JPS5829845U - Lead pin shape of ceramic multilayer wiring board - Google Patents

Lead pin shape of ceramic multilayer wiring board

Info

Publication number
JPS5829845U
JPS5829845U JP12306281U JP12306281U JPS5829845U JP S5829845 U JPS5829845 U JP S5829845U JP 12306281 U JP12306281 U JP 12306281U JP 12306281 U JP12306281 U JP 12306281U JP S5829845 U JPS5829845 U JP S5829845U
Authority
JP
Japan
Prior art keywords
lead pin
wiring board
multilayer wiring
ceramic multilayer
pin shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12306281U
Other languages
Japanese (ja)
Inventor
賢一 荒川
薗田　英明
健之 鈴木
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP12306281U priority Critical patent/JPS5829845U/en
Publication of JPS5829845U publication Critical patent/JPS5829845U/en
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はセラミック多層配線板をプリント板に実装した
時の断面図、第２図は第１図の■部の斜視図である。 １・・・・・・封止用キャップ、２・・・・・・半導体
チップ、３・・・・・・セラミック多層配線板、４・・
・・・・プリント板、５・・・・・・リードピン。FIG. 1 is a cross-sectional view of the ceramic multilayer wiring board mounted on a printed board, and FIG. 2 is a perspective view of the section ``■'' in FIG. 1. 1...Sealing cap, 2...Semiconductor chip, 3...Ceramic multilayer wiring board, 4...
...Printed board, 5...Lead pin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] セラミック多層配線板と、その外部端子に銀ろう等によ
り接続されるリードピンから構成され、そのリードピン
にテーパー付段を設けることを特徴とするセラミック多
層配線板のリードピン形状。A lead pin shape of a ceramic multilayer wiring board, which is composed of a ceramic multilayer wiring board and a lead pin connected to an external terminal thereof by silver solder or the like, and is characterized in that the lead pin is provided with a tapered step.
JP12306281U 1981-08-21 1981-08-21 Lead pin shape of ceramic multilayer wiring board Pending JPS5829845U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12306281U JPS5829845U (en) 1981-08-21 1981-08-21 Lead pin shape of ceramic multilayer wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12306281U JPS5829845U (en) 1981-08-21 1981-08-21 Lead pin shape of ceramic multilayer wiring board

Publications (1)

Publication Number Publication Date
JPS5829845U true JPS5829845U (en) 1983-02-26

Family

ID=29916970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12306281U Pending JPS5829845U (en) 1981-08-21 1981-08-21 Lead pin shape of ceramic multilayer wiring board

Country Status (1)

Country Link
JP (1) JPS5829845U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59170873U (en) * 1983-04-28 1984-11-15 松下電器産業株式会社 Electrical components with multiple terminals

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59170873U (en) * 1983-04-28 1984-11-15 松下電器産業株式会社 Electrical components with multiple terminals

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