JP2003154573A - Molding apparatus for emboss processing and emboss processing molding method - Google Patents
Molding apparatus for emboss processing and emboss processing molding methodInfo
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- JP2003154573A JP2003154573A JP2001358097A JP2001358097A JP2003154573A JP 2003154573 A JP2003154573 A JP 2003154573A JP 2001358097 A JP2001358097 A JP 2001358097A JP 2001358097 A JP2001358097 A JP 2001358097A JP 2003154573 A JP2003154573 A JP 2003154573A
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- Prior art keywords
- mold
- side mold
- movable
- fixed
- molding
- Prior art date
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、樹脂表面に微細な
エンボス加工をするエンボス加工成形装置及びエンボス
加工成形方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embossing molding apparatus and an embossing molding method for finely embossing a resin surface.
【０００２】[0002]
【従来の技術】近年、樹脂成形品の用途は広がる一方で
ある。その多様化する用途とともに、表面形態も微細な
エンボス加工を施したものなど多種多様なものが要求さ
れるようになってきている。2. Description of the Related Art In recent years, the applications of resin molded products have been expanding. Along with the diversified applications, a wide variety of surface morphologies such as those subjected to fine embossing are required.
【０００３】表面形態が、マイクロオーダ、ナノオーダ
のエンボス加工を有するものの場合、現在では、リソグ
ラフィー法によって樹脂微細構造体を形成するのがほと
んどであり、近年はこの種の技術の進歩により、高アス
ペクト比の微細構造を有するものが作製されるようにな
っている。In the case where the surface morphology has micro-order or nano-order embossing, most of the present time, a resin fine structure is formed by a lithographic method. Those having a specific fine structure have been manufactured.
【０００４】[0004]
【発明が解決しようとする課題】ところが、このリソグ
ラフィー法は、精度良く微細構造を形成するのに適して
いるが、工業的な大量生産には不向きであり、これに代
わる方法として、微細構造体を持つ金型を用いた成形方
法が検討されている。しかしながら、マイクロオーダ、
ナノオーダの金型を用いての成形の場合、金型の隅々に
まで成形原料を十分にいきわたらせることが難しく、そ
のため、精度良く微細構造体を成形することが困難であ
るという問題がある。However, although this lithographic method is suitable for forming a fine structure with high precision, it is not suitable for industrial mass production, and as an alternative method, a fine structure is used. A molding method using a mold having a is studied. However, micro-order,
In the case of molding using a nano-order mold, it is difficult to spread the molding raw material to all the corners of the mold, which makes it difficult to mold fine structures with high precision. .
【０００５】本発明は、表面に微細なエンボス加工を有
する樹脂を成形できるエンボス加工用成形装置及びエン
ボス加工成形方法を提供することを目的とする。An object of the present invention is to provide an embossing molding apparatus and an embossing molding method capable of molding a resin having a finely embossed surface.
【０００６】[0006]
【課題を解決するための手段】前記課題を解決するため
の本発明の請求項１に記載のエンボス加工用成形装置
は、固定側金型と、前記固定側金型に対して可動の可動
側金型と、前記固定側金型及び前記可動側金型に設けら
れた加熱用ヒーターと、前記固定側金型及び前記可動側
金型のいずれか一方もしくは両方に設けられた超音波振
動子と、を備えてなるエンボス加工用成形装置であっ
て、前記加熱用ヒーターで加熱すると共に、前記超音波
振動子によって高周波又は超音波振動させながら加圧、
及び離型して、前記固定側金型と前記可動側金型間に形
成される微細な凹凸を有したキャビティ内に成形原料を
均一に充填できるものである。このような構成による
と、成形原料が、半溶融状態で超音波振動子によって高
周波又は超音波振動されながら加圧、及び離型されるた
め、金型の隅々にまでいきわたり、成形されるため、精
度良く成形品が成形される。A molding apparatus for embossing according to claim 1 of the present invention for solving the above-mentioned problems is a fixed side mold and a movable side movable with respect to the fixed side mold. A mold, a heater for heating provided in the fixed side mold and the movable side mold, and an ultrasonic transducer provided in either or both of the fixed side mold and the movable side mold. A molding device for embossing, comprising: heating with the heater for heating and pressurizing while vibrating with high frequency or ultrasonic waves by the ultrasonic vibrator,
Further, by separating from the mold, the forming raw material can be uniformly filled in the cavity having fine irregularities formed between the fixed side mold and the movable side mold. According to this structure, the molding raw material is pressed and released while being ultrasonically vibrated by the ultrasonic vibrator in a semi-molten state, so that the molding raw material is spread to every corner of the mold and is molded. The molded product is molded with high accuracy.
