JPH01288200A - Manufacture of high polymer thin film piezoelectric transducer - Google Patents

Manufacture of high polymer thin film piezoelectric transducer

Info

Publication number
JPH01288200A
JPH01288200A JP11897088A JP11897088A JPH01288200A JP H01288200 A JPH01288200 A JP H01288200A JP 11897088 A JP11897088 A JP 11897088A JP 11897088 A JP11897088 A JP 11897088A JP H01288200 A JPH01288200 A JP H01288200A
Authority
JP
Japan
Prior art keywords
thin film
piezoelectric
piezoelectric film
packing
backing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11897088A
Other languages
Japanese (ja)
Other versions
JP2632921B2 (en
Inventor
Yasuto Takeuchi
康人 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GE Healthcare Japan Corp
Original Assignee
Yokogawa Medical Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Medical Systems Ltd filed Critical Yokogawa Medical Systems Ltd
Priority to JP11897088A priority Critical patent/JP2632921B2/en
Publication of JPH01288200A publication Critical patent/JPH01288200A/en
Application granted granted Critical
Publication of JP2632921B2 publication Critical patent/JP2632921B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To eliminate need for tensing a piezoelectric film in air and to minimize the probability of destruction of an electrode fitted to the piezoelectric film by mounting the piezoelectric material thin film to the packing of flat form not formed yet, heating and softening in an oven, pressing and forming by a press die, cooling and solidifying it and obtaining a recessed transducer. CONSTITUTION:After the piezoelectric film 2 with electrode after polarization is fitted onto a packing 1 made of a thermoplastic material, the packing is put in an over 4 and a press die 3 is pressed on the packing 1. That is, the temperature in the oven 4 is kept to a temperature where the polarization of the polarized piezoelectric film 2 is unchanged, the packing 1 is heated to a temperature offering ease of deformation of the packing 1 and the piezoelectric film 2 easily and then softened, the press die 3 is pressed onto the piezoelectric film 2 and the packing 1 to deform them into the form of the die 3 forcibly. After cooling, when the press die 3 is removed, the piezoelectric film 2 and the packing 1 are deformed into a desired recessed form. Then the mount of lead wire of the electrode is processed normally.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は高分子圧電材料の薄膜を用いた音響−電気変換
器の送受波面が曲面を成す高分子Ta膜膜圧ヒトランス
デューサ製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a high-molecular Ta film transducer in which the wave transmitting/receiving surface of an acoustic-electrical transducer using a thin film of a high-molecular piezoelectric material forms a curved surface.

(従来の技術) 超音波探触子に用いる圧電材料には水晶、水溶性結晶、
圧電セラミック、高分子圧電材料等があるが成型性が良
く、フィルム状にすることができ、又、可撓性がある等
の利点からポリ弗化ビニリデン(PVDF)や弗化ビニ
リデン−3弗化工チレン共重合体(P (VDF−Tr
FE)に代表される高分子圧電材料が医用超音波探触子
に応用され始めている。
(Prior art) Piezoelectric materials used in ultrasonic probes include quartz, water-soluble crystals,
There are piezoelectric ceramics, polymeric piezoelectric materials, etc., but polyvinylidene fluoride (PVDF) and vinylidene fluoride-3 fluoride have good moldability, can be made into a film, and have flexibility. Tyrene copolymer (P (VDF-Tr)
Polymer piezoelectric materials such as FE) are beginning to be applied to medical ultrasound probes.

従来、送受波面が曲面を成す超音波探触子、特に凹面の
それを作ろうとすると、バッキング材の方を薄膜す以て
目的と覆る凹面に仕上げておいて、それに電極付き分極
ずみの前記PVDFやP (VDF−TrFE)などの
平面状に作った高分子圧電膜を、押し延ばして接4して
いた。
Conventionally, when trying to make an ultrasonic probe with a curved wave transmitting/receiving surface, especially one with a concave surface, the backing material was finished with a thin film to cover the concave surface, and then the polarized PVDF with electrodes was attached to the backing material. A planar piezoelectric polymer film, such as P (VDF-TrFE) or P (VDF-TrFE), was stretched out and connected.

〈発明が解決しようとする課題) 然るに、この方法によるど、膜に張力を加えつつ押し延
ばしながら接着づることになり、膜に被着されている電
極にひびが入ったり、膜が均一に延びないという問題が
あった。叩ら、電極付きの圧電膜が加熱され軟化されは
するものの、空中に同かれIζまま引き延ばされる点が
問題である。
(Problems to be Solved by the Invention) However, with this method, the membrane is stretched while being stretched while applying tension, which may cause cracks in the electrodes attached to the membrane or the membrane not being stretched uniformly. The problem was that there was no. Although the piezoelectric film with electrodes is heated and softened by beating, the problem is that it remains suspended in the air and is stretched as it is.

