JPH01205973A - Abradant composition - Google Patents
Abradant compositionInfo
- Publication number
- JPH01205973A JPH01205973A JP63027941A JP2794188A JPH01205973A JP H01205973 A JPH01205973 A JP H01205973A JP 63027941 A JP63027941 A JP 63027941A JP 2794188 A JP2794188 A JP 2794188A JP H01205973 A JPH01205973 A JP H01205973A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- alumina
- water
- boehmite
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 27
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910001593 boehmite Inorganic materials 0.000 claims abstract description 26
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 150000003839 salts Chemical class 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000002245 particle Substances 0.000 abstract description 25
- 239000006185 dispersion Substances 0.000 abstract description 13
- 230000007547 defect Effects 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000000126 substance Substances 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052744 lithium Inorganic materials 0.000 abstract description 2
- 238000005498 polishing Methods 0.000 description 57
- 235000002639 sodium chloride Nutrition 0.000 description 17
- 230000000694 effects Effects 0.000 description 10
- 238000012545 processing Methods 0.000 description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 5
- -1 bayerite Chemical compound 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 4
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 4
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Chemical compound [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- YIXJRHPUWRPCBB-UHFFFAOYSA-N magnesium nitrate Chemical compound [Mg+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O YIXJRHPUWRPCBB-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 238000005054 agglomeration Methods 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910001679 gibbsite Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 235000010980 cellulose Nutrition 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- IIPYXGDZVMZOAP-UHFFFAOYSA-N lithium nitrate Chemical compound [Li+].[O-][N+]([O-])=O IIPYXGDZVMZOAP-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910001629 magnesium chloride Inorganic materials 0.000 description 2
- 235000011147 magnesium chloride Nutrition 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- ZZBAGJPKGRJIJH-UHFFFAOYSA-N 7h-purine-2-carbaldehyde Chemical compound O=CC1=NC=C2NC=NC2=N1 ZZBAGJPKGRJIJH-UHFFFAOYSA-N 0.000 description 1
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 1
- 239000005695 Ammonium acetate Substances 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 241000640882 Condea Species 0.000 description 1
- 235000009300 Ehretia acuminata Nutrition 0.000 description 1
- 244000046038 Ehretia acuminata Species 0.000 description 1
- 241000287828 Gallus gallus Species 0.000 description 1
- 101000666896 Homo sapiens V-type immunoglobulin domain-containing suppressor of T-cell activation Proteins 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 241000283986 Lepus Species 0.000 description 1
- 229920001732 Lignosulfonate Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 102100038282 V-type immunoglobulin domain-containing suppressor of T-cell activation Human genes 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- UGLUPDDGTQHFKU-UHFFFAOYSA-M [NH4+].S(=O)(=O)([O-])[O-].[Mg+] Chemical compound [NH4+].S(=O)(=O)([O-])[O-].[Mg+] UGLUPDDGTQHFKU-UHFFFAOYSA-M 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000011126 aluminium potassium sulphate Nutrition 0.000 description 1
- 235000019257 ammonium acetate Nutrition 0.000 description 1
- 229940043376 ammonium acetate Drugs 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229910001680 bayerite Inorganic materials 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910001648 diaspore Inorganic materials 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- IJJVMEJXYNJXOJ-UHFFFAOYSA-N fluquinconazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1N1C(=O)C2=CC(F)=CC=C2N=C1N1C=NC=N1 IJJVMEJXYNJXOJ-UHFFFAOYSA-N 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010335 hydrothermal treatment Methods 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229940071264 lithium citrate Drugs 0.000 description 1
- WJSIUCDMWSDDCE-UHFFFAOYSA-K lithium citrate (anhydrous) Chemical compound [Li+].[Li+].[Li+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O WJSIUCDMWSDDCE-UHFFFAOYSA-K 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical class C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- HZPNKQREYVVATQ-UHFFFAOYSA-L nickel(2+);diformate Chemical compound [Ni+2].[O-]C=O.[O-]C=O HZPNKQREYVVATQ-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 1
- 239000002674 ointment Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229940050271 potassium alum Drugs 0.000 description 1
- GRLPQNLYRHEGIJ-UHFFFAOYSA-J potassium aluminium sulfate Chemical compound [Al+3].[K+].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRLPQNLYRHEGIJ-UHFFFAOYSA-J 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 230000010415 tropism Effects 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 238000007779 wet slurry method Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は研磨剤組成物に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to an abrasive composition.
詳しくは、研磨能率がよく、すぐれた研磨表面を形成す
ることができる研磨剤組成物に関するものである。Specifically, the present invention relates to an abrasive composition that has good polishing efficiency and can form an excellent polished surface.
