JPH0414919B2 - - Google Patents
Info
- Publication number
- JPH0414919B2 JPH0414919B2 JP24482485A JP24482485A JPH0414919B2 JP H0414919 B2 JPH0414919 B2 JP H0414919B2 JP 24482485 A JP24482485 A JP 24482485A JP 24482485 A JP24482485 A JP 24482485A JP H0414919 B2 JPH0414919 B2 JP H0414919B2
- Authority
- JP
- Japan
- Prior art keywords
- shape
- probe
- transducer array
- backing material
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 21
- 239000000523 sample Substances 0.000 claims description 19
- 238000002604 ultrasonography Methods 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000012781 shape memory material Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000003672 processing method Methods 0.000 description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、超音波診断装置等で用いられる超音
波探触子に関し、更に詳しくは複雑な形状のもの
でも容易に加工できる超音波探触子の製造法に関
する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to an ultrasonic probe used in an ultrasonic diagnostic device, etc., and more specifically, an ultrasonic probe that can be easily processed even in complex shapes. Concerning the method of producing children.
（従来の技術）
超音波診断装置等で用いられる超音波探触子で
は、振動子アレイの一方の面に不要な超音波ビー
ムを吸収するためのバツキング材が設けられてい
る。第３図は従来のこのような超音波探触子の一
例を示す構成図であつて、１は例えばPZT（チタ
ン酸ジルコン酸鉛）系の素材で構成された超音波
振動子アレイ（以下単に振動子アレイという）で
あり、この振動子アレイの一方の面（背面）には
振動子アレイ１から背面に向かう不要な超音波ビ
ームを吸収するためのバツキング材２が設けられ
ている。尚、振動子アレイ１の他方の面（前面）
には整合層や音響レンズが設けられるが図示しな
い。ところで近時市場における探触子の多様化に
伴い曲面を有する探触子の需要が起きてきた。(Prior Art) In an ultrasonic probe used in an ultrasonic diagnostic apparatus or the like, a backing material for absorbing unnecessary ultrasonic beams is provided on one surface of a transducer array. FIG. 3 is a configuration diagram showing an example of such a conventional ultrasonic probe, in which 1 is an ultrasonic transducer array (hereinafter simply referred to as 1) made of a PZT (lead zirconate titanate) material, for example. A backing material 2 is provided on one surface (back surface) of the transducer array for absorbing unnecessary ultrasonic beams directed from the transducer array 1 toward the back surface. In addition, the other surface (front surface) of the transducer array 1
A matching layer and an acoustic lens are provided, but they are not shown. Incidentally, with the recent diversification of probes in the market, there has been a demand for probes with curved surfaces.
（発明が解決しようとする問題点）
上述のように曲面を持つた探触子の加工には特
殊な工作治具や、予め曲面を持つた振動子アレイ
等を必要としていた。その工作の方法の一例を第
４図に示す。予め半円形のバツキング材２の面に
振動子アレイ１をイ図のように貼り付け、次にロ
図のようにダイシングソー３で切れ目を入れ、次
に所要角度を回転させて切り、更に回転させて切
る方法で行つている。平面の場合は複数の刃で一
度に多く切る等ができるが、この場合は困難であ
る。又、平面でカツトし、強制的に曲げ加工を施
す等の加工を施すものもある。この場合は工程が
増加し、工数、費用の増加を来し、更に寸法精度
が出ない恐れがある。形が複雑な場合は、第４図
のロのように材料を回転させるだけでは加工でき
ないので、一層工数が増加する。(Problems to be Solved by the Invention) As described above, machining a probe with a curved surface requires a special tool, a transducer array, etc. that has a curved surface in advance. An example of this method is shown in Figure 4. The transducer array 1 is pasted in advance on the surface of the semicircular backing material 2 as shown in Figure A, then a cut is made with a dicing saw 3 as shown in Figure B, then the cut is made by rotating the required angle, and then rotated again. The method I use is to cut it. In the case of a flat surface, it is possible to cut many things at once with multiple blades, but in this case it is difficult. In addition, there are also products that are cut flat and subjected to processing such as forced bending. In this case, the number of steps increases, man-hours and costs increase, and dimensional accuracy may not be achieved. If the shape is complex, it cannot be processed simply by rotating the material as shown in Fig. 4B, which further increases the number of man-hours.
