja)	2000-02-21	エポキシ樹脂組成物
JP3218436B2 (ja)	2001-10-15	エポキシ樹脂組成物
JP3159390B2 (ja)	2001-04-23	積層板の製造方法
JP3440365B2 (ja)	2003-08-25	積層板用エポキシ樹脂組成物
JPH06228415A (ja)	1994-08-16	積層板用樹脂組成物と積層板