従来、水とアルミナからなる研磨剤組成物は知られてい
る（例えば、特開昭！Ｔ’ｌ−ｇ９３ｇｑ号参照）が、
研磨速度が十分でなく、研磨速度を上げる目的でアルミ
ナの粒径な大きくすると。Conventionally, abrasive compositions consisting of water and alumina have been known (for example, see JP-A-Sho! T'l-g93gq);
If the polishing speed is not sufficient, increase the alumina particle size to increase the polishing speed.
研磨表面に荒れが生ずるようになり、研磨速度と表面状
態の両方を満足するものとは言えなかった。The polishing surface became rough, and it could not be said that both the polishing speed and the surface condition were satisfied.
過去ｉｏ年間に於いて、工業的規模の生産が飛曜的に増
加したシリコン及び化合物半導体基板、各種の磁気メモ
リーハードディスク、レーザ一部品等の材料の精密研磨
加工においては。Over the past 20 years, industrial-scale production has increased dramatically for precision polishing of materials such as silicon and compound semiconductor substrates, various magnetic memory hard disks, and laser parts.
特に加工面の平滑度、無欠陥性（スクラッチ。In particular, the smoothness of the machined surface and the absence of defects (scratch).
オレンジビール、ビット、ノジュール、クラック等の欠
陥がない事）に対する要求水準が、過去の研磨加工技術
水準に比して遥かに高度化すると共に、他方、生産、検
査設備等に多額の投資が必要な為、生産スピードの向上
、不良欠陥ロスの低減に依るコストカットも重要な課題
となっている。The required level (no defects such as orange beer, bits, nodules, cracks, etc.) has become far more sophisticated than the past polishing technology level, and on the other hand, a large amount of investment is required in production, inspection equipment, etc. Therefore, cost cutting by improving production speed and reducing loss of defects and defects has become an important issue.
従りて、これらの分野で使用される研磨剤に就いても加
工精度と共に研磨速度の向上に対する要望が極めて強い
ものとなっている。Therefore, there is an extremely strong demand for improvements in processing accuracy and polishing speed for abrasives used in these fields.
本発明者らは、かかる要望を満足するよりすぐれた研磨
剤組成物を得るぺ〈、鋭意研究を重ねた結果、水とα−
アルミナからなる研磨剤組成物に、ベーマイト及び水溶
性の金属塩を存在させるときは、加工物加工面の平滑度
、或は表面欠陥（スクラッチ、オレンジピール等）発生
防止等の研磨仕上がり効果を低下させることなく、シか
も研磨速度を大幅に向上させることが出来ることを知得
して本発明を完成した。The present inventors have conducted intensive research to obtain a better abrasive composition that satisfies such demands.
When boehmite and water-soluble metal salts are present in an abrasive composition made of alumina, the smoothness of the processed surface of the workpiece or the polishing finish effect such as prevention of surface defects (scratches, orange peel, etc.) will be reduced. The present invention was completed based on the knowledge that it is possible to significantly improve the polishing speed without increasing the polishing rate.
本発明の要旨は、水、α−アルミナ、ベーマイト及び水
溶性の金属塩を含有してなる研磨剤組成物に存する。The gist of the present invention resides in an abrasive composition containing water, α-alumina, boehmite, and a water-soluble metal salt.
以下１本発明を更に詳細に説明する。The present invention will be explained in more detail below.
本発明で使用するα−アルミナとしては、特に限定され
ないがバイヤライト、ジブサイト、バイトラージライト
のような水酸化アルミニウム、ベーマイト、γ−アルミ
ナ、θ−アルミナのようなα−アルミナ以外、のアルミ
ナを、常法に従い１ｉｏｏ℃以上の温度で焼成して得た
アルミナが挙げられる。此の焼成温度は高い程研磨速度
が大きくなる傾向があるので／２００℃以上、ｌコＯＱ
〜／！ＴＯＯ℃で焼成して得られたα−アルミナが好ま
しい。The α-alumina used in the present invention includes, but is not particularly limited to, aluminum hydroxide such as bayerite, gibbsite, and bayeragelite, and alumina other than α-alumina such as boehmite, γ-alumina, and θ-alumina. , alumina obtained by firing at a temperature of 100° C. or higher according to a conventional method. The higher the firing temperature is, the higher the polishing rate tends to be.
~/! α-alumina obtained by firing at TOO°C is preferred.
加工精度及び研磨速度を考慮すると本発明で使用される
α−アルミナは平均粒径でｏ、ｉ〜ｉｏμ、好ましくは
０．／〜３μであり、又最大粒径で３０μ以下、好まし
くは２０μ以下の微粉体である。従って、焼成して得ら
れたα−アルミナは通常の微粉砕装置即ち湿式スラリ方
式ではボールミル、振動ミル等で粉砕し粗大粒子は重力
沈降、遠心沈降等の装置で分級するか。Considering processing accuracy and polishing speed, the average particle size of the α-alumina used in the present invention is o,i~ioμ, preferably 0. /~3μ, and the maximum particle size is 30μ or less, preferably 20μ or less. Therefore, the α-alumina obtained by firing is pulverized using a conventional pulverizing device, such as a ball mill or a vibrating mill in the case of a wet slurry method, and coarse particles are classified using a device such as gravity sedimentation or centrifugal sedimentation.