本発明は上記の点に鑑みてなされたもので、そ
の目的は、曲面等複雑な形状の探触子の加工も容
易に加工できる探触子の加工法を実現することで
ある。 The present invention has been made in view of the above points, and an object thereof is to realize a method for processing a probe that can easily process a probe having a complicated shape such as a curved surface.
（問題点を解決するための手段）
前記の問題点を解決する本発明は、バツキング
材に振動子アレイを貼り付けてダイシング加工を
した超音波診断装置の超音波探触子の製造法にお
いて、形状記憶材を形状記憶する外囲条件の下で
成型し、平常条件で平面状態に戻し、振動子アレ
イを貼り付け、ダイシング加工をし、遷移条件に
して成型形状に復帰させ、必要に応じてバツキン
グ材を貼り付けることを特徴とするものである。(Means for Solving the Problems) The present invention solves the above problems in a method of manufacturing an ultrasound probe for an ultrasound diagnostic device in which a transducer array is pasted on a backing material and subjected to dicing processing. Shape memory material is molded under surrounding conditions that memorize its shape, returned to a planar state under normal conditions, attached with a vibrator array, subjected to dicing processing, returned to the molded shape under transition conditions, and as needed. It is characterized by pasting a backing material.
（作用）
形状記憶材を高温にして成型して形状を記憶さ
せ、常温に戻して振動子アレイを貼り付け、ダイ
シング加工をして、遷移温度で記憶形状に戻し、
所望の超音波探触子を得る。(Function) Shape memory material is heated to high temperature and molded to memorize its shape, returned to room temperature, a vibrator array is attached, dicing is performed, and the material is returned to its memorized shape at a transition temperature.
Obtain the desired ultrasound probe.
（実施例） 以下に本発明の実施例につき詳細に説明する。(Example) Examples of the present invention will be described in detail below.
第１図に半円形超音波探触子の製造の一例を示
す。 FIG. 1 shows an example of manufacturing a semicircular ultrasonic probe.
イ図、形状記憶特性を有するゴム材４（ノルボ
ルネンポリマー等）を150℃以上で必要とする曲
率に成型し、形を記憶させる。 Figure A: A rubber material 4 with shape memory properties (norbornene polymer, etc.) is molded to the required curvature at 150°C or higher to memorize the shape.
ロ図、常温でこれを平板に戻し、振動子アレイ
１を貼る。 Figure B: Return this to a flat plate at room temperature and attach the vibrator array 1.
ハ図、ダイシングする。 Figure 1: Dicing.
ニ図、ゴム材４の二次遷移温度（約36℃）に加
熱すると、再び元の半円形状に戻る（この後常温
ではこの形を維持する）。 Figure 2: When heated to the secondary transition temperature of the rubber material 4 (approximately 36°C), it returns to its original semicircular shape (after this, it maintains this shape at room temperature).
ホ図、ゴム材４だけでは変形し易いのでバツキ
ング材２を接着する。 Figure E: Since the rubber material 4 alone is easily deformed, the backing material 2 is attached.
第２図に複雑な形状の例を示す。 Figure 2 shows an example of a complex shape.
イ図、前記ゴム材４を150℃以上で加圧成型し、
必要とする形を記憶させておく。 Figure A: Pressure molding the rubber material 4 at 150°C or higher;
Memorize the shape you need.
ロ図、ゴム材４を常温で平板にし、振動子アレ
イを貼り付ける。 Figure B: The rubber material 4 is made into a flat plate at room temperature, and the vibrator array is attached.
ハ図、ダイシング後再加熱（約36℃以上）する
と記憶していた形状に復帰する。 Figure C: When reheated after dicing (approximately 36°C or higher), it returns to its memorized shape.