【０００７】また、請求項２に記載のエンボス加工用成
形装置は、請求項１において、前記超音波振動が、前記
キャビティに対してＸ軸、Ｙ軸、Ｚ軸、ねじれ軸及び回
転軸方向に加えられるものである。このような構成によ
ると、キャビティ全体に均等に超音波振動が加えられる
ため、成形原料がキャビティ全体にいきわたり、精度良
くキャビティの凹凸を転写し、マイクロオーダ、ナノオ
ーダのエンボス加工が可能となる。The embossing molding apparatus according to claim 2 is the molding apparatus according to claim 1, wherein the ultrasonic vibrations are relative to the cavity in the X-axis, Y-axis, Z-axis, torsion axis and rotation axis directions. Is added. With such a configuration, since ultrasonic vibration is evenly applied to the entire cavity, the molding raw material spreads over the entire cavity, and the unevenness of the cavity is accurately transferred to enable micro-order or nano-order embossing.
【０００８】また、請求項３に記載のエンボス加工用成
形装置は、請求項１において、前記キャビティ内に形成
される凹凸が、１μｍ以上５００μｍ以下の幅ピッチ
で、１０μｍ以上１ｍｍ以下の深さであるものである。
このような構成によると、従来、金型成形できなかった
微細なエンボス加工を有する樹脂成形体を成形すること
が可能となる。The embossing molding apparatus according to claim 3 is the molding apparatus according to claim 1, wherein the irregularities formed in the cavity have a width pitch of 1 μm or more and 500 μm or less and a depth of 10 μm or more and 1 mm or less. There is something.
According to such a configuration, it becomes possible to mold a resin molded body having a fine embossing that could not be conventionally molded by a mold.
【０００９】また、請求項４に記載のエンボス加工用成
形装置は、請求項１において、前記固定側金型と、前記
可動側金型が真空容器内に設置されているものである。
このような構成によると、成形時に外部から不純物や、
加熱によってガス化した樹脂等が混入することが少なく
なり、純度の高い成形品とすることができる。The embossing molding apparatus according to a fourth aspect of the present invention is the molding apparatus according to the first aspect, wherein the fixed side mold and the movable side mold are installed in a vacuum container.
According to such a configuration, impurities and the like from outside during molding,
A resin or the like gasified by heating is less likely to be mixed in, and a molded product with high purity can be obtained.
【００１０】また、請求項５に記載のエンボス加工成形
方法は、固定側金型と可動側金型とで形成される微細な
凹凸を有するキャビティ内に成形原料を充填し、前記固
定側金型及び前記可動側金型を加熱すると共に、前記固
定側金型及び前記可動側金型のいずれか一方もしくは両
方に設けられた超音波振動子によって高周波又は超音波
振動させながら加圧、及び離型することによって、前記
成形原料を前記キャビティ内に均一に行き渡らせて均質
な肉厚にエンボス加工できる。このような方法による
と、微細な凹凸を有する金型によって形成されるキャビ
ティ内全体に成形原料を均等にいきわたらせることがで
き、精度の高い微細なエンボス加工を有した成形品を作
成することができる。Further, in the embossing molding method according to a fifth aspect of the present invention, a molding raw material is filled in a cavity having fine irregularities formed by a fixed side mold and a movable side mold, and the fixed side mold is formed. And heating the movable side mold and pressurizing and releasing while high-frequency or ultrasonic vibrating by an ultrasonic vibrator provided in one or both of the fixed side mold and the movable side mold. By doing so, the forming raw material can be uniformly spread in the cavity and embossed to have a uniform thickness. According to such a method, the molding raw material can be evenly distributed throughout the cavity formed by the mold having fine irregularities, and a molded product having highly accurate fine embossing can be produced. You can
【００１１】[0011]
【発明の実施の形態】以下に、本発明の実施形態の一例
を図面を参照しつつ説明する。図１は、本実施形態例に
係るエンボス加工用成形装置１の要部断面図である。本
実施形態例に係るエンボス加工用成形装置１は、図１に
おいて、固定側金型２と、この固定側金型２に対して可
動の可動側金型３と、これら固定側金型２及び可動側金
型３にそれぞれ設けられた加熱用ヒーター４，５と、固
定側金型２に設けられた超音波振動子７と、可動側金型
３に設けられた超音波振動子８と、で構成され、図示し
ない真空室内に設置されている。DETAILED DESCRIPTION OF THE INVENTION An example of an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of an essential part of an embossing molding apparatus 1 according to the present embodiment. The embossing molding apparatus 1 according to the present embodiment includes a fixed-side mold 2, a movable-side mold 3 that is movable with respect to the fixed-side mold 2, and the fixed-side mold 2 and the fixed-side mold 2 in FIG. Heating heaters 4 and 5 respectively provided in the movable mold 3, an ultrasonic vibrator 7 provided in the fixed mold 2, an ultrasonic vibrator 8 provided in the movable mold 3, And is installed in a vacuum chamber (not shown).