或は乾式方式即ちジェット気流に依る粉砕分級処理によ
り所望の粒度に整粒する。Alternatively, the particles are sized to a desired particle size by a dry method, that is, a crushing and classification process using a jet stream.
α−アルミナの含有量は１組成物全量に対して７〜３０
重量％、好ましくは２〜７５重量％である。あまりに少
ないと研磨速度が小さくなり、逆にあまりに多いと均一
分散が保てなくなり、かつ、スラリー粘度が過大となっ
て取扱いが困難となる。The content of α-alumina is 7 to 30 per total composition.
% by weight, preferably from 2 to 75% by weight. If it is too small, the polishing rate will be low, and if it is too large, it will not be possible to maintain uniform dispersion and the slurry will have an excessive viscosity, making it difficult to handle.
一方、ベーマイトは、アルミナ水和物の１種である。ア
ルミナ水和物には結晶形の違いによりジブサイト、バイ
アライト、ノルストランダイト、ベーマイト、ジアスポ
ア等が存在するが。On the other hand, boehmite is a type of alumina hydrate. Alumina hydrate includes gibbsite, bialite, norstrandite, boehmite, diaspore, etc. depending on the crystal form.
本発明の研磨剤組成物ではベーマイトを含有することを
必須の要件とする。The abrasive composition of the present invention must contain boehmite.
ベーマイトとは、ジブサイト等を２５θ℃程度で加圧水
熱処理するか、或はチｌ−グラー法で合成されるアルミ
ニウム有機化合物ＣＡｔ（ＯＲ）ｓ ］（但し、Ｒはア
ルキル基である）の加水分解に依って製造する方法で一
般的に生産されており。Boehmite is an aluminum organic compound CAt(OR)s (where R is an alkyl group) synthesized by hydrothermal treatment of gibbsite etc. at about 25θ℃ or by the Ziegler method. It is generally produced by a manufacturing method.
アルミナゾル、セラミックバインダー、繊維製品カーペ
ットの帯電防止処理、水の浄化処理、化粧品、軟こうの
増粘剤、アルミナ系触媒又は触媒担体等の原料として広
く利用されている工業材料である。It is an industrial material that is widely used as a raw material for alumina sol, ceramic binder, antistatic treatment of textile carpets, water purification treatment, cosmetics, thickener for ointment, alumina catalyst or catalyst carrier, etc.
ベーマイトは、 Ａｔ・αΣ又はＡｔ、Ｏ，・Ｈ２Ｏの
化学式で表示される物質で、粉体製品としては１例えば
、 ＫＡＩＳＥＲ（米国） 、 ＶＩＳＴＡ Ｃｈｅｍ
ｉｃａｌ （米国） ＋１ Ｃｏｎｄｅａ Ｃｈｅｍｉ
ｅ （ドイツ）等から市販されている。例えば２００μ
以下９５％、４’ｊμ以下ｓｏ％の粒子からなる粉体な
水中又は酸性の水中で攪拌１分散させると、一部繊維状
、大部分は粒状で、且つそのサイズが０．Ｏ１μ以下の
超微細粒子の形で分散し、コロイド状のゾルを形成する
性質を有する。ベーマイトのゾルに等電点９．りであり
１粒子自身が陽性に帯電している事が電気泳動法により
観測される。Boehmite is a substance expressed by the chemical formula At・αΣ or At, O,・H2O, and is available as a powder product.For example, KAISER (USA), VISTA Chem
ical (USA) +1 Condea Chemi
It is commercially available from companies such as E (Germany). For example 200μ
When a powder consisting of particles of 95% or less and 4'jμ or less is dispersed with stirring in water or acidic water, some particles are fibrous, most are granular, and the size is 0. It has the property of being dispersed in the form of ultrafine particles of 01μ or less and forming a colloidal sol. Isoelectric point of boehmite sol 9. It is observed by electrophoresis that each particle itself is positively charged.
本発明で水に分散されるベーマイトは粉体でもベーマイ
トゾルでも使用可能であるが、いずれの場合も、水に分
散させた場合の粒子径が０．０７μ以下のゾルを形成す
るものを使用する。The boehmite to be dispersed in water in the present invention can be used in powder form or boehmite sol, but in either case, use one that forms a sol with a particle size of 0.07μ or less when dispersed in water. .