本発明は上記の問題点に鑑みてなされたもので、その目
的は、圧電膜を空中で引張る必要のない超音波探触子の
製造方法を実現することにある。
The present invention has been made in view of the above problems, and its purpose is to realize a method of manufacturing an ultrasonic probe that does not require stretching a piezoelectric film in the air.

(課題を解決するための手段) 前記の課題を解決する本発明は、高分子圧電材料の薄膜
を用いた音響−電気変換器の送受波面が曲面を成す高分
子薄膜圧電トランスデユーサの製造方法において、略平
面の端面を有する熱可塑性のプラスデック材を用いたバ
ッキングに柔軟な高分子圧電材料による圧電性薄膜を被
着し、加熱して可塑化した後、所望の形状の曲面を有す
る押し梨により抑圧成形して固化させて目的の形状を有
する圧電トランスデユーサを得ることを特徴とするもの
である。
(Means for Solving the Problems) The present invention, which solves the above-mentioned problems, provides a method for manufacturing a polymer thin film piezoelectric transducer in which the wave transmitting/receiving surface of an acoustic-electrical transducer using a thin film of a polymer piezoelectric material forms a curved surface. In this method, a piezoelectric thin film made of a flexible polymeric piezoelectric material is applied to a backing made of a thermoplastic plus deck material having a substantially flat end surface, and after being heated and plasticized, a press having a curved surface of a desired shape is applied. The method is characterized in that a piezoelectric transducer having a desired shape is obtained by compression molding with a pear and solidifying it.

(作用) 平面状の未成形のバッキングに圧電月利薄膜を取り付け
、オーブン内で加熱軟化させた後、押し型で押圧成形す
る。その後冷却固化させて四面l・ランスデコーサを得
る。
(Function) A piezoelectric thin film is attached to a flat, unformed backing, heated and softened in an oven, and then pressed with a press mold. Thereafter, it is cooled and solidified to obtain a four-sided lance decoder.

又押圧成形前に圧電膜上に保護板を惹いて抑圧成形し、
ストレスを最小にする。
In addition, before press molding, a protective plate is placed on the piezoelectric film to suppress molding.
Minimize stress.

(実施例) 以下図面を参照して本発明の方法の実施例を詳細に説明
する。
(Example) Examples of the method of the present invention will be described in detail below with reference to the drawings.

第1図は本発明の方法の一実施例の説明図である。図に
おいて、(イ)図、(ロ)図、(ハ)図。
FIG. 1 is an explanatory diagram of an embodiment of the method of the present invention. In the figure, (a) figure, (b) figure, (c) figure.

(ニ)図は工程の順序を示す図である。図中1は熱可塑
性プラスチック、アクリル又はABS等で作られたバッ
キング(熱硬化性の半硬化エポキシでも良い)、2は電
極付き分極ずみの高分子圧電材で作られた圧Ti膜であ
る。3はバッキング1と圧電膜2の形を凹形にするため
の凸面を持った押し型で、4はバッキング1及び圧電膜
2を軟らかくするために熱を与えるオーブンである。
(d) Figure is a diagram showing the order of steps. In the figure, 1 is a backing made of thermoplastic, acrylic, or ABS (thermosetting semi-cured epoxy may be used), and 2 is a piezo-Ti film made of polarized polymeric piezoelectric material with electrodes. Reference numeral 3 denotes a pressing die having a convex surface for making the backing 1 and piezoelectric film 2 concave, and 4 an oven for applying heat to soften the backing 1 and piezoelectric film 2.