【００１２】可動側金型３には、複数の微細な突起１０
が形成されている。この突起１０によって、成形品の表
面にエンボス加工を施すことが可能となる。なお、突起
１０は、固定側金型２側に設けることもできる。The movable mold 3 has a plurality of fine protrusions 10.
Are formed. The protrusions 10 allow the surface of the molded product to be embossed. The protrusion 10 may be provided on the fixed mold 2 side.
【００１３】加熱用ヒーター４，５は、可動側金型３及
び成形原料となるＰＭＭＡ、ＰＥＴ、ＰＢＴ、エオポキ
シ樹脂等からなる板材の全面を均等に加熱できるような
ものであれば良く、図に示すよう面状ヒーターを使用す
ることが好ましい。The heating heaters 4 and 5 may be any one as long as they can uniformly heat the entire surface of the movable die 3 and the plate material made of PMMA, PET, PBT, epoxy resin, etc., which are the forming raw materials. It is preferred to use a planar heater as shown.
【００１４】超音波振動子７、８は、成形原料に振動を
印加できるものであればよく、印加する振動の周波数は
特に限定されないが、２０ｋＨｚ〜１００ｋＨｚである
ことが好ましい。なお、この超音波振動子７、８は、固
定側金型２側のみならず、可動側金型３側にも設けられ
ていても良く、また、可動側金型３側にのみ設けるよう
にしてもよい。The ultrasonic vibrators 7 and 8 may be any as long as they can apply vibration to the forming raw material, and the frequency of the applied vibration is not particularly limited, but is preferably 20 kHz to 100 kHz. The ultrasonic vibrators 7 and 8 may be provided not only on the fixed side mold 2 side but also on the movable side mold 3 side, or only on the movable side mold 3 side. May be.
【００１５】本実施形態例に係るエンボス加工用成形装
置１によるエンボス加工の成形方法は、まず、固定側金
型２に設けられている加熱用ヒーター５に成形原料とな
る樹脂製の板材を設置し、固定具９によって固定する。
そして、固定側金型２及び可動側金型４のそれぞれに設
けられている加熱用ヒーター４、５を成形原料である樹
脂が半溶融状態となる程度の温度にまで加熱し、可動側
金型３を固定側金型２の方に移動させる。この際、超音
波振動子７、８によって２０ｋＨｚ〜１００ｋＨｚの周
波数で振動を印加する。In the embossing molding method by the embossing molding apparatus 1 according to the present embodiment, first, a resin plate material serving as a molding raw material is installed in the heating heater 5 provided in the stationary mold 2. Then, it is fixed by the fixture 9.
Then, the heating heaters 4 and 5 provided in each of the fixed-side mold 2 and the movable-side mold 4 are heated to a temperature at which the resin as the molding raw material is in a semi-molten state, and the movable-side mold 3 is moved to the fixed side mold 2. At this time, the ultrasonic transducers 7 and 8 apply vibration at a frequency of 20 kHz to 100 kHz.