ベーマイトの含有量は組成物全ｉ：に対しｏ、ｉ〜２０
重量％、好ましくは０．３− ／ ０重量％である。ベ
ーマイト含有量が余りに少ないと研磨速度向上の効果が
期待出来ず、逆に余りに多いと見掛粘度、チキントロピ
ー性が増大し、α−アルミナの均一分散性を損なう事と
なると同時に研磨剤組成物の容器からの取出しが困難と
なる等ハンドリング上不適な物性となる。The content of boehmite is o for the total composition i: i ~ 20
% by weight, preferably 0.3-/0% by weight. If the boehmite content is too low, no effect of improving the polishing speed can be expected; on the other hand, if the boehmite content is too high, the apparent viscosity and chicken tropism will increase, impairing the uniform dispersion of α-alumina, and at the same time reducing the polishing composition. It has physical properties that are unsuitable for handling, such as difficulty in removing it from the container.
更に本発明では水、α−アルミナ及びベーマイトからな
る系に１粒子の分散性、或は逆に凝集性を高めるために
水溶性の金属塩を添加することが必要である。Furthermore, in the present invention, it is necessary to add a water-soluble metal salt to the system consisting of water, α-alumina, and boehmite in order to improve the dispersibility of a single particle or, conversely, to improve the cohesiveness.
水溶性の金属塩としては、水に対する溶解度が１ｙ７ｉ
ｏｏｙ水以上のものであれば使用出来るが、好ましくは
！； ｆ ／ ／ ００ ｆ水以上のものであることが
望ましい。As a water-soluble metal salt, the solubility in water is 1y7i.
You can use anything more than ooy water, but preferably! ; f//00 f water or higher is desirable.
このような水溶性の金属塩の例としては、リチウム、ナ
トリウム、カリウム等のアルカリ金属、マグネシウム、
カルシウムのようなアルカリ土類金属、亜鉛、アルミニ
ウム、ニッケル等の金属と、硝酸、硫酸、塩酸、燐酸の
ような無機酸又は蟻酸、酢酸、クエン酸のような有機酸
との塩があげられる。Examples of such water-soluble metal salts include alkali metals such as lithium, sodium, and potassium, magnesium,
Examples include salts of alkaline earth metals such as calcium, metals such as zinc, aluminum, and nickel, and inorganic acids such as nitric acid, sulfuric acid, hydrochloric acid, and phosphoric acid, or organic acids such as formic acid, acetic acid, and citric acid.
具体的には、硝酸リチウム、硫酸リチウム。Specifically, lithium nitrate and lithium sulfate.
クエン酸リチウム、硝酸ナトリウム、硫酸ナトリウム、
チオ硫酸ナトリウム、塩化ナトリウム。Lithium citrate, sodium nitrate, sodium sulfate,
Sodium thiosulfate, sodium chloride.
酢酸ナトリウム、硫酸カリウム、塩化カリウム。Sodium acetate, potassium sulfate, potassium chloride.
硝酸マグネシウム、硫酸マグネシウム、硫駿マグネシウ
ムアンモン、塩化マグネシウム、酢酸マグネシウム、硝
酸カルシウム、塩化カルシウム、硫駿亜鉛、塩化亜鉛、
酢酸亜鉛、硝酸アルミニウム、硫酸アルミニウム、燐酸
アルミニウム、塩化アルミニウム、カリ明ばん、硝酸ニ
ッケル、硫酸ニッケル、蟻酸ニッケル、酢酸ニッケル等
があげられる。Magnesium nitrate, magnesium sulfate, magnesium ammonium sulfate, magnesium chloride, magnesium acetate, calcium nitrate, calcium chloride, zinc sulfate, zinc chloride,
Examples include zinc acetate, aluminum nitrate, aluminum sulfate, aluminum phosphate, aluminum chloride, potassium alum, nickel nitrate, nickel sulfate, nickel formate, and nickel acetate.
これらの中では、アルミナ−水スラリー系に対する分散
又は凝集作用が高い点で硝酸マグネシウム、塩化マグネ
シウム、硫酸マグネシウム。Among these, magnesium nitrate, magnesium chloride, and magnesium sulfate have a high dispersion or coagulation effect on alumina-water slurry systems.
硝酸カルシウム、硝酸アルミニウム、硫酸アルミニウム
のようなマグネシウム、カルシウム又はアルミニウムの
無機酸塩が好ましい。Inorganic acid salts of magnesium, calcium or aluminum are preferred, such as calcium nitrate, aluminum nitrate, aluminum sulfate.
水溶性の金属塩の含有量は１組成物全量に対して０．５
〜２０重量％、好ましくは／−／Ｄ重ｔ％である。この
量があまりに少ないと本発明の効果が期待出来なくなる
。逆にあまりに多くても、添加効果が向上する事もなく
、冬時低現時に塩の結晶が析出するとか、排水浄化処理
の負担を増す等の不都合を生じるようになる。The content of water-soluble metal salt is 0.5 per total composition.
