JPH02118943U - - Google Patents

Info

Publication number
JPH02118943U
JPH02118943U JP2728789U JP2728789U JPH02118943U JP H02118943 U JPH02118943 U JP H02118943U JP 2728789 U JP2728789 U JP 2728789U JP 2728789 U JP2728789 U JP 2728789U JP H02118943 U JPH02118943 U JP H02118943U
Authority
JP
Japan
Prior art keywords
semiconductor
heatsink
attached
rib
ics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2728789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2728789U priority Critical patent/JPH02118943U/ja
Publication of JPH02118943U publication Critical patent/JPH02118943U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の放熱器を示す斜視
図、第2図は放熱器に半導体を取付ける状態を示
す説明図、第3図は放熱器に半導体を組込んだ状
態図である。 1……放熱器、2……半導体、3……半導体の
厚さ、4……弾性を有するリブ、5……凸部。
Fig. 1 is a perspective view showing a heatsink according to an embodiment of the present invention, Fig. 2 is an explanatory diagram showing a state in which a semiconductor is attached to the heatsink, and Fig. 3 is a diagram showing a state in which a semiconductor is assembled into the heatsink. . DESCRIPTION OF SYMBOLS 1... Heat sink, 2... Semiconductor, 3... Thickness of semiconductor, 4... Elastic rib, 5... Convex portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] トランジスタ、IC等半導体を放熱器に取付け
る構造において、放熱器に一体で半導体を固定す
る弾性を有したレール部と、半導体の取付位置を
決めるリブを設け、嵌合固定により半導体にかか
る取付時の付加を一定にすることを特徴とする半
導体の取付装置。
In a structure in which semiconductors such as transistors and ICs are attached to a heatsink, an elastic rail part that fixes the semiconductor integrally to the heatsink and a rib that determines the mounting position of the semiconductor are provided. A semiconductor mounting device characterized by constant loading.
JP2728789U 1989-03-13 1989-03-13 Pending JPH02118943U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2728789U JPH02118943U (en) 1989-03-13 1989-03-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2728789U JPH02118943U (en) 1989-03-13 1989-03-13

Publications (1)

Publication Number Publication Date
JPH02118943U true JPH02118943U (en) 1990-09-25

Family

ID=31249650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2728789U Pending JPH02118943U (en) 1989-03-13 1989-03-13

Country Status (1)

Country Link
JP (1) JPH02118943U (en)

Similar Documents

Publication Publication Date Title
JPH02118943U (en)
JPS62118453U (en)
JPH028043U (en)
JPH02132955U (en)
JPS6322749U (en)
JPS61149346U (en)
JPH01161338U (en)
JPH0336146U (en)
JPH01146547U (en)
JPH02136333U (en)
JPH0434744U (en)
JPH01127253U (en)
JPH01176946U (en)
JPS62166642U (en)
JPS6251752U (en)
JPH01154646U (en)
JPH0479440U (en)
JPH0365263U (en)
JPH0276204U (en)
JPS6318851U (en)
JPH0323945U (en)
JPH01156550U (en)
JPS632175U (en)
JPH0383965U (en)
JPS6185174U (en)