【００１６】図２に、本実施形態例に係るエンボス加工
用成形装置１の加圧時の状態の断面図を示す。この時、
成形原料である樹脂板材６は、加熱用ヒーター４，５に
よって加熱されて、半溶融状態となり、キャビティ内で
流動状態となっている。そして、超音波振動子７、８に
よって振動が印加されているため、キャビティ内での流
動が容易に行われ、可動側金型３に形成されている突起
１０の幅ピッチが１μｍ以上５００μｍ以下で、１０μ
ｍ以上１ｍｍ以下の深さという微細なものであっても、
確実に突起１０の凹凸内に行き渡るようになる。なお、
可動側金型３の表面には離型剤を塗布しておくことが好
ましい。これによって、離型時に容易に成形品が離型
し、離型時のエンボス加工面の損傷を抑制することがで
きる。FIG. 2 shows a cross-sectional view of the embossing molding apparatus 1 according to the present embodiment in a pressurized state. At this time,
The resin plate material 6 which is a forming raw material is heated by the heaters 4 and 5 to be in a semi-molten state and in a fluid state in the cavity. Further, since the vibration is applied by the ultrasonic vibrators 7 and 8, the flow in the cavity is easily performed, and the width pitch of the protrusions 10 formed on the movable mold 3 is 1 μm or more and 500 μm or less. 10μ
Even if it is a fine one with a depth of m or more and 1 mm or less,
It surely reaches the unevenness of the protrusion 10. In addition,
It is preferable to apply a release agent to the surface of the movable mold 3. As a result, the molded product can be easily released at the time of release, and damage to the embossed surface at the time of release can be suppressed.
【００１７】そして、所定時間加圧した後、加熱ヒータ
ー４，５の電源を切り、樹脂板材６を冷却固化させた
後、図３に示すように、可動側金型３を固定側金型２か
ら離れる方向に移動させ、樹脂板材６を離型する。この
際、超音波振動子７，８によって２０ｋＨｚ〜１００ｋ
Ｈｚの周波数で振動を印加する。この一連の工程によっ
て、樹脂板材６の表面には、微細で均質なエンボス加工
を施すことが可能となる。After pressurizing for a predetermined time, the heaters 4 and 5 are turned off and the resin plate material 6 is cooled and solidified. Then, as shown in FIG. And the resin plate material 6 is released from the mold. At this time, 20 kHz to 100 kHz by the ultrasonic transducers 7 and 8
Vibration is applied at a frequency of Hz. Through this series of steps, the surface of the resin plate material 6 can be finely and uniformly embossed.
【００１８】ここで、超音波振動子７、８によって振動
が印加される方向は、図４に示すように、可動側金型３
及び固定側金型２で形成されるキャビティに対してそれ
ぞれＸ軸、Ｙ軸、Ｚ軸及びこれら各軸の合成方向であ
る。また、これらの方向以外にも、Ｚ軸に対してねじれ
振動を印加する方向及び円、楕円等の回転振動を与える
方向にも振動が印加される。このように、キャビティの
全ての方向に均等に振動が印加されるため、成形原料が
キャビティ内に均等にいきわたり、各金型に形成されて
いる微細な凹凸を精度良く転写することが可能となる。Here, the direction in which vibration is applied by the ultrasonic transducers 7 and 8 is, as shown in FIG.
And the cavities formed by the fixed-side mold 2 are the X-axis, the Y-axis, the Z-axis, and the combined direction of these axes, respectively. In addition to these directions, vibration is also applied in the direction in which torsional vibration is applied to the Z axis and in the direction in which rotational vibration such as a circle or an ellipse is applied. In this way, since the vibration is uniformly applied in all directions of the cavity, it becomes possible to evenly distribute the molding raw material into the cavity and accurately transfer the fine irregularities formed in each mold. .
【００１９】図５及び図６に本実施形態例に係るエンボ
ス加工成形方法によって形成されたエンボス加工の一例
の顕微鏡写真の３Ｄ表示を示す。図５は、幅ピッチが５
０μｍ、孔深さが１００μｍのエンボス加工を施したも
のである。図６は、幅ピッチが２００μｍ、孔深さが１
００μｍのエンボス加工を施したものである。図に示す
ように、従来金型成形では困難であったマイクロオーダ
の均質なエンボス加工が本発明に係るエンボス加工用成
形装置１では可能となることがわかる。FIGS. 5 and 6 show 3D representations of micrographs of an example of embossing formed by the embossing forming method according to this embodiment. In FIG. 5, the width pitch is 5
It is embossed with 0 μm and a hole depth of 100 μm. In FIG. 6, the width pitch is 200 μm and the hole depth is 1.