以上の実施例の製造方法を説明する。(イ)図は熱可塑
性材料のバッキング1と電極付き分極ずみの圧電膜2を
示す図である。(ロ)図はバッキング1の上に圧電膜2
を取り付けた図、(ハ)図は(ロ)図の圧電膜2を取り
付けたバッキング1をA−ブン4に入れ、押し型3をバ
ッキング1に押し付けJ:うとしている図である。オー
ブン4中の温度は分極された圧電膜2の分極状態が変化
しない程度の温度に保ち、バッキング1と圧電膜2の変
形が容易な程度に加熱し軟化させる。軟化しlζならば
、押し型3を圧電膜2とバッキング1とに押し付け、押
し型3の形状に強制的に変形させる。く二)図は冷朗後
押し型3を+m脱させ、残された圧m膜2とバッキング
1が所望の凹形に変形された状態を示す図である。この
後電極のリード線の取り付は等通常の処理を行う。
The manufacturing method of the above embodiment will be explained. Figure (a) shows a backing 1 made of thermoplastic material and a polarized piezoelectric film 2 with electrodes. (b) The figure shows piezoelectric film 2 on backing 1.
Figure (C) shows the backing 1 with the piezoelectric film 2 attached in Figure (B) placed in the A-bun 4, and the press die 3 being pressed against the backing 1. The temperature in the oven 4 is maintained at a temperature that does not change the polarization state of the polarized piezoelectric film 2, and the backing 1 and the piezoelectric film 2 are heated and softened to an extent that they can be easily deformed. If it is softened to lζ, the press die 3 is pressed against the piezoelectric film 2 and the backing 1, and forcibly deformed into the shape of the press die 3. 2) The figure shows a state in which the cold support mold 3 has been removed by +m and the remaining pressure membrane 2 and backing 1 have been deformed into a desired concave shape. After this, normal processing such as attaching the electrode lead wires is carried out.

尚、本発明の製造方法において、第2図に示すように行
うことも有効である。図において、第1図と同等の部分
には同一の符号を付しである。図中、5は圧電膜2と押
し型3のとの間に入れて圧電膜2の緩衝材とするバッキ
ング1と同じ材I+で作った保護板である。この製造方
法を説明する。
In addition, in the manufacturing method of the present invention, it is also effective to perform as shown in FIG. In the figure, parts equivalent to those in FIG. 1 are given the same reference numerals. In the figure, reference numeral 5 denotes a protection plate made of the same material I+ as the backing 1 which is inserted between the piezoelectric film 2 and the mold 3 and serves as a cushioning material for the piezoelectric film 2. This manufacturing method will be explained.

圧電膜2をバッキング1の上に置くまでは第1図の方法
と同じである。次に保護板5を圧電膜2の上に首<((
ロ)図)。オーブン4中に入れ加熱軟化する。軟化した
ら押し型3でバッキング1と圧電膜2と保護板5と共に
成形する。保護板5はバッキング1と同じ材質なので、
間に挟んで成形される圧電膜2のストレスは最小となり
、分極処理された圧電膜2に対する影響は最小である(
(ロ)図)。(ハ)図は押し型3を外し、保護板5ち外
す状態を示している。保護板5は装置いただけなので容
易に離れるが、頭型剤を用いれば一層離れ易くなる。
The method is the same as that shown in FIG. 1 until the piezoelectric film 2 is placed on the backing 1. Next, place the protective plate 5 on top of the piezoelectric film 2.
b) Figure). Place in oven 4 and heat to soften. Once softened, it is molded together with the backing 1, piezoelectric film 2, and protection plate 5 using a press die 3. Since the protective plate 5 is made of the same material as the backing 1,
The stress on the piezoelectric film 2 formed between them is minimal, and the effect on the polarized piezoelectric film 2 is minimal (
(b) Figure). (C) The figure shows the state in which the pressing mold 3 is removed and the protective plate 5 is removed. Since the protective plate 5 is only a device, it can be easily removed, but if a head molding agent is used, it will be easier to separate.

(発明の効果) 以上詳細に説明したように本発明によれば、圧電膜に取
り付けられた電極に対づる破壊の確率を最小にして曲面
の超音波トランスデユーサを作ることができるようにな
り、実用上の効果は大きい。
(Effects of the Invention) As described above in detail, according to the present invention, it is possible to manufacture a curved ultrasonic transducer while minimizing the probability of damage to the electrodes attached to the piezoelectric film. , the practical effect is great.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の方法の一実施例の図、第2図は本発明
の他の実施例の図である。 1・・・バッキング  2・・・圧電膜3・・・押し型
   4・・・オーブン5・・・保護板 特許出願人 横河メディカルシステム株式会社第1図
FIG. 1 is a diagram of one embodiment of the method of the invention, and FIG. 2 is a diagram of another embodiment of the invention. 1... Backing 2... Piezoelectric film 3... Press mold 4... Oven 5... Protective plate Patent applicant Yokogawa Medical Systems Co., Ltd. Figure 1

Claims (3)