~20% by weight, preferably /-/D weight t%. If this amount is too small, the effects of the present invention cannot be expected. On the other hand, if the amount is too large, the effect of addition will not be improved and problems will occur, such as precipitation of salt crystals during low temperatures in winter and increased burden on wastewater purification treatment.
本発明の研磨剤組成物が優れた研磨効果を有することの
詳細は不明であるが、ベーマイト及び水溶性の金属塩の
存在が研磨剤組成物中のα−アルミナの分散状態に何等
からの影響を及ぼし、かかる分散状態が研磨加工に有利
に作用すると思われる。即ち前述のα−アルミナ粒子を
水中又は酸性の水中で攪拌し分散させると１個々の粒子
は陽性の電荷を保有し、水又は電解質の陰イオンを吸着
し電気的二重層を形成する。The details of why the abrasive composition of the present invention has an excellent polishing effect are unknown, but the presence of boehmite and a water-soluble metal salt has no effect on the dispersion state of α-alumina in the abrasive composition. This state of dispersion is believed to have an advantageous effect on polishing. That is, when the α-alumina particles described above are stirred and dispersed in water or acidic water, each particle has a positive charge and adsorbs anions of water or electrolyte to form an electrical double layer.
かかる微粒子の分散系にあってはファンデルワールス引
力に依る凝集と電気的斥力に依る反発作用力とで成る種
の平衡状態を形成するのであるが、こ＼にベーマイトを
共存させると、ベーマイトは該水中で陽性に帯電するた
め、全体の分散系としては電気的斥力に依る粒子相互間
の分散効果が強まる事となる。かかるスラリー状研磨剤
による精密研磨加工に於ては遊離砥粒であるα−アルミ
ナ粒子が単分散又は凝集状態で研磨パッドに保持され、
成る加工圧で被加工物表面を摺動するにつれて、砥粒（
α−アルミナ粒子）がころがりつ＼或は渭りつ＼研削作
用を及ぼしている事になり、砥粒が被加工物表面を研削
する作用点の数が多く且つ各作用点での研削作用力が均
一である程、加工時の単位摺動量。In such a dispersion system of fine particles, a kind of equilibrium state is formed consisting of agglomeration due to van der Waals attraction and repulsive force due to electrical repulsion, but when boehmite is coexisting in this state, boehmite Since the particles are positively charged in the water, the dispersion effect between particles due to electrical repulsion becomes stronger in the entire dispersion system. In precision polishing using such a slurry abrasive, α-alumina particles, which are free abrasive grains, are held on the polishing pad in a monodispersed or aggregated state,
The abrasive grains (
This means that the abrasive grains (α-alumina particles) are exerting a rolling or rolling action, and the number of action points at which the abrasive grains grind the surface of the workpiece is large, and the grinding force at each action point is The more uniform the unit sliding amount during machining.
単位時間当りの研磨量が大きく且つ加工表面精度が高く
なる筈である。しかしながら、研磨パッドと被加工物表
面の接触面では砥粒（α−アルミナ）と被加工物が研削
されて発生した微細粒子（削りかす）が水に懸濁したス
ラリ状態が存在するため１個々の粒子の分散又は凝集状
態が研磨量、断層仕上り性に強く影響を及ぼすであろう
事が推定されるが１本発明の如く水、α−アルミナ、ベ
ーマイト及び水溶性金属塩を含有してなる研磨剤に於て
はベーマイト及び水溶性金属塩が各粒子の分散又は凝集
状態に影響し。The amount of polishing per unit time should be large and the precision of the machined surface should be high. However, at the contact surface between the polishing pad and the workpiece surface, there is a slurry state in which abrasive grains (α-alumina) and fine particles (shavings) generated by grinding the workpiece are suspended in water. It is presumed that the state of dispersion or agglomeration of the particles will have a strong influence on the amount of polishing and the finish quality of the sections. In abrasives, boehmite and water-soluble metal salts affect the dispersion or agglomeration state of each particle.
研磨性能の向上をもたらすと思われる。This is thought to improve polishing performance.
本発明の研磨剤組成物の調製は、前記各成分を混合攪拌
すればよく、混合順序等も特に制限されるものではない
。The abrasive composition of the present invention can be prepared by mixing and stirring the above-mentioned components, and the order of mixing is not particularly limited.
又、この研磨剤組成物の調製に際しては、被加工物の種
類、加工条件等の研磨加工上の必要条件に応じて、下記
の如き各種の公知の添加剤を加えてもよい。Further, when preparing this abrasive composition, various known additives as described below may be added depending on the necessary conditions for polishing such as the type of workpiece and processing conditions.