It is embossed with a thickness of 00 μm. As shown in the figure, it can be seen that the embossing molding apparatus 1 according to the present invention enables uniform micro-order embossing, which has been difficult with conventional die molding.
【００２０】なお、本発明に係るエンボス加工用成形装
置は、前述の実施形態例に限定されるものではなく、他
の樹脂成形法にも適用することができ、例えば、射出成
形の如く、可動側金型及び固定側金型によって形成され
るキャビティ内に成形原料を装填して、樹脂成形品を形
成することにも適用することが可能である。この場合、
高周波又は超音波の振動が印加されることによってキャ
ビティ内に成形原料が均一に行き渡るようになる。The molding apparatus for embossing according to the present invention is not limited to the above-mentioned embodiment, but can be applied to other resin molding methods. It is also possible to apply the molding raw material into the cavity formed by the side mold and the fixed mold to form a resin molded product. in this case,
By applying high-frequency or ultrasonic vibration, the forming raw material is evenly distributed in the cavity.
【００２１】[0021]
【実施例】以下、実施例により本発明を具体的に説明す
る。まず、図１に示すように、固定側金型２に設けられ
ている加熱用ヒーター５に成形原料となるＰＭＭＡの板
材を設置し、固定具９によって固定する。そして、固定
側金型２及び可動側金型４のそれぞれに設けられている
加熱用ヒーター４、５をＰＭＭＡが半溶融状態となる１
４０℃にまで加熱し、可動側金型３を固定側金型２の方
に移動させる。この際、超音波振動子７、８によって２
０ｋＨｚ〜１００ｋＨｚの周波数で振動を印加する。EXAMPLES The present invention will be specifically described below with reference to examples. First, as shown in FIG. 1, a plate material of PMMA, which is a forming raw material, is placed on the heater 5 for heating provided on the stationary mold 2, and is fixed by a fixture 9. Then, the heating heaters 4 and 5 provided in each of the fixed-side mold 2 and the movable-side mold 4 turn the PMMA into a semi-molten state 1
The mold is heated to 40 ° C., and the movable mold 3 is moved toward the fixed mold 2. At this time, the ultrasonic transducers 7 and 8
Vibration is applied at a frequency of 0 kHz to 100 kHz.
【００２２】そして、図２に示すように、圧力４９ＭＰ
ａで、６０秒間加圧する。この時、成形原料であるＰＭ
ＭＡ６は、加熱用ヒーター４，５によって加熱されて、
半溶融状態となり、キャビティ内で流動状態となってい
る。そして、超音波振動子７、８によって振動が印加さ
れているため、キャビティ内での流動が容易に行われ、
可動側金型３に形成されている突起１０の幅ピッチを正
確にかつ精度良く転写する。加圧後は、加熱ヒーター
４，５の電源を切り、ＰＭＭＡ６が約９５℃となり冷却
固化させた後、図３に示すように、可動側金型３を固定
側金型２から離れる方向に移動させ、ＰＭＭＡ６を離型
する。この際、超音波振動子７，８によって２０ｋＨｚ
〜１００ｋＨｚの周波数で振動を印加する。この一連の
工程によって、ＰＭＭＡ６の表面には、図５または図６
に示すような微細で均質なエンボス加工を施すことが可
能となる。Then, as shown in FIG. 2, the pressure is 49MP.
At a, press for 60 seconds. At this time, PM which is a forming raw material
MA6 is heated by heaters 4 and 5 for heating,
It is in a semi-molten state and is in a fluid state in the cavity. And, since the vibration is applied by the ultrasonic vibrators 7 and 8, the flow in the cavity is easily performed,
The width pitch of the protrusions 10 formed on the movable mold 3 is accurately and accurately transferred. After the pressurization, the heaters 4 and 5 are turned off, the PMMA 6 is cooled to about 95 ° C. and solidified, and then the movable side mold 3 is moved away from the fixed side mold 2 as shown in FIG. Then, the PMMA 6 is released. At this time, 20 kHz by the ultrasonic transducers 7 and 8
Vibration is applied at a frequency of -100 kHz. As a result of this series of steps, the surface of the PMMA 6 is formed as shown in FIG.
