JPS62104477U - - Google Patents
Info
- Publication number
- JPS62104477U JPS62104477U JP19730085U JP19730085U JPS62104477U JP S62104477 U JPS62104477 U JP S62104477U JP 19730085 U JP19730085 U JP 19730085U JP 19730085 U JP19730085 U JP 19730085U JP S62104477 U JPS62104477 U JP S62104477U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- reinforcing material
- mounting hole
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012779 reinforcing material Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第1図は、本考案の一実施例に従つて構成され
た可撓性回路基板の実装部構造を概念的に示す要
部断面構成図、第2図は、可撓性回路基板及びそ
の実装部に設けるべき補強材の両実装穴の構成を
示す概念平面図、第3図は、第1図の可撓性回路
基板の実装部構造に回路部品を半田付けした状態
の同様な要部断面構成図、そして、第4図は、従
来例に従つた可撓性回路基板の実装部構造を説明
する為の上記と同様な要部断面構造図である。
1:可撓性回路基板、2:基板のベース材、3
:接続用端子部、4:基板側の実装穴、5:薄い
補強材、6:補強材の実装穴、7:部品のリード
端子、8:接続用半田、9:同径の実装穴。
FIG. 1 is a cross-sectional configuration diagram of main parts conceptually showing the structure of a mounting part of a flexible circuit board constructed according to an embodiment of the present invention, and FIG. 2 is a diagram showing a flexible circuit board and its mounting structure. FIG. 3 is a conceptual plan view showing the configuration of both mounting holes of the reinforcing material to be provided in the mounting section of the flexible circuit board, and FIG. The configuration diagram and FIG. 4 are cross-sectional structural diagrams of essential parts similar to those described above for explaining the structure of the mounting part of the flexible circuit board according to the conventional example. 1: Flexible circuit board, 2: Base material of the board, 3
: Connection terminal part, 4: Mounting hole on board side, 5: Thin reinforcing material, 6: Mounting hole of reinforcing material, 7: Lead terminal of component, 8: Solder for connection, 9: Mounting hole of the same diameter.
Claims (1)
可撓性回路基板に於いて、該補強材を導く構成す
ると共に、可撓性回路基板の実装穴と対応する補
強材側の実装穴を可縁性回路基板の実装穴より大
きく形成するように構成してなる可撓性回路基板
の実装部構造。 In a flexible circuit board in which a reinforcing material is provided in the mounting portion of the circuit component, the reinforcing material is guided and the mounting hole on the reinforcing material side corresponding to the mounting hole of the flexible circuit board is formed. A mounting part structure of a flexible circuit board configured to be formed larger than a mounting hole of a flexible circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985197300U JPH0341488Y2 (en) | 1985-12-21 | 1985-12-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985197300U JPH0341488Y2 (en) | 1985-12-21 | 1985-12-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62104477U true JPS62104477U (en) | 1987-07-03 |
JPH0341488Y2 JPH0341488Y2 (en) | 1991-08-30 |
Family
ID=31156901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985197300U Expired JPH0341488Y2 (en) | 1985-12-21 | 1985-12-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0341488Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010084540A1 (en) * | 2009-01-20 | 2010-07-29 | パナソニック株式会社 | Circuit board, circuit module, and electronic device provided with circuit module |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4886366U (en) * | 1972-01-21 | 1973-10-19 | ||
JPS5124520U (en) * | 1974-08-12 | 1976-02-23 | ||
JPS5226164U (en) * | 1975-08-14 | 1977-02-23 | ||
JPS535756U (en) * | 1976-07-01 | 1978-01-19 | ||
JPS57111084A (en) * | 1981-11-13 | 1982-07-10 | Matsushita Electric Ind Co Ltd | Printed circuit board |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5226164B2 (en) * | 1972-12-29 | 1977-07-12 | ||
JPS5179798A (en) * | 1974-12-27 | 1976-07-12 | Japan Tobacco & Salt Public | TABAKONOKOKITSUMIKAIRYOHO |
-
1985
- 1985-12-21 JP JP1985197300U patent/JPH0341488Y2/ja not_active Expired
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4886366U (en) * | 1972-01-21 | 1973-10-19 | ||
JPS5124520U (en) * | 1974-08-12 | 1976-02-23 | ||
JPS5226164U (en) * | 1975-08-14 | 1977-02-23 | ||
JPS535756U (en) * | 1976-07-01 | 1978-01-19 | ||
JPS57111084A (en) * | 1981-11-13 | 1982-07-10 | Matsushita Electric Ind Co Ltd | Printed circuit board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010084540A1 (en) * | 2009-01-20 | 2010-07-29 | パナソニック株式会社 | Circuit board, circuit module, and electronic device provided with circuit module |
Also Published As
Publication number | Publication date |
---|---|
JPH0341488Y2 (en) | 1991-08-30 |