添加剤としては、例えば、エタノール、プロパツール、
エチレングリコールの様な水溶性アルコール類、アルキ
ルベンゼンスルホン酸ソーダ、ナフタリンスルホン酸の
ホルマリン縮合物の様な界面活性剤、硫酸、塩酸、硝駿
、酢酸の様な酸類、リグニンスルホン酸塩、カルボキシ
メチルセルロース塩、ポリアクリル酸塩の様な有機ポリ
アニオン系物質、セルロース、カルボキシメチルセルロ
ース、ヒドロキシエチルセルロースの様なセルロース類
、硫酸アンモニウム。Examples of additives include ethanol, propatool,
Water-soluble alcohols such as ethylene glycol, sodium alkylbenzene sulfonates, surfactants such as formalin condensates of naphthalene sulfonic acids, acids such as sulfuric acid, hydrochloric acid, nitric acid, acetic acid, lignin sulfonates, carboxymethyl cellulose salts , organic polyanionic materials such as polyacrylates, celluloses such as cellulose, carboxymethyl cellulose, hydroxyethyl cellulose, ammonium sulfate.
塩化アンモニウム、酢酸アンモニウムの様な無機塩類等
があげられる。Examples include inorganic salts such as ammonium chloride and ammonium acetate.
尚、本発明の研磨剤組成物の ｐＨとしては。In addition, the pH of the polishing composition of the present invention is as follows.
３〜ｇ、好ましくはμ〜７である。ｐＨは一塩の種類、
添加量等に依って変動するものであるが、一般に、水−
アルミナ系研磨剤でｐＨをアルカリサイドに偏倚させる
と、高粘度となり、多孔質網状組織からなる研磨パッド
の目詰まり劣化、被加工物表面へのスクラッチ発生トラ
ブル等を起こし易くなるので、研磨剤組成物のｐＨを酸
性サイドに調整するのが通例であって、かかる目的で酸
類な少量添加する場合がある。3-g, preferably μ-7. pH is monosalt type,
Although it varies depending on the amount added, generally water-
If the pH of an alumina-based abrasive is biased toward the alkaline side, it will have a high viscosity, which will easily cause problems such as clogging and deterioration of the polishing pad made of a porous network structure and scratches on the surface of the workpiece. It is customary to adjust the pH of a substance to the acidic side, and small amounts of acids may be added for this purpose.
本発明の研磨剤組成物は、金属、ガラス、プラスチック
等の研磨に使用されるが、欠陥のない研磨表面が得られ
ることから、メモリーハードディスク等の研磨に特に好
適である。The abrasive composition of the present invention is used for polishing metals, glass, plastics, etc., and is particularly suitable for polishing memory hard disks etc. since it provides a defect-free polished surface.
以下、実施例によって本発明を具体的に説明するが１本
発明はその要旨を超えない限り以下の実施例に限定され
るものではない。Hereinafter, the present invention will be specifically explained with reference to examples, but the present invention is not limited to the following examples unless it exceeds the gist thereof.
実施例１−コダ、及び比較例１
〔研磨剤組成物の調整〕
水酸化アルミニウムを１３００℃、！ｒ待時間条件で焼
成し、乾式方法で粉砕整粒したα−アルミナ（平均粒子
径Ｏ，Ｓ Ｕμ、最大粒子径ｇμ）を、高速ミキサーを
用いて水に分散させてα−アルミナ濃度６重量−のスラ
リーを調製した。Example 1 - Koda and Comparative Example 1 [Adjustment of polishing composition] Aluminum hydroxide was heated at 1300°C! α-Alumina (average particle size O, S Uμ, maximum particle size gμ), which was calcined under waiting time conditions and pulverized using a dry method, was dispersed in water using a high-speed mixer to obtain an α-alumina concentration of 6 weight. A slurry of - was prepared.
これにベーマイト及び水溶性の金属塩を第１ｆｆＫ記載
の割合で添加分散させて研磨剤組成物を調製した。A polishing composition was prepared by adding and dispersing boehmite and a water-soluble metal salt in the proportions described in 1FFK.
’Ａ Ｐｕｒａｌ （Ｗ３ ％名）ＳＣＦ （平均粒
子径的２゜μ）を使用した。'A Pural (W3% name) SCF (average particle diameter 2 μm) was used.
被加工物としてアルミニウム基板にニッケル・リンの無
電解メツキにッケル９０〜９２％。The workpiece is electroless plating of nickel and phosphorus on an aluminum substrate with a coating rate of 90 to 92%.
リン１Ｏ−ｆｆ％の合金メツキ層）を施したＪ、５イン
チメモリハードディスク（外径約ｑ ｓ ％ ）の基板
を使用した。A J5-inch memory hard disk substrate (outer diameter approximately qs%) coated with an alloy plating layer containing 1O-ff% phosphorus was used.