It is possible to perform fine and uniform embossing as shown in FIG.
【００２３】[0023]
【発明の効果】本発明は以上のように構成されており、
従来、金型による加工が困難であったマイクロオーダの
均質なエンボス加工を簡易な装置で行え、工業的に大量
生産を可能とできる効果を奏する。The present invention is configured as described above,
Conventionally, it is possible to perform uniform micro-order embossing with a simple device, which has been difficult to process with a metal mold, and it is possible to industrially mass-produce.
【図１】本発明に係るエンボス加工用成形装置の一実施
形態例の要部断面図である。FIG. 1 is a cross-sectional view of a main part of an embodiment of an embossing molding apparatus according to the present invention.
【図２】図１におけるエンボス加工用成形装置の加圧時
の状態の断面図である。FIG. 2 is a cross-sectional view of the embossing molding apparatus in FIG. 1 when pressurized.
【図３】図１におけるエンボス加工用成形装置の成形後
の離型時を示す断面図である。FIG. 3 is a cross-sectional view showing a state after mold release of the molding apparatus for embossing in FIG. 1 after molding.
【図４】超音波振動子による振動の印加方向を説明する
ための図である。FIG. 4 is a diagram for explaining a direction in which vibration is applied by an ultrasonic vibrator.
【図５】本発明に係るエンボス加工用成形装置で成形し
たエンボス加工表面の顕微鏡の３Ｄ写真を示す図であ
る。FIG. 5 is a view showing a 3D photograph of a microscope of an embossed surface formed by the embossing forming apparatus according to the present invention.
【図６】本発明に係るエンボス加工用成形装置で成形し
たエンボス加工表面の顕微鏡の３Ｄ写真を示す図であ
る。FIG. 6 is a view showing a 3D photograph of a microscope of an embossed surface formed by the embossing forming apparatus according to the present invention.
１ エンボス加工用成形装置 ２ 固定側金型 ３ 可動側金型 ４、５ 加熱用ヒーター ６ 成形原料 ７ 超音波振動子 ８ 超音波振動子 ９ 固定具 １０ 突起 1 Molding equipment for embossing 2 Fixed mold 3 Movable mold 4,5 heating heater 6 molding raw materials 7 Ultrasonic transducer 8 Ultrasonic transducer 9 Fixture 10 protrusions
Claims (5)
ヒーターと、 前記固定側金型及び前記可動側金型のいずれか一方もし
くは両方に設けられた超音波振動子と、を備えてなるエ
ンボス加工用成形装置であって、 前記加熱用ヒーターで加熱すると共に、前記超音波振動
子によって高周波又は超音波振動させながら加圧、及び
離型して、前記固定側金型と前記可動側金型間に形成さ
れる微細な凹凸を有したキャビティ内に成形原料を均一
に充填できるエンボス加工用成形装置。1. A fixed-side mold, a movable-side mold movable with respect to the fixed-side mold, a heating heater provided on the fixed-side mold and the movable-side mold, and the fixed side. A molding device for embossing, comprising: an ultrasonic vibrator provided in either or both of a mold and the movable side mold, wherein the ultrasonic vibration is generated by heating with the heating heater. It is possible to uniformly fill the molding raw material into the cavity having fine irregularities formed between the fixed side mold and the movable side mold by pressurizing and releasing while vibrating the mold with high frequency or ultrasonic waves. Molding equipment for embossing.
してＸ軸、Ｙ軸、Ｚ軸、ねじれ軸及び回転軸方向に加え
られる請求項１に記載のエンボス加工用成形装置。2. The embossing molding apparatus according to claim 1, wherein the ultrasonic vibration is applied to the cavity in the X-axis, Y-axis, Z-axis, twist axis, and rotation axis directions.