以上のように形状記憶特性を有するゴム材を使
用して高温で所望形状に成型し、常温で平板に戻
し、振動子アレイを貼り付けてダイシングをし、
遷移温度に加熱して記憶させた所望形状に戻すこ
とにより困難なダイシング加工をすることなく容
易に所望形状のダイシング加工をした超音波探触
子を得ることができる。 As described above, a rubber material with shape memory properties is used to mold it into a desired shape at high temperature, return it to a flat plate at room temperature, attach a vibrator array, and dice it.
By heating it to a transition temperature and returning it to the memorized desired shape, it is possible to easily obtain an ultrasonic probe diced into a desired shape without performing difficult dicing.
ここに挙げたのは一例であつて、例えば形状記
憶特性を有する材料はゴム材に限るものでなく、
他の材質でも形状記憶特性を有するものであれば
よい。 The examples listed here are only examples; for example, materials with shape memory characteristics are not limited to rubber materials.
Other materials may also be used as long as they have shape memory characteristics.
（発明の効果）
以上説明したように本発明によれば、複雑な形
状の超音波探触子も容易にダイシング加工等がで
きる。(Effects of the Invention) As explained above, according to the present invention, even complex-shaped ultrasonic probes can be easily processed by dicing.
第１図は本発明の実施例の加工法を示す図でイ
からホまで加工順序を示してある。第２図は別の
形状の加工法を示す図でイからハまで加工順序を
示してある。第３図は従来の超音波探触子の図、
第４図は変形探触子の従来の加工法の図である。
１……振動子アレイ、２……バツキング材、３
……ダイシングソー、４……形状記憶材、５……
接着剤。
FIG. 1 is a diagram showing a processing method according to an embodiment of the present invention, and shows the processing order from A to E. FIG. 2 is a diagram showing a processing method for another shape, and shows the processing order from A to C. Figure 3 is a diagram of a conventional ultrasound probe.
FIG. 4 is a diagram of a conventional processing method for a deformed probe. 1... Vibrator array, 2... Bucking material, 3
...Dicing saw, 4...Shape memory material, 5...
glue.
Claims (1)
イシング加工をした超音波診断装置の超音波探触
子の製造法において、形状記憶材を形状記憶する
外囲条件の下で成型し、平常条件で平面状態に戻
し、振動子アレイを貼り付け、ダイシング加工を
し、遷移条件にして成型形状に復帰させ、必要に
応じてバツキング材を貼り付けることを特徴とす
る超音波探触子の製造法。1 In a manufacturing method for an ultrasound probe for an ultrasound diagnostic device in which a transducer array is attached to a backing material and diced, the shape memory material is molded under surrounding conditions that memorize the shape, and then flattened under normal conditions. A method of manufacturing an ultrasonic probe, which comprises returning the probe to the original state, pasting a transducer array thereon, performing dicing processing, restoring the molded shape under transition conditions, and pasting a backing material as necessary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24482485A JPS62104399A (en) | 1985-10-31 | 1985-10-31 | Manufacture of ultrasonic probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24482485A JPS62104399A (en) | 1985-10-31 | 1985-10-31 | Manufacture of ultrasonic probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62104399A JPS62104399A (en) | 1987-05-14 |
| JPH0414919B2 true JPH0414919B2 (en) | 1992-03-16 |
Family
ID=17124495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24482485A Granted JPS62104399A (en) | 1985-10-31 | 1985-10-31 | Manufacture of ultrasonic probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62104399A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177944A (en) * | 1988-12-28 | 1990-07-11 | Shimadzu Corp | Manufacture of ultrasonic probe |
| EP1336637A1 (en) * | 2002-02-14 | 2003-08-20 | Fuji Photo Film Co., Ltd. | Gas barrier film |
-
1985
- 1985-10-31 JP JP24482485A patent/JPS62104399A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62104399A (en) | 1987-05-14 |
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