此のディスクを両面研磨機に装填して研磨する。研磨機
の上下定盤に、夫々、スェードタイプのポリウレタン基
質研磨パッドが装着しである両面研磨機に該ディスクを
装填し、ディスクと両研磨パッドを相対的に摺動させて
Ｓ分間研磨を行なった。Load this disk into a double-sided polisher and polish it. The disc was loaded into a double-sided polishing machine with suede type polyurethane substrate polishing pads attached to the upper and lower surface plates of the polisher, and polishing was performed for S minutes by sliding the disc and both polishing pads relative to each other. Ta.
研磨はディスクと両研磨パッドの間に上記研磨剤試料を
毎分当り、？ ００ ｃｃの割合で供給し。For polishing, apply the above abrasive sample between the disk and both polishing pads per minute. 00 cc.
加工圧１００ｆｔ／Ｃｄで行なった。The processing was carried out at a processing pressure of 100 ft/Cd.
研磨の後、ディスクを両面研磨機より取出し。After polishing, remove the disc from the double-sided polisher.
超音波洗浄をくり返し、ディスク加工面を清浄にして、
目視検査に依り１表面欠陥の有無程度を評価した。Repeat ultrasonic cleaning to clean the disc processing surface.
The presence or absence of surface defects was evaluated by visual inspection.
次にディスクの厚さの計測を行ない厚さの減少量から毎
分当りの平均研磨速度を算出した。Next, the thickness of the disk was measured, and the average polishing rate per minute was calculated from the amount of decrease in thickness.
此の試験結果は第１表に示す通りである。The test results are shown in Table 1.
第 ７ 表
実施例２５〜２ｇ、及び比較例コ
〔研磨剤組成物の調整〕
水酸化アルミニウムな／２００℃、５時間の条件で焼成
し、乾式方法で粉砕整粒したα−アルミナ（平均粒子径
θ、ｌＩ９μ、最大粒子径Ｓμ）を、高速ミキサーを用
いて水に分散させてα−アルミナ濃度３重量％のスラリ
ーを調整した。Table 7 Examples 25 to 2g and Comparative Example [Preparation of abrasive composition] Aluminum hydroxide/α-alumina (average particle A slurry having an α-alumina concentration of 3% by weight was prepared by dispersing the particles (diameter θ, lI 9μ, maximum particle size Sμ) in water using a high-speed mixer.
これにベーマイト及び水溶性の金属塩を第２表に記載の
割合で添加分散させて研磨剤組成物を調製した。A polishing composition was prepared by adding and dispersing boehmite and a water-soluble metal salt in the proportions shown in Table 2.
なお、ベーマイトとしては水酸化アルミニウムをオート
クレーブ中２３０℃で水熱処理して得たベーマイトゾル
を使用した。As the boehmite, a boehmite sol obtained by hydrothermally treating aluminum hydroxide at 230° C. in an autoclave was used.
〔研磨試験〕
被加工物として一３ＱｒＨ１径のポリカーボネートディ
スクを用い、これを両面研磨機に装填して研磨した。[Polishing Test] A polycarbonate disk with a diameter of 13QrH1 was used as the workpiece, and this was loaded into a double-sided polisher and polished.
尚、研磨機の上下定盤には夫々スェードタイプの軟質ポ
リウレタン基質研磨パッドが装着されており、ディスク
と研磨パッドの間に研磨剤試料を毎分当りｓ ｏ ｏ
ｃｃの割合で供給しながら。Furthermore, suede type soft polyurethane substrate polishing pads are attached to the upper and lower surface plates of the polishing machine, and an abrasive sample is applied between the disks and the polishing pads every minute.
While feeding at the rate of cc.
加工圧ｇｏｆｆ／ｃｒｄの条件でディスクと研磨パッド
を相対的に摺動させてＳ分間研磨を行なった。Polishing was performed for S minutes by sliding the disk and polishing pad relative to each other under the conditions of processing pressure goff/crd.
研磨終了後ディスクを研磨機より取出し、超音波洗浄に
より加工面を清浄にして目視検査で表面欠陥の有無程度
を評価した。After polishing, the disk was removed from the polisher, the processed surface was cleaned by ultrasonic cleaning, and the presence or absence of surface defects was evaluated by visual inspection.
次にディスクの重量を測定して、研磨前後の重量損失量
を算出して、毎分当りの平均研磨量を求めた。Next, the weight of the disk was measured, the amount of weight loss before and after polishing was calculated, and the average amount of polishing per minute was determined.
此の試験結果は第２表に示す通りである。The test results are shown in Table 2.