１μｍ以上５００μｍ以下の幅ピッチで、１０μｍ以上
１ｍｍ以下の深さである請求項１に記載のエンボス加工
用成形装置。3. The unevenness formed in the cavity,
The embossing molding device according to claim 1, wherein the embossing molding device has a width pitch of 1 μm or more and 500 μm or less and a depth of 10 μm or more and 1 mm or less.
空容器内に設置されている請求項１に記載のエンボス加
工用成形装置。4. The embossing molding apparatus according to claim 1, wherein the fixed-side mold and the movable-side mold are installed in a vacuum container.
微細な凹凸を有するキャビティ内に成形原料を充填し、
前記固定側金型及び前記可動側金型を加熱すると共に、
前記固定側金型及び前記可動側金型のいずれか一方もし
くは両方に設けられた超音波振動子によって高周波又は
超音波振動させながら加圧、及び離型することによっ
て、前記成形原料を前記キャビティ内に均一に行き渡ら
せて均質な肉厚にエンボス加工できるエンボス加工成形
方法。5. A molding raw material is filled in a cavity having fine irregularities formed by a fixed mold and a movable mold,
While heating the fixed side mold and the movable side mold,
By applying pressure and releasing while high-frequency or ultrasonic vibration is applied by an ultrasonic vibrator provided in one or both of the fixed-side mold and the movable-side mold, the molding raw material is stored in the cavity. An embossing molding method that can evenly spread over the entire surface and emboss into a uniform thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001358097A JP3619863B2 (en) | 2001-11-22 | 2001-11-22 | Embossing molding apparatus and embossing molding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001358097A JP3619863B2 (en) | 2001-11-22 | 2001-11-22 | Embossing molding apparatus and embossing molding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003154573A true JP2003154573A (en) | 2003-05-27 |
| JP3619863B2 JP3619863B2 (en) | 2005-02-16 |
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ID=19169336
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
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| Country | Link |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005049829A (en) * | 2003-07-14 | 2005-02-24 | Konica Minolta Holdings Inc | Molding having minute shape, optical element, molding method and molding apparatus |
| JP2006051796A (en) * | 2004-03-29 | 2006-02-23 | Konica Minolta Holdings Inc | Molding method, cooling apparatus, optical element and molding apparatus |
| WO2007116469A1 (en) * | 2006-03-31 | 2007-10-18 | Fujitsu Limited | Method of transferring pattern and apparatus for transferring pattern |
| WO2008148244A1 (en) * | 2007-06-06 | 2008-12-11 | Dongguan Memtech Electronic Products Co., Ltd | A method of forming a grain on a hot-pressing plastic sheet at a time |
| WO2008148243A1 (en) * | 2007-06-06 | 2008-12-11 | Dongguan Memtech Electronic Products Co., Ltd | A method of forming a grain on a plastic sheet at a time |
| KR101562853B1 (en) * | 2009-06-09 | 2015-10-27 | 주식회사 스페이스솔루션 | Press with vibration device |
-
2001
- 2001-11-22 JP JP2001358097A patent/JP3619863B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005049829A (en) * | 2003-07-14 | 2005-02-24 | Konica Minolta Holdings Inc | Molding having minute shape, optical element, molding method and molding apparatus |
| JP4569744B2 (en) * | 2003-07-14 | 2010-10-27 | コニカミノルタホールディングス株式会社 | Optical element molding method |
| JP2006051796A (en) * | 2004-03-29 | 2006-02-23 | Konica Minolta Holdings Inc | Molding method, cooling apparatus, optical element and molding apparatus |
| WO2007116469A1 (en) * | 2006-03-31 | 2007-10-18 | Fujitsu Limited | Method of transferring pattern and apparatus for transferring pattern |
| WO2008148244A1 (en) * | 2007-06-06 | 2008-12-11 | Dongguan Memtech Electronic Products Co., Ltd | A method of forming a grain on a hot-pressing plastic sheet at a time |
| WO2008148243A1 (en) * | 2007-06-06 | 2008-12-11 | Dongguan Memtech Electronic Products Co., Ltd | A method of forming a grain on a plastic sheet at a time |
| KR101562853B1 (en) * | 2009-06-09 | 2015-10-27 | 주식회사 스페이스솔루션 | Press with vibration device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3619863B2 (en) | 2005-02-16 |
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