【特許請求の範囲】[Claims] (1)高分子圧電材料の薄膜を用いた音響−電気変換器
の送受波面が曲面を成す高分子薄膜圧電トランスデュー
サの製造方法において、略平面の端面を有する熱可塑性
のプラスチック材を用いたバッキングに柔軟な高分子圧
電材料による圧電性薄膜を被着し、加熱して可塑化した
後、所望の形状の曲面を有する押し型により押圧成形し
て固化させて目的の形状を有する圧電トランスデューサ
を得ることを特徴とする高分子薄膜圧電トランスデュー
サの製造方法。
(1) In a method for manufacturing a polymer thin film piezoelectric transducer in which the wave transmitting/receiving surface of an acoustic-electric transducer using a thin film of a polymer piezoelectric material forms a curved surface, a backing using a thermoplastic plastic material having a substantially flat end surface is used. To obtain a piezoelectric transducer having a desired shape by depositing a piezoelectric thin film made of a flexible polymeric piezoelectric material, heating it to plasticize it, and then press-molding it with a press mold having a curved surface of a desired shape and solidifying it. A method for manufacturing a polymer thin film piezoelectric transducer characterized by:
(2)圧電性薄膜を被着したバッキング上に保護板を載
置して加熱軟化後押圧成形し、固化後前記保護板を取り
外すことを特徴とする請求項1記載の高分子薄膜圧電ト
ランスデューサの製造方法。
(2) The polymer thin film piezoelectric transducer according to claim 1, characterized in that a protective plate is placed on the backing on which the piezoelectric thin film is adhered, and the protective plate is pressed after being heated and softened, and the protective plate is removed after solidification. Production method.
(3)保護板にバッキングと同じ材料もしくは略同等の
材料で作られたものを用いることを特徴とする請求項2
記載の高分子薄膜圧電トランスデューサの製造方法。
(3) Claim 2 characterized in that the protective plate is made of the same material or substantially equivalent material as the backing.
A method of manufacturing the polymer thin film piezoelectric transducer described above.
JP11897088A 1988-05-16 1988-05-16 Method of manufacturing polymer thin film piezoelectric transducer Expired - Fee Related JP2632921B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11897088A JP2632921B2 (en) 1988-05-16 1988-05-16 Method of manufacturing polymer thin film piezoelectric transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11897088A JP2632921B2 (en) 1988-05-16 1988-05-16 Method of manufacturing polymer thin film piezoelectric transducer

Publications (2)

Publication Number Publication Date
JPH01288200A true JPH01288200A (en) 1989-11-20
JP2632921B2 JP2632921B2 (en) 1997-07-23

Family

ID=14749789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11897088A Expired - Fee Related JP2632921B2 (en) 1988-05-16 1988-05-16 Method of manufacturing polymer thin film piezoelectric transducer

Country Status (1)

Country Link
JP (1) JP2632921B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006208090A (en) * 2005-01-26 2006-08-10 Jtekt Corp Ultrasonic probe
US20110192016A1 (en) * 2009-10-13 2011-08-11 National Institute Of Aerospace Associates Energy conversion materials fabricated with boron nitride nanotubes (BNNTs) and BNNT polymer composites
US20120119621A1 (en) * 2009-07-27 2012-05-17 Alexander Frey Bending device for bending a piezoelectric bender, piezoelectric converter for converting mechanical energy into electrical energy, by using the bending device, and method for converting mechanical energy into electrical energy
JP2012093247A (en) * 2010-10-27 2012-05-17 Jfe Steel Corp Method for detecting defect using leakage surface acoustic wave, and defect detecting device
JP2012093246A (en) * 2010-10-27 2012-05-17 Jfe Steel Corp Ultrasonic probe and method for detecting defect
US10607742B2 (en) 2011-05-09 2020-03-31 National Institute Of Aerospace Associates Radiation shielding materials containing hydrogen, boron and nitrogen

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006208090A (en) * 2005-01-26 2006-08-10 Jtekt Corp Ultrasonic probe
US20120119621A1 (en) * 2009-07-27 2012-05-17 Alexander Frey Bending device for bending a piezoelectric bender, piezoelectric converter for converting mechanical energy into electrical energy, by using the bending device, and method for converting mechanical energy into electrical energy
US20110192016A1 (en) * 2009-10-13 2011-08-11 National Institute Of Aerospace Associates Energy conversion materials fabricated with boron nitride nanotubes (BNNTs) and BNNT polymer composites
US10435293B2 (en) * 2009-10-13 2019-10-08 National Institute Of Aerospace Associates Methods of manufacturing energy conversion materials fabricated with boron nitride nanotubes (BNNTs) and BNNT polymer composites
JP2012093247A (en) * 2010-10-27 2012-05-17 Jfe Steel Corp Method for detecting defect using leakage surface acoustic wave, and defect detecting device
JP2012093246A (en) * 2010-10-27 2012-05-17 Jfe Steel Corp Ultrasonic probe and method for detecting defect
US10607742B2 (en) 2011-05-09 2020-03-31 National Institute Of Aerospace Associates Radiation shielding materials containing hydrogen, boron and nitrogen

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