第 λ 表
〔発明の効果〕
本発明に従いα−アルミナ−水分散系にベーマイト及び
水溶性の金属塩を添加した研磨剤組成物は、研磨加工面
に表面欠陥を発生する事なく、より高い研磨速度を発現
し、研磨加工能率を高めることができる。しかも１本発
明の研磨剤組成物は研磨速度が高いため、研磨加工時間
の短縮、研磨剤消費量の低減、高価なる研磨パッドの損
耗、劣化の減少等による加工コストの低下をもたらし、
極めて有用である。Table λ [Effects of the Invention] The abrasive composition according to the present invention in which boehmite and water-soluble metal salts are added to the α-alumina-water dispersion system can achieve higher polishing without generating surface defects on the polished surface. It can develop speed and improve polishing efficiency. Moreover, since the polishing agent composition of the present invention has a high polishing speed, it shortens polishing processing time, reduces the amount of polishing agent consumed, and reduces processing costs by reducing wear and deterioration of expensive polishing pads.
Extremely useful.
出願人 三菱化成工業株式会社 代理人 弁理士 長谷用 − ほか１名 １ 事件の表示 昭和６３年特許願第２７９４１号 ２ 発明の名称 研磨剤組成物 ３ 補正をする者Applicant: Mitsubishi Chemical Industries, Ltd. Agent: Patent Attorney Hase - 1 other person 1 Display of incident 1988 Patent Application No. 27941 2 Name of the invention Abrasive composition 3 Person making the amendment
Claims (1)
塩を含有してなる研磨剤組成物。(1) An abrasive composition containing water, α-alumina, boehmite, and a water-soluble metal salt.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63027941A JP2632898B2 (en) | 1988-02-09 | 1988-02-09 | Polishing composition |
| US07/298,048 US4956015A (en) | 1988-01-19 | 1989-01-18 | Polishing composition |
| EP89100801A EP0325232B1 (en) | 1988-01-19 | 1989-01-18 | Polishing composition |
| DE68927116T DE68927116T2 (en) | 1988-01-19 | 1989-01-18 | Polishing compound |
| KR1019890000536A KR0141694B1 (en) | 1988-01-19 | 1989-01-19 | Polishing composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63027941A JP2632898B2 (en) | 1988-02-09 | 1988-02-09 | Polishing composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01205973A true JPH01205973A (en) | 1989-08-18 |
| JP2632898B2 JP2632898B2 (en) | 1997-07-23 |
Family
ID=12234921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63027941A Expired - Lifetime JP2632898B2 (en) | 1988-01-19 | 1988-02-09 | Polishing composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2632898B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10195421A (en) * | 1996-11-14 | 1998-07-28 | Nissan Chem Ind Ltd | Abrasion composition for aluminum disk and abrasion process using the composition |
| US6007592A (en) * | 1996-11-14 | 1999-12-28 | Nissan Chemical Industries, Ltd. | Polishing composition for aluminum disk and polishing process therewith |
| US6336945B1 (en) | 1996-11-14 | 2002-01-08 | Kao Corporation | Abrasive composition for the base of magnetic recording medium and process for producing the base by using the same |
| WO2008102672A1 (en) * | 2007-02-20 | 2008-08-28 | Sumitomo Electric Industries, Ltd. | Polishing slurry, method for manufacturing the polishing slurry, nitride crystalline material and method for polishing surface of the nitride crystalline material |
| JP2015109128A (en) * | 2013-12-05 | 2015-06-11 | 花王株式会社 | Polishing solution composition for glass hard disk substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61278587A (en) * | 1985-06-04 | 1986-12-09 | Fujimi Kenmazai Kogyo Kk | Polishing composition |
| JPS6215282A (en) * | 1985-07-12 | 1987-01-23 | Fujimi Kenmazai Kogyo Kk | Composition for grinding plastic product |
-
1988
- 1988-02-09 JP JP63027941A patent/JP2632898B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61278587A (en) * | 1985-06-04 | 1986-12-09 | Fujimi Kenmazai Kogyo Kk | Polishing composition |
| JPS6215282A (en) * | 1985-07-12 | 1987-01-23 | Fujimi Kenmazai Kogyo Kk | Composition for grinding plastic product |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10195421A (en) * | 1996-11-14 | 1998-07-28 | Nissan Chem Ind Ltd | Abrasion composition for aluminum disk and abrasion process using the composition |
| US6007592A (en) * | 1996-11-14 | 1999-12-28 | Nissan Chemical Industries, Ltd. | Polishing composition for aluminum disk and polishing process therewith |
| US6336945B1 (en) | 1996-11-14 | 2002-01-08 | Kao Corporation | Abrasive composition for the base of magnetic recording medium and process for producing the base by using the same |
| WO2008102672A1 (en) * | 2007-02-20 | 2008-08-28 | Sumitomo Electric Industries, Ltd. | Polishing slurry, method for manufacturing the polishing slurry, nitride crystalline material and method for polishing surface of the nitride crystalline material |
| JP2015109128A (en) * | 2013-12-05 | 2015-06-11 | 花王株式会社 | Polishing solution composition for glass hard disk substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2632898B2 (en) | 1997-07-23 |
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